XC9235A18CMR-G [TOREX]
Switching Regulator/Controller, Current-mode, 0.6A, 1380kHz Switching Freq-Max, PDSO5;型号: | XC9235A18CMR-G |
厂家: | Torex Semiconductor |
描述: | Switching Regulator/Controller, Current-mode, 0.6A, 1380kHz Switching Freq-Max, PDSO5 光电二极管 |
文件: | 总40页 (文件大小:1044K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC9235/XC9236/XC9237Series
ETR0514-015
600mA Driver Tr. Built-In, Synchronous Step-Down DC/DC Converters
☆GreenOperation Compatible
■GENERAL DESCRIPTION
The XC9235/XC9236/XC9237 series is a group of synchronous-rectification type DC/DC converters with a built-in 0.42Ω
P-channel MOS driver transistor and 0.52ΩN-channel MOS switching transistor, designed to allow the use of ceramic
capacitors. Operating voltage range is from 2.0V to 6.0V (A~C types), 1.8V to 6.0V (D~G types). For the D/F types which
have a reference voltage of 0.8V (accuracy: ±2.0%), the output voltage can be set from 0.9V by using two external resistors.
The A/B/C/E/G types have a fixed output voltage from 0.8V to 4.0V in increments of 0.05V (accuracy: ±2.0%). The device
provides a high efficiency, stable power supply with an output current of 600mA to be configured using only a coil and two
capacitors connected externally.
With the built-in oscillator, either 1.2MHz or 3.0MHz can be selected for suiting to your
particular application. As for operation mode, the XC9235 series is PWM control, the XC9236 series is automatic PWM/PFM
switching control and the XC9237 series can be manually switched between the PWM control mode and the automatic
PWM/PFM switching control mode, allowing fast response, low ripple and high efficiency over the full range of loads (from light
load to heavy load).
The soft start and current control functions are internally optimized. During stand-by, all circuits are shutdown to reduce current
consumption to as low as 1.0μA or less. The B/F/G types have a high speed soft-start as fast as 0.25ms in typical for quick
turn-on. With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF
when input voltage becomes 1.4V or lower.
The B to G types integrate CL discharge function which enables the electric charge at the output capacitor CL to be discharged
via the internal discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage
quickly returns to the VSS level as a result of this function.
Four types of package SOT-25, USP-6C, USP-6EL and WLP-5-03 are available.
■APPLICATIONS
■FEATURES
●Smart phones / Mobile phones
●Bluetooth
Driver Transistor Built-In
: 0.42Ω P-ch driver transistor
0.52Ω N-ch switch transistor
: 2.0V ~ 6.0V (A/B/C types)
1.8V ~ 6.0V (D/E/F/G types)
: 0.8V ~ 4.0V (Internally set)
0.9V ~ 6.0V (Externally set)
: 92% (TYP.)*
Input Voltage
●Mobile devices / terminals
●Portable game consoles
●Digital still cameras / Camcorders
●Note PCs / Tablet PCs
Output Voltage
High Efficiency
Output Current
: 600mA
Oscillation Frequency
Maximum Duty Cycle
Control Methods
: 1.2MHz, 3.0MHz (+15%)
: 100%
: PWM (XC9235)
PWM/PFM Auto (XC9236)
PWM/PFM Manual (XC9237)
: Current Limiter Circuit Built-In
(Constant Current & Latching)
CL Discharge (B/C/D/E/F/G types)
High Speed Soft Start (B/F/G type)
: Low ESR Ceramic Capacitor
:-40℃ ~ +85℃
■
TYPICAL APPLICATION CIRCUIT
Function
●XC9235/XC9236/XC9237
A/B/C/E/G types (Output Voltage Fixed)
Capacitor
Operating Ambient Temperature
Packages
: SOT-25 (A/B/C types only)
USP-6C
USP-6EL(A/B/C/G types only)
WLP-5-03(A/B types only)
: EU RoHS Compliant, Pb Free
Environmentally Friendly
* Performance depends on external components and wiring on the PCB.
