UCC3952DP-3G4 [TI]

1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16, SOIC-16;
UCC3952DP-3G4
型号: UCC3952DP-3G4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16, SOIC-16

信息通信管理 光电二极管
文件: 总9页 (文件大小:131K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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SLUS400D – AUGUST 2000  
PW PACKAGE  
(TOP VIEW)  
D
Protects Sensitive Lithium-Ion Cells From  
Overcharging and Over-Discharging  
D
Dedicated for One-Cell Applications  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
TCLK  
NC  
PACK+  
CBPS  
NC  
PACK–  
PACK–  
PACK–  
PACK–  
PACK–  
D
Integrated Low-Impedance MOSFET Switch  
and Sense Resistor  
BNEG  
BNEG  
BNEG  
BNEG  
BNEG  
BNEG  
D
Precision Trimmed Overcharge and  
Overdischarge Voltage Limits  
D
D
D
D
D
Extremely Low Power Drain  
3-A Current Capacity  
Overcurrent and Short-Circuit Protection  
Reverse Charger Protection  
Thermal Protection  
description  
DP PACKAGE  
(TOP VIEW)  
The UCC3952 monolithic BiCMOS lithium–ion  
battery protection circuit increases the useful  
operating life of a one-cell rechargeable battery  
pack. Cell protection features include internally  
trimmed charge and discharge voltage limits,  
discharge current limit with a delayed shutdown,  
and an ultra-low-current sleep mode state when  
the cell is discharged. Additional features include  
an on-chip MOSFET for reduced external compo-  
nent count and a charge pump for reduced power  
losses while charging or discharging a low-cell-  
voltage battery pack. This protection circuit  
requires one external capacitor and can operate  
and safely shut down in a short circuit condition.  
TCLK  
NC  
PACK+  
CBPS  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
NC  
SUB  
13 SUB  
12  
11  
10  
9
SUB  
SUB  
BNEG  
BNEG  
BNEG  
PACK–  
PACK–  
PACK–  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2000, Texas Instruments Incorporated  
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Ins tr u men ts  
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1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
U C C 3 9 5 2 - 1 , U C C 3 9 5 2 - 2 , U C C 3 9 5 2 - 3 , U C C 3 9 5 2 - 4  
S in g le ĆC e ll L ith i u mĆI on Ba tte r y Pr o te c tio n IC  
SLUS400D – AUGUST 2000  
application diagram  
+
PACK  
1
2
3
4
5
6
7
8
TCLK  
N/C  
16  
15  
3 k  
+
CBPS  
0.1µF  
BNEG  
BNEG  
BNEG  
BNEG  
BNEG  
NC 14  
CHARGER  
13  
12  
11  
10  
9
PACK  
PACK  
PACK  
PACK  
LOAD  
PACK  
BNEG  
AVAILABLE OPTIONS  
PACKAGES  
T
A
TSSOP–16 (PW)  
SOIC–16 (DP)  
UCC3952PW–1  
UCC3952PW–2  
UCC3952PW–3  
UCC3952PW–4  
UCC3952DP–1  
UCC3952DP–2  
UCC3952DP–3  
UCC3952DP–4  
–20°C to 70 °C  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
U C C 3 9 5 2 - 1 , U C C 3 9 5 2 - 2 , U C C 3 9 5 2 - 3 , U C C 3 9 5 2 - 4  
Si n gl e ĆCe ll L ith iu m ĆIo n Ba tte r y P r ot ect i on I C  
SLUS400D – AUGUST 2000  
absolute maximum ratings over operating free-air temperature (unless otherwise noted)  
Supply voltage (PACK+ to BNEG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
Maximum forward voltage (PACK+ to PACK–) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 V  
Maximum reverse voltage (where PACK+ to BNEG = 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –8 V  
Maximum cell continuous charge current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A  
Junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C  
J
Storage Temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Data Book for thermal limitations and  
considerations of packages. All voltages are referenced to GND.  
