VSP5324-Q1 [TI]
汽车类 4 通道 12 位 80MSPS 模数转换器 (ADC);型号: | VSP5324-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 汽车类 4 通道 12 位 80MSPS 模数转换器 (ADC) 转换器 模数转换器 |
文件: | 总65页 (文件大小:3110K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
VSP5324-Q1 4 通道、12 位、80MSPS ADC
1 特性
2 应用
1
•
•
适用于汽车类 应用
具有符合 AEC-Q100 标准的下列结果
•
深度传感:
–
–
–
–
–
位置和接近传感
–
–
–
器件温度等级 2:–40°C 至 +105°C
3D 扫描
器件人体放电模型(HBM) ESD 分类等级 2
器件充电模型 (CDM) ESD 分类等级 C4B
3D 机器视觉
安全和监控
手势控制
•
针对低功耗而设计:
–
单信道接口:
50MSPS 时,每通道 65mW
3 说明
VSP5324-Q1 器件是一款低功耗、12 位、80MSPS、
四通道模数转换器 (ADC)。低功耗和在一个紧凑封装
内的多通道集成使得此器件对于 3D 时差测距 (ToF) 系
统具有很大的吸引力。
–
双信道接口:
80MSPS 时,每通道 82mW
•
•
动态性能:
–
–
–
5MHz 输入频率,80MSPS
信噪比 (SNR):70dBFS
串行低压差分信令 (LVDS) 输出减少了接口线路的数量
并实现高度系统集成。
无杂散动态范围 (SFDR):85dBc
串行低压差分信令 (LVDS) 模数转换器 (ADC) 数据
输出
此器件采用紧凑型 9mm x 9mm VQFN-64 封装。
•
•
•
多种 LVDS 测试模式以验证数据捕捉
封装:9mm x 9mm VQFN-64
工作温度:–40°C 至 +105°C
器件信息(1)
器件型号
封装
VQFN (64)
封装尺寸(标称值)
VSP5324-Q1
9.00mm x 9.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
简化的原理图
信噪比与输入信号频率间的关系
18-V
AVDD LVDD
18-V
71.1
70.6
70.1
69.6
69.1
68.6
VSP5324-Q1
SPI Control
Register
control
Time of Flight
Sensor
Analog Inputs
4-Channel
12-bit ADC
Bit Clock
Frame Clock
LVDS Data
Host
Serializer
Common Mode Voltage (optional)
Reference (optional)
Power
Down
Sampling
Clock
0
10
20
30
40
50
60
70
80
Input Signal Frequency (MHz)
D007
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLES275
VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
www.ti.com.cn
目录
7.2 Functional Block Diagrams ..................................... 19
7.3 Feature Description................................................. 20
7.4 Device Functional Modes........................................ 26
7.5 Programming........................................................... 27
7.6 Register Maps......................................................... 29
Application and Implementation ........................ 51
8.1 Application Information............................................ 51
8.2 Typical Application ................................................. 51
Power Supply Recommendations...................... 53
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 ESD Ratings.............................................................. 6
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information.................................................. 7
6.5 Electrical Characteristics: Dynamic Performance..... 7
6.6 Electrical Characteristics: General............................ 8
6.7 Electrical Characteristics: Digital............................... 9
6.8 Timing Requirements................................................ 9
8
9
10 Layout................................................................... 53
10.1 Layout Guidelines ................................................. 53
10.2 Layout Example .................................................... 54
11 器件和文档支持 ..................................................... 55
11.1 器件支持................................................................ 55
11.2 文档支持................................................................ 56
11.3 接收文档更新通知 ................................................. 56
11.4 社区资源................................................................ 56
11.5 商标....................................................................... 57
11.6 静电放电警告......................................................... 57
11.7 Glossary................................................................ 57
12 机械、封装和可订购信息....................................... 57
6.9 LVDS Timing at Different Sampling Frequencies
(One-Lane Interface, 12x Serialization) ................... 10
6.10 LVDS Timing at Different Sampling Frequencies
(Two-Lane Interface, 6x Serialization) ..................... 10
6.11 Serial Interface Timing Requirements................... 10
6.12 Typical Characteristics.......................................... 12
Detailed Description ............................................ 19
7.1 Overview ................................................................. 19
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Original (December 2014) to Revision A
Page
•
•
已更改 将器件可见性从定制更改为目录.................................................................................................................................. 1
已添加 接收文档更新通知和社区资源 ................................................................................................................................... 56
2
Copyright © 2015–2017, Texas Instruments Incorporated
VSP5324-Q1
www.ti.com.cn
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
5 Pin Configuration and Functions
RGC Package
64-Pin VQFN With Exposed Thermal Pad
Top View
1
2
3
4
5
6
7
8
9
IN1_P
IN1_M
AGND
NC
48
IN4_M
47 IN4_P
46 AGND
45 NC
NC
NC
42
43
AGND
IN2_P
IN2_M
AGND
AGND
42 IN3_M
41 IN3_P
40 AGND
39 NC
Thermal Pad
NC 10
NC
11
12
NC
38
37
LGND
AGND
PD 13
LGND 14
36 LGND
LVDD
35
34
33
OUT1A_P 15
OUT4A_M
OUT4A_P
OUT1A_M
16
NC - No internal connection
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO.
24
23
3
ADCLKM
ADCLKP
Digital output
Digital output
Negative LVDS differential frame clock output pin
Positive LVDS differential frame clock output pin
6
9
AGND
37
40
43
46
50
57
60
Ground
Analog ground pin
AVDD
CLKM
Supply
Analog supply pin, 1.8 V
Negative clock input
Differential clock input: apply differential clocks (sine wave, LVPECL, and LVDS) to CLKP and
CLKM. Single-ended clock input: apply a CMOS clock to CLKP and tie CLKM to ground.
59
Analog input
Copyright © 2015–2017, Texas Instruments Incorporated
3
VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
www.ti.com.cn
Pin Functions (continued)
PIN
TYPE
DESCRIPTION
NAME
NO.
Positive clock input
CLKP
58
Analog input
Differential clock input: apply differential clocks (sine wave, LVPECL, and LVDS) to CLKP and
CLKM. Single-ended clock input: apply a CMOS clock to CLKP and tie CLKM to ground.
CS
61
2
Digital input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Analog input
Serial interface enable pin
IN1_M
IN1_P
IN2_M
IN2_P
IN3_M
IN3_P
IN4_M
IN4_P
Channel 1 negative differential analog input
Channel 1 positive differential analog input
Channel 2 negative differential analog input
Channel 2 positive differential analog input
Channel 3 negative differential analog input
Channel 3 positive differential analog input
Channel 4 negative differential analog input
Channel 4 positive differential analog input
1
8
7
42
41
48
47
Internal and external reference control input pin
Logic high: device uses internal reference
Logic low: device uses external reference
INT/EXT
56
Digital input
LCLKM
LCLKP
26
25
12
14
36
35
4
Digital output
Digital output
Negative LVDS differential bit clock output pin
Positive LVDS differential bit clock output pin
LGND
LVDD
Ground
Supply
Digital ground pin
Digital and LVDS supply pin, 1.8 V
5
10
11
38
39
44
45
51
NC
—
Unused; do not connect
Channel 1A negative LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
OUT1A_M
OUT1A_P
OUT1B_M
OUT1B_P
OUT2A_M
OUT2A_P
OUT2B_M
OUT2B_P
OUT3A_M
OUT3A_P
16
15
18
17
20
19
22
21
30
29
Interface
Interface
Interface
Interface
Interface
Interface
Interface
Interface
Interface
Interface
Channel 1A positive LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
Channel 1B negative LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
Channel 1B positive LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
Channel 2A negative LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
Channel 2A positive LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
Channel 2B negative LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
Channel 2B positive LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
Channel 3A negative LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
Channel 3A positive LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
4
Copyright © 2015–2017, Texas Instruments Incorporated
VSP5324-Q1
www.ti.com.cn
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
Pin Functions (continued)
PIN
TYPE
DESCRIPTION
NAME
NO.
Channel 3B negative LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
OUT3B_M
OUT3B_P
OUT4A_M
OUT4A_P
OUT4B_M
OUT4B_P
PD
28
Interface
Interface
Interface
Interface
Interface
Interface
Digital input
Channel 3B positive LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
27
34
33
32
31
13
Channel 4A negative LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
Channel 4A positive LVDS differential output pin.
This pin can be used with either one- or two-lane interface.
Channel 4B negative LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
Channel 4B positive LVDS differential output pin. This pin is used with two-lane interface.
In one-lane interface, this pin is unused and must be floated without a 100-Ω termination.
Power-down control input pin
Logic high: device is in power-down state; logic low: normal operation
Reference bottom voltage pin
Internal reference mode: the reference bottom voltage (0.45 V) is output on this pin.
External reference mode: the reference bottom voltage (0.45 V) must be externally applied to this
pin. There are no required decoupling capacitors on this pin.
REFB
REFT
54
55
Analog input
Analog input
Reference top voltage pin
Internal reference mode: the reference top voltage (1.45 V) is output on this pin.
External reference mode: reference top voltage (1.45 V) must be externally applied to this pin.
There are no required decoupling capacitors on this pin.
RESET
SCLK
64
63
62
52
Digital input
Digital input
Digital input
Digital output
Serial interface reset pin; active low
Serial interface clock pin
SDATA
SDOUT
Serial interface data pin
Serial interface readout pin
Control input pin synchronizes test patterns across channels.
When unused, this pin should be tied to ground.
SYNC
49
Digital input
Common-mode voltage pin
VCM
53
Analog output Internal reference mode: common-mode voltage output pin, 0.95 V.
External reference mode: reference voltage must be externally applied to this pin.
Copyright © 2015–2017, Texas Instruments Incorporated
5
VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range, unless otherwise noted.(1)
MIN
–0.3
–0.3
MAX
2.2
UNIT
V
AVDD
Supply voltage
LVDD
2.2
V
Ground voltage
Between AGND and LGND
differences
–0.3
–0.3
–0.3
0.3
V
V
V
Digital outputs
Digital inputs (CLKN, CLKP(2), RESET, SCLK,
SDATA, CS, SYNC, PD, INT/EXT)
lesser of 2.2 or (LVDD + 0.3)
lesser of 2.2 or (LVDD + 0.3)
Input voltage
Analog inputs
Input current (all pins except supplies)
Ambient temperature, under bias, TA
Junction temperature, TJ
–0.3
–10
–40
lesser of 2.2 or (LVDD + 0.3)
V
10
mA
°C
°C
°C
105
125
125
Storage temperature, Tstg
–55
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP, CLKN is less than |0.3 V|).
This setting prevents the ESD protection diodes at the clock input pins from turning on.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per AEC Q100-002(1)
Other pins
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per AEC
Q100-011
Corner pins (1, 16, 17,
32, 33, 48, 49, and 64)
±750
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
Over operating free-air temperature range, unless otherwise noted.
MIN
1.7
NOM
1.8
MAX
1.9
UNIT
V(AVDD)
V(LVDD)
VID
Analog supply voltage
Digital supply voltage
V
V
1.7
1.8
1.9
Differential input voltage
Input common-mode voltage
2
VPP
mV
VIC
VIC ± 50
Two-lane LVDS interface
One-lane LVDS interface
Sine wave, ac-coupled
LVPECL, ac-coupled
10
10
80
50
MSPS
MSPS
VPP
VPP
VPP
V
Input clock sample rate
1.5
1.6
0.7
3.3
50%
5
(VCLKP
–
Input clock amplitude
differential
VCLKM
)
LVDS, ac-coupled
LVCMOS, single-ended, ac-coupled
Duty cycle
35%
–40
65%
105
CLOAD
RLOAD
TA
Maximum external capacitance from each output pin to DRGND
Differential resistance between LVDS output pairs (LVDS mode)
Operating free-air
pF
Ω
100
°C
6
Copyright © 2015–2017, Texas Instruments Incorporated
VSP5324-Q1
www.ti.com.cn
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
6.4 Thermal Information
VSP5324-Q1
THERMAL METRIC(1)
RGC (VQFN)
UNIT
64 PINS
20.6
6.1
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
2.7
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ψJB
2.6
RθJC(bot)
0.4
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics: Dynamic Performance
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, sampling frequency = 80 MSPS, 50% clock duty cycle, and –1-
dBFS differential analog input, unless otherwise noted. Minimum and maximum values are across the full temperature range
of TMIN = –40°C to TMAX = 105°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V.
PARAMETER
Resolution
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Bits
12
ƒIN = 5 MHz
68
70
69.5
69.8
69.2
85
dBFS
dBFS
dBFS
dBFS
dBc
SNR
Signal-to-noise ratio
ƒIN = 30 MHz
ƒIN = 5 MHz
ƒIN = 30 MHz
ƒIN = 5 MHz
ƒIN = 30 MHz
ƒIN = 5 MHz
ƒIN = 30 MHz
ƒIN = 5 MHz
ƒIN = 30 MHz
ƒIN = 5 MHz
ƒIN = 30 MHz
ƒIN = 5 MHz
ƒIN = 30 MHz
SINAD
SFDR
THD
Signal-to-noise and distortion ratio
Spurious-free dynamic range
Total harmonic distortion
Second-harmonic distortion
Third-harmonic distortion
64
63
64
64
82
dBc
81.5
78
dBc
dBc
90
dBc
HD2
86
dBc
85
dBc
HD3
82
dBc
91
dBc
Worst spur
(other than second and third harmonics)
83
dBc
ƒ1 = 8 MHz, ƒ2 = 10 MHz,
each tone at –7 dBFS
IMD
Two-tone intermodulation distortion
Crosstalk (far channel)
83
95
1
dBc
10-MHz full-scale signal on aggressor
channel; no input signal applied on victim
channel
dB
Recovery to within 1% (of full-scale) for
6-dB overload with sine-wave input
Clock
cycle
Input overload recovery
For 50-mVPP signal on AVDD supply,
up to 10 MHz, no signal applied to analog
inputs
PSRR
AC power-supply rejection ratio
50
dB
ENOB
DNL
INL
Effective number of bits
Differential nonlinearity
Integral nonlinearity
ƒIN = 5 MHz
ƒIN = 5 MHz
ƒIN = 5 MHz
11.3
±0.2
±0.3
Bits
–0.8
0.8
1
LSBs
LSBs
Copyright © 2015–2017, Texas Instruments Incorporated
7
VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
www.ti.com.cn
6.6 Electrical Characteristics: General
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, sampling frequency = 80 MSPS, 50% clock duty cycle, and –1-
dBFS differential analog input, unless otherwise noted. Minimum and maximum values are across the full temperature range
of TMIN = –40°C to TMAX = 105°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V.
