V62/06605-01XE [TI]

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS; 双上升沿触发D型触发器
V62/06605-01XE
型号: V62/06605-01XE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS
双上升沿触发D型触发器

触发器 锁存器 逻辑集成电路 光电二极管
文件: 总14页 (文件大小:506K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
FEATURES  
Controlled Baseline  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
– One Assembly/Test Site, One Fabrication  
Site  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Extended Temperature Performance of– 55°C  
to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
– 1000-V Charged-Device Model (C101)  
PW PACKAGE  
(TOP VIEW)  
Enhanced Product-Change Notification  
(1)  
Qualification Pedigree  
2-V to 5.5-V VCC Operation  
Max tpd of 13 ns at 5 V  
1CLR  
1D  
V
CC  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
2CLR  
2D  
1CLK  
1PRE  
1Q  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
2CLK  
2PRE  
2Q  
Typical VOHV (Output VOH Undershoot)  
>2.3 V at VCC = 3.3 V, TA = 25°C  
1Q  
8
GND  
2Q  
Supports Mixed-Mode Voltage Operation on  
All Ports  
Ioff Supports Partial-Power-Down Mode  
Operation  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION/ORDERING INFORMATION  
These dual positive-edge-triggered D-type flip-flops are designed for 2-V to 5.5-V VCC operation.  
A low level at the preset (PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the  
other inputs. When PRE and CLR are inactive (high), data at the data (D) inputs meeting the setup-time  
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs  
at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval,  
data at the D input can be changed without affecting the levels at the outputs.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the devices when they are powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
LV74AEP  
–55°C to 125°C  
TSSOP – PW  
Reel of 2000  
SN74LV74AMPWREP  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
UNLESS OTHERWISE NOTED this document contains ADVANCE  
Copyright © 2006, Texas Instruments Incorporated  
INFORMATION on new products in the sampling or preproduction  
phase of development. Characteristic data and other specifications  
are subject to change without notice.  
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
PRE  
L
CLR  
H
CLK  
X
D
X
X
X
H
L
Q
H
L
Q
L
H
L
X
H
H(1)  
L
L
X
H(1)  
H
H
H
L
H
H
L
H
H
H
L
X
Q0  
Q 0  
(1) This configuration is nonstable; that is, it does not persist when  
PRE or CLR returns to its inactive (high) level.  
LOGIC DIAGRAM, EACH FLIP-FLOP (POSITIVE LOGIC)  
PRE  
CLK  
C
C
C
Q
TG  
C
C
C
C
D
TG  
TG  
TG  
Q
C
C
C
CLR  
2
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX UNIT  
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Output voltage range(2)(3)  
7
7
7
V
V
VO  
VO  
IIK  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–20  
–50  
±25  
±50  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0  
Continuous output current  
Continuous current through VCC or GND  
Package thermal impedance(4)  
Storage temperature range  
VO = 0 to VCC  
θJA  
113 °C/W  
150 °C  
Tstg  
–65  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) This value is limited to 5.5 V maximum.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
3
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
Recommended Operating Conditions(1)  
MIN  
2
MAX  
5.5  
UNIT  
VCC  
Supply voltage  
V
VCC = 2 V  
1.5  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 2 V  
V
V
V
CC × 0.7  
CC × 0.7  
CC × 0.7  
VIH  
High-level input voltage  
V
V
0.5  
CC × 0.3  
CC × 0.3  
CC × 0.3  
5.5  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
V
V
V
VIL  
Low-level input voltage  
VI  
Input voltage  
0
0
V
V
VO  
Output voltage  
VCC  
–50  
–2  
VCC = 2 V  
µA  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 2 V  
IOH  
High-level output current  
Low-level output current  
–6  
mA  
µA  
–12  
50  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 2.3 V to 2.7 V  
VCC = 3 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
2
IOL  
6
mA  
12  
200  
100  
20  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
TA  
–55  
125  
°C  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
VCC  
2 V to 5.5 V  
2.3 V  
MIN  
VCC – 0.1  
2
TYP  
MAX UNIT  
IOH = –50 µA  
IOH = –2 mA  
IOH = –6 mA  
IOH = –12 mA  
IOL = 50 µA  
IOL = 2 mA  
VOH  
V
3 V  
2.48  
4.5 V  
3.8  
2 V to 5.5 V  
2.3 V  
0.1  
0.4  
V
VOL  
IOL = 6 mA  
3 V  
0.44  
IOL = 12 mA  
4.5 V  
0.55  
II  
VI = 5.5 V or GND  
0 to 5.5 V  
5.5 V  
±1  
20  
5
µA  
µA  
µA  
ICC  
Ioff  
VI = VCC or GND, IO = 0  
VI or VO = 0 to 5.5 V  
0
3.3 V  
2
2
Ci  
VI = VCC or GND  
pF  
5 V  
4
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
Timing Requirements  