■
TYPICAL PERFORMANCE CHARACTERISTICS
●Efficiency vs. Output Current(fOSC=1.2MHz, VOUT=1.8V)
●XC9235/XC9236/XC9237
PWM/PFM Automatic Sw itching Control
100
D/F types (Output Voltage Externally Set)
90
80
VIN= 4.2V
70
PWM Control
VIN= 4.2V
3.6V
2.4V
3.6V
2.4V
60
50
40
30
20
10
0
0.1
1
10
100
1000
Output Current:IOUT(mA)
1/40
XC9235/XC9236/XC9237 Series
■PIN CONFIGURATION
Lx
5
VOUT
4
1
Lx
VIN
VSS
6
5
VIN
6
1
Lx
2
3
VSS
2
3
VSS
VSS
5
4
CE/MODE
4
VOUT (FB)
CE/MODE
VOUT
1
2
3
VIN
VSS CE/MODE
SOT-25
USP-6C
USP-6EL
(TOP VIEW)
(BOTTOM VIEW)
(BOTTOM VIEW)
* Please short the VSS pin (No. 2 and 5).
* The dissipation pad for the USP-6C/USP-6EL packages should be
solder-plated in recommended mount pattern and metal masking so as to
enhance mounting strength and heat release. We recommend keeping the
dissipation pas electrically isolated from the other Pins. If the pad needs to be
connected to other pins, it should be connected to the VSS (No. 5) pin.
WLP-5-03
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
USP-6C/USP-6EL
PIN NAME
FUNCTIONS
SOT-25
WLP-5-03
1
2
3
6
2, 5
4
2
3
1
VIN
VSS
Power Input
Ground
CE / MODE
VOUT
High Active Enable / Mode Selection Pin
Fixed Output Voltage Pin (A/B/C/E/G types)
Output Voltage Sense Pin (D/F types)
Switching Output
4
5
3
1
4
5
FB
Lx
2/40
XC9235/XC9236/XC9237
Series
■PRODUCT CLASSIFICATION
●Ordering Information
(
(
(
)
)
)
*1
*1
*1
XC9235①②③④⑤⑥-⑦
XC9236①②③④⑤⑥-⑦
XC9237①②③④⑤⑥-⑦
Fixed PWM control
PWM / PFM automatic switching control
Fixed PWM control QPWM / PFM automatic switching manual selection
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A
B
C
E
G
D
F
VIN≧2.0V, No CL discharge, Low speed soft-start
VIN≧2.0V, CL discharge, High speed soft-start
VIN≧2.0V, CL discharge, Low speed soft-start
VIN≧1.8V, CL discharge, Low speed soft-start
VIN≧1.8V, CL discharge, High speed soft-start
VIN≧1.8V, CL discharge, Low speed soft-start
VIN≧1.8V, CL discharge, High speed soft-start
Fixed Output voltage (VOUT
Functional selection
)
①
Adjustable Output voltage (FB)
Functional selection
Output voltage options
e.g. VOUT=2.8V→②=2, ③=8
Fixed Output Voltage (VOUT
)
08 ~ 40
VOUT=2.85V→②=2, ③=L
②③
0.05V increments: 0.05=A, 0.15=B, 0.25=C, 0.35=D, 0.45=E,
0.55=F, 0.65=H, 0.75=K, 0.85=L, 0.95=M
Reference voltage is fixed in 0.8V
②=0, ③=8
Adjustable Output Voltage
(FB)
08
C
1.2MHz
3.0MHz
④
Oscillation Frequency
D
MR
MR-G
ER
SOT-25(*2) (3,000pcs/Reel)
SOT-25(*2) (3,000pcs/Reel)
USP-6C (3,000pcs/Reel)
USP-6C (3,000pcs/Reel)
USP-6EL(*4) (3,000pcs/Reel)
WLP-5-03 (*3) (3,000pcs/Reel)
Packages
⑤⑥-⑦
(Order Unit)
ER-G
4R-G
0R-G
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) SOT-25 package are available for the A/B/C series only.
(*3) WLP-5-03 package is available for the A/B series only.
(*4) USP-6EL package are available for the A/B/C/G series only.
3/40
XC9235/XC9236/XC9237 Series
■FUNCTION
OPERATIONAL STATES
CE/MODE
OPERATIONAL STATES
XC9237
CE/MODE
H Level (*2)
XC9235
XC9236
Synchronous
PWM/PFM
Automatic Switching
Synchronous PWM Fixed Control
Stand-by
Synchronous
PWM/PFM
Synchronous
H Level
L Level
PWM Fixed Control
Automatic Switching
M Level (*2)
L Level (*2)
Stand-by
Stand-by
(*1) Please do not leave the CE/MODE pin open.