PARAMETER
ANALOG INx_PUT
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Voltage range
2
2
VPP
kΩ
Differential
input
VID
Resistance, at dc
Capacitance, at dc
2.2
550
pF
Analog input bandwidth
MHz
Analog input common-mode current
(per input pin)
µA/
MSPS
1.6
VOC
Common-mode output voltage
VCM output current capability
0.95
5
V
IO(VCM)
mA
DC ACCURACY
Offset error
±5
±20
2
mV
Gain error resulting from internal
reference inaccuracy alone
EGREF
–2
%FS
%FS
EGCHAN Gain error of channel alone
0.5
POWER SUPPLY
80 MSPS
50 MSPS
114
86
135
85
mA
mA
IAVDD
Analog supply current
Output buffer supply current
Analog power
Two-lane LVDS interface, 80 MSPS,
350-mV swing with 100-Ω external
termination
69
56
mA
mA
ILVDD
One-lane LVDS interface, 50 MSPS,
350-mV swing with 100-Ω external
termination
80 MSPS
50 MSPS
205
155
mW
mW
Two-lane LVDS interface, 80 MSPS,
350-mV swing with 100-Ω external
termination
124
101
mW
mW
Digital power LVDS interface
Total power
One-lane LVDS interface, 50 MSPS,
350-mV swing with 100-Ω external
termination
80 MSPS, two-lane LVDS interface
50 MSPS, one-lane LVDS interface
329
256
mW
mW
mW
mW
Global power-down
Standby power
40
135
8
Copyright © 2015–2017, Texas Instruments Incorporated
VSP5324-Q1
www.ti.com.cn
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
6.7 Electrical Characteristics: Digital
At V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, unless otherwise noted. The DC specifications refer to the condition where the digital
outputs do not switch, but are tied permanently to a valid logic level 0 or 1.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INx_PUTS (RESET, SCLK, SDATA, CS, PDN, SYNC, INT/EXT)
All digital inputs support 1.8-V and 3.3-V CMOS
logic levels
VIH
VIL
High-level input voltage
Low-level input voltage
> 1.3
V
V
All digital inputs support 1.8-V and 3.3-V CMOS
logic levels
< 0.4
IIH
IIL
High-level input current
Low-level input current
VIH = 1.8 V
VIL = 0 V
6
µA
µA
< 0.1
DIGITAL OUTPUTS
AVDD –
0.1
VOH
VOL
High-level output voltage
CMOS interface (SDOUT)
CMOS interface (SDOUT)
V
V
Low-level output voltage
0.1
LVDS interface (OUTP, OUTM, LCLKP, LCLKM,
ADCLKP, ADCLKM), with an external 100-Ω
termination
High-level output differential
voltage
VOD(H)
245
420
mV
LVDS interface (OUTP, OUTM, LCLKP, LCLKM,
ADCLKP, ADCLKM), with an external 100-Ω
termination
Low-level output differential
voltage
VOD(L)
VOC
–420
–245
mV
V
Output common-mode voltage
1.05
6.8 Timing Requirements(1)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, sampling frequency = 80 MSPS, sine wave input clock, C(LOAD) = 5
pF, and R(LOAD) = 100 Ω, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN
= –40°C to TMAX = 105°C, V(AVDD) = 1.8 V, and V(LVDD) = 1.7 V to 1.9 V.
MIN
NOM
MAX
UNIT
Aperture delay
4
ns
Aperture delay
matching(2)(3)
Between the two channels of the same device
±175
ps
Between two devices at the same temperature and
LVDD supply
Aperture delay variation
Aperture jitter (RMS)
2.5
320
5
ns
fs
Time to valid data after coming out of partial
power-down mode
50
µs
Wakeup time
ADC latency
Time to valid data after coming out of global
power-down mode
100
11
500
µs
Clock
cycles
One-lane LVDS output interface
Two-lane LVDS output interface
Clock
cycles
15
Data valid to zero crossing of LCLKP, 80 MSPS,
two-lane LVDS
tsu
th
Data setup time
Data hold time(4)
0.61
0.74
ns
ns
Zero crossing of LCLKP to data becoming invalid,
80 MSPS, two-lane LVDS
Input clock rising edge crossover to frame clock
rising edge crossover, two-lane LVDS for
10 ≤ ƒS ≤ 80 MSPS
(11 / 12) ×
tS + td
ns
tp
Clock propagation delay
Delay time
Input clock rising edge crossover to frame clock
rising edge crossover, one-lane LVDS for
10 ≤ ƒS ≤ 65 MSPS
(9 / 12) ×
tS + td
ns
ns
td
6.8
9
11.8
(1) Timing parameters are ensured by design and characterization and are not tested in production.
(2) C(LOAD) is the effective external single-ended load capacitance between each output pin and ground.
(3) R(LOAD) is the differential load resistance between the LVDS output pair.
(4) Data valid refers to a logic high of 100 mV and a logic low of –100 mV.
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Timing Requirements(1) (continued)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, sampling frequency = 80 MSPS, sine wave input clock, C(LOAD) = 5
pF, and R(LOAD) = 100 Ω, unless otherwise noted. Minimum and maximum values are across the full temperature range of TMIN
= –40°C to TMAX = 105°C, V(AVDD) = 1.8 V, and V(LVDD) = 1.7 V to 1.9 V.
MIN
NOM
MAX
UNIT
LVDS bit clock duty cycle
Data fall time
Differential clock duty cycle (LCLKP – LCLKM)
50
%
Rise time measured from –100 mV to 100 mV,
10 MSPS ≤ sampling frequency ≤ 80 MSPS
tf
tr
0.2
0.2
ns
ns
ns
ns
Rise time measured from –100 mV to 100 mV,
10 MSPS ≤ sampling frequency ≤ 80 MSPS
Data rise time
Rise time measured from –100 mV to 100 mV,
10 MSPS ≤ sampling frequency ≤ 80 MSPS
tr(CLK) Output clock rise time
tf(CLK) Output clock fall time
0.18
0.18
Rise time measured from –100 mV to 100 mV,
10 MSPS ≤ sampling frequency ≤ 80 MSPS
6.9 LVDS Timing at Different Sampling Frequencies (One-Lane Interface, 12x Serialization)
See 图 1 and 图 2.
MIN
0.75
0.47
0.25
0.62
0.38
0.19
MAX
UNIT
ƒ(SAMPLE) = 40 MSPS
ƒ(SAMPLE) = 50 MSPS
ƒ(SAMPLE) = 65 MSPS
ƒ(SAMPLE) = 40 MSPS
ƒ(SAMPLE) = 50 MSPS
ƒ(SAMPLE) = 65 MSPS
LCLKP zero-crossing to data becoming
invalid (both edges)
th
ns
Data valid to LCLKP zero-crossing (both
edges)
tsu
ns
6.10 LVDS Timing at Different Sampling Frequencies (Two-Lane Interface, 6x Serialization)
See 图 1 and 图 2.
MIN
1.9
MAX
UNIT
ƒ(SAMPLE) = 40 MSPS
ƒ(SAMPLE) = 50 MSPS
ƒ(SAMPLE) = 65 MSPS
ƒ(SAMPLE) = 40 MSPS
ƒ(SAMPLE) = 50 MSPS
ƒ(SAMPLE) = 65 MSPS
LCLKP zero-crossing to data becoming
invalid (both edges)
th
1.55
1.1
ns
1.44
1.02
0.64
Data valid to LCLKP zero-crossing (both
edges)
tsu
ns
6.11 Serial Interface Timing Requirements
See 图 3.
MIN
MAX
UNIT
MHz
ns
ƒ(SCLK)
tsu(LOADS)
tsu(LOADH)
tsu(D)
SCLK frequency = 1 / tSCLK
SEN to SCLK setup time
SCLK to SEN hold time
SDATA setup time
> DC
33
33
ns
33
ns
th(D)
SDATA hold time
33
ns
10
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OUTx_P
Logic 0
VOD(L) = -350 mV(1)
Logic 1
VOD(H) = 350 mV(1)
OUTx_M
VVIC
OCM
IC
GND
(1) With an external 100-Ω termination..
图 1. LVDS Output Voltage Levels
CLKM
CLKP
Input
Clock
t
PDI
ADCLKM
Frame
Clock
ADCLKP
LCLKM
t
su
t
h
Bit
Clock
LCLKP
t
t
t
t
h
su
h
su
OUT1A, OUT1B
OUT2A, OUT2B
OUT3B, OUT3A
OUT4B, OUT4A
Output
Data
Dn(1)
Dn + 1(1)
图 2. LVDS Mode Timing
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Register Address
Register Data
D15
D14
D13
D12
D11
D10
D7
D6
D5
D4
D3
D2
D1
D0
A7
A6
A5
A4
A3
A2
A1
A0
D9
D8
SDATA
SCLK
th(D)
tsu(D)
tsu(LOADH)
t(SCLK)
tsu(LOADS)
CS
RESET
图 3. Serial Interface Timing
6.12 Typical Characteristics
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-100
-110
-120
-130
-140
0
10
20
30
40
0
10
20
30
40
Frequency (MHz)
Frequency (MHz)
D001
D002
SNR = 69.6 dBFS
SFDR = 89.3 dBc
SINAD = 69.5 dBFS
THD = 85.9 dBc
SNR = 69.6 dBFS
SFDR = 84.8 dBc
SINAD = 69.4 dBFS
THD = 83.2 dBc
Sample Rate = 80 MSPS
Sample Rate = 80 MSPS
图 4. FFT for 5-MHz Input Signal
图 5. FFT for 15-MHz Input Signal
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-100
-110
-120
-130
-140
0
10
20
30
40
0
5
10
15
20
Frequency (MHz)
Frequency (MHz)
D003
D004
SNR = 68.5 dBFS
SFDR = 76.5 dBc
SINAD = 67.8 dBFS
THD = 75 dBc
SNR = 69.8 dBFS
SFDR = 85.1 dBc
SINAD = 69.7 dBFS
THD = 84.7 dBc
Sample Rate = 80 MSPS
Sample Rate = 40 MSPS
图 6. FFT for 65-MHz Input Signal
图 7. FFT For 5-MHz Input Signal
12
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Typical Characteristics (接下页)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
0
-10
0
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-100
-110
-120
-130
-140
0
5
10
15
20
0
5
10
15
20
Frequency (MHz)
Frequency (MHz)
D005
D006
SNR = 69.6 dBFS
SFDR = 86.8 dBc
SINAD = 69.5 dBFS
THD = 84 dBc
SNR = 67.2 dBFS
SFDR = 76.5 dBc
SINAD = 66.6 dBFS
THD = 74 dBc
Sample Rate = 40 MSPS
Sample Rate = 40 MSPS
图 8. FFT for 15-MHz Input Signal
图 9. FFT for 65-MHz Input Signal
71.1
70.6
70.1
69.6
69.1
68.6
90
88
86
84
82
80
78
76
0
10
20
30
40
50
60
70
80
0
10
20
30
40
50
60
70
80
Input Signal Frequency (MHz)
Input Signal Frequency (MHz)
D007
D008
图 10. Signal-to-Noise Ratio (SNR) vs Input Signal
图 11. Spurious-Free-Dynamic Range (SFDR) vs Input Signal
Frequency
Frequency
72
70
68
66
64
62
60
88
fIN = 10.05 (MHz)
fIN = 76.85 (MHz)
fIN = 10.05 (MHz)
fIN = 76.85 (MHz)
86
84
82
80
78
76
74
0
1
2
3
4
5
6
7
8
9
10 11 12
0
1
2
3
4
5
6
7
8
9
10 11 12
Digital Gain (dB)
Digital Gain (dB)
D009
D010
图 12. SNR vs Digital Gain
图 13. SFDR vs Digital Gain
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Typical Characteristics (接下页)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
76
74
72
70
68
66
64
120
100
80
60
40
20
0
72
71.5
71
88
SNR
SFDR
87.5
87
70.5
70
86.5
86
69.5
69
85.5
85
SNR
SFDR (dBc)
SFDR (dBFS)
68.5
68
84.5
84
-50
-40
-30
-20
-10
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2
Input Amplitude (dBFS)
Input Clock Amplitude, Differential (VPP
)
D011
D012
ƒIN = 5 MHz
ƒIN = 5 MHz
图 14. Performance vs Input Signal Amplitude
图 15. Performance vs Input Clock Amplitude
73
72.5
72
88
73
72
71
70
69
68
95
90
85
80
75
70
SNR
THD
SNR
SFDR
87.5
87
71.5
71
86.5
86
70.5
70
85.5
85
69.5
69
84.5
84
68.5
68
83.5
83
35
40
45
50
55
60
65
0.8
0.85
0.9
0.95
1
1.05
1.1
Input Clock Duty Cycle (%)
Analog Input Common-Mode Voltage (V)
D013
D014
ƒIN = 5 MHz
ƒIN = 5 MHz
图 16. Performance vs Input Clock Duty Cycle
图 17. Performance vs Input Common-Mode
73
90
88
86
84
82
80
78
76
74
72
70
70.2
70.1
70
SNR
SFDR
V(AVDD) = 1.65 V
V(AVDD) = 1.7 V
V(AVDD) = 1.8 V
V(AVDD) = 1.9 V
V(AVDD) = 1.95 V
72.5
72
71.5
71
69.9
69.8
69.7
69.6
69.5
69.4
70.5
70
69.5
69
68.5
68
1.3
1.4
1.5
1.6
1.7
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
External Reference Input (V)
Temperature (èC)
D0135
D016
ƒIN = 5 MHz
External reference using the VCM pin
ƒIN = 5 MHz
图 18. Performance in External Reference Mode
图 19. SNR vs AVDD and Temperature
14
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ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
Typical Characteristics (接下页)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
85
84
83
82
81
80
79
78
77
70.2
70.1
70
V(DVDD) = 1.65 V
