XC25BS3X29MX [TOREX]
CMOS Low Power Consumption; CMOS低功耗
| 型号： | XC25BS3X29MX |
| 厂家： | 
Torex Semiconductor |
| 描述： | CMOS Low Power Consumption |
| 文件： | 总10页 (文件大小：626K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
■APPLICATIONS
●Crystal oscillation modules
◆CMOS Low Power Consumption
◆Input Frequency : 14kHz ~ 35MHz
◆Divider Ratio
: 1~ 2047 Divisions
(Laser Trimming)
●Microcontroller
◆Multiplier Ratio
: 20 ~ 2047 Multiplications
(Laser Trimming)
●PDAs
●Portable audio systems
●Various system clocks
◆Comparative Frequency
: 14kHz ~ 500kHz
◆Output Frequency : 9MHz ~ 80MHz
■GENERAL DESCRIPTION
■FEATURES
The XC25BS3 series are high frequency, low power
consumption PLL clock generator ICs with built-in crystal
oscillator circuit, divider circuit & multiplier PLL circuit.
Output Frequency
Reference Oscillation
(fCLKin)
: 9MHz ~ 80MHz (Q0=fCLKin×N/M)
: 14kHz ~ 35MHz
Laser trimming gives the option of being able to select from
divider ratios (M) of 1 to 2047 and multiplier ratio (N) of 20 to
2047. Output frequency (Q0) is equal to reference oscillation
(fCLKin) multiplied by N/M, within a range of 9MHz to 80MHz.
Q1 output is selectable from input reference frequency (f0),
Ground (GND), PLL output frequency/2 (Q0/2), and
comparative frequency/2 (f0/M/2). Reference oscillation can
input 14kHz to 35MHz of reference clock. Further, comparative
frequency, within a range of 14kHz to 500kHz, can be obtained
by dividing the reference oscillation. By halting oscillation via
the CE pin, consumption current can be controlled. Output will
be one of high impedance.
Divider Ratio (M)
Multiplier Ratio (N)
: Selectable from divisions of 1 ~ 2047
: Selectable from multiplications
of 20 ~ 2047
Output
: 3-State
Q1 output selectable from
reference oscillation, GND, PLL
output frequency/2, comparative
frequency/2.
Operating Voltage Range: 2.97V ~ 5.5V
Low Power Consumption: CMOS (stand-by function included)*1
Ultra Small Package
: SOT-26, USP-6B
*1 High output impedance during stand-by
■PIN ASSIGNMENT
■PIN CONFIGURATION
PIN NUMBER
SOT-26 USP-6B
PIN NAME
FUNCTION
Q0
Q1
VDD
VSS
CE
1
2
3
3
2
1
CE
VSS
Q0
Chip Enable
GND
PLL Output
CLKin
SOT-26
(TOP VIEW)
Reference Oscillation, GND,
Comparative Frequency/2,
or PLL Output/2 Output *
*The dissipation pad for the USP-6B
package should be solder-plated in
recommended mount pattern and metal
masking so as to enhance mounting
strength and heat release.
4
6
Q1
5
6
5
4
VDD
CLKin
Power Supply
Reference Clock Input
If the pad needs to be connected to other
pins, it should be connected to the VDD
pin.
* Q1 Output is selectable from the above mentioned functions.
1/10
XC25BS3 ETR1501_003
XC25BS3 Series
■FUNCTION LIST
●CE,Q0/Q1 True Logic
CE
“H”
“L”
FUNCTION
Q0/Q1 Clock Output
Stand-by Output Pin = High Impedance
Stand-by Output Pin = High Impedance
(VSS pin pull-down due to IC's internal resistance)
"H" = High level
"L" = Low level
Open
■PRODUCT CLASSIFICATION
●Ordering Information
XC25BS3①②③④⑤
DESIGNATOR
DESCRIPTION
SYMBOL
Integer
DESCRIPTION
: Based on internal standards
e.g. Product number 001 → ①②③ = 001
①②③
Product Number
M
D
: SOT-26
④
⑤
Package
: USP-6B
Ｒ
Ｌ
: Embossed tape, standard feed
: Embossed tape, reverse feed
Device Orientation
■PACKAGING INFORMATION
●SOT-26
●USP-6B
2/10
XC25BS3
Series
■MARKING RULE
●SOT-26
①②Represents product series
MARK
PRODUCT SERIES
XC25BS30xxMx
②
①
3
B
③Represents ② and ③ of product number as in ordering information
SOT-26
(TOP VIEW)
PRODUCT
SERIES
PRODUCT
SERIES
SYMBOL
②
③
SYMBOL
②
③
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
H
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
2
3
4
5
6
7
8
9
0
1
2
3
4
5
6
XC25BS3x01Mx
XC25BS3x02Mx
XC25BS3x03Mx
XC25BS3x04Mx
XC25BS3x05Mx
XC25BS3x06Mx
XC25BS3x07Mx
XC25BS3x08Mx
XC25BS3x09Mx
XC25BS3x10Mx
XC25BS3x11Mx
XC25BS3x12Mx
XC25BS3x13Mx
XC25BS3x14Mx
XC25BS3x15Mx
XC25BS3x16Mx
K
L
1
1
1
2
2
2
2
2
2
2
2
2
2
3
3
…
7
8
9
0
1
2
3
4
5
6
7
8
9
0 *
1 *
…
XC25BS3x17Mx
XC25BS3x18Mx
XC25BS3x19Mx
XC25BS3x20Mx
XC25BS3x21Mx
XC25BS3x22Mx
XC25BS3x23Mx
XC25BS3x24Mx
XC25BS3x25Mx
XC25BS3x26Mx
XC25BS3x27Mx
XC25BS3x28Mx
XC25BS3x29Mx
XC25BS3x30Mx
XC25BS3x31Mx
…
M
N
P
R
S
T
U
V
X
Y
Z
0
1
…
④Represents assembly lot number
0 to 9, A to Z, reverse character 0 to 9 and A to Z repeated.
