WL1831 [TI]

WiLink™8 单频带工业 Wi-Fi®、Bluetooth® 和低功耗蓝牙收发器;


型号：	WL1831
厂家：	TEXAS INSTRUMENTS
描述：	WiLink™8 单频带工业 Wi-Fi®、Bluetooth® 和低功耗蓝牙收发器蓝牙
文件：	总12页 (文件大小：886K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

WL1801, WL1831

ZHCSO12 –MAY 2021

支持Wi-Fi®、Bluetooth® 和低功耗Bluetooth® 的WL18x1 WiLink™ 8 单频带组合

器件

– 能量存储电源转换系统(PCS)

• 楼宇和家居自动化

1 特性

• 一般特性

– 采用Wafer Scale Package (WSP) 封装，PCB

空间占用小

– HVAC 网关

– 恒温器

– 楼宇安全网关

• 工厂自动化

• 电机驱动器

• 电器

– 通过采用多个集成式开关模式电源(DC2DC)，

提供与电池的高效直接连接

– 无缝集成TI Sitara 和其他应用处理器

– 工作温度：-40°C 至+85°C

– 仅定义的用例配置文件中支持105°C 工作温度

范围。

• 零售自动化和支付

• Wi-Fi 连接^®

– 支持IEEE 802.11b/g/n 的基带处理器和射频收

发器

– 实现完整WLAN 解决方案的集成式2.4GHz PA

– 介质访问控制器

• 使用64、128 和256 位WEP、TKIP 或

AES 密钥且基于硬件的加密和解密

• 支持Wi-Fi 保护接入（WPA、WPA2、

WPA3）和IEEE 802.11i

– IEEE 标准802.11d/e/h/i/k/r PICS 兼容

– 802.11v 支持，提供高精度计时和位置近似估计

– 支持4 引脚SDIO 主机接口，包括高速(H3) 和

V3 模式

• 蓝牙^®和低功耗蓝牙（仅限WL1831）

– 兼容蓝牙5.1 安全连接并支持CSA2（声明ID：

D032799）

– 主机控制器接口(HCI) 传输，用于通过UART

进行蓝牙传输

– SBC 编码和A2DP 的专用音频处理器支持

– 双面蓝牙和低功耗蓝牙

– TI 的蓝牙和低功耗蓝牙认证堆栈

• 主要优势

– 支持多种差异化用例，可通过在两极（STA 和

AP）上同时配置WiLink 8，直接连接至不同RF

通道（Wi-Fi 网络）上其他的Wi-Fi 设备

– 提供多种配置方法，一步即可将家用设备连接至

Wi-Fi

– 连接空闲时Wi-Fi 功耗低(< 800µA)

– 可配置的局域网唤醒滤波器可只将系统唤醒

– Wi-Fi 和蓝牙单天线共存

2 应用

• 电网基础设施

– 电表

– 串式逆变器

– 微型逆变器

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SWRS286

WL1801, WL1831

ZHCSO12 –MAY 2021

www.ti.com.cn

3 说明

WiLink^™8 WL18x1 是一款高度集成的单芯片 WLAN、蓝牙和低功耗蓝牙器件，可构成一个完整的独立通信系

统。

该器件是德州仪器 (TI) 的第8 代连接组合芯片。因此，WL18x1 基于经过验证的技术，并完善了 TI 的集成式连接

器件产品系列。该器件具有低电流、面积小和友好共存等特性，因此非常适合移动设备、移动计算机和目录嵌入

式设备应用。TI 提供适用于 Linux^®和 Android^™等高级操作系统的驱动程序。WinCE 以及包括 QNX、

Nucleus、ThreadX 和FreeRTOS 在内的RTOS 等其他驱动程序可通过第三方获得支持。

表3-1. 器件信息

WLAN 2.4GHz SISO

器件

蓝牙、低功耗蓝牙

WL1801

WL1831

✓

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4 系统方框图

图4-1 所示为WL18x1 的系统图。

SDIO Hose I/F

IRAM

Encryption co-

processors

Processor

DRAM

Modem

Packet RAM

PMAC

DMA

Clocks

Power

WLAN MAC

Transceiver

(DRPw)

Clock & Reset

Generator

ELP

Coexistance

Antenna I/F

WLAN Control

WLAN PHY

图4-1. WL18x1 简化Wi-Fi 系统图

PCM/I2S Interface

UART HCI

IROM

Processor

AES

DRAM

Modem

Bluetooth™

Core

Packet RAM

DMA

Clocks

Power

Bluetooth™ MAC

Transceiver

(DRPb)

IROM

Processor

DMA

DRAM

Coexistance

Antenna I/F

Audio Engine

Bluetooth™ PHY

图4-2. WL1831 简化蓝牙系统图

Revision History

注：以前版本的页码可能与当前版本的页码不同

DATE

REVISION

NOTES

Initial Release

May 2021

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Product Folder Links: WL1801 WL1831

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ZHCSO12 –MAY 2021

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5 Chip Packaging and Ordering

5.1 Ordering Information

WSP/CSP (Wafer/Chip Scale Package) 12x11 matrixes with lead-free balls RoHS compliant.