V(DVDD) = 1.7 V
V(DVDD) = 1.8 V
V(DVDD) = 1.9 V
V(DVDD) = 1.95 V
69.9
69.8
69.7
69.6
69.5
69.4
V(AVDD) = 1.65 V
V(AVDD) = 1.7 V
V(AVDD) = 1.8 V
V(AVDD) = 1.9 V
V(AVDD) = 1.95 V
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
Temperature (èC)
Temperature (èC)
D017
D018
ƒIN = 5 MHz
ƒIN = 5 MHz
图 20. SFDR vs AVDD and Temperature
图 21. SNR vs DVDD and Temperature
85
84
83
82
81
80
79
78
77
70
69.9
69.8
69.7
69.6
69.5
69.4
V(DVDD) = 1.65 V
V(DVDD) = 1.7 V
V(DVDD) = 1.8 V
V(DVDD) = 1.9 V
V(DVDD) = 1.95 V
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
Temperature (èC)
Temperature (èC)
D019
D020
ƒIN = 5 MHz
A 0.7-VPP 5-MHz sine-wave input is applied on the INx_P pin
The INx_M pin is connected to the device VCM pin
图 22. SFDR vs DVDD and Temperature
图 23. SNR vs Temperature For Single-Ended Input
74
0.2
73.5
73
0.1
0
72.5
72
71.5
71
-0.1
70.5
70
-0.2
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
250
750
1250
1750
2250
2750
3250
3750
Temperature (èC)
Output Codes (LSB)
D021
D022
A 0.7-VPP 5-MHz sine-wave input is applied on the INx_P pin
The INx_M pin is connected to the device VCM pin
图 24. SFDR vs Temperature for Single-ended Input
图 25. Integral Nonlinearity
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Typical Characteristics (接下页)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
55
50
45
40
35
30
25
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
240
740
1240
1740
2240
2740
3240
3740
0
10
20
30
40
50
60
70
Output Codes (LSB)
Frequency of CMRR Signal (MHz)
D023
D024
ƒIN = 3 MHz
50-mVPP signal superimposed on the input
common-mode
图 27. CMRR vs Frequency
图 26. Differential Nonlinearity
5
-5
50
40
Low-pass
Band-pass 1
Band-pass 2
High-pass
30
-15
-25
-35
-45
-55
-65
-75
-85
20
10
0
-10
-20
-30
-40
-50
-60
-70
-80
Low-pass
High-pass
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5
Normalized Frequency (fIN/fS)
0
0.1
0.2
0.3
0.4
0.5
Normalized Frequency (fIN/fS)
D025
D026
图 28. Filter Response (Decimate-by-2)
图 29. Filter Response (Decimate-by-4)
3
0
-3
-6
-9
0
-10
-20
-30
-40
-12
-15
-18
-21
-24
-27
-30
-33
-36
-39
-42
-45
-50
-60
K = 2
-70
K = 3
K = 4
K = 5
K = 6
K = 7
K = 8
K = 9
K = 10
-80
-90
-100
-110
-120
-130
-140
0.02
0.1
1
10
20
0
5
10
15
20
Frequency (MHz)
Frequency (MHz)
D027
D028
SNR = 70.8 dBFS
THD = 87.3 dBc
SINAD = 70.7 dBFS
SFDR = 88.7 dBc
Decimate-by-2 filter enabled
图 30. Digital High-Pass Filter Response
图 31. FFT for 5-MHz Input Signal
(Sample Rate = 80 MSPS With Decimation Filter = 2)
16
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Typical Characteristics (接下页)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
0
-10
0
HPF disabled
HPF enabled, K = 2
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-70
-60
-80
-70
-90
-80
-100
-110
-120
-130
-140
-90
-100
-110
-120
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
10
20
30
40
Input Signal Frequency (MHz)
Frequency (MHz)
D029
D030
SNR = 70.8 dBFS
SFDR = 88.7 dBc
SINAD = 70.7 dBFS
THD = 87.3 dBc
图 32. FFT With HPF Enabled and Disabled
图 33. FFT (Full-Band) for 5-MHz Input Signal
(No Input Signal)
(Sample Rate = 80 MSPS With Low-Frequency Noise
Suppression Enabled)
0
-10
0
LF-noise supression enabled
LF-noise supression disabled
LF-noise supression enabled
LF-noise supression disabled
-10
-20
-20
-30
-30
-40
-40
-50
-50
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-130
-140
-100
-110
-120
-130
-140
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Frequency (MHz)
1
39 39.1 39.2 39.3 39.4 39.5 39.6 39.7 39.8 39.9 40
Frequency (MHz)
D031
D032
图 34. FFT (0 MHz to 1 MHz) for 5-MHz Input Signal
(Sample Rate = 80 MSPS With Low-Frequency Noise
Suppression Enabled)
图 35. FFT (39 MHz to 40 MHz) for 5-MHz Input Signal
(Sample Rate = 80 MSPS With Low-Frequency Noise
Suppression Enabled)
120
220
110
100
90
200
180
160
140
120
100
80
80
70
60
50
10
20
30
40
50
60
70
80
10
20
30
40
50
60
70
80
Sampling Frequency (MHz)
Sampling Frequency (MHz)
D033
D034
图 36. Analog Supply Current
图 37. Power Consumption on Analog Supply
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Typical Characteristics (接下页)
Typical values are at 25°C, V(AVDD) = 1.8 V, V(LVDD) = 1.8 V, 80-MSPS sampling clock frequency, 50% clock duty cycle, and
–1-dBFS differential analog input, unless otherwise noted.
130
120
110
100
90
240
220
200
180
160
140
120
100
80
Two-wire
One-wire
One-wire, decimate-by-2
Two-wire
One-wire
One-wire, decimate-by-2
80
70
60
50
40
30
60
10
20
30
40
50
60
70
80
10
20
30
40
50
60
70
80
Sampling Frequency (MHz)
Sampling Frequency (MHz)
D035
D036
图 38. Digital Supply Current
图 39. Power Consumption on Digital Supply
18
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ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
7 Detailed Description
7.1 Overview
The VSP5324-Q1 device is a high-performance, 12-bit, quad-channel, analog-to-digital converter (ADC) with
sample rates up to 80 MSPS. The conversion process is initiated by a rising edge of the external input clock and
when the analog input signal is sampled. The sampled signal is sequentially converted by a series of small
resolution stages, with the outputs combined in a digital correction logic block. At every clock edge the sample
propagates through the pipeline, resulting in a data latency of 11 clock cycles. The output is available as 12-bit
data, in serial (low-voltage differential signaling) LVDS format, coded in either offset binary or binary twos
complement format.
7.2 Functional Block Diagrams
AVDD AGND
LVDD
LGND
Device
OUT1A_P
OUT1A_M
Serializer
Serializer
IN1_P
IN1_M
12-Bit
ADC
Digital
OUT1B_P
OUT1B_M
OUT2A_P
OUT2A_M
Serializer
Serializer
IN2_P
IN2_M
12-Bit
ADC
Digital
Digital
Digital
OUT2B_P
OUT2B_M
OUT3A_P
OUT3A_M
Serializer
Serializer
IN3_P
IN3_M
12-Bit
ADC
OUT3B_P
OUT3B_M
OUT4A_P
OUT4A_M
Serializer
Serializer
IN4_P
IN4_M
12-Bit
ADC
OUT4B_P
OUT4B_M
DC
Clocking
Sync
Signal
Serializer
Clocks
Bit Clock, 3x
LCLKP
LCLKM
Differential and
Single-Ended
Input Clock
CLKP
CLKM
Clock
Buffer
PLL
CLOCKGEN
Frame Clock, 1x
ADCLKP
ADCLKM
ADC Control
Serial
Interface
Reference
SDOUT
图 40. Quad ADC, One-Lane Configuration
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Functional Block Diagrams (接下页)
AVDD AGND
LVDD
LGND
Device
OUT1A_P
OUT1A_M
Serializer
Serializer
IN1_P
IN1_M
12-Bit
ADC
Digital
OUT1B_P
OUT1B_M
OUT2A_P
OUT2A_M
Serializer
Serializer
IN2_P
IN2_M
12-Bit
ADC
Digital
Digital
Digital
OUT2B_P
OUT2B_M
OUT3A_P
OUT3A_M
Serializer
Serializer
IN3_P
IN3_M
12-Bit
ADC
OUT3B_P
OUT3B_M
OUT4A_P
OUT4A_M
Serializer
Serializer
IN4_P
IN4_M
12-Bit
ADC
OUT4B_P
OUT4B_M
DC
Clocking
Sync
Signal
Serializer
Clocks
Bit Clock, 3x
LCLKP
LCLKM
Differential and
Single-Ended
Input Clock
CLKP
CLKM
Clock
Buffer
PLL
CLOCKGEN
Frame Clock, 1x
ADCLKP
ADCLKM
ADC Control
Serial
Interface
Reference
SDOUT
图 41. Quad ADC, Two-Lane Configuration
7.3 Feature Description
7.3.1 Analog Input
The analog input consists of a switched-capacitor-based differential sample-and-hold architecture, as shown in
图 42. This differential topology results in very good AC performance even for high-input frequencies at high
sampling rates. The INx_P and INx_M pins must be externally biased around a common-mode voltage of 0.95 V,
available on the VCM pin. For a full-scale differential input, each input pin (INx_P, INx_M) must swing
symmetrically between VCM + 0.5 V and VCM – 0.5 V, resulting in a 2-VPP differential input swing. The input
sampling circuit has a high 3-dB bandwidth that extends up to 550 MHz (measured from the input pins to the
sampled voltage).
20
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Feature Description (接下页)
SZ
S
R(ON)
R(ON)
C(PAR3)
25 W
100 W
0.3 pF
Sampling
Switch
L(PKG)
2 nH
S
Sampling
Capacitor
15 W
INx_P
R(ON)
C(PAR2)
1 pF
C(SAMP)
4 pF
C(BOND)
10 W
1 kW
1 kW
0.5 pF
R(ESR)
C(PAR1)
0.1 pF
R(ON)
40 Ω
VIC
200 W
L(PKG)
2 nH
C(SAMP)
C(PAR2)
1 pF
R(ON)
4 pF
15 W
10 W
INx_M
Sampling
Capacitor
C(BOND)
0.5 pF
Sampling
Switch
S
R(ON)
R(ON)
R(ESR)
25 W
100 W
200 W
C(PAR3)
0.3 pF
S
SZ
图 42. Analog Input Equivalent Circuit
7.3.1.1 Large- and Small-Signal Input Bandwidth
The analog input circuit small-signal bandwidth is high, approximately 550 MHz. When using an amplifier to drive
the VSP5324-Q1 device, the total amplifier noise up to small-signal bandwidth must be considered. The device
large-signal bandwidth depends on the input signal amplitude. The VSP5324-Q1 device supports 2-VPP
amplitude for input signal frequencies up to 80 MHz. For higher frequencies (greater than 80 MHz), the input
signal amplitude must be decreased proportionally. For example, at 160 MHz, the device supports a maximum of
1-VPP signal.
7.3.2 Digital Processing Block
The VSP5324-Q1 device integrates a set of commonly-used digital functions that can be used to ease system
design such as test patterns and gain.
7.3.2.1 Digital Gain
The VSP5324-Q1 device includes programmable digital gain settings from 0 dB to 12 dB in 1-dB steps. The
benefit of digital gain is to obtain improved SFDR performance. SFDR improvement is achieved at the expense
of SNR; for each gain setting, SNR degrades by approximately 1 dB. Therefore, gain can be used to trade-off
between SFDR and SNR.
For each gain setting, the analog input full-scale range support scales proportionally, as shown in 表 1. After
reset, the device is in 0-dB gain mode. To use other gain settings, program the GAIN_CHx bits in registers 2Ah
(see the Register 2Ah (offset = 2Ah) [reset = 0] section) and 2Bh (see the Register 2Bh (offset = 2Bh) [reset = 0]
section).
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表 1. Analog Input Full-Scale
Range Across Gains
DIGITAL GAIN
(dB)
FULL-SCALE
(VPP
)
0
1
2
1.78
1.59
1.42
1.26
1.12
1.00
0.89
0.80
0.71
0.63
0.56
0.50
2
3
4
5
6
7
8
9
10
11
12
7.3.2.2 ADC Input Polarity Inversion
Normally, the INx_P pin represents the positive analog input pin and INx_M represents the complementary
negative input. Setting the INVERT_ CH[4:1] bits listed in 表 2 (which provide individual control for each channel)
causes the inputs to be swapped. INN now represents the positive input and INx_P represents the negative
input.
表 2. Polarity Inversion
ADDRESS
(HEX)
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
INVERT_
CH4
INVERT_
CH3
INVERT_
CH2
INVERT_
CH1
24
PRBS_SEED[22:16]
X(1)
X
X
X
X
(1) X = don't care.