(*2) XC9237 series CE/MODE pin voltage level range
H Level : VIN - 0.25V ≦ H Level ≦ 6.0V
M Level : 0.65V ≦ M Level ≦ VIN - 1.0V
L Level : 0V ≦ L Level ≦ 0.25V
4/40
XC9235/XC9236/XC9237
Series
■BLOCK DIAGRAM
●XC9235 / XC9236 / XC9237 A Series
●XC9235 / XC9236 / XC9237 B/C/E/G
●XC9235 / XC9236 / XC9237 D/F Series
NOTE: The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "L" level inside,
and XC9235 series chooses only PWM control.
The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "H" level inside,
and XC9236 series chooses only PWM/PFM automatic switching control.
Diodes inside the circuit are ESD protection diodes and parasitic diodes.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
VIN Pin Voltage
SYMBOL
VIN
RATINGS
- 0.3 ~ 6.5
- 0.3 ~ VIN + 0.3
- 0.3 ~ 6.5
- 0.3 ~ 6.5
- 0.3 ~ 6.5
±1500
UNIT
V
Lx Pin Voltage
VLX
V
VOUT Pin Voltage
FB Pin Voltage
VOUT
VFB
V
V
CE / MODE Pin Voltage
Lx Pin Current
VCE/MODE
ILx
V
mA
SOT-25
250
USP-6C
USP-6EL
WLP-5-03
120
Power Dissipation
Pd
mW
120
750
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
- 40 ~ + 85
- 55 ~ + 125
OC
OC
5/40
XC9235/XC9236/XC9237 Series
■ELECTRICAL CHARACTERISTICS
XC9235A18Cxx/XC9236A18Cxx/XC9237A18Cxx, VOUT=1.8V, fOSC=1.2MHz, Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
Output Voltage
VOUT
VIN
1.764
2.0
1.800 1.836
V
V
①
①
①
Operating Voltage Range
Maximum Output Current
-
-
6.0
-
VIN=VOUT(E)+2.0V, VCE=1.0V,
When connected to external components (*9)
IOUTMAX
600
mA
V
CE =VIN, VOUT=0V,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1, *11)
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
Supply Current
IDD
-
-
15
0
33
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
1020
120
1200
160
1380
200
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =VIN, IOUT=1mA (*12)
IPFM
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VCE=VIN=(C-1), IOUT=1mA (*12)
200
300
%
%
%
①
③
③
DMAX
DMIN
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
When connected to external components,
100
-
-
-
-
0
Efficiency(*2)
EFFI
-
92
-
%
①
V
CE=VIN=VOUT(E)+1.2V, IOUT=100mA
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Lx SW "L" Leak Current (*5)
Current Limit (*10)
RLxH
RLxH
VIN=VCE=5.0V, VOUT=0V, ILx=100mA (*3)
VIN=VCE=3.6V, VOUT=0V, ILx=100mA (*3)
VIN=VCE=5.0V (*4)
-
0.35
0.42
0.45
0.52
0.01
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
④
-
-
RLxL
-
Ω
RLxL
VIN=VCE=3.6V (*4)
-
Ω
ILEAKH
ILEAKL
ILIM
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VOUT=5.0V, VCE=0V, Lx=5.0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
-
-
μA
μA
mA
⑤
⑤
⑥
1.0
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
V
OUT=0V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
Voltage changes Lx to “H” level (*11)
V
OUT=0V, Applied voltage to VCE ,
V
Voltage changes Lx to “L” level (*11)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 1020 kHz≦fOSC≦1380kHz (*13)
PWM "H" Level Voltage
VPWMH
-
-
VIN - 1.0
V
①
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC<1020kHz (*13)
VIN
0.25
–
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V
VIN=5.0V, VCE=0V, VOUT=0V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
When connected to external components,
Soft Start Time
Latch Time
tSS
0.5
1.0
1.0
-
2.5
ms
ms
①
⑦
V
CE=0V → VIN, IOUT=1mA
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
Short Lx at 1Ω resistance (*7)
,
tLAT
20.0
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage
VSHORT
0.675 0.900 1.150
V
⑦
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage
NOTE:
*1: Including hysteresis operating voltage range.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: R&D value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
*7: Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
*8: When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
*9: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*10: Current limit denotes the level of detection at peak of coil current.