(G, I, J, O, Q, W excepted.)
* Character inversion is used.
●USP-6B
①②③Represents product series
MARK
②
PRODUCT SERIES
①
B
S
③
3
S
1
2
3
6
S
3
XC25BS30xxDx
XC25BS3SxxDx
5
4
④,⑤Represents ② and ③ of product number as in ordering information (ex)
USP-6B
(TOP VIEW)
MARK
④
PRODUCT SERIES
⑤
7
0
XC25BS3007Dx
XC25BS3S01Dx
0
1
⑥Represents production lot number
0 to 9, A to Z repeated (G, I, J, O, Q, W excepted)
Note: No character inversion used.
3/10
XC25BS3 Series
■BLOCK DIAGRAM
■ABSOLUTE MAXIMUM RATINGS
Ta = 25℃
PARAMETER
Supply Voltage
CLKin Pin Voltage
CE Pin Voltage
Q0 Pin Voltage
Q1 Pin Voltage
Q0 Output Current
Q1 Output Current
SYMBOL
VDD
VCK
CONDITIONS
VSS-0.3～VSS+7.0
VSS-0.3～VDD+0.3
VSS-0.3～VDD+0.3
VSS-0.3～VDD+0.3
VSS-0.3～VDD+0.3
±50
UNITS
V
V
V
V
V
mA
mA
VCE
VQ0
VQ1
IQ0
IQ1
±50
SOT-26
USP-6B
150
100
Power Dissipation
Pd
mW
Storage Temperature Range
Operating Temperature Range
Topr
Tstg
-30～+80
-40～+125
℃
℃
4/10
XC25BS3
Series
■ELECTRICAL CHARACTERISTICS
XC25BS30xxMR
●Set Value (example 1)
PARAMETER
Input Frequency
Q0 Pin Output Multiplier Ratio
Output Frequency 1
Output Frequency 2
SYMBOL
fCLKin
N/M
MIN.
13.000
－
TYP.
－
MAX.
20.000
－
UNITS
MHz
Multiplier
MHz
－
4.000
－
fQ0
Q1
52.000
80.000
fCLKin
● DC Characteristics
XC25BS30xxMR
fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25℃, No Load
PARAMETER
Supply Voltage
SYMBOL
VDD
VIH
CONDITIONS
MIN.
2.97
2.7
－
TYP.
3.30
－
MAX.
3.63
－
UNITS
V
Input Voltage "High"
Input Voltage "Low"
Input Current "High"
Input Current "Low"
Output Voltage "High"
Output Voltage "Low"
Supply Current 1
V
V
μA
μA
V
VIL
IIH
IIL
－
0.6
3.0
－
VCK=3.3V
VCK=0V
VDD=2.97V, IOH=-8mA
VDD=2.97V, IOL=8mA
CE=3.3V
－
－
-3.0
2.5
－
－
VOH
VOL
IDD1
IDD2
VCEH
VCEL
Rp1
Rp2
－
－
－
0.4
11.0
5.0
－
V
－
5.5
－
mA
μA
V
V
MΩ
kΩ
Supply Current 2
CE "High" Voltage
CE "Low" Voltage
CE Pull-Down Resistance 1
CE Pull-Down Resistance 2
CE=0V
－
2.70
－
－
－
0.45
2.5
80.0
CE=3.3V
CE=0.3V
0.5
20.0
1.5
50.0
● AC Characteristics
XC25BS30xxMR
fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25℃, CL=15pF
PARAMETER
Output Rise Time
Output Fall Time
Duty Ratio
Output Start Time
PLL Output Jitter
SYMBOL
TTLH
TTHL
DUTY
Ton
CONDITIONS
VDD=3.3V (20% to 80%) (*2)
VDD=3.3V (20% to 80%) (*2)
MIN.