T&R P/N

ROM/SR

ROM

Pitch (mm)

Parts Per Reel

2500

Package

WL1801GYFVR

WL1831GYFVR

0.4

WSP 130 pin

ROM

2500

5.1.1 Device Support Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These

prefixes represent evolutionary stages of product development from engineering prototypes through fully

qualified production devices.

Device development indicator:

Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not

fully comply with TI Specifications. Experimental/Prototype devices are shipped against the following disclaimer:“This product

is still in development and is intended for internal evaluation purposes.”Notwithstanding any provision to the contrary, TI

makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific

purpose, of this device.

Null

Device is qualified and released to production. TI’s standard warranty applies to production devices.

5.2 Chip Marking

Chip Topside

WL18 = WL18xx family

WL18

= Features ( Blank = standard power)

LLLL

= Device Mark 1 & 2

YMLLLLS $$

= 2 digit Date Code

= Lot Trace code

= Assembly Site Code per QSS 005-120

= Fab Code

= Pin one indicator (ﬁlled solid)

5.2.1 Marking System

In order to minimize delivery time to customer for small quantities, TI may ship the device ordered or an

equivalent device currently available that contains at least the functions of the part ordered. From all aspects,

this device will behave exactly the same as the part ordered. For example:

Customer orders device WL1831.

Part shipped may be either WL1831, WL1833, WL1835, or WL1837

Mark 1 indication (first digit):

Mark

WLAN

Tested

Bluetooth

WL180x

Valid

WL183x

Tested

Valid

Mark 2 indication (second digit):

Mark

WLAN 2.4G

WLAN 5G

MIMO 2.4G

WL18x1

WL18x3

WL18x5

WL18x7

Tested

Valid

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ZHCSO12 –MAY 2021

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Mark

WLAN 2.4G

Tested

WLAN 5G

MIMO 2.4G

WL18x1

Valid

WL18x3

WL18x5

WL18x7

Tested

Valid

Tested

Valid

Tested

Valid

5.3 Tape and Reel Information

5.3.1 Tape Direction

5.3.2 Part Direction

5.3.3 Part Orientation

The device is located such as symbolization in upper side and lead pins in lower side.

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5.3.4 Tape Dimensions

Tape Dimensions (12 mm width Tape) (Notes A, B)

1. Tape cover = 9.3mm. The cover tape does not cover the index hole and does not shift to outside from carrier

tape

2. Tape structure

- The carrier tape is made of plastic and the structure is shown in above schematic.

- The device is put on embossed area of carrier tape, and covered by cover tape made of plastic.

3. ESD Countermeasure: Plastic material used in both carrier tape and cover tape are static dissipative

5.3.5 Reel Dimensions

Reel dimension (ø 330 mm Reel, 12 mm width Tape)

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ZHCSO12 –MAY 2021

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1. Material: Polystyrene (Static Dissipative / Antistatic)

5.4 Packaging

• Tape leader fixed by drafting tape.

• Reel is placed in moisture-proof anti-static bag and bag is heat-sealed.

• Reel bag is placed into corrugated fiberboard box. Filler such as cushion is added if space exists inside.

• Reel box is stacked into corrugated fiberboard shipping box.

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6 Mechanical Drawing

DESCRIPTION

MIN

4.59

4.88

0.500

-----

NOM

4.64

4.93

0.538

0.40

0.25

0.21

11x12

-----

MAX

4.69

4.98

0.575

-----

Body size (W, mm) *

Body size (L, mm) *

Overall thickness (t, mm)

Terminal pitch (mm)

Ball / terminal diameter (mm)

Ball height (mm)

0.20

0.12

-----

0.30

-----

Ball matrix footprint (W x L)

Coplanarity at terminal / ball side (mm)

-----

0.05

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重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI

提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OPTION ADDENDUM

www.ti.com

18-May-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

WL1801GYFVR

WL1831GYFVR

ACTIVE

DSBGA

YFV

130

2500 RoHS & Green

SNAGCU

Level-1-260C-UNLIM

-40 to 105

WL18G

ACTIVE

YFV

SNAGCU

WL18G

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

18-May-2021

Addendum-Page 2

重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款 (https:www.ti.com.cn/zh-cn/legal/termsofsale.html) 或 ti.com.cn 上其他适用条款/TI 产品随附的其他适用条款

的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE

邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122

WL1831 [TI]

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