bq500410ARGZT [TI]

Free Positioning, Qi Compliant Wireless Power Transmitter Manager; 免费定位,戚符合无线电源发送器管理器
bq500410ARGZT
型号: bq500410ARGZT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Free Positioning, Qi Compliant Wireless Power Transmitter Manager
免费定位,戚符合无线电源发送器管理器

无线
文件: 总30页 (文件大小:1100K)
中文:  中文翻译
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bq500410A  
www.ti.com  
SLUSB96 – NOVEMBER 2012  
Free Positioning, Qi Compliant Wireless Power Transmitter Manager  
Check for Samples: bq500410A  
1
FEATURES  
DESCRIPTION  
The bq500410A is a free-positioning digital wireless  
power controller that integrates all functions required  
to control wireless power transfer to a WPC compliant  
receiver. It is WPC 1.1 ready and designed for 12-V  
systems but applicable to other supply voltages. The  
bq500410A pings the surrounding environment for  
WPC compliant devices to be powered, safely  
engages the device, reads the packet feedback from  
the powered device, and manages the power  
transfer. A charging area of at least 70 mm x 20 mm  
provides flexible receiver placement on a transmitter  
pad. The bq500410A supports both Parasitic Metal  
Detection (PMOD) and Foreign Object Detection  
(FOD) by continuously monitoring the efficiency of the  
established power transfer, protecting from power lost  
due to metal objects misplaced in the wireless power  
transfer path. Should any abnormal condition develop  
during power transfer, the bq500410A handles it and  
provides fault indicator outputs. Comprehensive  
protection features provide a robust design to protect  
the system in all receiver placements.  
Expanded Free Positioning Using Three Coil  
Transmit Array  
Intelligent Control of Wireless Power Transfer  
Conforms to Wireless Power Consortium  
(WPC) A6 Transmitter Specification  
Digital Demodulation Reduces Components  
WPC1.1 Ready, Including Foreign Object  
Detection (FOD)  
Enhanced Parasitic Metal Detection (PMOD)  
Assures Safety  
Over-Current Protection  
LED Indication of Charging State and Fault  
Status  
APPLICATIONS  
WPC 1.1 Ready Wireless Chargers for:  
Smart Phones and other Handhelds  
Hermetically Sealed Devices and Tools  
Cars and Other Vehicles  
The bq500410A is available in an area saving 48-pin,  
7 mm x 7 mm QFN package and operates over a  
temperature range from –40°C to 110°C.  
Tabletop Charge Surfaces  
See www.ti.com/wirelesspower for More  
Information on TI's Wireless Charging  
Solutions  
Functional Diagram and Efficiency Versus System Output Current  
80  
70  
60  
50  
40  
30  
20  
Transmitter  
Receiver  
Power  
Power  
Stage  
Voltage  
Conditioning  
AC-DC  
Rectification  
Load  
Communication  
BQ500410A  
Controller  
Feedback  
bq51k  
0
1
2
3
4
5
Output Power (W)  
G000  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2012, Texas Instruments Incorporated  
bq500410A  
SLUSB96 – NOVEMBER 2012  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION(1)  
OPERATING  
TEMPERATURE  
RANGE, TA  
TOP-SIDE  
MARKING  
ORDERABLE PART NUMBER  
PIN COUNT  
SUPPLY  
PACKAGE  
bq500410ARGZR  
bq500410ARGZT  
48 pin  
48 pin  
Reel of 2500  
Reel of 250  
QFN  
QFN  
bq500410A  
bq500410A  
-40°C to 110°C  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
MIN  
–0.3  
–0.3  
–0.3  
–40  
MAX  
3.6  
Voltage applied at V33D to DGND  
Voltage applied at V33A to AGND  
3.6  
V
(2)  
Voltage applied to any pin  
3.6  
Storage temperature, TSTG  
150  
°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages referenced to GND.  