*11: “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
*12: XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
*13: XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
6/40
XC9235/XC9236/XC9237
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235A18Dxx/XC9236A18Dxx/XC9237A18Dxx, VOUT=1.8V, fOSC=3.0MHz, Ta=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
Output Voltage
VOUT
VIN
1.764
2.0
1.800 1.836
V
V
①
①
①
Operating Voltage Range
Maximum Output Current
-
-
6.0
-
VIN=VOUT(E)+2.0V, VCE=1.0V,
When connected to external components (*9)
IOUTMAX
600
mA
V
CE=VIN, VOUT=0V,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1,*11)
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
Supply Current
IDD
-
-
21
0
35
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
2550
170
3000
220
3450
270
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=VIN, IOUT=1mA (*12)
IPFM
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VCE=VIN=(C-1), IOUT=1mA (*12)
-
100
-
200
300
%
%
%
①
③
③
DMAX
DMIN
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.1V
When connected to external components,
-
-
-
0
Efficiency(*2)
EFFI
-
86
-
%
①
V
CE=VIN=VOUT(E)+1.2V, IOUT=100mA
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Lx SW "L" Leak Current (*5)
Current Limit (*10)
RLxH
RLxH
VIN=VCE=5.0V, VOUT =0V, ILx=100mA (*3)
VIN=VCE=3.6V, VOUT =0V, ILx=100mA (*3)
VIN=VCE=5.0V (*4)
-
0.35
0.42
0.45
0.52
0.01
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
-
-
RLxL
-
Ω
RLxL
VIN=VCE=3.6V (*4)
-
Ω
-
ILEAKH
ILEAKL
ILIM
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VOUT=5.0V, VCE=0V, Lx=5.0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
-
-
μA
μA
mA
⑤
⑤
⑥
1.0
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
V
OUT=0V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
Voltage changes Lx to “H” level (*11)
V
OUT=0V, Applied voltage to VCE,
V
Voltage changes Lx to “L” level (*11)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 2550kHz≦fOSC≦3450kHz (*13)
PWM "H" Level Voltage
VPWMH
-
-
VIN - 1.0
V
①
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC<2550kHz (*13)
VIN
0.25
–
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V
VIN=5.0V, VCE=0V, VOUT=0V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
When connected to external components,
Soft Start Time
Latch Time
tSS
0.5
1.0
0.9
-
2.5
20
ms
ms
①
⑦
V
CE=0V → VIN, IOUT=1mA
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
Short Lx at 1Ω resistance (*7)
,
tLAT
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage
VSHORT
0.675 0.900 1.150
V
⑦
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage
NOTE:
*1: Including hysteresis operating voltage range.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: R&D value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
*7: Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
*8: When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
*9: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*10: Current limit denotes the level of detection at peak of coil current.
*11: “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
*12: XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
*13: XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
7/40
XC9235/XC9236/XC9237 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235B(C)(E)(G)18Cxx/XC9236B(C)(E)(G)18Cxx/XC9237B(C)(E)(G)18Cxx, VOUT=1.8V, fOSC=1.2MHz, Ta=25℃
PARAMETER
Output Voltage
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
1.764
1.800 1.836
V
V
①
①
①
③
Operating Voltage Range (B/C series)
Operating Voltage Range (E/G series)
2.0
1.8
-
-
6.0
6.0
VIN
VIN=VOUT(E)+2.0V, VCE=1.0V,
Maximum Output Current
UVLO Voltage
IOUTMAX
VUVLO
600
-
-
mA
V
When connected to external components (*9)
VCE =VIN, VOUT=VOUT(E)×0.5V (*14)
1.00
1.40
1.78
Voltage which Lx pin holding “L” level (*1, *11)
Supply Current
IDD
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
-
-
15
0
33
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
1020
120
1200
160
1380
200
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE =VIN, IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
VCE=VIN=(C-1), IOUT=1mA (*12)
200
300