7.3.2.3 SYNC Function
The SYNC function can be used to synchronize the RAMP test patterns across channels. This function can be
enabled using either the hardware pin (SYNC) or software register bits.
To enable the software sync, set the register bit, EN_SYNC. To use the SYNC pin, set the EN_SYNC and
HARD_SYNC_TP register bits. Note that SYNC pin is disabled after reset.
7.3.2.4 Output Data Format
Two output data formats are supported: twos complement and offset binary. These modes can be selected using
the BTC_MODE serial interface register bit.
For a positive overload, the D[11:0] output data bits are FFFh in offset binary output format and 7FFh in twos
complement output format. For a negative input overload, the output code is 000h in offset binary output format
and 800h in twos complement output format.
22
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7.3.3 Serial LVDS Interface
The VSP5324-Q1 device offers several flexible output options which makes interfacing to an (application-specific
integrated circuit) ASIC or an (field-programmable gate array) FPGA easy. Each option can be easily
programmed using the serial interface. 表 3 lists a summary of all options. This table also lists the default values
after power-up and reset and a detailed description of each option. The output interface options are one-lane and
two-lane serialization, and are described in the One-Lane, 12x Serialization with DDR Bit Clock and 1x Frame
Clock and Two-Lane, 6x Serialization with DDR Bit Clock and 0.5x Frame Clock sections, respectively.
表 3. Summary of Output Interface Options
AVAILABLE IN
ONE-
LANE
TWO-
LANE
DEFAULT AFTER
RESET
FEATURE
OPTIONS
DESCRIPTION
One-lane: ADC data are sent serially
over one pair of LVDS pins
Two-lane: ADC data are split and
sent serially over two pairs of LVDS
pins
Lane interface
One and two lanes
Yes
Yes
One-lane
Serialization factor
12x
6x
Yes
Yes
No
No
No
12x
—
6x
—
—
DDR bit clock frequency
3x
Yes
No
Only with two-lane interface
—
1x sample rate
1/2x sample rate
Byte-wise
Bit-wise
Yes
No
1x
Frame clock frequency
Yes
Yes
Yes
—
Only with two-lane interface
No
Byte-wise
Byte-wise
These options are available only with
two-lane interface.
Byte wise: ADC data are split into
upper and lower bytes that are output
on separate lanes.
No
Bit sequence
Bit wise: ADC data are split into even
and odd bits that are output on
separate lanes.
Word-wise
No
Yes
Byte-wise
Word wise: Successive ADC data
samples are sent over separate
lanes.
7.3.3.1 One-Lane, 12x Serialization with DDR Bit Clock and 1x Frame Clock
The 12-bit ADC data are serialized and output over one LVDS pair per channel along with a 6x bit clock and 1x
frame clock, as shown in 图 43. The output data rate is 12x sample rate and is therefore suited for low sample
rates (typically up to 50 MSPS).
Input Clock
CLK Frequency = fS
Frame Clock
ADCLK Frequency = 1x ƒS
Bit Clock
LCLK Frequency = 6x ƒS
Output Data(1)
D11
(D0)
D10
(D1)
D9
(D2)
D8
(D3)
D7
(D4)
D6
(D5)
D5
(D6)
D4
(D7)
D3
(D8)
D2
(D9)
D1
(D10)
D0
(D11)
D11
(D0)
D10
(D1)
OUT1A, OUT2A, OUT3A, OUT4A
Data Rate = 12x ƒS
Sample N
Sample N + 1
(1) Upper number is the data bit in MSB-first mode. Lower number in parenthesis is the data bit in LSB-first mode.
图 43. LVDS Output Interface, One-Lane, 12x Serialization
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7.3.3.2 Two-Lane, 6x Serialization with DDR Bit Clock and 0.5x Frame Clock
In the two-lane serialization option, the 12-bit ADC data are serialized and output over two LVDS pairs per
channel. The output data rate is a 6x sample rate with a 3x bit clock and a 1x frame clock.
Compared to the one-line scenario, the two-line output data rate is half the amount. This difference allows the
device to be used up to the maximum sampling rate. Two-lane serialization is available in bit-, byte-, and word-
wise modes. 图 44 shows the bit- and byte-wise modes and 图 45 shows the word-wise mode.
Input Clock
CLK Frequency = ƒS
FRAME Clock
ADCLKP, ADCLKM
Frequency = 0.5x ƒS
DDR Bit Clock
LCLK Frequency = 3x ƒSS
Output Data(1)(2)
OUT1B, OUT2B
OUT3B, OUT4B
D11
(D0)
D10
(D1)
D9
(D2)
D8
(D3)
D7
(D4)
D6
(D5)
D11
(D0)
D10
(D1)
D9
(D2)
D8
(D3)
D7
(D4)
D6
(D5)
Output Data(1)(2)
OUT1A, OUT2A
OUT3A, OUT4A
D5
(D6)
D4
(D7)
D3
(D8)
D2
(D9)
D1
(D10)
D0
(D11)
D5
(D6)
D4
(D7)
D3
(D8)
D2
(D9)
D1
(D10)
D0
(D11)
Output Data(1)(2)
OUT1B, OUT2B,
OUT3B, OUT4B
D10
(D1)
D8
(D3)
D6
(D5)
D4
(D7)
D2
(D9)
D0
(D11)
D10
(D1)
D8
(D3)
D6
(D5)
D4
(D7)
D2
(D9)
D0
(D11)
Output Data(1)(2)
OUT1A, OUT2A,
OUT3A, OUT4A
D11
(D0)
D9
(D2)
D7
(D4)
D5
(D6)
D3
(D8)
D1
(D10)
D11
(D0)
D9
(D2)
D7
(D4)
D5
(D6)
D3
(D8)
D1
(D10)
(1) The upper number is the data bit in MSB-first mode. The lower number in parenthesis is the data bit in LSB-first mode.
(2) The unshaded cells indicate sample N data. The shaded cells indicate sample N + 1 data.
图 44. LVDS Output Interface, Two-Lane, 6x Serialization, Byte-Wise and Bit-Wise Modes
Input Clock
CLK Frequency = ƒS
FRAME Clock
ADCLKP, ADCLKM
Frequency = 0.5x ƒS
DDR Bit Clock
LCLK Frequency = 3x ƒS
Output Data(1)(2)
OUT1A, OUT2A
OUT3A, OUT4A
D0
(D11)
D1
(D10)
D2
(D9)
D3
(D8)
D4
(D7)
D5
(D6)
D6
(D5)
D7
(D4)
D8
(D3)
D9
(D2)
D10
(D1)
D11
(D0)
Output Data(1)(2)
OUT1B, OUT2B
OUT3B, OUT4B
D0
(D11)
D1
(D10)
D2
(D9)
D3
(D8)
D4
(D7)
D5
(D6)
D6
(D5)
D7
(D4)
D8
(D3)
D9
(D2)
D10
(D1)
D11
(D0)
(1) The upper number is the data bit in MSB-first mode. The lower number in parenthesis is the data bit in LSB-first mode.
(2) The unshaded cells indicate sample N data. The shaded cells indicate sample N + 1 data.
图 45. LVDS Output Interface, Two-Lane, 6x Serialization, Word-Wise Mode
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7.3.4 Bit Clock Programmability
The VSP5324-Q1 output interface is normally a DDR interface with the LCLK rising and falling edge transitions in
the middle of alternate data windows. 图 46 shows this default phase.
ADCLKP
LCLKP
OUTxy_P
图 46. LCLK Default Phase (PHASE_DDR[1:0] = 10)
The LCLK phase can be programmed relative to the output frame clock and data using the PHASE_DDR[1:0]
bits in 表 4. 图 47 shows the LCLK phase modes.
表 4. Clock Programmability
ADDRESS
(HEX)
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
EN_REF_
VCM0
EN_REF_
VCM1
42
X(1)
X
X
X
X
X
X
X
PHASE_DDR[1:0]
X
X
X
X
(1) X = don't care.
ADCLKP
LCLKP
ADCLKP
LCLKP
OUTxy_P
OUTxy_P
a) PHASE_DDR[1:0] = 00
b) PHASE_DDR[1:0] = 10
ADCLKP
LCLKP
ADCLKP
LCLKP
OUTxy_P
OUTxy_P
c) PHASE_DDR[1:0] = 01
d) PHASE_DDR[1:0] = 11
图 47. LCLK Phase Programmability Modes
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7.3.5 LVDS Output Data and Clock Buffers
图 48 shows the equivalent circuit of each LVDS output buffer. After reset, the buffer presents a 100-Ω output
impedance to match the external 100-Ω termination.
The VID voltage is nominally 350 mV, resulting in an output swing of ±350 mV with 100-Ω external termination.
The buffer output impedance behaves in the same way as a source-side series termination. By absorbing
reflections from the receiver end, the buffer helps improve signal integrity.
Device
VID
OUTxy_P
External
100-W Load
OUTxy_M
RO
1.1 V
VID
图 48. LVDS Buffer Equivalent Circuit
7.4 Device Functional Modes
7.4.1 External Reference Mode Of Operation
The VSP5324-Q1 device supports an external reference mode of operation either by:
•
•
Forcing the reference voltages on the REFT and REFB pins, or by
Applying the reference voltage on the VCM pin.
This mode can be used to operate multiple VSP5324-Q1 chips with the same (externally applied) reference
voltage.
7.4.1.1 Using the REF Pins
For normal operation, the device requires two reference voltages, REFT and REFB. By default, the device
generates these two voltages internally. To enable the external reference mode, set the register bits as listed in
表 5. This procedure powers down the internal reference amplifier and the two reference voltages can be forced
directly on the REFT and REFB pins as (V(REFT) = 1.45 V ± 50 mV) and (V(REFB) = 0.45 V ±50 mV).
Use to calculate the relationship between the ADC full-scale input voltage (VFS) and the applied reference
voltages.
VFS = 2 ´ (V(REFT) - V(REFB)
)
(1)
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Device Functional Modes (接下页)
7.4.1.2 Using the VCM Pin
In this mode, an external reference voltage (VREFIN) can be applied to the VCM pin. Use公式 2 to calculate the
relationship between the ADC full-scale input voltage and VREFIN.
VFS = 2 ´ VREFIN
(2)
To enable this mode, set the register bits as listed in 表 5. This action changes the function of the VCM pin to an
external reference input pin. The voltage applied on VCM must be 1.5 V ±50 mV.
表 5. External Reference Function
FUNCTION
EN_HIGH_ADDRS
EN_EXT_REF
EXT_REF_VCM
External reference using the REFT and REFB pins
External reference using the VCM pin
1
1
1
1
00
11
7.5 Programming
7.5.1 Serial Interface
The VSP5324-Q1 device has a set of internal registers that can be accessed by the serial interface formed by
the CS (serial interface enable), SCLK (serial interface clock), and SDATA (serial interface data) pins. When CS
is low the following occurs:
•
•
•
The serial shift of bits into the device is enabled.
Serial data (on the SDATA pin) are latched at every SCLK rising edge.
The serial data are loaded into the register at every 24th SCLK rising edge.
If the word length exceeds a multiple of 24 bits, the excess bits are ignored. Data can be loaded in multiples of
24-bit words within a single active CS pulse.
The first eight bits form the register address and the remaining 16 bits form the register data. The interface can
function with SCLK frequencies from 15 MHz down to very low speeds (of few Hertz) and also with a non-50%
SCLK duty cycle.
7.5.2 Register Initialization
After power-up, the internal registers must be initialized to the default values. This reset can be accomplished in
one of two ways:
1. A hardware reset is applied by a low-going pulse on the RESET pin (widths greater than 10 ns), as shown in
图 3 and Serial Interface Timing Requirements.
2. A software reset is applied by using the serial interface and setting the RST bit (register 00h, bit D0) high.
This setting initializes the internal registers to default values and then self-resets the RST bit low. In this
case, the RESET pin is kept high (inactive).
See the Serial Interface Timing Requirements section and 图 3 for timing information.
7.5.3 Serial Register Readout
The device includes a mode where the contents of the internal registers can be readback on the SDOUT pin, as
shown in 图 49. This mode can useful as a diagnostic check to verify the serial interface communication between
the external controller and ADC.
By default, after power-up and device reset, the SDOUT pin is high-impedance. When readout mode is enabled
using the READOUT register bit, the SDOUT pin outputs the contents of the selected register serially in the
following sequence:
1. The READOUT register bit must be set to 1 in order for the device to enter readout mode. This setting
disables any further writes into the internal registers, except for the register at address 01h. Note that the
READOUT bit is also located in this register. The device can exit readout mode by writing the READOUT bit
to 0. Only the register contents of address 01h are unable to be read in register readout mode.
2. The read cycle is initiated by clocking the register address A[7:0] on the SDIN pin.
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Programming (接下页)
3. The device serially outputs the contents (D[15:0]) of the selected register on the SDOUT pin.
4. The external controller latches the contents at the SCLK rising edge.
5. The READOUT register bit is set to 0 to exit serial readout mode, which enables all registers of the device to
be written to. At this point, the SDOUT pin enters a high-impedance state.
Register Address (A[7:0]) = 01h
Register Data (D[15:0]) = 0001h
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
SDATA
SCLK
CS
Pin SDOUT becomes active
and forces low.
Pin SDOUT is in the high-impedance state.
SDOUT
a) Enable Serial Readout (READOUT = 1)
Register Data (D[15:0]) = XXXX (don’t care)
Register Address (A[7:0]) = 0Fh
A7
D15
D14
D13
D12
D11
D10
SDATA
SCLK
A6
A5
A4
A3
A2
A1
A0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CS
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
SDOUT
0
0
1
Pin SDOUT outputs contents of register 0x0F in the same cycle, MSB first.
b) Read contents of register 0Fh. This register is initialized with 0200h (previously, the device was in global power down).