2
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SLUSB96 – NOVEMBER 2012  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
3.0  
NOM  
MAX  
3.6  
UNIT  
V
Supply voltage during operation, V33D, V33A  
Operating free-air temperature range  
Junction temperature  
3.3  
V
TA  
TJ  
–40  
110  
110  
°C  
UNITS  
°C/W  
THERMAL INFORMATION  
bq500410A  
RGZ  
48 PINS  
27.1  
THERMAL METRIC(1)  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
θJCtop  
θJB  
12.9  
4.3  
ψJT  
0.2  
ψJB  
4.3  
θJCbot  
0.6  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-  
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
Spacer  
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SLUSB96 – NOVEMBER 2012  
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ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
NOM  
MAX  
UNIT  
SUPPLY CURRENT  
IV33A  
V33A = 3.3 V  
8
42  
52  
15  
55  
60  
IV33D  
ITotal  
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS  
Supply current  
V33D = 3.3 V  
mA  
V33D = V33A = 3.3 V  
V33  
3.3-V linear regulator  
Emitter of NPN transistor  
3.25  
40  
3.3  
4
3.6  
4.6  
V
V33FB  
IV33FB  
Beta  
3.3-V linear regulator feedback  
Series pass base drive  
Series NPN pass device  
VIN = 12 V; current into V33FB pin  
10  
mA  
EXTERNALLY SUPPLIED 3.3 V POWER  
V33D  
V33A  
Digital 3.3-V power  
Analog 3.3-V power  
TA = 25°C  
TA = 25°C  
3
3
3.6  
3.6  
V
3.3-V slew rate between 2.3 V and 2.9 V,  
V33A = V33D  
V33Slew  
3.3-V slew rate  
0.25  
V/ms  
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_B-  
VCM  
Common mode voltage each pin  
–0.15  
1.631  
V
COMM+,  
COMM-  
Modulation voltage digital resolution  
1
mV  
REA  
Input Impedance  
Ground reference  
0.5  
–5  
1.5  
3
5
MΩ  
IOFFSET  
Input offset current  
1-ksource impedance  
µA  
ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR  
VADC_OPEN  
VADC_SHORT  
VADC_RANGE  
INL  
Voltage indicating open pin  
Voltage indicating pin shorted to GND  
Measurement range for voltage monitoring  
ADC integral nonlinearity  
Input leakage current  
LED_MODE, LOSS_THR open  
LED_MODE, LOSS_THR shorted to ground  
ALL ANALOG INPUTS  
2.37  
0.36  
2.5  
V
0
-2.5  
2.5  
mV  
nA  
Ilkg  
3 V applied to pin  
Ground reference  
100  
RIN  
Input impedance  
8
MΩ  
pF  
CIN  
Input capacitance  
10  
DIGITAL INPUTS/OUTPUTS  
DGND1  
+ 0.25  
VOL  
VOH  
Low-level output voltage  
IOL = 6 mA , V33D = 3 V  
IOH = -6 mA , V33D = 3 V  
V33D  
- 0.6 V  
High-level output voltage  
V
VIH  
High-level input voltage  
Low-level input voltage  
Output high source current  
Output low sink current  
V33D = 3 V  
2.1  
3.6  
1.4  
4
VIL  
V33D = 3.5 V  
IOH(MAX)  
IOL(MAX)  
mA  
4
SYSTEM PERFORMANCE  
VRESET  
tRESET  
fSW  
Voltage where device comes out of reset  
V33D Pin  
2.3  
2
2.4  
V
Pulse width needed for reset  
Switching Frequency  
RESET pin  
µs  
112  
205  
0.5  
kHz  
Time to detect presence of device requesting  
power  
tdetect  
s
4
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SLUSB96 – NOVEMBER 2012  
DEVICE INFORMATION  
Functional Block Diagram  
7
8
9
MSP_RST/LED1  
bq500410A  
LED Control /  
Low Power  
MSP_MISO/LED2  
MSP_TEST  
Supervisor  
Interface  
COMM_A+ 37  
COMM_A- 38  
COMM_B+ 39  
COMM_B- 40  
14 MSP_SYNC  
18 MSP_CLK  
Digital  
Demodulation  
25 MSP_MOSI/LPWR_EN  
26 MSP_RDY  
12 DPWM_A  
15 Coil 1.1  
16 Coil 1.2  
17 Coil 1.3  
FOD  
6
PWM/  
Coil_Select  
Controller  
PMOD 13  
V_IN 46  
V_SENSE 45  
I_SENSE 42  
12-Bit  
ADC  
23 BUZ_AC  
24 BUZ_DC  
Buzzer  
Control  
T_SENSE  
2
1
COIL_PEAK  
LOSS_THR 43  
LED_MODE 44  
Power  
Control  
11 PMB_DATA  
10 PMB_CLK  
I2C  
TEMP_INT  
5
RESET  
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SLUSB96 – NOVEMBER 2012  
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48-Pin RGZ (QFN) Package  
(Top View)  
36  
GND  
COIL_PEAK  
1
35 BPCAP  
T_SENSE  
AD03  
2
3
34  
V33A  
33 V33D  
AD08  
RESET  
4
5
32  
GND  
31  
RESERVED  
RESERVED  
29 RESERVED  
FOD  
6
bq500410A  
30  
MSP_RST/LED1  
MSP_MISO/LED2  
MSP_TEST  
7
8
RESERVED  
28  
27  
26  
25  
9
PMB_CLK  
10  
RESERVED  
EPAD  
49  
PMB_DATA 11  
DPWM_A  
MSP_RDY  
12  
MSP_MOSI/LPWR_EN  
6
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SLUSB96 – NOVEMBER 2012  
Table 1. bq500410A Pin Description  
PIN  
NAME  
I/O  
DESCRIPTION  
NO.  