electrical characteristics, T = –20°C to 70°C, all voltages are with respect to BNEG (unless  
A
otherwise stated)  
state transition threshold  
PARAMETER  
TEST CONDITIONS  
MIN  
4.15  
4.20  
4.25  
4.30  
3.85  
3.90  
3.95  
4.00  
2.25  
2.55  
10  
TYP  
4.20  
4.25  
4.30  
4.35  
3.90  
3.95  
4.00  
4.05  
2.35  
2.65  
25  
MAX UNITS  
4.25  
UCC3952–1  
UCC3952–2  
UCC3952–3  
UCC3952–4  
UCC3952–1  
UCC3952–2  
UCC3952–3  
UCC3952–4  
4.30  
V
(OV)  
Normal to overcharge voltage  
V
4.35  
4.40  
3.95  
4.00  
Overcharge to normal recovery  
voltage  
V
V
(OVR)  
4.05  
4.10  
V
V
Normal to undercharge  
2.45  
2.75  
40  
V
V
(UV)  
(UVR)  
d(OD)  
Undercharge to normal recovery  
Overcharge delay time  
t
ms  
short circuit protection  
PARAMETER  
TEST CONDITIONS  
PACK+ = 3.7 V  
MIN  
3.0  
1
TYP  
MAX UNITS  
I
t
Discharge current limit  
6.0  
3.0  
A
(THLD)  
Discharge current delay  
PACK+ = 3.7 V, I = 6 A  
I
ms  
M  
d(DLY)  
R
Discharge current reset resistance  
PACK+ = 3.7 V  
7.5  
(RESET)  
bias  
PARAMETER  
Supply current  
TEST CONDITIONS  
MIN  
TYP  
5
MAX UNITS  
I
V
V
V
< V  
< V  
< V  
(OV)  
8
24  
µA  
µA  
µA  
DD  
(UV)  
(PACK)  
I
Operating supply current in overvoltage  
Shutdown current  
11  
DD(OV)  
(OV)  
(PACK)  
I
= 2.0 V  
2.5  
(SD)  
(PACK)  
Minimum cell voltage when all circuits are fully  
functional  
V
1.7  
V
s
(min)  
t (OV)  
d
Overvoltage delay time  
1
2
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
U C C 3 9 5 2 - 1 , U C C 3 9 5 2 - 2 , U C C 3 9 5 2 - 3 , U C C 3 9 5 2 - 4  
S in g le ĆC e ll L ith i u mĆI on Ba tte r y Pr o te c tio n IC  
SLUS400D – AUGUST 2000  
electrical characteristics, T = –20°C to 70°C, all voltages are with respect to BNEG (unless  
A
otherwise stated) (continued)  
FET switch  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
PACK+ > V  
OV  
(SWITCH)  
Battery overcharged state switch permits discharge  
,
I
= 1 mA to 2 A,  
100  
400  
mV  
current only.  
V
Voltage at PACK–  
(PACK–)  
PACK+ = 2.5V,  
I
= –1 mA to –2 A,  
(SWITCH)  
–600  
–100  
50  
mV  
Battery overdischarged state switch permits charge  
current only.  
PACK+ = 2.5 V,  
In normal mode (when not in OV or UV). This value  
includes package and bondwire resistance.  
R
Series resistance of the device  
75  
mΩ  
ON  
thermal shutdown  
PARAMETER  
Thermal shutdown temperature (see Note 2)  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
T
(SD)  
135  
°C  
NOTE 2: This parameter is ensured by design and is not production tested.  
detailed description  
pin descriptions  
BNEG  
Connect the negative terminal of the battery to this pin.  
PACK+  
Connect to the positive terminal of the battery. This pin is available to the user.  
CBPS  
This power supply bypass pin is connected to PACK+ through an internal 3-kresistor. An external 0.1-µF  
capacitor must be connected between this pin and BNEG.  
PACK–  
The negative terminal of the battery pack (negative terminal available to the user). The internal FET switch  
connects this terminal to the BNEG terminal to give the battery pack user appropriate access to the battery. In  
an overcharged state, only discharge current is permitted. In an overdischarged state, only charge current is  
permitted.  
SUB (DP Package Only)  
Do not connect. These pins must be electrically isolated from all other pins. The SUB pins may be soldered to  
an isolated copper pad for heatsinking. However, most applications do not require heatsinking.  
TCLK  
Production test mode pin. This pin is used to provide a high-frequency clock to the IC during production testing.  