%
%
%
①
③
③
DTYLIMIT_PFM
DMAX
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
100
-
-
-
-
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
0
DMIN
When connected to external components,
Efficiency(*2)
EFFI
-
92
-
%
①
V
CE=VIN=VOUT(E)+1.2V, IOUT=100mA
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
RLxH
RLxH
RLxL
RLxL
ILEAKH
ILIM
VIN=VCE=5.0V, VOUT (E)×0.9V , ILx=100mA (*3)
VIN=VCE=3.6V, VOUT (E)×0.9V , ILx=100mA (*3)
VIN=VCE=5.0V (*4)
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
④
-
-
-
Ω
VIN=VCE=3.6V (*4)
-
-
Ω
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
μA
mA
⑤
⑥
Current Limit (*10)
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT
/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
VOUT
Voltage changes Lx to “H” level (*11)
VOUT VOUT(E)×0.9V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
= VOUT(E)×0.9V, Applied voltage to VCE,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
=
,
V
When connected to external components,
PWM "H" Level Voltage
VPWMH
IOUT=1mA (*6), Voltage which oscillation frequency
-
-
VIN - 1.0
V
①
becomes 1020 kHz≦fOSC≦1380kHz (*13)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC<1020kHz (*13)
VIN
0.25
–
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT
VIN=5.0V, VCE=0V, VOUT
When connected to external components,
CE=0V → VIN, IOUT=1mA
When connected to external components,
CE=0V → VIN, IOUT=1mA
=
VOUT(E)×0.9V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
=
VOUT(E)×0.9V
Soft Start Time (B/G Series)
Soft Start Time (C/E Series)
Latch Time
tSS
tSS
-
0.25
1.0
-
0.40
2.5
ms
ms
ms
①
①
⑦
V
0.5
1.0
V
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
,
tLAT
20.0
Short Lx at 1Ω resistance (*7)
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
VIN=VCE=5.0V, The VOUT at Lx=”Low"(*11) while
Short Protection Threshold
Voltage (B/C Series)
VSHORT
0.675 0.900 1.150
0.338 0.450 0.563
V
⑦
Short Protection Threshold
Voltage (E/G Series)
VSHORT
RDCHG
V
⑦
⑧
decreasing VOUT from VOUT (E)×0.4V
CL Discharge
VIN=5.0V, LX=5.0V, VCE=0V, VOUT=open
200
300
450
Ω
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is VOUT→VIN→VCE
NOTE:
*1: Including hysteresis operating voltage range.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: R&D value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
*7: Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
*8: When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
*9: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*10: Current limit denotes the level of detection at peak of coil current.
*11: “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
*12: XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
*13: XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
*14: VIN is applied when VOUT (E) x 0.5V becomes more than VIN.
8/40
XC9235/XC9236/XC9237
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235B(C)(E)(G)18Dxx/XC9236B(C)(E)(G)18Dxx/XC9237B(C)(E)(G)18Dxx, VOUT=1.8V, fOSC=3.0MHz, Ta=25℃
PARAMETER
Output Voltage
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX. UNIT CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
1.764
1.800 1.836
V
V
①
①
①
③
Operating Voltage Range (B/C series)
Operating Voltage Range (E/G series)
2.0
1.8
-
-
6.0
6.0
VIN
VIN=VOUT(E)+2.0V, VCE=1.0V,
Maximum Output Current
UVLO Voltage
IOUTMAX
VUVLO
600
-
-
mA
V
When connected to external components (*9)
VCE=VIN, VOUT=VOUT(E)×0.5V (*14)
,
1.00
1.40
1.78
Voltage which Lx pin holding “L” level (*1,*11)
VIN=VCE=5.0V, VOUT=VOUT(E)×1.1V
Supply Current
IDD
-
-
21
0
35
μA
μA
②
②
Stand-by Current
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(E)×1.1V
1.0
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
2550
170
3000
220
3450
270
kHz
mA
①
①
When connected to external components,
VIN=VOUT(E)+2.0V, VCE=VIN, IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
V
CE=VIN=(C-1), IOUT=1mA (*12)
-
100
-
200
300
%
%
%
①
③
③
DTYLIMIT_PFM
DMAX
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V
-
-
-
VIN=VCE=5.0V, VOUT=VOUT(E)×0.1V
0
DMIN
When connected to external components,
Efficiency(*2)
EFFI
-
86
-
%
①
V
CE=VIN=VOUT(E)+1.2V, IOUT=100mA