1
2
COIL_PEAK  
T_SENSE  
I
I
Input from peak detect circuit  
Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply  
connecting to 3.3-V supply  
3
AD03  
This pin can be either connected to GND or left open. Connecting to GND can improve  
layout grounding  
I
4
5
6
AD08  
RESET  
FOD  
I
I
Reserved. Connect to 3.3-V supply  
Device reset. Use 10-kΩ to 100-kΩ pull-up resistor to 3.3-V supply  
FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It  
controls the FOD threshold resistor read at startup.  
O
7
8
MSP_RST/LED1  
MSP_MISO/LED2  
A dual function pin. MSP – RST provides serial communication to the external supervisor.  
LED1 -- If external MSP430 is not used, connect to a (green) LED via 470-Ω resistor for  
status indication. Grounding pin 25 determines this pin's function.  
I
A dual function pin. MSP – MISO provided serial communication to the external supervisor.  
LED2 -- If external MSP430 is not used, connect to a (red) LED via 470-Ω resistor for status  
indication. Grounding pin 25 determines this pin's function.  
I
9
MSP_TEST  
PMB_CLK  
PMB_DATA  
DPWM_A  
PMOD  
I
MSP – Test, If external MSP430 is not used, leave this pin open  
10  
11  
12  
13  
I/O  
I/O  
O
10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only.  
10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only.  
PWM Output to half bridge driver. Switching dead times must be externally generated.  
PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It  
controls the PMOD threshold resistor read at startup.  
O
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
MSP_SYNC  
COIL 1.1  
O
O
O
O
I/O  
O
I
MSP SPI_SYNC, If external MSP430 is not used, leave this pin open  
Enables the first coil drive train and COMM signal selector  
Enables the second coil drive train and COMM signal selector  
Enables the third coil drive train and COMM signal selector  
MSP430 JTAG_CLK, SPI_CLK. Used for boot loading the MSP430 supervisor  
Reserved, leave this pin open.  
COIL 1.2  
COIL 1.3  
MSP_CLK  
RESERVED  
RESERVED  
DOUT_TX  
DOUT_RX  
BUZ_AC  
Reserved, connect to GND.  
I
Reserved, leave this pin open  
I
Reserved, leave this pin open  
O
AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins  
BUZ_DC  
DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected  
to an LED via 470-Ω resistor.  
O
25  
MSP_MOSI/LPWR_EN  
MSP-TDI, SPI-MOSI, Low Standby Power Supervisor Enable. Connect to GND if separate  
MSP430 low power supervisor is not used.  
I/O  
26  
27  
28  
29  
30  
31  
MSP_RDY  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
MSP_RDY, MSP430 Programmed Indication  
Reserved, leave this pin open  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
RESERVED  
Reserved, leave this pin open  
Reserved, leave this pin open  
Reserved, leave this pin open  
Reserved, connect 10-kΩ pull-down resistor to GND. Do not leave open.  
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SLUSB96 – NOVEMBER 2012  
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Table 1. bq500410A Pin Description (continued)  
PIN  
I/O  
DESCRIPTION  
NO.  
32  
NAME  
GND  
GND  
33  
V33D  
Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as  
possible.  