In an application, this pin is left unconnected or tied to BNEG.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
U C C 3 9 5 2 - 1 , U C C 3 9 5 2 - 2 , U C C 3 9 5 2 - 3 , U C C 3 9 5 2 - 4  
Si n gl e ĆCe ll L ith iu m ĆIo n Ba tte r y P r ot ect i on I C  
SLUS400D – AUGUST 2000  
APPLICATION INFORMATION  
PACK+ 16  
CBPS 15  
3k  
V
UV  
V
UVR  
4–1  
MUX  
T
DEL  
OV  
STATE  
MACHINE  
LOGIC  
V
1SEC  
OVR  
THRESHOLD  
COMPARATOR  
TCLK  
N/C  
1
2
3
4
5
6
7
8
9
V
OV  
1.5V  
T
SEL  
DEL  
UV  
10mS  
CLK  
BNEG  
BNEG  
BNEG  
BNEG  
BNEG  
BNEG  
PACK–  
SYSTEM  
CLOCK  
GENERATOR  
TDLS  
1mS  
SETD  
V
PUMP  
50mV  
50mV  
2M  
RST  
THERMAL  
SHUTDOWN  
PACK– 10  
PACK– 11  
PACK– 12  
13  
PACK–  
NC 14  
Figure 1. Detailed Block Diagram  
battery voltage monitoring  
The battery cell voltage is sampled every 8 ms by connecting a resistor divider across it and comparing the  
resulting voltage to a precision internal reference voltage. Under normal conditions (cell voltage is below  
overvoltage threshold and above undervoltage threshold), the UCC3952 consumes less than 10 µA of current  
and the internal MOSFET is fully turned on with the aid of a charge pump.  
When the cell voltage falls below the undervoltage threshold for two consecutive samples, the IC disconnects  
the load from the battery pack and enters a super-low-power mode. The pack remains in this state until it detects  
the application of a charger, at which point charging is enabled. The requirement of two consecutive readings  
below the undervoltage threshold filters out momentary drops in cell voltage due to load transients, preventing  
nuisance trips.  
If the cell voltage exceeds the overvoltage threshold for 1 second, charging is disabled; however, discharge  
current is still allowed. This feature of the IC is explained further in the controlled charge/discharge mode section  
of this document.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
U C C 3 9 5 2 - 1 , U C C 3 9 5 2 - 2 , U C C 3 9 5 2 - 3 , U C C 3 9 5 2 - 4  
S in g le ĆC e ll L ith i u mĆI on Ba tte r y Pr o te c tio n IC  
SLUS400D – AUGUST 2000  
APPLICATION INFORMATION  
overcurrent monitoring and protection  
Discharge current is continuously monitored via an internal sense resistor. In the event of excessive current,  
an overcurrent condition is declared if the high current (over 3 A) persists for over 1 ms. This delay allows for  
charging of the system bypass capacitors without tripping the overcurrent protection. A 0.1-µF capacitor on the  
CBPS pin provides momentary holdup for the IC to assure proper operation in the event that a hard short  
suddenly pulls the cell voltage below the minimum operating voltage.  
Once an overcurrent condition has been declared, the internal MOSFET turns off. To return the device to normal  
operation, the UCC3952 requires a load impedance greater than 7.5 Macross PACK+ to PACK–. This  
impedance is typically achieved by removing the battery pack from the system. At this point, the pack returns  
to its normal state of operation.  
controlled charge/discharge mode  
When the chip senses an overvoltage condition, it prevents any additional charging, but allows discharge. This  
is accomplished by activating a linear control loop, which controls the gate of the MOSFET based on the  
differential voltage across its drain-to-source terminals. The linear loop attempts to regulate the differential  
voltage across the MOSFET to 100 mV. When a light load is applied to the part, the loop adjusts the impedance  
of the MOSFET to maintain 100 mV across it. As the load increases, the impedance of the MOSFET is  
decreased to maintain the 100-mV control. At heavy loads (still below the overcurrent limit), the loop does not  
maintain regulation and drives the gate of the MOSFET to the battery voltage (not the charge-pump output  
voltage). The MOSFET R  
in the overvoltage state is higher than RDS(on) during normal operation. The  
DS(on)  
voltage drop (and associated power loss) across the internal MOSFET in this mode of operation is still  
significantly lower than the typical solution of two external back-to-back MOSFETs, where the body diode is  
conducting.  
When the chip senses an undervoltage condition, it disconnects the load from the battery pack and shuts itself  
down to minimize current drain from the battery. Several circuits remain powered and detect placement of the  
battery pack into a charger. Once the charger presence is detected, the linear loop is activated and the chip  
allows charging current into the battery. This linear control mode of operation is in effect until the battery voltage  
reaches a level of V  
, at which time normal operation is resumed.  
UVR  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Feb-2006  
PACKAGING INFORMATION  
Orderable Device  
UCC3952DP-1  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952DP-2  
SOIC  
SOIC  
D
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952DP-3  
D
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952DP-3G4  
UCC3952DP-4  
SOIC  
D
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOIC  
D
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952DP-4G4  
UCC3952PW-1  
SOIC  
D
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952PW-1G4  
UCC3952PW-2  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952PW-3  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952PW-3G4  
UCC3952PW-4  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
UCC3952PW-4G4  
UCC3952PWTR-2  
UCC3952PWTR-3  
UCC3952PWTR-3G4  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
24-Feb-2006  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
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