UCC35705DG4 [TI]
High Speed Voltage Mode Pulse Width Modulator 8-SOIC 0 to 70;
| 型号： | UCC35705DG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High Speed Voltage Mode Pulse Width Modulator 8-SOIC 0 to 70 开关 光电二极管 |
| 文件： | 总22页 (文件大小：798K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
D, OR P PACKAGE
(TOP VIEW)
D
D
Greater Than 4-MHz Operation
Integrated Oscillator / Voltage Feed Forward
Compensation
ILIM
FB
VDD
OUT
GND
RC
1
2
3
4
8
7
6
5
D
D
D
D
D
D
D
>4:1 Input Voltage Range
DGK PACKAGE
(TOP VIEW)
VFF
25-ns Current Limit Delay
DISCH
Programmable Maximum Duty Cycle Clamp
Optocoupler Interface
1
2
3
4
8
7
6
5
ILIM
VDD
50-μA Start-Up Current
FB
OUT
GND
RC
4.2-mA Operating Current @ 1 MHz
VFF
Smallest Footprint of the 8-pin MSOP
Package Minimizes Board Area and Height
DISCH
description
The UCC35705 and UCC35706 devices are 8-pin voltage mode primary side controllers with fast over-current
protection. These devices are used as core high-speed building blocks in high performance isolated and non-isolated
power converters.
UCC35705/UCC35706 devices feature a high speed oscillator with integrated feed-forward compensation for
improved converter performance. A typical current sense to output delay time of 25 ns provides fast response to
overload conditions. The IC also provides an accurate programmable maximum duty cycle clamp for increased
protection which can also be disabled for the oscillator to run at maximum possible duty cycle.
Two UVLO options are offered. The UCC35705 with lower turn-on voltage is intended for dc-to-dc converters while
the higher turn-on voltage and the wider UVLO range of the UCC35706 is better suited for offline applications.
The UCC35705/UCC35706 family is offered in 8-pin MSOP (DGK), SOIC (D) and PDIP (P) packages.
typical application schematic
+
+
V
OUT
--
V
IN
--
VDD
FB
8
2
4
DISCH
TPS2829
5
3
RC
OUT
7
1
VFF
FET DRIVER
SOFT
START
CIRCUIT
6
GND
ILIM
UCC35705/6
MODE = 1
UDG-99181
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001 -- 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
}
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Input voltage (VFF,RC,ILIM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage (FB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Input current (DISCH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 mA
Output current (OUT) dc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C
Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to GND. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Power
‡
Supply Control Data Book (TI Literature Number SLUD003) for thermal limitations and considerations of packages.
AVAILABLE OPTIONS
Packaged Devices
MSOP-8
T
A
= T
J
SOIC-8
PDIP-8
Small Outline
UVLO Option
†
Plastic Dip (P)
Small Outline (D)
†
(DGK)
8.8V/8V
12V/8V
8.8V/8V
12V/8V
UCC25705D
UCC25706D
UCC35705D
UCC35706D
UCC25705P
UCC25706P
UCC35705P
UCC35706P
UCC25705DGK
UCC25706DGK
UCC35705DGK
UCC35706DGK
-- 4 0°C to 85°C
0°C to 70°C
†
D (SOIC--8) and DGK (MSOP--8) packages are available taped and reeled. Add R suffix to device type (e.g.
UCC35705DR) to order quantities of 2500 devices per reel for SOIC-8 and 2000 devices per reel for the MSOP-8.