34  
V33A  
Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor  
and additional bypass capacitors  
35  
36  
37  
38  
39  
40  
41  
42  
BPCAP  
GND  
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND  
GND  
COMM_A+  
COMM_A-  
COMM_B+  
COMM_B-  
RESERVED  
I_SENSE  
I
I
I
I
I
I
Digital demodulation noninverting input A, connect parallel to input B+  
Digital demodulation inverting input A, connect parallel to input B-  
Digital demodulation noninverting input B, connect parallel to input A+  
Digital demodulation inverting input B, connect parallel to input A-  
Reserved, leave this pin open  
Transmitter input current, used for parasitic loss calculations. Use 20-mΩ sense resistor and  
A=50 gain current sense amp  
43  
44  
45  
LOSS_THR  
LED_MODE  
V_SENSE  
I
I
I
Input to program foreign metal object detection (FOD) threshold  
LED Mode Select  
Transmitter power train input voltage, used for FOD and Loss calculations. Voltage sample  
point should be after current input sense resistor. Use 76.8-kΩ to 10-kΩ divider to minimize  
quiescent loss.  
46  
47  
48  
49  
V_IN  
I
System input voltage selector. Connect this input to GND for 12-V operation.  
GND  
GND  
I
ADCREF  
EPAD  
External reference voltage input. Connect this input to GND.  
Flood with copper GND plane and stitch vias to PCB internal GND plane  
8
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SLUSB96 – NOVEMBER 2012  
Principles of Operation  
Fundamentals  
The principle of wireless power transfer is simply an open cored transformer consisting of a transmitter and  
receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and  
electronics are typically built into a portable device, such as a cell-phone.  
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs once the transmitter coil is  
driven. The flux is coupled into the secondary coil which induces a voltage and current flows. The secondary  
voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be  
managed via any of various familiar closed-loop control schemes.  
Wireless Power Consortium (WPC)  
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC  
Standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard  
defines the physical parameters and the communication protocol to be used in wireless power. For more  
information, or to download a copy of the WPC specification, go to http://www.wirelesspowerconsortium.com/.  
Power Transfer  
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil  
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.  
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.  
The closer the space between the coils is, the better the coupling. However, the practical distance is set to be  
less than 5 mm, as defined within the WPC Specification, to account for housing and interface surfaces.  
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the  
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to  
contain the fields to avoid coupling to other adjacent system components.  
Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC  
compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed.  
Power transfer is thus regulated by changing the frequency along the resonance curve from 112 kHz to 205 kHz,  
(that is the higher the frequency is, the lower the power). Duty cycle remains constant at 50% throughout the  
power band and is reduced only once 205 kHz is reached.  
The WPC standard describes the dimensions, materials of the coils and information regarding the tuning of the  
coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system  
efficiency.  
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Principles of Operation (continued)  
Communication  
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to  
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to  
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),  
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual  
message and a checksum, as defined by the WPC standard.  
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in  
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side  
electronics and the frequency of its coil-drive output is adjusted to close the regulation loop. The bq500410A  
features internal digital demodulation circuitry.  
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the  
resistive modulation approach, where a resistor is periodically added to the load, Figure 2 shows the resulting  
amplitude change in the transmitter voltage. Figure 2 shows the capacitive modulation approach, where a  
capacitor is periodically added to the load and the resulting amplitude change in the transmitter voltage.  
Rectifier  
Receiver  
Capacitor  
Amax  
Receiver Coil  
Modulation  
Resitor  
Operating state at logic “0”  
Operating state at logic “1”  
A(0)  
A(1)  
Comm  
Fsw  
F, kHz  
a)  
b)  
Figure 1. Receiver Resistive Modulation Circuit  
Rectifier  
Receiver  
Capacitor  
Receiver Coil  
Amax  
Modulation  
Capacitors  
Operating state at logic “ 0”  
Operating state at logic “ 1”  
A(0)  
A(1)  
Comm  
Fsw  
F, kHz  
Fo(1) < Fo(0)  
a)  
b)  
Figure 2. Receiver Capacitive Modulation Circuit  
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The bq500410A  
Description of Operation  
The bq500410A pings the surroundings in 400-ms intervals by sequentially firing the three coils in the array. The  
COMM feedback signal is multiplexed through analog switches and is synchronized to the coil being driven. To  
select the best coil match, the bq500410A looks for the strongest COMM signal. The coil is engaged and driven,  
note that only one coil is driven at a time. The driven coil is tolerant of slight misalignment of the RX while power  
is being transferred. Actually displacing the RX to an adjacent coil while charging is allowable, the sequential  
ping sequence and detection to determine the best matching coil to drive continues to repeat.  