图 49. Serial Readout Timing
After reset, the device default states include the following:
•
•
•
•
•
•
The device is in normal operation mode with 12x serialization enabled for all channels.
Output interface is one-lane, 12x serialization with a 6x bit clock and a 1x frame clock frequency.
Data format is LSB-first and offset binary.
Serial readout is disabled.
The PD pin is configured as a global power-down pin.
Digital gain is set to 0 dB.
28
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7.6 Register Maps
表 6. Serial Register Memory Map
ADDRESS
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
00
X(1)
X
X
X
X
X
X
X
X
X
X
X
X
X
X
RST
EN_HIGH_
ADDRS
01
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
READOUT
X
02
0A
EN_SYNC
X
RAMP_PAT_RESET_VAL
PDN_
COM
PLETE
PDN_PIN_
CFG
PDN_
0F
14
1C
X
X
X
X
X
X
X
X
X
X
X
PDN_CH4
PARTIAL
X
X
PDN_CH3
LFNS_CH3
X
X
PDN_CH2
X
X
PDN_CH1
X
LFNS_CH1
X
X
X
X
LFNS_CH4
LFNS_CH2
X
X
EN_
FRAME_
PAT
ADCLKOUT[11:0]
PRBS_SEED[15:0]
23
24
INVERT_
CH4
INVERT_
CH3
INVERT_
CH2
INVERT_
CH1
PRBS_SEED[22:16]
X
X
X
X
X
PRBS_
SEED_
FROM_
REG
DUAL_
CUSTOM_
PAT
SINGLE_
CUSTOM_
PAT
HARD_
SYNC_TP
PRBS_
TP_EN
TP_SOFT_
SYNC
25
X
X
X
X
X
EN_RAMP
BITS_CUSTOM2[13:12]
BITS_CUSTOM1[13:12]
26
27
BITS_CUSTOM1[9:0]
BITS_CUSTOM2[9:0]
X
X
X
X
X
X
X
X
X
X
X
X
EN_BIT
ORDER
28
29
X
X
X
X
X
X
X
X
X
X
X
X
BIT_WISE
X
EN_WORDWISE_BY_CH[7:0]
GLOBAL_
EN_FILTER
X
X
X
X
X
X
X
X
2A
2B
X
X
X
X
X
X
X
X
GAIN_CH2[3:0]
GAIN_CH3[3:0]
X
X
X
X
X
X
X
X
GAIN_CH1[3:0]
GAIN_CH4[3:0]
HPF_EN_
CH1
USE_
FILTER1
2E
30
33
X
X
X
HPF_CORNER _CH1[3:0]
HPF_CORNER _CH2[3:0]
HPF_CORNER _CH3[3:0]
HPF_CORNER _CH4[3:0]
FILTER1_COEFF_SET[2:0]
FILTER2_COEFF_SET[2:0]
FILTER3_COEFF_SET[2:0]
FILTER1_RATE[2:0]
FILTER2_RATE[2:0]
FILTER3_RATE[2:0]
X
X
X
ODD_TAP1
X
X
X
X
HPF_EN_
CH2
USE_
FILTER2
ODD_TAP2
ODD_TAP3
HPF_EN_
CH3
USE_
FILTER3
HPF_EN_
CH4
USE_
FILTER4
35
38
X
X
FILTER4_COEFF_SET[2:0]
X
FILTER4_RATE[2:0]
X
X
X
ODD_TAP4
X
X
X
X
X
X
X
X
X
X
DATA_RATE[1:0]
(1) X = don't care.
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Register Maps (接下页)
表 6. Serial Register Memory Map (接下页)
ADDRESS
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
EN_REF_
VCM0
EN_REF_
VCM1
42
X
X
X
X
X
X
X
X
PHASE_DDR[1:0]
X
X
X
PAT_
DESKEW
45
46
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
PAT_SYNC
X
MSB_
FIRST
BTC_
MODE
ENABLE 46
FALL_SDR
EN_16BIT
X
EN_14BIT
X
EN_12BIT
X
X
X
EN_SDR
EN_2LANE
50
51
53
54
55
ENABLE 50
ENABLE 51
ENABLE 53
ENABLE 54
ENABLE 55
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
MAP_CH12_TO_OUT1B[3:0]
MAP_CH12_TO_OUT2A[3:0]
MAP_CH12_TO_OUT1A[3:0]
MAP_CH12_TO_OUT2B[3:0]
MAP_CH34_TO_OUT3B[3:0]
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
MAP_CH34_TO_OUT3A[3:0]
MAP_CH34_TO_OUT4B[3:0]
MAP_CH34_TO_OUT4A[3:0]
EN_EXT_
REF
F0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
30
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ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
7.6.1 Serial Registers
7.6.1.1 Register 00h (offset = 00h) [reset = 0]
This is a general register.
图 50. Register 00h
D15
D7
D14
D6
D13
D5
D12
D11
D10
D2
D9
D1
D8
X
W-0
D4
X
D3
D0
RST
W-0
W-0
表 7. Register 00h Field Descriptions
Bit
Field
X
Type
W
Reset
Description
D15-D1
D0
0
0
Don't care bits
RST
W
Reset
0 = Normal operation (default)
1 = Self-clearing software reset (after reset, this bit is set to
0)
7.6.1.2 Register 01h (offset = 01h) [reset = 0]
This is a general register.
图 51. Register 01h
D15
D7
D14
D13
D5
D12
D11
D10
D9
D1
D8
X
W-0
D6
X
D4
D3
D2
X
D0
EN_HIGH_ADD
RS
READOUT
W-0
W-0
W-0
W-0
表 8. Register 01h Field Descriptions
Bit
Field
Type
W
Reset
Description
D15-D5
D4
X
0
0
Don't care bits
EN_HIGH_ADDRS
W
Register F0h access
0 = Disables access to register F0h (default)
1 = Enables access to register F0h
D3-D1
D0
X
W
W
0
0
Don't care bits
READOUT
Register mode readout
0 = Normal operation (default)
1 = Register mode readout
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7.6.1.3 Register 02h (offset = 02h) [reset = 0]
This is a general register.
图 52. Register 02h
D15
D7
D14
D6
D13
D12
D11
D10
X
D9
D1
D8
D0
X
EN_SYNC
R/W-0
R/W-0
R/W-0
D5
D4
D3
D2
X
R/W-0
表 9. Register 02h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15-D14
D13
X
0
0
Don't care bits
SYNC enable(1)
EN_SYNC
0 = Normal operation; SYNC feature disabled (default)
1 = SYNC feature enabled to synchronize test patterns
D12-D0
X
R/W
0
Don't care bits
(1) This bit must be set to 1 when the software or hardware SYNC feature is used; see bits D15 and D8 in the Register 25h (offset = 25h)
[reset = 0] section.
7.6.1.4 Register 0Ah (offset = 0Ah) [reset = 0]
This is a general register.
图 53. Register 0Ah
D15
D7
D14
D6
D13
D5
D12
D11
D10
D2
D9
D1
D8
D0
RAMP_PAT_RESET_VAL
R/W-0
D4
D3
RAMP_PAT_RESET_VAL
R/W-0
表 10. Register 0Ah Field Descriptions
Bit
Field
Type
Reset
Description
D15-D0 RAMP_PAT_RESET_VAL
R/W
0
These bits determine the initial value of the ramp pattern after
reset.
32
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7.6.1.5 Register 0Fh (offset = 0Fh) [reset = 0]
This is a power-down mode register. All bits default to 0 after reset.
图 54. Register 0Fh
D15
D14
D13
X
D12
D4
D11
D10
D9
D8
PDN_PIN_CFG
PDN_
COMPLETE
PDN_PARTIAL
R/W-0
R/W-0
R/W-0
R/W-0
D7
D6
X
D5
D3
D2
D1
X
D0
PDN_CH4
R/W-0
PDN_CH3
R/W-0
X
PDN_CH2
R/W-0
PDN_CH1
R/W-0
R/W-0
R/W-0
R/W-0
表 11. Register 0Fh Field Descriptions
Bit
D15-D11
D10
Field
Type
R/W
R/W
Reset
Description
X
0
0
Don't care bits
PDN_PIN_CFG
PD pin configuration
0 = PD pin configured for complete power-down mode
1 = PD pin configured for partial power-down mode
D9
D8
D7
PDN_ COMPLETE
R/W
R/W
R/W
0
0
0
Complete power-down
0 = Normal operation
1
= Register mode for complete power-down (slower
recovery)
PDN_PARTIAL
PDN_CH4
Partial power-down
0 = Normal operation
1 = Partial power-down mode (fast recovery from power-
down)
ADC power-down mode for channel 4
0 = Normal operation
1 = Partial power-down mode (fast recovery from power-
down)
D6
D5
X
R/W
R/W
0
0
Don't care bit
PDN_CH3
ADC power-down mode for channel 3
0 = Normal operation
1 = ADC power-down mode for channel 3
Don't care bits
D4-D3
D2
X
R/W
R/W
0
0
PDN_CH2
ADC power-down mode for channel 2
0 = Normal operation
1 = ADC power-down mode for channel 2
Don't care bit
D1
D0
X
R/W
R/W
0
0
PDN_CH1
ADC power-down mode for channel 1
0 = Normal operation
1 = ADC power-down mode for channel 1
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7.6.1.6 Register 14h (offset = 14h) [reset = 0]
This is a general register.
图 55. Register 14h
D15
D14
D13
D12
D11
D10
D9
D8
X
R/W-0
D7
D6
X
D5
D4
D3
D2
D1
X
D0
LFNS_CH4
R/W-0
LFNS_CH3
R/W-0
X
LFNS_CH2
R/W-0
LFNS_CH1
R/W-0
R/W-0
R/W-0
R/W-0
表 12. Register 14h Field Descriptions
Bit
D15-D8
D7
Field
Type
R/W
R/W
Reset
Description
X
0
0
Don't care bits
LFNS_CH4
Noise-suppression mode selection for channel 4
0 = LFNS disabled (default)
1 = Low-frequency noise-suppression mode enable for
channel 4
D6
D5
X
R/W
R/W
0
0
Don't care bit
LFNS_CH3
Noise-suppression mode selection for channel 3
0 = LFNS disabled (default)
1 = Low-frequency noise-suppression mode enable for
channel 3
D4-D3
D2
X
R/W
R/W
0
0
Don't care bits
LFNS_CH2
Noise-suppression mode selection for channel 2
0 = LFNS disabled (default)
1 = Low-frequency noise-suppression mode enable for
channel 2
D1
D0
X
R/W
R/W
0
0
Don't care bit
LFNS_CH1
Noise-suppression mode selection for channel 1
0 = LFNS disabled (default)
1 = Low-frequency noise-suppression mode enable for
channel 1
34
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ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
7.6.1.7 Register 1Ch (offset = 1Ch) [reset = 0]
This is a test pattern register. All bits default to 0 after reset.
图 56. Register 1Ch
D15
X
D14
D13
D12
D11
D10
D9
D1
D8
D0
EN_FRAME_P
AT
ADCLKOUT[11:0]
R/W-0
D7
R/W-0
D6
R/W-0
D5
D4
D3
D2
ADCLKOUT[11:0]
R/W-0
X
R/W-0
表 13. Register 1Ch Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15
D14
X
0
0
Don't care bit
EN_FRAME_PAT
Frame pattern enable
0 = Normal frame clock operation
1 = Enables the output frame clock to be programmed
through a pattern
D13-D2 ADCLKOUT[11:0]
R/W
R/W
0
0
ADCLK pin frame clock pattern
These bits determine the 12-bit pattern for the frame clock on
the ADCLKP and ADCLKN pins.
D1-D0
X
Don't care bits
7.6.1.8 Register 23h (offset = 23h) [reset = 0]
This is a test pattern register.
图 57. Register 23h
D15
D7
D14
D6
D13
D5
D12
PRBS_SEED[15:0]
R/W-0
D11
D10
D2
D9
D1
D8
D0
D4
D3
PRBS_SEED[15:0]
R/W-0
表 14. Register 23h Field Descriptions
Bit
Field
Type
Reset
Description
D15-D0 PRBS_SEED[15:0]
R/W
0
PRBS pattern seed value, lower bits
These bits determine the PRBS pattern starting seed value of
the lower 16 bits. (Default = 0)
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7.6.1.9 Register 24h (offset = 24h) [reset = 0]
This is a test pattern register. All bits default to 0 after reset.
图 58. Register 24h
D15
D14
D13
D12
PRBS_SEED[22:16]
R/W-0
D11
D10
D9
D8
X
R/W-0
D7
D6
X
D5
D4
D3
D2
D1
X
D0
INVERT_CH4
R/W-0
INVERT_CH3
R/W-0
X
R/W-0
INVERT_CH2
R/W-0
INVERT_CH1
R/W-0
R/W-0
R/W-0
表 15. Register 24h Field Descriptions
Bit
Field
Type
Reset
Description
D15-D9 PRBS_SEED[22:16]
R/W
0
PRBS pattern seed value, upper bits
These bits determine the PRBS pattern starting seed value of
the upper seven bits.
D8
D7
X
R/W
R/W
0
0
Don't care bit
INVERT_CH4
Analog input pin polarity for channel 4
0 = Normal configuration (default)
1 = Electrically swaps the analog input pin polarity for
channel 4
D6
D5
X
R/W
R/W
0
0
Don't care bit
INVERT_CH3
Analog input pin polarity for channel 3
0 = Normal configuration (default)
1 = Electrically swaps the analog input pin polarity for
channel 3
D4-D3
D2
X
R/W
R/W
0
0
Don't care bits
INVERT_CH2
Analog input pin polarity for channel 2
0 = Normal configuration (default)
1 = Electrically swaps the analog input pin polarity for
channel 2
D1
D0
X
R/W
R/W
0
0
Don't care bit
INVERT_CH1
Analog input pin polarity for channel 1
0 = Normal configuration (default)
1 = Electrically swaps the analog input pin polarity for
channel 1
36
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ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
7.6.1.10 Register 25h (offset = 25h) [reset = 0]
This is a test pattern register. All bits default to 0 after reset.