electrical characteristics, VDD = 11 V, VIN = 30 V, RT = 47 k, RDISCH = 400 k, RFF = 14 k, CT = 220 pF,
CVDD = 0.1 μF, and no load on the outputs, 0°C ≤ TA ≤ 70°C for the UCC3570x and --40°C ≤ TA ≤ 85°C
for the UCC2570x, TA = TJ, (unless otherwise specified)
UVLO section (UCCx5705)
PARAMETER
TEST CONDITIONS
TEST CONDITIONS
TEST CONDITIONS
MIN
8.0
7.4
0.3
TYP MAX UNITS
Start threshold
Stop threshold
Hysteresis
8.8
8.2
0.6
9.6
9.0
1.0
V
V
V
UVLO section (UCCx5706)
PARAMETER
Start threshold
MIN
11.2
7.2
TYP MAX UNITS
12.0
8.0
12.8
8.8
V
V
V
Stop threshold
Hysteresis
3.5
4.0
4.5
supply current section
PARAMETER
MIN
TYP MAX UNITS
Start-up current
V
V
= UVLO start – 1 V, V comparator off
DD
30
90
μA
DD
DD
I
active
comparator on, oscillator running at 1 MHz
4.2
5.0
mA
DD
2
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
electrical characteristics, VDD = 11 V, VIN = 30 V, RT = 47 k, RDISCH = 400 k, RFF = 14 k, CT = 220 pF,
C
VDD = 0.1 μF, and no load on the outputs, 0°C ≤ TA ≤ 70°C for the UCC3570x and --40°C ≤ TA ≤ 85°C
for the UCC2570x, TA = TJ, (unless otherwise specified)
line sense section
PARAMETER
Low line comparator threshold
Input bias current (VFF)
TEST CONDITIONS
MIN
0.95
–100
TYP MAX UNITS
1.00
1.05
100
V
nA
oscillator section
PARAMETER
TEST CONDITIONS
VFF = 1.2 V to 4.8 V
MIN
TYP MAX UNITS
Frequency
0.9
1.0
1.2
4.8
0
1.1
MHz
V
VFF = 1.2 V,
VFF = 4.8 V,
See Note 1
See Note 1
See Note 1
CT peak voltage
CT valley voltage
V
V
NOTE 1: Ensured by design. Not production tested.
current limit section
PARAMETER
Input bias current
TEST CONDITIONS
TEST CONDITIONS
MIN
0.2
TYP MAX UNITS
–0.2
200
25
–1
220
35
μA
mV
ns
Current limit threshold
180
Propagation delay, ILIM to OUT
50 mV overdrive
pulse width modulator section
PARAMETER
FB input impedance
MIN
TYP MAX UNITS
V
V
V
V
= 3 V
< 2 V
30
50
90
0
kΩ
%
FB
FB
FB
Minimum duty cycle
= V
,
F
F
= 1 MHz
= 1 MHz
70
75
93
12
65
80
%
DD
OSC
Maximum duty cycle
= 0 V,
%
DISCH
OSC
PWM gain
VFF = 2.5 V,
MODE = 1
%/V
ns
Propagation delay, PWM to OUT
120
output section
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNITS
VOH
I
I
= –5 mA,
= 5 mA
V
– output
DD
0.3
0.15
10
0.6
0.4
25
V
V
OUT
OUT
VOL
Rise time
Fall time
C
= 50 pF
= 50 pF
ns
ns
LOAD
LOAD
C
10
25
3
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
pin descriptions
DISCH: A resistor to VIN sets the oscillator discharge current programming a maximum duty cycle. When grounded,
an internal comparator switches the oscillator to a quick discharge mode. A small 100-pF capacitor between DISCH
and GND may reduce oscillator jitter without impacting feed-forward performance. IDISCH must be between 25 μA
and 250 μA over the entire VIN range.
FB: Input to the PWM comparator. This pin is intended to interface with an optocoupler. Input impedance is 50-kΩ
typical.
GND: Ground return pin.
ILIM: Provides a pulse-by-pulse current limit by terminating the PWM pulse when the input is above 200 mV. This
provides a high speed (25 ns typical) path to reset the PWM latch, allowing for a pulse-by-pulse current limit.
OUT: The output is intended to drive an external FET driver or other high impedance circuits, but is not intended to
directly drive a power MOSFET. This improves the controller’s noise immunity. The output resistance of the PWM
controller, typically 60 Ω pull-up and 30 Ω pull-down, will result in excessive rise and fall times if a power MOSFET
is directly driven at the speeds for which the UCC35705/6 is optimized.
RC: The oscillator can be configured to provide a maximum duty cycle clamp. In this mode the on--time is set by RT
and CT, while the off-time is set by RDISCH and CT. Since the voltage ramp on CT is proportional to VIN, feed-forward
action is obtained. Since the peak oscillator voltage is also proportional to VIN, constant frequency operation is
maintained over the full power supply input range. When the DISCH pin is grounded, the duty cycle clamp is disabled.
The RC pin then provides a low impedance path to ground CT during the off time.