Capacitor Selection  
Capacitor selection is critical to proper system operation. The total capacitance value of 2 nF x 68 nF (+5.6-nF  
center coil) is required in the resonant tank. This is the WPC system compatibility requirement, not a guideline.  
NOTE  
A total capacitance value of 2 nF x 68 nF/100 V (68 nF + 5.6 nF center coil) (C0G  
dielectric type) is required in the resonant tank to achieve the correct resonance  
frequency.  
The capacitors chosen must be rated for at least 100 V and must be of a high quality C0G dielectric (sometimes  
also called NP0). These are typically available in a 5% tolerance, which is adequate. The use of X7R types or  
below is not recommended if WPC compliance is required because critical WPC Certification Testing, such as  
the minimum modulation or ensured power requirements, might fail.  
The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work  
depending on market availability. All capacitors must be of C0G types, not mixed with any other dielectric types.  
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A6 Coil Specification  
The coil and matching capacitor specification for the A6 transmitter has been established by WPC Standard. This  
is fixed and cannot be changed on the transmitter side.  
The bq500410A is primarily intended to drive a 3 coil array but it can also be used to drive a single coil. For  
single coil operation the two outer coils and associated electronics are simply omitted. Please refer to the  
application schematic at the end of this datasheet (See Figure 6).  
Doo  
Dol  
Dil  
Doe  
Figure 3. Coil Specification Drawing  
Table 2. Coil Specification  
PARAMETER  
Outer length  
Inner length  
Outer width  
Inner width  
SYMBOL  
Dol  
SPECIFICATION  
53.2, (±0.5)  
27.5, (±0.5)  
45.2, (±0.5)  
19.5, (±0.5)  
1.5, (±0.5)  
12  
UNIT  
Dil  
Dow  
Diw  
Dc  
mm  
Thickness  
Turns  
N
Turns  
mm  
Layers  
-
1
Odd displacement  
Even displacement  
Doo  
Doe  
49.2, (±4)  
24.6, (±2)  
NOTE  
The performance of an A6 transmitter can vary based on the design of the A6 coil set. For  
best performance with small receiver coils under heavy loading, it is best to design the coil  
set such that the Doo dimension is on the low end of the specified tolerance.  
For a current list of coil vendors please see:  
bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649  
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Option Select Pins  
Two pins (pin 43 and pin 44) on the bq500410A are allocated to program the Loss Threshold and the LED mode  
of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting  
voltage measured in order to identify the value of the attached programming resistor. The values of the operating  
parameters set by these pins are determined using Table 4. For LED_MODE, the selected bin determines the  
LED behavior based on Table 3; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal  
object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section).  
bq500410A  
LED_MODE  
44  
Resistors  
LOSS_THR  
43  
to set  
To 12-bit ADC  
options  
Figure 4. Option Programming  
LED Modes  
The bq500410A can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor  
(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune  
or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.  
The selection resistor connected between pin 44 and GND selects one of the desired LED indication schemes  
presented in Table 3.  
Table 3. LED Modes  
OPERATIONAL STATES  
LED  
LED  
CONTROL  
OPTION  
SELECTION  
RESISTOR  
DESCRIPTION  
LED  
POWER  
TRANSFER  
CHARGE  
COMPLETE  
PMOD or FOD  
WARNING  
STANDBY  
FAULT  
0
1
<36.5 kΩ  
42.2 kΩ  
LEDs off  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2 Red  
Off  
Off  
On  
On  
Off  
Off  
Off  
Off  
Blink slow(1)  
On  
Off  
On  
Off  
On  
Off  
Off  
Off  
Off  
On  
Off  
Blink fast(2)  
Off  
Generic  
Off  
Blink slow(1)  
Off  
2
3
4
48.7 kΩ  
56.2 kΩ  
Generic + standby  
Generic Opt 1  
Off  
Off  
On  
On  
Off  
On  
Blink fast(2)  
Off  
Off  
Blink fast(2)  
On  
LED1, Green  
LED2 Red  
Off  
Off  
64.9 kΩ  
> 75 kΩ  
Generic Opt 2  
Reserved  
On  
Blink fast(2)  
(1) Blink slow = 0.625 Hz  
(2) Blink fast = 2.5 Hz  
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Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)  
The bq500410A is WPC1.1 ready and supports both enhanced PMOD and FOD features by continuously  
monitoring the input voltage and current to calculate input power. Combining input power, known losses, and the  
value of power reported by the RX device being charged, the bq500410A can estimate how much power is  
unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this  
unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power transfer is  
halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the receiver being  
charged.  
PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0  
Specification. The user has the flexibility to adjust the LOSS_THR resistor or to disable PMOD by leaving pin 43  
open should issues with compliance or interoperability arise.  
The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore  
more accurate. Where the WPC1.0 specification requires merely the Rectified Power packet, the WPC1.1  
specification additionally uses the Received Power packet which more accurately tracks power used by the  
receiver.  
As default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting  
point is 400 mW (selected by a 56.2-kΩ resistor on the LOSS_THR option pin 43). If, for some reason, the  
application requires disabling one or the other or setting separate PMOD and FOD thresholds, Figure 5 can be  
used.  
Resistor R39 sets the FOD threshold and R24 sets the PMOD threshold in this configuration. The control lines  
(FOD and PMOD) are driven briefly at power-up when the resistor values are read.  
To selectively disable PMOD support, R24 and Q8-B should be omitted from the above design.  
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Table 4. Option Select Bins  
LOSS THRESHOLD  
BIN NUMBER  
RESISTANCE (kΩ)  
(mW)  
0
1
<36.5  
42.2  
48.7  
56.2  
64.9  
75.0  
86.6  
100  
250  
300  
2
350  
3
400  
4
450  
5
500  
6
550  
7
600  
8
115  
650  
9
133  
700  
10  
11  
12  
13  
154  
750  
800  
178  
205  
850  
>237  
Feature Disabled  
SEE_NOTE  
SEE_NOTE  
R22  
R39  
R24  
Q8-A  
Q8-B  
AGND  
FOD  
PMOD  
Figure 5. LOSS_THR Connection Circuits  
NOTE  
Either one of these circuits is connected to LOSS_THR, but not both.  
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Shut Down by Thermal Sensor or Trigger  
Typical applications of the bq500410A does not require additional thermal protection. This shutdown feature is  
provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1.0-V  
threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shut down.  
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is  
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are  
connected to the bq500410A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the  
system shuts down and a fault is indicated (depending on LED mode chosen).  
To implement this feature follow these steps:  
1. Consult the NTC datasheet and find the resistence vs temperature curve.  
2. Determine the actual temperature where the NTC will be placed by using a thermal probe.  
3. Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.  
4. Use the following formula to determine the upper leg resistor (R_Setpoint):  
R _Setpoint = 2.3´R _NTC  
(1)  
The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature  
is not used, this pin must be pulled high.  
NOTE  
Pin 2 must always be terminated, else erratic behavior may result.  
Fault Handling and Indication  
The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long  
the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the  
condition or fault.  
Table 5. Fault Handling and Indication  
DURATION  
CONDITION  
HANDLING  
(before retry)  
Immediate  
5 seconds  
Infinite  
EPT-00  
EPT-01  
Unknown  
Charge complete  
Internal fault  
EPT-02  
EPT-03  
5 minutes  
Immediate  
Immediate  
Infinite  
Over temperature  
Over voltage  
EPT-04  
EPT-05  
Over current  
EPT-06  
Battery failure  
Reconfiguration  
No response  
EPT-07  
Not applicable  
Immediate  
Immediate  
1 minute  
EPT-08  
OVP (over voltage)  
OC (over current)  
NTC (external sensor)  
5 minutes  
10 seconds LED only,  
2 seconds LED +  
buzzer  
PMOD/FOD warning  
PMOD/FOD  
12 seconds  
5 minutes  
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Power Transfer Start Signal  
The bq500410A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms  
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400  
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized  
indication scheme. Do not exceed 4 mA loading from either of these pins which is more than adequate for small  
signaling and actuation. If not used, these pins should be left open.  
Power-On Reset  
The bq500410A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles  
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.  
External Reset, RESET Pin  
The bq500410A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low  
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ  
pull-up resistor.  
Trickle Charge and CS100  
CS100 is supported. If CS100 is reported by the RX, the bq500410A indicates that charge is complete.  
The WPC specification provides an End-of-Power Transfer message (EPT) to indicate charge complete. Upon  
receipt of the charge complete message, the bq500410A changes the LED indication to solid green LED output  
and halt power transfer for 5 seconds. Subsequently, transmitters pings the receiver again to see if its status has  
changed, assuming it receives another EPT, the LED mode stays the same.  
