VSP3200Y [TI]
适用于 CCD/CMOS/CIS 传感器的 16 位、8MSPS 3 通道 AFE，双输出模式 | PT | 48 | 0 to 85;
| 型号： | VSP3200Y |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于 CCD/CMOS/CIS 传感器的 16 位、8MSPS 3 通道 AFE，双输出模式 | PT | 48 | 0 to 85 CD 商用集成电路 传感器 |
| 文件： | 总7页 (文件大小：776K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VSP3200
VSP3210
VSP3200
www.ti.com
CCD SIGNAL PROCESSOR FOR
SCANNER APPLICATIONS
FEATURES
DESCRIPTION
The VSP3200 and VSP3210 are complete CCD image
processors that operate from single +5V supplies.
F INTEGRATED TRIPLE-CORRELATED
DOUBLE SAMPLER
F OPERATION MODE SELECTABLE:
This complete image processor includes three Corre-
lated Double Samplers (CDSs) and Programmable
Gain Amplifiers (PGAs) to process CCD signals.
1-Channel, 3-Channel CCD Mode, 8Msps
F PROGRAMMABLE GAIN AMPLIFIER:
0dB to +13dB
The VSP3200 is interface compatible with the
VSP3210, which is a 16-bit, one-chip product.
F SELECTABLE OUTPUT MODES:
Normal/Demultiplexed
The VSP3210 is pin-to-pin compatible with VSP3100,
when in demultiplexed output mode.
F OFFSET CONTROL RANGE: ±500mV
F +3V, +5V Digital Output
The VSP3200 and VSP3210 can be operated from 0°C
to +85°C, and are available in LQFP-48 packages.
F LOW POWER: 300mW (typ)
F LQFP-48 SURFACE-MOUNT PACKAGE
VREF
CLP
CK1 CK2
ADCCK
TP0
Reference
Circuit
CM
Timing Generator
Clamp
Clamp
Clamp
REFP
REFN
RINP
CDS
CDS
CDS
PGA
PGA
PGA
AGND
6
OE
10
10
10
10-Bit
DAC
VDRV
16-Bit
A/D
Converter
Digital
Output
Control
GINP
B0-B15
(A0-A2, D0-D9)
MUX
16
6
10-Bit
DAC
BINP
3
Gain
Control
Register
Offset
Register
10
10-Bit
DAC
Register
Port
R
G
B
R
G
B
P/S
Configuration
Register
WRT
RD
6
SCLK
SD
8
6
VSP3200
Copyright © 2000, Texas Instruments Incorporated
SBMS012A
Printed in U.S.A. November, 2000
PACKAGE OPTION ADDENDUM
www.ti.com
21-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
VSP3200Y
VSP3200YG4
VSP3210Y/2K
ACTIVE
ACTIVE
NRND
LQFP
LQFP
LQFP
PT
PT
PT
48
48
48
250
250
RoHS & Green
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 85
VSP3200Y
Samples
Samples
NIPDAU
NIPDAU
VSP3200Y
VSP3210Y
2000 RoHS & Green
0 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Nov-2022
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
VSP3210Y/2K
LQFP
PT
48
2000
330.0
17.4
9.5
9.5
2.0
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
LQFP PT 48
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
VSP3210Y/2K
2000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
VSP3200Y
PT
PT
LQFP
LQFP
48
48
250
250
10x25
10x25
150
150
315 135.9 7.62
315 135.9 7.62
12.2
12.2
11.1 11.25
11.1 11.25
VSP3200YG4
Pack Materials-Page 3
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