图 59. Register 25h
D15
D14
D13
D12
D11
D10
X
D9
D1
D8
HARD_SYNC_ PRBS_SEED_ PRBS_MODE_ PRBS_TP_EN
TP_SOFT_SYN
C
TP
FROM_REG
R/W-0
2
R/W-0
R/W-0
R/W-0
D4
R/W-0
D2
R/W-0
D0
D7
X
D6
D5
D3
EN_RAMP
DUAL_CUSTO SINGLE_CUST
BITS_CUSTOM2[13:12]
BITS_CUSTOM1[13:12]
M_PAT
OM_PAT
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
表 16. Register 25h Field Descriptions
Bit
Field
Type
Reset
Description
D15
HARD_SYNC_TP
R/W
0
Sync test pattern selection
0 = Inactive
1
= External SYNC feature enabled for syncing test
patterns
D14
PRBS_SEED_FROM_REG
R/W
0
PRBS seed selection
0 = Disabled
1 = Selection of PRBS seed from registers 23h and 24h
enabled
D13
D12
PRBS_MODE_2
PRBS_TP_EN
R/W
R/W
0
0
PRBS mode selection
This bit sets the PRBS mode of the 9-bit LFSR (the 23-bit LFSR
is default).
PRBS test pattern selection
0 = PRBS test pattern disabled
1 = PRBS test pattern enable bit
Don't care bits
D11-D9
D8
X
R/W
R/W
0
0
TP_SOFT_SYNC
Test pattern software sync
0 = No sync
1 = Software sync bit for test patterns on all eight channels
Don't care bit
D7
D6
X
R/W
R/W
0
0
EN_RAMP
Ramp pattern enable
0 = Normal operation
1 = Enables a repeating full-scale ramp pattern on the
outputs. Ensure that bits D4 and D5 are 0.
D5
D4
DUAL_CUSTOM_PAT
SINGLE_CUSTOM_PAT
BITS_CUSTOM2[13:12]
R/W
R/W
R/W
0
0
0
Output toggles between two codes
0 = Normal operation
1 = Enables mode where the output toggles between two
defined codes. Ensure that bits D4 and D6 are 0.
Output is defined code
0 = Normal operation
1 = Enables mode where the output is a constant specified
code. Ensure that bits D5 and D6 are 0.
D3-D2
MSB selection for dual patterns
These bits determine two MSBs for the second code of the dual
custom patterns.
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表 16. Register 25h Field Descriptions (接下页)
Bit
Field
Type
Reset
Description
D1-D0
BITS_CUSTOM1[13:12]
R/W
0
MSB selection for single patterns
These bits define two MSBs for the single custom pattern (and
for the first code of the dual custom patterns).
7.6.1.11 Register 26h (offset = 26h) [reset = 0]
This is a test pattern register.
图 60. Register 26h
D15
D14
D13
D5
D12
D11
D10
D2
D9
D1
D8
D0
BITS_CUSTOM1[9:0]
R/W-0
D7
D6
D4
D3
BITS_CUSTOM1[9:0]
R/W-0
X
R/W-0
表 17. Register 26h Field Descriptions
Bit
Field
Type
Reset
Description
D15-D6 BITS_CUSTOM1[9:0]
R/W
0
Lower single custom pattern bits
These bits determine the 10 lower bits for the single custom
pattern (and the first code of the dual custom pattern).
D5-D0
X
R/W
0
Don't care bits
7.6.1.12 Register 27h (offset = 27h) [reset = 0]
This is a test pattern register.
图 61. Register 27h
D15
D14
D13
D5
D12
D11
D10
D2
D9
D1
D8
D0
BITS_CUSTOM2[9:0]
R/W-0
D7
D6
D4
D3
BITS_CUSTOM2[9:0]
R/W-0
X
R/W-0
表 18. Register 27h Field Descriptions
Bit
Field
Type
Reset
Description
D15-D6 BITS_CUSTOM2[9:0]
R/W
0
Lower dual custom pattern bits
These bits determine the 10 lower bits for the second code of
the dual custom pattern.
D5-D0
X
R/W
0
Don't care bits
38
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ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
7.6.1.13 Register 28h (offset = 28h) [reset = 0]
This is an output interface mode register. All bits default to 0 after reset.
图 62. Register 28h
D15
EN_BITORDER
R/W-0
D14
D6
D13
D5
D12
D4
D11
D3
D10
D2
D9
D1
D8
X
BIT_WISE
R/W-0
R/W-0
D7
D0
EN_WORDWISE_BY_CH[7:0]
R/W-0
表 19. Register 28h Field Descriptions
Bit
Field
Type
Reset
Description
Bit order enable(1)
D15
EN_BITORDER
R/W
0
This bit enables the bit order output in two-lane mode.
0 = Byte-wise
1 = Word-wise
Don't care bit
D14-D9
D8
X
R/W
R/W
0
0
BIT_WISE
Bit- or byte-wise selection
This bit selects between byte-wise and bit-wise format.
0 = Byte-wise, the upper bits come are on one lane and the
lower bits are on other lane
1 = Bit-wise, the odd bits come out on one lane and the
even bits come out on other lane
D7-D0
EN_WORDWISE_BY_CH[7:0]
R/W
0
Word-wise enable with channels 7 to 0
0 = Data comes out in two-lane mode with the upper set of
bits on one channel and the lower set of bits on the other
channel
1 = Output format is one sample on one LVDS lane with
the next sample on the other LVDS lane
(1) This bit must set 1 to enable bits D[8:0].
7.6.1.14 Register 29h (offset = 29h) [reset = 0]
This is a digital filter mode register. All bits default to 0 after reset.
图 63. Register 29h
D15
D7
D14
D6
D13
D5
D12
D4
D11
D3
D10
D2
D9
D1
D8
X
R/W-0
D0
X
X
GLOBAL_EN_F
ILTER
R/W-0
R/W-0
R/W-0
表 20. Register 29h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15-D2
D1
X
0
0
Don't care bits
GLOBAL_EN_FILTER
Filter block enable
0 = Inactive
1 = Global control filter blocks enabled
Don't care bit
D0
X
R/W
0
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7.6.1.15 Register 2Ah (offset = 2Ah) [reset = 0]
This is a digital gain mode register. All bits default to 0 after reset.
图 64. Register 2Ah
D15
D7
D14
D6
D13
D5
D12
D4
D11
D3
D10
GAIN_CH2[3:0]
R/W-0
D9
D8
D0
X
R/W-0
D2
D1
X
GAIN_CH1[3:0]
R/W-0
R/W-0
表 21. Register 2Ah Field Descriptions
Bit
D15-D12
Field
Type
R/W
R/W
Reset
Description
X
0
0
Don't care bits
D11-D8 GAIN_CH2[3:0]
Channel 2 gain
These bits set the programmable gain of channel 2
Don't care bits
D7-D4
D3-D0
X
R/W
R/W
0
0
GAIN_CH3[3:0]
Channel 1 gain
These bits set the programmable gain of channel 1
7.6.1.16 Register 2Bh (offset = 2Bh) [reset = 0]
This is a digital gain mode register. All bits default to 0 after reset.
图 65. Register 2Bh
D15
D7
D14
D6
D13
D5
D12
D4
D11
D3
D10
GAIN_CH3[3:0]
R/W-0
D9
D8
D0
X
R/W-0
D2
D1
X
GAIN_CH4[3:0]
R/W-0
R/W-0
表 22. Register 2Bh Field Descriptions
Bit
D15-D12
Field
Type
R/W
R/W
Reset
Description
X
0
0
Don't care bits
D11-D8 GAIN_CH3[3:0]
Channel 3 gain
These bits set the programmable gain of channel 3
Don't care bits
D7-D4
D3-D0
X
R/W
R/W
0
0
GAIN_CH4[3:0]
Channel 4 gain
These bits set the programmable gain of channel 4
40
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7.6.1.17 Register 2Eh (offset = 2Eh) [reset = 0]
This is a digital filter mode register. All bits default to 0 after reset.
图 66. Register 2Eh
D15
X
D14
HPF_EN_CH1
R/W-0
D13
D12
D11
D10
D9
D8
HPF_CORNER _CH1[3:0]
R/W-0
FILTER1_COEFF_SET[2:0]
R/W-0
R/W-0
D7
D6
D5
D4
D3
X
D2
D1
X
D0
FILTER1_COE
FF_SET[2:0]
FILTER1_RATE[2:0]
ODD_TAP1
USE_FILTER1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
表 23. Register 2Eh Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15
D14
X
0
0
Don't care bit
HPF_EN_CH1
Channel 1 HPF filter enable
0 = Disabled
1 = HPF filter enable for channel 1
D13-D10 HPF_CORNER _CH1[3:0]
R/W
R/W
R/W
0
0
0
HPF corner for channel 1
These bits set the HPF corner in values from 2k to 10k.
D9-D7
D6-D4
FILTER1_COEFF_SET[2:0]
FILTER1_RATE[2:0]
Filter 1 coefficient set
These bits select the stored coefficient set for filter 1.
Filter 1 decimation factor
These bits set the decimation factor for filter 2.
Don't care bit
D3
D2
X
R/W
R/W
0
0
ODD_TAP1
Filter 1 odd tap
This bit uses odd tap filter 1.
Don't care bit
D1
D0
X
R/W
R/W
0
0
USE_FILTER1
Channel 1 filter
0 = Disabled
1 = Enables filter for channel 1
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7.6.1.18 Register 30h (offset = 30h) [reset = 0]
This is a digital filter mode register. All bits default to 0 after reset.
图 67. Register 30h
D15
X
D14
HPF_EN_CH2
R/W-0
D13
D12
D11
D10
D9
D8
HPF_CORNER _CH2[3:0]
R/W-0
FILTER2_COEFF_SET[2:0]
R/W-0
R/W-0
D7
D6
D5
D4
D3
X
D2
D1
X
D0
FILTER2_COE
FF_SET[2:0]
FILTER2_RATE[2:0]
ODD_TAP2
USE_FILTER2
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
表 24. Register 30h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15
D14
X
0
0
Don't care bit
HPF_EN_CH2
Channel 2 HPF filter enable
0 = Disabled
1 = HPF filter enable for channel 2
D13-D10 HPF_CORNER _CH2[3:0]
R/W
R/W
R/W
0
0
0
HPF corner for channel 2
These bits set the HPF corner in values from 2k to 10k.
D9-D7
D6-D4
FILTER2_COEFF_SET[2:0]
FILTER2_RATE[2:0]
Filter 2 coefficient set
These bits select the stored coefficient set for filter 2.
Filter 2 decimation factor
These bits set the decimation factor for filter 2.
Don't care bit
D3
D2
X
R/W
R/W
0
0
ODD_TAP2
Filter 2 odd tap
This bit uses odd tap filter 2.
Don't care bit
D1
D0
X
R/W
R/W
0
0
USE_FILTER2
Channel 2 filter
0 = Disabled
1 = Enables filter for channel 2
42
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7.6.1.19 Register 33h (offset = 33h) [reset = 0]
This is a digital filter mode register. All bits default to 0 after reset.
图 68. Register 33h
D15
X
D14
HPF_EN_CH3
R/W-0
D13
D12
D11
D10
D9
D8
HPF_CORNER _CH3[3:0]
R/W-0
FILTER3_COEFF_SET[2:0]
R/W-0
R/W-0
D7
D6
D5
D4
D3
X
D2
D1
D0
FILTER3_COE
FF_SET[2:0]
FILTER3_RATE[2:0]
ODD_TAP3
USE_FILTER3
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
表 25. Register 33h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15
D14
X
0
0
Don't care bit
HPF_EN_CH3
Channel 3 HPF filter enable
0 = Disabled
1 = HPF filter enable for channel 3
D13-D10 HPF_CORNER _CH3[3:0]
R/W
R/W
R/W
0
0
0
HPF corner for channel 3
These bits set the HPF corner in values from 2k to 10k.
D9-D7
D6-D4
FILTER3_COEFF_SET[2:0]
FILTER3_RATE[2:0]
Filter 3 coefficient set
These bits select the stored coefficient set for filter 3.
Filter 3 decimation factor
These bits set the decimation factor for filter 3.
Don't care bit
D3
D2
X
R/W
R/W
0
0
ODD_TAP3
Filter 3 odd tap
This bit uses odd tap filter 3.
Don't care bit
D1
D0
X
R/W
R/W
0
0
USE_FILTER3
Channel 3 filter
0 = Disabled
1 = Enables filter for channel 3
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7.6.1.20 Register 35h (offset = 35h) [reset = 0]
This is a digital filter mode register. All bits default to 0 after reset.
图 69. Register 35h
D15
X
D14
HPF_EN_CH4
R/W-0
D13
D12
D11
D10
D9
D8
HPF_CORNER _CH4[3:0]
R/W-0
FILTER4_COEFF_SET[2:0]
R/W-0
R/W-0
D7
D6
D5
D4
D3
X
D2
D1
X
D0
FILTER4_COE
FF_SET[2:0]
FILTER4_RATE[2:0]
ODD_TAP4
USE_FILTER4
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
表 26. Register 35h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15
D14
X
0
0
Don't care bit
HPF_EN_CH4
Channel 4 HPF filter enable
0 = Disabled
1 = HPF filter enable for channel 4
D13-D10 HPF_CORNER _CH4[3:0]
R/W
R/W
R/W
0
0
0
HPF corner for channel 4
These bits set the HPF corner in values from 2k to 10k.