The WPC specification also provides reporting of the level of battery charge (Charge Status). In some battery  
charging applications there is a benefit to continue the charging process in trickle-charge mode to top off the  
battery. The bq500410A changes the LED indication to reflect charge complete when a 'Charge Status 100%'  
message is received, but unlike the response to an EPT message, it does not halt power transfer while the LED  
is solid green. The RX, the mobile device being charged, uses a CS100 packet to enable trickle charge mode.  
Current Monitoring Requirements  
The bq500410A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be  
provided in the design.  
Current monitoring is optional however, it is used for the foreign metal protection features and over current  
protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant.  
Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This  
would enable a forward migration path to future WPC1.1 compatibility.  
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current  
shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature  
stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed.  
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Over-Current Protection  
The bq500410A has an integrated current protection feature which monitors the input current reported by the  
current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power  
transfer is halted for one minute.  
If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE  
input pin to the bq500410A (pin 42) should be grounded.  
NOTE  
Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor  
circuit or by connecting to ground.  
MSP430G2101 Low Power Supervisor  
This is an optional low-power feature. By adding the MSP430G2101, as recommended in the bq500410A  
application schematic, the bq500410A device is periodically shut down to conserve power, yet all relevant states  
are recalled and all running LED status indicators remain active.  
Since the bq500410A needs an external low-power mode to significantly reduce power consumption, the most  
direct way to reduce power is to remove its supply and completely shut it down. In doing so, however, the  
bq500410A goes through a reset and any data in memory would be lost. Important information regarding charge  
state, fault condition, operating mode and indicator pins driven would be cleared.  
The MSP430G2101, in its role as a low-power supervisor, is used to provide accurate 'ping' timing, retains  
charge state, operating mode, fault condition and all relevant operation states. The LEDs are now driven and  
controlled by the MSP430, not the bq500410A, which directly drives and maintains the LED status indication  
during the bq500410A reset periods. Since the LED indicators are now driven by the MSP430G2101, care  
should be taken not to exceed the pin output current drive limit.  
Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected  
making it possible to achieve Energy Star rating.  
The user does not need to program the MSP430G2101, an off-the-shelf part can be used. The required  
MSP430G2101 firmware is embedded in the bq500410A and is boot loaded at first power up, similar to a field  
update. The MSP430G2101 code cannot be modified by the user.  
NOTE  
The user cannot program the MSP430G2101 in this system.  
All Unused Pins  
All unused pins can be left open unless otherwise indicated. Please refer to Table 1. Grounding of unused pins, if  
it is an option, can improve PCB layout.  
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APPLICATION INFORMATION  
Overview  
The application schematic for the transmitter with reduced standby power is shown in Figure 7.  
CAUTION  
Please check the bq500410A product page for the most up-to-date schematic and list  
of materials reference design package before starting a new project.  
Input Regulator  
The bq500410A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down  
from the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements  
with respect to cost or efficiency.  
The application example circuit utilizes a low-cost buck regulator, TPS54231.  
Power Trains  
The bq500410A drives three independent half bridges. Each half bridge drives one coil from the coil set  
assembly. The TPS28225 is the recommended driver device for this application. It features high-side drive  
capability which enables the use of N-channel MOSFETs throughout. Gate-drive supply can be derived from a  
primitive active voltage divider. A highly regulated supply is not required to drive MOSFET gates.  
Signal Processing Components  
The COMM signal used to control power transfer is derived from the coil voltage. Each coil has its own signal  
processing chain. The coil voltage is AC coupled and divided down to a manageable level and biased to a 1-V  
offset. Series connected diodes are provided for protection from any possible transients. The three signal  
processing chains are then multiplexed together via analog switches. Thus, the correct signal processing chain  
and COMM signal used to control power transfer is from the coil being driven.  
Low-Power Supervisor  
Power reduction is achieved by periodically disabling the bq500410A while LED and housekeeping control  
functions are continued by U4, the low-cost, low quiescent current micro controller MSP430G2101. When U4 is  
present in the circuit (which is set by a pull-up resistor on bq500410A pin 25), the bq500410A at first power-up  
boots the MSP430G2101 with the necessary firmware and the two chips operate in tandem. During standby  
operation, the bq500410A periodically issues SLEEP command, Q1 pulls the supply to the bq500410A, therefore  
eliminating its power consumption. Meanwhile, the MSP430G2101 maintains the LED indication and stores  
previous charge state during this bq500410A reset period. This bq500410A off period is set by the  
MSP430G2101. WPC compliance mandates the power transmitter controller, bq500410A, awakes every 400 ms  
to produce an analog ping and check if a valid device is present. This time constant can not be altered to further  
reduce power.  