VDD: Power supply pin. This pin should be bypassed with a 0.1-μF capacitor for proper operation. The undervoltage
lockout function of the UCC35705/6 allows for a low current startup mode and ensures that all circuits become active
in a known state. The UVLO thresholds on the UCC35705 are appropriate for a dc-to-dc converter application. The
wider UVLO hysteresis of the UCC35706 (typically 4 V) is optimized for a bootstrap startup mode from a high
impedance source.
VFF: The feed-forward pin provides the controller with a voltage proportional to the power supply input voltage. When
the oscillator is providing a duty cycle clamp, a current of 2 × IDISCH is sourced from the VFF pin. A single resistor
RFF between VFF and GND then set VFF to:
2 × RFF
2 × RFF + RDISCH
VFF ≈ VIN ×
When the DISCH pin is grounded and the duty cycle clamp is not used, the internal current source is disabled and
a resistor divider from VIN is used to set VFF. In either case, when the voltage on VFF is less than 1.0 V, both the
output and oscillator are disabled.
4
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
pin descriptions (continued)
MODE
50 mV
I
--
DISCH
4
1.0 V
CLK
+
VDD
LOW LINE
S
Q
Q
PWM
LATCH
2 * I (MODE=1)
0 (MODE = 0)
--
RD
RD
RD
+
7
8
OUT
VDD
VFF
RC
3
5
--
Q
S
+
+
RD Q
UVLO
UCC35705 (8.8 V/8 V)
UCC35706 (12 V/8 V)
30 * I (MODE=1)
80 (MODE = 0)
--
Ω
100 mV
6
1
GND
ILIM
0.7 V
PWM
--
FB
2
200 mV
+
CURRENT LIMIT
Ω
30 k
+
--
Ω
20 k
1 pF
Figure 1. Block Diagram
FUNCTIONAL DESCRIPTION
oscillator and PWM
The oscillator can be programmed to provide a duty cycle clamp or be configured to run at the maximum possible
duty cycle.
The PWM latch is set during the oscillator discharge and is reset by the PWM comparator when the CT waveform
is greater than the feedback voltage. The voltage at the FB pin is attenuated before it is applied to the PWM
comparator. The oscillator ramp is shifted by approximately 0.65-V at room temperature at the PWM comparator. The
offset has a temperature coefficient of approximately --2 mV/°C.
The ILIM comparator adds a pulse by pulse current limit by resetting the PWM latch when VILIM > 200 mV. The PWM
latch is also reset by a low line condition (VFF <1.0 V).
All reset conditions are dominant; asserting any output will force a zero duty cycle output.
oscillator with duty cycle clamp (MODE = 1)
The timing capacitor CT is charged from ground to VFF through RT. The discharge path is through an on-chip current
sink that has a value of 30 × IDISCH, where IDISCH is the current through the external resistor RDISCH. Since the
charge and discharge currents are both proportional to VIN, their ratio, and the maximum duty cycle remains constant
as VIN varies.
5
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
FUNCTIONAL DESCRIPTION
V
IN
R
T
R
DISCH
DISCH
RC
5
4
VDD
C
T
I
DISCH
2 * I
DISCH
30 * I
VFF
DISCH
3
R
FF
Figure 2. Duty Cycle Clamp (MODE = 1)
The on-time is approximately:
TON =∝ × RT × CT where ∝=
The off-time is:
TOFF =∝ ×
VFF
VIN
2 × RFF
RDISCH
≈
C × R × R
T
T
DISCH
30 × RT − RDISCH
The frequency is:
1
1
f =
×
∝ × RT × CT
RDISCH
30×RT−RDISCH
1 +
The maximum duty cycle is:
TON
TON + TOFF
RDISCH
30 × RT
= 1 −
Duty Cycle =
6
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
FUNCTIONAL DESCRIPTION
component selection for oscillator with duty cycle clamp (MODE = 1)
For a power converter with the following specifications:
D
D
D
D
D
VIN(min) = 18 V
VIN(max) = 75 V
VIN(shutdown) = 15 V
FOSC = 1 MHz
DMAX = 0.78 at VIN(min)
In this mode, the on-time is approximately:
D
D
TON(max) = 780 ns
TOFF(min) = 220 ns
18
D
VFF(min)
=
= 1.20 V
15
(1) Pick CT = 220 pF.
(2) Calculate RT.