D9-D7
D6-D4
FILTER4_COEFF_SET[2:0]
FILTER4_RATE[2:0]
Filter 4 coefficient set
These bits select the stored coefficient set for filter 4.
Filter 4 decimation factor
These bits set the decimation factor for filter 4.
Don't care bit
D3
D2
X
R/W
R/W
0
0
ODD_TAP4
Filter 4 odd tap
This bit uses odd tap filter 4.
Don't care bit
D1
D0
X
R/W
R/W
0
0
USE_FILTER4
Channel 4 filter
0 = Disabled
1 = Enables filter for channel 4
7.6.1.21 Register 38h (offset = 38h) [reset = 0x0000]
This is an output interface mode register.
图 70. Register 38h
D15
D7
D14
D6
D13
D5
D12
D11
D10
D2
D9
D1
D8
D0
X
R/W-
D4
D3
X
DATA_RATE[1:0]
R/W-
R/W-
表 27. Register 38h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15-D2
D1-D0
X
0
0
Don't care bits
DATA_RATE[1:0]
Clock rate selection
These bits select the output frame clock rate. (Default = 0)
44
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7.6.1.22 Register 42h (offset = 42h) [reset = 0]
This is an output interface mode register.
图 71. Register 42h
D15
D14
D13
D12
D11
X
D10
D2
D9
D8
D0
EN_REF_VCM
0
R/W-0
R/W-0
D3
D7
X
D6
D5
D4
X
D1
X
PHASE_DDR[1:0]
R/W-0
EN_REF_VCM
1
R/W-0
R/W-0
R/W-0
R/W-0
表 28. Register 42h Field Descriptions
Bit
Field
Type
Reset
Description
D15
EN_REF_VCM0
R/W
0
To enable the external reference mode, the EN_EXT_REF
register bit (register F0h) must be set to 1.
00 = In external reference mode, apply the reference on the
REFT, REFB pins
01, 10 = Don't use
11 = In external reference mode, apply the reference on the
VCM pin
D14-D7
D6-D5
X
R/W
R/W
0
0
Don't care bits
PHASE_DDR[1:0]
These bits control the LCLK output phase relative to data.
(Default = 10)
D4
D3
X
R/W
R/W
0
0
Don't care bit
EN_REF_VCM1
To enable the external reference mode, the EN_EXT_REF
register bit (register F0h) must be set to 1.
00 = In external reference mode, apply the reference on the
REFT, REFB pins
01, 10 = Don't use
11 = In external reference mode, apply the reference on the
VCM pin
D2-D0
X
R/W
0
Don't care bits
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7.6.1.23 Register 45h (offset = 45h) [reset = 0]
This is a test pattern register. All bits default to 0 after reset.
图 72. Register 45h
D15
D7
D14
D6
D13
D5
D12
D4
D11
D10
D2
D9
D8
X
R/W-0
D3
D1
D0
X
PAT_SYNC
R/W-0
PAT_DESKEW
R/W-0
R/W-0
表 29. Register 45h Field Descriptions
Bit
Field
Type
R/W
R/W
Reset
Description
D15-D2
D1
X
0
0
Don't care bits
PAT_SYNC
Sync pattern enable
0 = Inactive
1 = Sync pattern mode enabled; ensure that D0 is 0
D0
PAT_DESKEW
R/W
0
Deskew pattern enable
0 = Inactive
1 = Deskew pattern mode enabled; ensure that D1 is 0
7.6.1.24 Register 46h (offset = 46h) [reset = 0]
This is an output interface mode register. All bits default to 0 after reset.
图 73. Register 46h
D15
ENABLE 46
R/W-0
D14
X
D13
FALL_SDR
R/W-0
D12
X
D11
D10
D9
D8
X
EN_16BIT
R/W-0
EN_14BIT
R/W-0
EN_12BIT
R/W-0
R/W-0
R/W-0
R/W-0
D7
D6
X
D5
D4
D3
D2
D1
X
D0
EN_SDR
R/W-0
MSB_FIRST
R/W-0
BTC_MODE
R/W-0
EN_2LANE
R/W-0
R/W-0
R/W-0
表 30. Register 46h Field Descriptions
Bit
Field
ENABLE 46
Type
Reset
Description
Enable register 46(1)
This bit enables register 46.
Don't care bit
D15
R/W
0
D14
D13
X
R/W
R/W
0
0
FALL_SDR
SDR output mode
0 = At data window edge
1 = The LCLK rising or falling edge control comes in the
middle of the data window when operating in SDR output
mode
D12
D11
X
R/W
R/W
0
0
Don't care bit
EN_16BIT
16-bit mode enable
0 = Inactive
1 = 16-bit serialization mode enabled; ensure bits D[10:9]
are 0
(1) This bit must be set to 1 to enable bits D[13:0].
46
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表 30. Register 46h Field Descriptions (接下页)
Bit
Field
Type
Reset
Description
D10
EN_14BIT
R/W
0
14-bit mode enable
0 = Inactive
1 = 14-bit serialization mode enabled; ensure bits D11 and
D9 are 0
D9
EN_12BIT
R/W
0
12-bit mode enable
0 = Inactive
1 = 12-bit serialization mode enabled; ensure bits D[11:10]
are 0
D8-D5
D4
X
R/W
R/W
0
0
Don't care bits
EN_SDR
Bit clock selection
0 = DDR bit clock
1 = SDR bit clock
D3
D2
MSB_FIRST
BTC_MODE
R/W
R/W
0
0
MSB first selection
0 = LSB first
1 = MSB first
Binary mode selection
0 = Binary offset (ADC data output format)
1 = Binary twos complement (ADC data output format)
Don't care bit
D1
D0
X
R/W
R/W
0
0
EN_2LANE
LVDS output lane selection
0 = One-lane LVDS output
1 = Two-lane LVDS output
7.6.1.25 Register 50h (offset = 50h) [reset = 0]
This is a programmable LVDS mapping mode register. All bits default to 0 after reset.
图 74. Register 50h
D15
ENABLE 50
R/W-0
D14
D13
D12
D4
D11
X
D10
D9
D1
D8
D0
R/W-0
D7
D6
D5
D3
D2
MAP_CH12_TO_OUT1B[3:0]
R/W-0
MAP_CH12_TO_OUT1A[3:0]
R/W-0
表 31. Register 50h Field Descriptions
Bit
Field
Type
Reset
Description
Enable for register 50h(1)
This bit enables register 50h.
Don't care bits
D15
ENABLE 50
R/W
0
D14-D8
D7-D4
X
R/W
R/W
0
0
MAP_CH12_TO_OUT1B[3:0]
OUT1B pin to channel mapping
These bits select the OUT1B pin pair to channel data mapping.
D3-D0
MAP_CH12_TO_OUT1A[3:0]
R/W
0
OUT1A pin to channel mapping
These bits select the OUT1A pin pair to channel data mapping.
(1) This bit must be set to 1 to enable bits D[7:0].
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7.6.1.26 Register 51h (offset = 51h) [reset = 0]
This is a programmable LVDS mapping mode register. All bits default to 0 after reset.
图 75. Register 51h
D15
ENABLE 51
R/W-0
D14
D13
X
D12
D4
D11
D3
D10
D9
D8
D0
MAP_CH12_TO_OUT2B[3:0]
R/W-0
R/W-0
D7
D6
D5
D2
D1
MAP_CH12_TO_OUT2A[3:0]
R/W-0
X
R/W-0
表 32. Register 51h Field Descriptions
Bit
Field
Type
Reset
Description
Enable for register 51h(1)
D15
ENABLE 51
R/W
0
This bit enables register 51h.
Don't care bits
D14-D12
X
R/W
R/W
0
0
D11-D8 MAP_CH12_TO_OUT2B[3:0]
OUT2B pin to channel mapping
These bits select the OUT2B pin pair to channel data mapping.
D7-D4
D3-D0
MAP_CH12_TO_OUT2A[3:0]
X
R/W
R/W
0
0
OUT2A pin to channel mapping
These bits select the OUT2A pin pair to channel data mapping.
Don't care bits
(1) This bit must be set to 1 to enable bits D[7:0].
7.6.1.27 Register 53h (offset = 53h) [reset = 0]
This is a programmable LVDS mapping mode register. All bits default to 0 after reset.
图 76. Register 53h
D15
ENABLE 53
R/W-0
D14
D6
D13
X
D12
D4
D11
D3
D10
D9
D8
D0
MAP_CH34_TO_OUT3B[3:0]
R/W-0
R/W-0
D7
D5
D2
D1
X
R/W-0
表 33. Register 53h Field Descriptions
Bit
Field
ENABLE 53
Type
Reset
Description
Enable register 53h(1)
This bit enables register 53h.
Don't care bits
D15
R/W
0
D14-D12
X
R/W
R/W
0
0
D11-D8 MAP_CH34_TO_OUT3B[3:0]
OUT3B pin to channel mapping
These bits select the OUT3B pin pair to channel data mapping.
Don't care bits
D7-D0
X
R/W
0
(1) This bit must be set to 1 to enable bits D[7:0].
48
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7.6.1.28 Register 54h (offset = ) [reset = 0]
This is a programmable LVDS mapping mode register. All bits default to 0 after reset.
图 77. Register 54h
D15
ENABLE 54
R/W-0
D14
D6
D13
D5
D12
D4
D11
X
D10
D2
D9
D1
D8
D0
R/W-0
D7
D3
X
MAP_Ch34_to_OUT3A[3:0]
R/W-0
R/W-0
表 34. Register 54h Field Descriptions
Bit
Field
ENABLE 54
Type
Reset
Description
Enable register 54h(1)
This bit enables register 54h.
Don't care bits
D15
R/W
0
D14-D4
D3-D0
X
R/W
R/W
0
0
MAP_Ch34_to_OUT3A[3:0]
OUT3A pin to channel mapping
These bits select the OUT3A pin pair to channel data mapping.
(1) This bit must be set to 1 to enable bits D[7:0].
7.6.1.29 Register 55h (offset = 55h) [reset = 0]
This is a programmable LVDS mapping mode register. All bits default to 0 after reset.
图 78. Register 55h
D15
ENABLE 55
R/W-0
D14
D13
D12
D4
D11
X
D10
D9
D1
D8
D0
R/W-0
D7
D6
D5
D3
D2
MAP_CH34_TO_OUT4A[3:0]
R/W-0
MAP_CH34_TO_OUT4B[3:0]
R/W-0
表 35. Register 55h Field Descriptions
Bit
Field
Type
Reset
Description
Enable register 55h(1)
This bit enables register 55h.
Don't care bits
D15
ENABLE 55
R/W
0
D14-D8
D7-D4
X
R/W
R/W
0
0
MAP_CH34_TO_OUT4A[3:0]
OUT4A pin to channel mapping
These bits select the OUT4A pin pair to channel data mapping.
D3-D0
MAP_CH34_TO_OUT4B[3:0]
R/W
0
OUT4B pin to channel mapping
These bits select the OUT4B pin pair to channel data mapping.
(1) This bit must be set to 1 to enable bits D[7:0].
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7.6.1.30 Register F0h (offset = F0h) [reset = 0]
This is a general register.
注
The EN_HIGH_ADDRS bit (register 01h, bit D4) must be set to 1 in order to access this
register.
图 79. Register F0h
D15
EN_EXT_REF
R/W-0
D14
D6
D13
D5
D12
D11
X
D10
D2
D9
D1
D8
D0
R/W-0
D7
D4
D3
X
R/W-0
表 36. Register F0h Field Descriptions
Bit
Field
EN_EXT_REF
Type
Reset
Description
D15
R/W
0
Reference mode selection
0 = Internal reference mode enabled (default)
External reference mode enabled. The voltage
1
=
reference can be applied on either the REFP and REFB
pins or the VCM pin.
D7-D0
X
R/W
0
Don't care bits
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The VSP5324-Q1 device is a low power 12-bit, 4-channel ADC customized for time-of-flight applications. The
device accepts four single-ended or differential analog inputs and can be configured to output the digitized data
on 4 or 8 LVDS lanes as per the requirements of the external host receiver. The sampling clock can be fed to the
device using a single-ended or a differential signal. High-speed sampling rates of up to 80 MSPS can be used to
speed up the sensor readout and therefore use longer sensor exposure times without taking a hit on the frame-
rate. The device is controlled using a simple 4-wire SPI. Power constrained systems can additionally make use of
the power-down pin (PD) to take the device quickly in and out of low-power mode. The device uses an internal
reference and internal common-mode voltage by default and has a provision for the use of external reference
and external common-mode voltage inputs.
8.2 Typical Application
18-V
18-V
AVDD LVDD
VSP5324-Q1
SPI Control
Register
control
Time of Flight
Sensor
Analog Inputs
4-Channel
12-bit ADC
Bit Clock
Frame Clock
LVDS Data
Host
Serializer
Common Mode Voltage (optional)
Reference (optional)
Power
Down
Sampling
Clock
图 80. Application Schematic
8.2.1 Design Requirements
For optimum performance, the analog inputs must be driven differentially. If the inputs are driven in a single-
ended manner, capacitors must be placed on the INx_M signals and close to the INx_M pins. An optional 5-Ω to
15-Ω resistor in series with each input pin can be kept to damp out ringing caused by package parasitics. The
drive circuit may have to be designed to minimize the impact of kick-back noise generated by sampling switches
opening and closing inside the ADC, as well as ensuring low insertion loss over the desired frequency range and
matched impedance to the source.