Disabling Low-Power Supervisor Mode  
For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for an application schematic  
example.  
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Input Power Requirements  
For full wireless power system capability and WPC compliance, the AC power adapter selected for the  
application should have a minimum rating of 12 V at 750 mA.  
PCB Layout  
Careful PCB layout practice is critical to proper system operation. There are many references on proper PCB  
layout techniques. A few good tips are repeated here:  
The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be  
achieved though not as easily. Ideally, the approach to the layer stack-up has been:  
Layer 1 component placement and as much ground plane as possible.  
Layer 2 clean ground.  
Layer 3 finish routing.  
Layer 4 clean ground.  
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also  
provides a noise free voltage reference plane for device operation.  
Keep as much copper as possible. Make sure the bq500410A GND pins and the power pad have a continuous  
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also  
acts as a heat sink for the bq500410A. A good GND reference is necessary for proper bq500410A operation,  
such as analog-digital conversion, clock stability and best overall EMI performance.  
Separate the analog ground plane from the power ground plane and use only ONE tie point to connect grounds.  
Having several tie points defeats the purpose of separating the grounds!  
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce  
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as  
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.  
The DC-to-DC buck regulator used from the 12-V input supplies the bq500410A with 3.3 V. Typically a single-  
chip controller solution with integrated power FET and synchronous rectifier or outboard diode is used. Pull in the  
buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, full-bridge  
components should be pulled together as tight as possible. See the bq500410A EVM for an example of a good  
layout technique.  
References  
1. Technology, Wireless Power Consortium, http://www.wirelesspowerconsortium.com/  
2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant  
Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401)  
3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number  
SLUSAL8)  
4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas  
Instruments Literature Number SLVSAT9)  
5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635)  
6. Application Note, bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649  
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bq500410A Single, Low-Power and Low-Cost Schematics  
F
6 1 P T  
5 1 P T  
-
N I  
T U O  
+ N I  
A 3 3 V  
D A P E  
9 4  
D N G  
2 3  
4 3  
3 3  
D N G  
6 3  
D N G  
7 4  
D 3 3 V  
D R B _ N I V  
C C V _ 3 V 3  
U T S A T S  
T O I L P  
Figure 6. bq500410A Single Coil Application Diagram  
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F
0 . 0 1  
F
0 . 0 1  
F
0 . 0 1  
2 7 R  
0 8 R  
6 8 R  
0 . 0 1  
0 . 0 1  
0 . 0 1  
2 R  
3 7 R  
1 8 R  
-
N I  
T U O  
+ N I  
A 3 3 V  
D 3 3 V  
D A P E  
4 3  
3 3  
9 4  
2 3  
6 3  
7 4  
D N G  
D N G  
D N G  
D R B _ N I V  
C C V _ 3 V 3  
U T S A T S  
T O I L P  
Figure 7. bq500410A Low-Power Application Diagram  
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F
0 . 0 1  
F
0 . 0 1  
F
0 . 0 1  
2 7 R  
0 8 R  
6 8 R  
0 . 0 1  
0 . 0 1  
0 . 0 1  
2 R  
3 7 R  
1 8 R  
A 3 3 V  
D 3 3 V  
D A P E  
D N G  
D N G  
D N G  
4 3  
3 3  
9 4  
2 3  
6 3  
7 4  
U T S A T S  
C C V  
N I - V 2 1  
C C V  
Figure 8. bq500410A Low-Cost Application Diagram  
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PACKAGE OPTION ADDENDUM  
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12-Nov-2012  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Samples  
Drawing  
(1)  
(2)  
(3)  
(Requires Login)  
BQ500410ARGZR  
ACTIVE  
VQFN  
VQFN  
RGZ  
48  
48  
2500  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
BQ500410ARGZT  
ACTIVE  
RGZ  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
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7-Nov-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ500410ARGZR  
BQ500410ARGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
330.0  
180.0  
16.4  
16.4  
7.3  
7.3  
7.3  
7.3  
1.5  
1.5  
12.0  
12.0  
16.0  
16.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
7-Nov-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ500410ARGZR  
BQ500410ARGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
367.0  
210.0  
367.0  
185.0  
38.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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Applications  
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