VIN min × T
(
)
ON max
RT =
VFF min × C
T
RT = 51.1 kΩ
(3) RDISCH
30 × RT
RDISCH
=
VFF(min)
VIN(min)
⎧
⎫
×R ×C
T
T
⎪
⎪
⎪
⎪
1 +
⎪
⎪
⎪
TOFF(min)
⎪
⎩
⎭
RDISCH = 383 kΩ.
IDISCH must be between 25 μA and 250 μA over the entire VIN range.
With the calculated values, IDISCH ranges from 44 μA to 193 μA, within the allowable range. If IDISCH is too high, CT
must be decreased.
(4) RFF
VFF(min) × RDISCH
RFF
=
− 1
2 × VIN(min)
The nearest 1% standard value to the calculated value is 13.7 k.
7
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
FUNCTIONAL DESCRIPTION
oscillator without duty cycle clamp (MODE = 0)
In this mode, the timing capacitor is discharged through a low impedance directly to ground. The DISCH pin is
externally grounded. A comparator connected to DISCH senses the ground connection and disables both the
discharge current source and VFF current source. A resistor divider is now required to set VFF.
V
IN
R
T
RC
DISCH
5
4
C
T
VFF
3
Figure 3. Ocsillator Without Clamp (MODE = 0)
In this mode, the on-time is approximately:
VFF
VIN
TON =∝ × RT × CT where ∝=
The off-time is:
TOFF ≈ 75 ns
The frequency is:
1
f =
∝ × RT × CT + 75 ns
8
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
FUNCTIONAL DESCRIPTION
component selection for oscillator without duty cycle clamp (MODE = 0)
For a power converter with the following specifications:
D
D
D
D
VIN(min) = 18 V
VIN(max) = 75 V
VIN(shutdown) = 15 V
FOSC = 1 MHz
With these specifications,
18
15
VFF(min)
=
= 1.2 V
(1) Pick CT = 220 pF
(2) Calculate RT.
VIN(min)
VFF(min)
1
×
− 75 ns
FOSC
CT
RT =
TYPICAL CHARACTERISTICS
UCC35706 UVLO THRESHOLDS
UCC35705 UVLO THRESHOLDS
vs
vs
TEMPERATURE
TEMPERATURE
8.9
8.8
8.7
8.6
8.5
8.4
13
12
11
10
9
8.3
8.2
8.1
8.0
8
7
--50
--25
0
25
50
75
100
125
--50
--25
0
25
50
°C
75
100
125
Temperature
°C
Temperature
Figure 4
Figure 5
9
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
TYPICAL CHARACTERISTICS
OPERATING CURRENT (AT 1mHz)
LOW-LINE THRESHOLD
vs.
vs
TEMPERATURE
TEMPERATURE
1.05
1.04
1.03
1.02
1.01
1.00
0.99
0.98
0.97
0.96
0.65
4.8
4.7
4.6
4.5
4.4
4.3
4.2
4.1
4.0
3.9
3.8
--50
--25
0
25
50
75
100
125
--50
--25
0
25
50
°C
75
100
125
°C
Temperature
Temperature
Figure 6
Figure 7
PROGRAMMABLE MAXIMUM
DUTY CYCLE
OSCILLATOR FREQUENCY
vs
vs
TEMPERATURE
TEMPERATURE
82
80
78
76
74
72
1.10
1.05
1.00
0.95
0.90
70
68
--50
--25
0
25
50
75
100
125
0
--50
--25
25
50
°C
75
100
125
°C
Temperature
Temperature
Figure 8
Figure 9
10
www.ti.com
UCC25705, UCC25706, UCC35705, UCC35706
HIGH-SPEED VOLTAGE MODE PULSE WIDTH MODULATOR
SLUS473B -- NOVEMBER 1999 -- REVISED OCTOBER 2010
TYPICAL CHARACTERISTICS
CURRENT-LIMIT THRESHOLD
CURRENT-LIMIT PROP DELAY
vs
vs
TEMPERATURE
TEMPERATURE
35
33
31
29
27
220
215
210
205
200
195
190
25
23
21
19
17
15
185
180
--50
--25
0
25
50
°C
75
100
125
--50
--25
0
25
50
°C
75
100
125
Temperature
Temperature
Figure 10
Figure 11
Revision History
Revision SLUS473A, March 2001 to SLUS473B:
Modified “TOFF” and “f” equation on page 6.