8.2.2 Detailed Design Procedure
8.2.2.1 Drive Circuit Requirements
For optimum performance, the analog inputs must be driven differentially, as shown in 图 81. This architecture
improves the common-mode noise immunity and even-order harmonic rejection. A 5-Ω to 15-Ω resistor in series
with each input pin is recommended to damp out ringing caused by package parasitic. The drive circuit shows an
R-C filter across the analog input pins. The purpose of the filter is to absorb glitches caused by the sampling
capacitors opening and closing.
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Typical Application (接下页)
0.1 mF
10 W
INx_P
Differential
Input
2 pF
Device
INx_M
10 W
0.1 mF
图 81. Analog Input Drive Circuit
8.2.2.2 Clock Input
The VSP5324-Q1 device can function with either single-ended or differential clock inputs. The device can
automatically detect if a single-ended or differential clock is applied. To operate with a single-ended input clock,
CLKP must be driven by a CMOS clock with CLKM tied to GND. 图 82 and 图 83 show the typical single-ended
and differential clock termination schemes (respectively).
CMOS
Clock Input
CLKP
Device
CLKM
图 82. Single-Ended Clock Driving Circuit
0.1 mF
0.1 mF
0.1 mF
CLKP
CLKP
CLKP
R(TERM)
Device
Device
R(TERM)
Device
0.1 mF
0.1 mF
0.1 mF
CLKM
CLKM
CLKM
R(TERM)
a) Differential Sine-Wave Clock Input
b) Differential LVPECL Clock Input
c) Differential LVDS Clock Input
图 83. Differential Clock Driving Circuit
52
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Typical Application (接下页)
8.2.3 Application Curves
73
72
71
70
69
68
95
90
85
80
75
70
70
69.9
69.8
69.7
69.6
69.5
69.4
SNR
SFDR
0.8
0.85
0.9
0.95
1
1.05
1.1
-40 -27.5 -15 -2.5 10 22.5 35 47.5 60 72.5 85
Analog Input Common-Mode Voltage (V)
Temperature (èC)
D014
D020
ƒIN = 5 MHz
A 0.7-VPP 5-MHz sine-wave input is applied on the INx_P pin
The INx_M pin is connected to the device VCM pin
图 84. Performance vs Input Common-Mode
图 85. SNR vs Temperature For Single-Ended Input
9 Power Supply Recommendations
Using an LDO supply with minimal noise on the AVDD supply is recommended. The LVDD supply can be
connected to an LDO or a DC-DC converter. A capacitor with a value of 100 nF per supply pin is recommended
in addition to a 1-µF common decoupling capacitor per rail.
10 Layout
10.1 Layout Guidelines
10.1.1 General Guidelines
The following list includes general layout guidelines. Refer to 图 86 as needed.
•
•
Route the clock input as a differential pair when a differential clock input is used.
When single ended inputs are used, place 100-nF capacitors close to the pins on the INx_M inputs to ensure
that the reference rail is stable. When differential inputs are used, the inputs must be routed as differential
pairs.
•
Route the LVDS clock and data output pairs with 100-Ω differential impedance and length matched as per the
sampling frequency.
10.1.2 Grounding
A single ground plane is sufficient to provide good performance, provided that the analog, digital, and clock
sections of the board are cleanly partitioned.
10.1.3 Supply Decoupling
Minimal external decoupling can be used without loss in performance because the VSP5324-Q1 device already
includes internal decoupling. Note that decoupling capacitors can help filter external power-supply noise, thus the
optimum number of capacitors depends on the actual application. The decoupling capacitors should be placed
very close to the converter supply pins.
版权 © 2015–2017, Texas Instruments Incorporated
53
VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
www.ti.com.cn
Layout Guidelines (接下页)
10.1.4 Exposed Pad
In addition to providing a path for heat dissipation, the pad is also electrically connected to the digital ground
internally. Therefore, soldering the exposed pad to the ground plane is necessary to achieve the best thermal
and electrical performance. For detailed information, see application notes QFN Layout Guidelines and
QFN/SON PCB Attachment.
10.2 Layout Example
Analog input pins
Clock inputs
LVDS clock and data output pairs
Pin 1
The layout in this example uses four single-ended inputs and four LVDS-data outputs. The components that require
special layout attention are shown and are listed in the General Guidelines section. For the two-lane output option,
eight LVDS data pairs are used.
图 86. VSP5324-Q1 Layout Example
54
版权 © 2015–2017, Texas Instruments Incorporated
VSP5324-Q1
www.ti.com.cn
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
11 器件和文档支持
11.1 器件支持
11.1.1 器件命名规则
模拟带宽
孔径延迟
基频功率相对低频值下降 3dB 时的模拟输入频率。
输入采样时钟上升沿与发生采样的实际时间之间的延迟时间。该延迟在各通道中会有所不同。最大差
值被定义为孔径延迟差异(通道间)。
孔径不确定性(抖动) 采样之间孔径延迟时间的变化。
时钟脉宽和占空比 时钟占信号空比是时钟信号保持逻辑高电平的时间(时钟脉宽)与一个时钟信号周期的比率。
占空比通常以百分比的形式表示。理想差分正弦波时钟的占空比为 50%。
最大转换速率 行指定操作时所采用的最大采样率。除非另有说明,所有参数测试均以该采样率执行。
最小转换速率 ADC 正常工作时的最小采样率。
微分非线性 (DNL) 理想 ADC 对模拟输入值进行编码转换时以 1 LSB 为步长。DNL 是指任意单个步长与这一理想
值之间的偏差(以 LSB 为计量单位)。
积分非线性 (INL) INL 是 ADC 传递函数与其最小二乘法曲线拟合所确定的最佳拟合曲线的偏差(以 LSB 为计量单
位)。
增益误差
增益误差是指 ADC 实际输入满量程范围与其理想值的偏差。增益误差以理想输入满量程范围的百分
比形式表示,由两部分组成:基准不精确导致的误差和通道导致的误差。两种误差均以独立形式标
注,分别为 EG(REF) 和 EG(CHAN)。对于一阶近似值,总增益误差为 (Etot ~ EG(REF) + EG(CHAN))。例如,
如果 Etot = ±0.5%,则满量程输入范围为 [(1 – 0.5 / 100) × ƒS(ideal)] 至 [(1 + 0.5 / 100) × ƒS(ideal)]。
偏移误差
温度漂移
偏移误差是指 ADC 实际平均空闲通道输出编码与理想平均空闲通道输出编码之间的差值(以 LSB 数
表示)。该数量通常转换为毫伏。
温度漂移系数(相对于增益误差和偏移误差)指定了参数从 TMIN 到 TMAX 每摄氏度的变化量。此系数
由参数在 TMIN 至 TMAX 范围内的最大变化量除以 TMAX – TMIN 的差值计算得出。
信噪比 (SNR) SNR 是指基频功率 (PS) 与噪底功率 (PN) 的比值,后者不包括直流功率和前 9 个谐波的功率。当基
频的绝对功率用作基准时,SNR 以 dBc(相对于载波的分贝数)为单位;当基频功率被外推至转换
器满量程范围时,SNR 以 dBFS(相对于满量程的分贝数)为单位。
PS
SNR = 10 Log10
PN
(3)
信噪比和失真 (SINAD) SINAD 是指基频功率 (PS) 与所有其他频谱成分(包括噪声 (PN) 和失真 (P(HD)),但不包括
直流)功率的比值。当基频的绝对功率用作基准时,SINAD 以 dBc(相对于载波的分贝数)为单位;
当基频功率被外推至转换器满量程范围时,SINAD 以 dBFS(相对于满量程的分贝数)为单位。
PS
SINAD = 10 Log10
PN + P(HD)
(4)
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55
VSP5324-Q1
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
www.ti.com.cn
器件支持 (接下页)
有效位数 (ENOB) ENOB 测量的是转换器相对于理论限值(基于量化噪声)的性能。
SINAD - 1.76
ENOB =
6.02
(5)
总谐波失真 (THD) THD 是指基频功率 (PS) 与前 9 个谐波的功率 (P(HD)) 的比值。THD 通常以 dBc 为单位(相对
于载波的分贝数)。
PS
THD = 10 Log10
PN
(6)
无杂散动态范围 (SFDR) 基频功率与最高的其他频谱成分(毛刺或谐波)功率的比值。SFDR 通常以 dBc 为单位
(相对于载波的分贝数)。
双频互调失真 (IMD3) IMD3 是基频(ƒ1 和 ƒ2 频率处)功率与最差频谱成分(2 ƒ1 – ƒ2 或 2 ƒ2 – ƒ1 频率处)功
率的比值。当基频的绝对功率用作基准时,IMD3 以 dBc(相对于载波的分贝数)为单位;当基频功
率被外推至转换器满量程范围时,IMD3 以 dBFS(相对于满量程的分贝数)为单位。
直流电源抑制比 (DC PSRR) DC PSSR 是偏移误差变化量与模拟电源电压变化量的比值。DC PSRR 通常以 mV/V
为单位进行表示。
交流电源抑制比 (AC PSRR) AC PSRR 测量的是 ADC 对电源电压变化的抑制能力。如果 ΔV(AVDD) 表示电源电压
的变化,ΔVO 表示 ADC 输出代码的相应变化(以输入为基准),则:
DVO
PSRR = 20 Log10
(Expressed in dBc)
DV(AVDD)
(7)
电压过载恢复 使过载的模拟输入端的误差恢复至 1% 以下所需的时钟周期数。该技术参数的测试方法是分别施加
具有 6dB 正过载和负过载的正弦波信号。然后记录下过载后前几个采样(相对于期望值)的偏差。
共模抑制比 (CMRR) CMRR 测量的是 ADC 对模拟输入共模变化的抑制能力。如果 ΔVIC 为输入引脚的共模电压变
化值,ΔVO 为 ADC 输出代码的相应变化(以输入为基准),则:
DVO
CMRR = 20 Log10
(Expressed in dBc)
DVIC
(8)
串扰(仅限于多通道 ADC) 串扰测量的是目标通道与其相邻通道之间的内部信号耦合。串扰分两种情况:一种是
与紧邻通道(近端通道)之间的耦合,另一种是与跨封装通道(远端通道)之间的耦合。通常采用对
邻近通道施加满量程信号的方式来测量串扰。串扰是指耦合信号功率(在目标通道的输出端测得)与
邻近通道输入端所施加信号功率的比值。串扰通常以 dBc 为单位进行表示。
11.2 文档支持
11.2.1 相关文档
请参阅如下相关文档:
•
•
《QFN 布局指南》
《QFN/SON PCB 连接》
11.3 接收文档更新通知
如需接收文档更新通知,请导航至 TI.com 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
56
版权 © 2015–2017, Texas Instruments Incorporated
VSP5324-Q1
www.ti.com.cn
ZHCSH90A –JANUARY 2015–REVISED DECEMBER 2017
11.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知和修
订此文档。如欲获取此数据表的浏览器版本,请参阅左侧的导航。
版权 © 2015–2017, Texas Instruments Incorporated
57
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
VSP5324TRGCRQ1
ACTIVE
VQFN
RGC
64
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 105
VSP5324T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
VSP5324TRGCRQ1
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
VQFN RGC 64
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
VSP5324TRGCRQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGC 64
9 x 9, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224597/A
www.ti.com
PACKAGE OUTLINE
VQFN - 1 mm max height
RGC0064A
PLASTIC QUADFLAT PACK- NO LEAD
9.15
8.85
A
B
9.15
8.85
PIN 1 INDEX AREA
(0.2)TYP
(0.1)TYP
DETAIL 'A'
DETAIL 'A'
OPTION1
OPTION2
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
2X
7.5
EXPOSED
7.25±0.1
THERMAL PAD
32
17
16
33
SEE DETAIL 'A'
60X
0.5
SYMM
65
2X
7.5
0.3
0.18
64X
0.1
C A B
C
48
1
0.05
PIN1 ID
64
49
(OPTIONAL)
SYMM
0.5
0.3
64X
4219009/A 10/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
RGC0064A
PLASTIC QUADFLAT PACK- NO LEAD
2X(8.8)
2X(7.5)
SEE SOLDER MASK
DETAIL
64X(0.6)
(
7.25)
64
49
1
48
64X(0.24)
60X(0.5)
65
SYMM
2X
2X(7.5)
(8.8)
4X
(1.14)
2X
(1.1)
(0.05)
(TYP)
33
16
45X (Ø0.2)
(TYP) VIA
4X
(1.14)
SYMM
32
17
2X
(1.1)
LAND PATTERN EXAMPLE
SCALE: 10X
SOLDER MASK
OPENING
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED METAL
EXPOSED METAL
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219009/A 10/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN - 1 mm max height
RGC0064A
PLASTIC QUADFLAT PACK- NO LEAD
2X (8.8)
2X(7.5)
SYMM
36X
(0.94)
64x(0.6)
64
49
1
48
65
64X(0.24)
60X(0.5)
2X(0.57)
2X(8.8)
SYMM
2X(7.5)
4X(1.14)
(R0.05)
TYP
33
16
EXPOSED METAL
17
32
4X(1.14)
2X(0.57)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
60% PRINTED COVERAGE BY AREA
SCALE: 12X
4219009/A 10/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
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所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、
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许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。
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束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
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TI
VSP5620
16-Bit, 4-Channel, CCD/CMOS Sensor Analog Front-End with LED DriverWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
VSP5620RSLR
16-Bit, 4-Channel, CCD/CMOS Sensor Analog Front-End with LED DriverWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
VSP5621
16-Bit, 4-Channel, CCD/CMOS Sensor Analog Front-End with LED DriverWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
VSP5621RSLR
16-Bit, 4-Channel, CCD/CMOS Sensor Analog Front-End with LED DriverWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
VSP5622
16-Bit, 4-Channel, CCD/CMOS Sensor Analog Front-End with LED DriverWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
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