－
TYP.
5.0
5.0
50
MAX.
－
UNITS
ns
ns
%
ms
－
－
40
－
60
20
－
(*2)
1σ(*2)
－
Tj
－
60
ps
*2 R&D guarantee
5/10
XC25BS3 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC25BS30xxMR (Continued)
●Set Value (example 2)
PARAMETER
Input Frequency
Q0 Pin Output Multiplier Ratio
Output Frequency 1
Output Frequency 2
SYMBOL
fCLKin
N/M
MIN.
10.000
－
TYP.
－
MAX.
16.000
－
UNITS
MHz
Multiplier
MHz
－
3.000
－
fQ0
Q1
30.000
48.000
GND
●DC Characteristics
XC25BS30xxMR
fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25℃, No Load
PARAMETER
SYMBOL
VDD
VIH
CONDITIONS
MIN.
2.97
2.7
－
TYP.
3.30
－
MAX.
3.63
－
UNITS
V
Supply Voltage
Input Voltage "High"
Input Voltage "Low"
Input Current "High"
Input Current "Low"
Output Voltage "High"
Output Voltage "Low"
Supply Current 1
V
V
μA
μA
V
VIL
IIH
IIL
－
0.6
3.0
－
VCK=3.3V
VCK=0V
VDD=2.97V, IOH=-8mA
VDD=2.97V, IOL=8mA
CE=3.3V
－
－
-3.0
2.5
－
－
VOH
VOL
IDD1
IDD2
VCEH
VCEL
Rp1
Rp2
－
－
－
0.4
8.0
5.0
－
V
－
4.0
－
mA
μA
V
V
MΩ
kΩ
Supply Current 2
CE "High" Voltage
CE "Low" Voltage
CE Pull-Down Resistance 1
CE Pull-Down Resistance 2
CE=0V
－
2.70
－
－
－
0.45
2.5
80.0
CE=3.3V
CE=0.3V
0.5
20.0
1.5
50.0
● AC Characteristics
XC25BS30xxMR
fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25℃, CL=15pF
PARAMETER
Output Rise Time
Output Fall Time
Duty Ratio
Output Start Time
PLL Output Jitter
SYMBOL
TTLH
TTHL
DUTY
Ton
CONDITIONS
VDD=3.3V (20% to 80%) (*2)
VDD=3.3V (20% to 80%) (*2)
MIN.
－
TYP.
5.0
5.0
50
MAX.
－
UNITS
ns
ns
%
ms
－
－
40
－
60
20
－
(*2)
1σ(*2)
－
Tj
－
60
ps
*2 R&D guarantee
6/10
XC25BS3
Series
■TYPICAL APPLICATION CIRCUITS
●Circuit Example
①Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2
②Q1 Pin - GND
■NOTES ON USE
(1) Please insert a by-pass capacitor of 0.1μF.
(2) Rq0 and Rq1 are matching resistors. Their use is recommended in order to counter unwanted radiations.
(3) Please place a by-pass capacitor and matching resistors as close to the IC as possible. The output may not be
locked if the by-pass capacitor is not close enough to the IC. Further, there is a possibility of unwanted radiation
occurrence between the resistor and the IC pin if the matching resistors are not close enough to the IC.
(4) When selecting GND for the Q1 pin, although the IC will be connected to GND internally, it is also recommended that
the PCB be connected to GND.
(5) When the CE pin is not controlled by external signals, it is recommended that a time constant circuit of R1=1kΩ×
C1=0.1μF be added for stability.
(6) With this IC, output is achieved by dividing and multiplying the reference oscillation by means of the PLL circuit. In
cases where this output is further used as a reference oscillation of another PLL circuit, the final output signal's jitter
may increase, so all necessary precautions should be taken to avoid this.
(7) It is recommended that a low noise power supply, such as a series regulator, be used for the supply voltage. Using
a power supply such as a switching regulator might lead to a larger jitter, which in turn may lead to an inability to lock
due to the ripple of the switching regulator.
(8) As for this IC, synchronization of input and output signal’s edge is not guaranteed though the input frequency
operates to the output frequency multiply.
7/10
XC25BS3 Series
■REFERENCE LAND PATTERN
①Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2
②Q1 Pin - GND
8/10
XC25BS3
Series
■AC CHARACTERISTICS WAVEFORMS
1) Output Rise Time / Output Fall Time
2) Duty Ratio
3) Output Start Time
9/10
XC25BS3 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
10/10
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