D
11
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
PACKAGING INFORMATION
Orderable Device
UCC25705D
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
D
8
8
8
8
8
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
25705
25705
25705
25705
25705
25705
25705
UCC25705DG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
75
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
UCC25705DGK
UCC25705DGKG4
UCC25705DGKTR
UCC25705DGKTRG4
UCC25705DTR
VSSOP
VSSOP
VSSOP
VSSOP
SOIC
DGK
DGK
DGK
DGK
D
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
CU NIPDAUAG
CU NIPDAUAG
CU NIPDAUAG
CU NIPDAU
80
Green (RoHS
& no Sb/Br)
2500
2500
2500
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
UCC25705DTRG4
UCC25705P
ACTIVE
ACTIVE
SOIC
PDIP
D
P
8
8
TBD
Call TI
Call TI
-40 to 85
-40 to 85
50
50
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC25705P
UCC25705P
25706
UCC25705PG4
UCC25706D
ACTIVE
ACTIVE
PDIP
SOIC
P
D
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
UCC25706DG4
UCC25706DGK
ACTIVE
ACTIVE
SOIC
D
8
8
TBD
Call TI
Call TI
-40 to 85
-40 to 85
VSSOP
DGK
80
80
50
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
25706
UCC25706DGKG4
UCC25706P
ACTIVE
ACTIVE
VSSOP
PDIP
DGK
P
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
CU NIPDAU
Level-2-260C-1 YEAR
N / A for Pkg Type
-40 to 85
-40 to 85
25706
Green (RoHS
& no Sb/Br)
UCC25706P
UCC25706PG4
UCC35705D
ACTIVE
ACTIVE
PDIP
SOIC
P
D
8
8
TBD
Call TI
Call TI
-40 to 85
0 to 70
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
35705
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
UCC35705DG4
UCC35705DGK
UCC35705DGKG4
UCC35705DTR
ACTIVE
SOIC
VSSOP
VSSOP
SOIC
D
8
8
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAUAG
CU NIPDAUAG
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
35705
35705
35705
35705
ACTIVE
ACTIVE
ACTIVE
DGK
DGK
D
80
80
Green (RoHS
& no Sb/Br)
0 to 70
Green (RoHS
& no Sb/Br)
0 to 70
2500
Green (RoHS
& no Sb/Br)
0 to 70
UCC35705DTRG4
UCC35705P
ACTIVE
ACTIVE
SOIC
PDIP
D
P
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC35705P
UCC35705PG4
UCC35706D
ACTIVE
ACTIVE
PDIP
SOIC
P
D
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
75
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
35706
35706
35706
UCC35706DG4
UCC35706DGK
ACTIVE
ACTIVE
SOIC
D
8
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
0 to 70
0 to 70
VSSOP
DGK
100
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
UCC35706DGKG4
UCC35706P
ACTIVE
ACTIVE
VSSOP
PDIP
DGK
P
8
8
TBD
Call TI
Call TI
0 to 70
0 to 70
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
UCC35706P
UCC35706PG4
ACTIVE
PDIP
P
8
TBD
Call TI
Call TI
0 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC25706 :
Automotive: UCC25706-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UCC25705DGKTR
UCC25705DTR
UCC35705DTR
VSSOP
SOIC
DGK
D
8
8
8
2500
2500
2500
330.0
330.0
330.0
12.4
12.4
12.4
5.3
6.4
6.4
3.4
5.2
5.2
1.4
2.1
2.1
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
SOIC
D
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UCC25705DGKTR
UCC25705DTR
UCC35705DTR
VSSOP
SOIC
DGK
D
8
8
8
2500
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
SOIC
D
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
相关型号：
UCC35705DGKTRG4
0.02A SWITCHING CONTROLLER, 4000kHz SWITCHING FREQ-MAX, PDSO8, GREEN, PLASTIC, MSOP-8
TI
UCC35705DR
0.02A SWITCHING CONTROLLER, 4000kHz SWITCHING FREQ-MAX, PDSO8, GREEN, PLASTIC, MS-012AA, SOP-8
TI
UCC35705DTRG4
0.02A SWITCHING CONTROLLER, 4000kHz SWITCHING FREQ-MAX, PDSO8, GREEN, PLASTIC, MS-012AA, SOP-8
TI
©2020 ICPDF网 联系我们和版权申明