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
PARAMETER  
MIN  
MAX UNIT  
MIN  
8
MAX  
PRE or CLR low  
CLK  
9
9
tw  
Pulse duration  
ns  
8
Data  
8
9
tsu  
th  
Setup time before CLK↑  
ns  
ns  
PRE or CLR inactive  
7
7
Hold time, data after CLK↑  
0.5  
0.5  
Timing Requirements  
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
PARAMETER  
MIN  
MAX UNIT  
MIN  
6
MAX  
PRE or CLR low  
CLK  
7
7
tw  
Pulse duration  
ns  
6
Data  
6
7
tsu  
th  
Setup time before CLK↑  
ns  
ns  
PRE or CLR inactive  
5
5
Hold time, data after CLK↑  
1.45  
2.15  
Timing Requirements  
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
PARAMETER  
MIN  
MAX UNIT  
MIN  
5
MAX  
PRE or CLR low  
CLK  
5
5
tw  
Pulse duration  
ns  
5
Data  
5
5
tsu  
th  
Setup time before CLK↑  
ns  
ns  
PRE or CLR inactive  
3
3
Hold time, data after CLK↑  
1.45  
2.15  
Switching Characteristics  
over recommended operating free-air temperature range,VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
TYP  
70  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN  
MAX  
UNIT  
MHz  
ns  
MIN  
MAX  
fmax  
tpd  
CL = 50 pF  
CL = 50 pF  
30  
25  
1
PRE or CLR  
CLK  
13  
17.4  
20  
20  
23  
Q or Q  
14.2  
1
5
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
Switching Characteristics  
over recommended operating free-air temperature range,VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
TYP  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN  
MAX  
UNIT  
MHz  
ns  
MIN  
MAX  
fmax  
tpd  
CL = 50 pF  
CL = 50 pF  
50  
90  
45  
1
PRE or CLR  
CLK  
9.2  
15.8  
15.4  
18  
18  
Q or Q  
10.2  
1
Switching Characteristics  
over recommended operating free-air temperature range,VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
TYP  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN  
MAX  
UNIT  
MHz  
ns  
MIN  
MAX  
fmax  
tpd  
CL = 50 pF  
CL = 50 pF  
90  
140  
75  
1
PRE or CLR  
CLK  
6.6  
9.7  
9.9  
12  
13  
Q or Q  
7.2  
1
Noise Characteristics(1)  
VCC = 3.3 V, CL = 50 pF, TA = 25°C  
PARAMETER  
Quiet output, maximum dynamic VOL  
MIN TYP  
MAX UNIT  
VOL(P)  
VOL(V)  
VOH(V)  
VIH(D)  
VIL(D)  
0.1  
0.8  
V
V
V
V
V
Quiet output, minimum dynamic VOL  
Quiet output, minimum dynamic VOH  
High-level dynamic input voltage  
Low-level dynamic input voltage  
0
3.2  
–0.8  
2.31  
0.99  
(1) Characteristics are for surface-mount packages only.  
Operating Characteristics  
TA = 25°C  
PARAMETER  
TEST CONDITIONS  
CL = 50 pF, f = 10 MHz  
VCC  
3.3 V  
5 V  
TYP UNIT  
21  
pF  
23  
Cpd  
Power dissipation capacitance  
6
SN74LV74A-EP  
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
www.ti.com  
SCLS696JANUARY 2006  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
S1  
Open  
R
L
= 1 kΩ  
TEST  
/t  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
GND  
t
t
Open  
PLH PHL  
C
L
C
L
t
/t  
V
CC  
PLZ PZL  
(see Note A)  
(see Note A)  
/t  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
V
CC  
50% V  
CC  
Timing Input  
0 V  
t
w
t
h
t
su  
V
CC  
V
CC  
50% V  
50% V  
CC  
Input  
Input  
CC  
50% V  
50% V  
CC  
Data Input  
0 V  
CC  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
50% V  
50% V  
50% V  
50% V  
CC  
CC  
CC  
CC  
0 V  
0 V  
t
t
t
t
t
PLH  
PHL  
PZL  
PLZ  
Output  
Waveform 1  
V  
V
CC  
OH  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
V
+ 0.3 V  
OL  
S1 at V  
CC  
V
OL  
V
OL  
(see Note B)  
t
PHL  
PLH  
t
t
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
OH  
OL  
Out-of-Phase  
Output  
− 0.3 V  
OH  
50% V  
50% V  
50% V  
CC  
CC  
CC  
V
0 V  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time, with one input transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PHL  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PLH pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuits and Voltage Waveforms  
7
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-May-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
SN74LV74AMPWREP  
V62/06605-01XE  
ACTIVE  
ACTIVE  
TSSOP  
TSSOP  
PW  
PW  
14  
14  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Add to cart  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Add to cart  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN74LV74A-EP :  
Catalog: SN74LV74A  
Automotive: SN74LV74A-Q1  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-May-2012  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
SN74LV74AMPWREP  
TSSOP  
PW  
14  
2000  
330.0  
12.4  
6.9  
5.6  
1.6  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP PW 14  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
SN74LV74AMPWREP  
2000  
Pack Materials-Page 2  
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