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
RLxH
RLxH
RLxL
RLxL
ILEAKH
ILIM
VIN=VCE=5.0V, VOUT
VIN=VCE=3.6V, VOUT
VIN=VCE=5.0V (*4)
VIN=VCE=3.6V (*4)
=
=
VOUT(E)×0.9V, ILx=100mA (*3)
VOUT(E)×0.9V, ILx=100mA (*3)
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
-
-
-
Ω
-
-
Ω
-
VIN=VOUT=5.0V, VCE=0V, Lx=0V
VIN=VCE=5.0V, VOUT=VOUT(E)×0.9V (*8)
μA
mA
⑤
⑥
Current Limit (*10)
900
1350
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△VOUT
/
IOUT=30mA, -40℃≦Topr≦85℃
-
±100
-
ppm/
℃
①
③
③
VOUT
=
VOUT(E)×0.9V, Applied voltage to VCE
Voltage changes Lx to “H” level (*11)
VOUT(E)×0.9V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
0.25
V
VOUT
=
,
V
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 2550kHz≦fOSC≦3450kHz (*13)
PWM "H" Level Voltage
VPWMH
-
-
VIN - 1.0
V
①
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC<2550kHz (*13)
VIN
0.25
–
PWM "L" Level Voltage
VPWML
-
-
V
①
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT
VIN=5.0V, VCE=0V, VOUT
When connected to external components,
CE=0V → VIN, IOUT=1mA
When connected to external components,
CE=0V → VIN, IOUT=1mA
=
VOUT(E)×0.9V
- 0.1
- 0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
=
VOUT(E)×0.9V
Soft Start Time (B/G Series)
Soft Start Time (C/E Series)
Latch Time
tSS
tSS
-
0.32
0.9
-
0.50
2.5
20
ms
ms
ms
①
①
⑦
V
0.5
1.0
V
VIN=VCE=5.0V, VOUT=0.8×VOUT(E)
,
tLAT
Short Lx at 1Ω resistance (*7)
Sweeping VOUT, VIN=VCE=5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes
“L” level within 1ms
Short Protection Threshold
Voltage (B/C Series)
VSHORT
0.675 0.900 1.150
V
⑦
VIN=VCE=5.0V, The VOUT at Lx=”Low"(*11) while
decreasing VOUT from VOUT (E)×0.4V
Short Protection Threshold
Voltage (E/G Series)
VSHORT
RDCHG
0.338 0.450 0.563
V
⑦
⑧
CL Discharge
VIN=5.0V, LX=5.0V, VCE=0V, VOUT=open
200
300
450
Ω
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is VOUT→VIN→VCE
NOTE:
*1: Including hysteresis operating voltage range.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: R&D value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
*7: Time until it short-circuits VOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
*8: When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
*9: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*10: Current limit denotes the level of detection at peak of coil current.
*11: “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
*12: XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
*13: XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
*14: VIN is applied when VOUT (E) x 0.5V becomes more than VIN.
9/40
XC9235/XC9236/XC9237 Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235D(F)08Cxx/XC9236D(F)08Cxx/XC9237D(F)08Cxx, FB Type, fOSC=1.2MHz, Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB
CONDITIONS
MIN.
TYP.
MAX.
UNIT CIRCUIT
VIN = VCE =5.0V, The VFB at Lx=”High"(*11) while
decreasing FB pin voltage from 0.9V.
0.784 0.800 0.816
V
③
Operating Voltage Range
Maximum Output Current
VIN
1.8
-
-
6.0
-
V
①
①
VIN=3.2V, VCE=1.0V
IOUTMAX
600
mA
When connected to external components (*9)
VCE = VIN , VFB = 0.4V,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1,*11)
VIN =VCE=5.0V, VFB= 0.88V
Supply Current
IDD
-
-
15
0
μA
μA
②
②
Stand-by Current
ISTB
VIN =5.0V, VCE=0V, VFB= 0.88V
1.0
When connected to external components,
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
1020
120
1200
160
1380
kHz
mA
①
①
V
IN = 3.2V, VCE=1.0V, IOUT=100mA
When connected to external components,
200
V
IN =3.2V, VCE = VIN , IOUT=1mA (*12)
CE= VIN =2.0V IOUT=1mA (*12)
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
V
200
300
%
%
%
①
③
③
DTYLIMIT_PFM
DMAX
VIN = VCE =5.0V, VFB = 0.72V
100
-
-
-
-
VIN = VCE =5.0V, VFB = 0.88V
0
DMIN
When connected to external components,
Efficiency(*2)
EFFI
-
92
-
%
①
V
CE = VIN = 2.4V, IOUT = 100mA
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
RLxH
RLxH
RLxL
RLxL
ILEAKH
VIN = VCE = 5.0V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 3.6V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 5.0V (*4)
-
-
-
-
-
0.35
0.42
0.45
0.52
0.01
0.55
0.67
0.65
0.77
1.0
Ω
Ω
Ω
Ω
μA
mA
④
④
-
-
⑨
VIN = VCE = 3.6V (*4)
VIN = VFB = 5.0V, VCE = 0V, LX= 0V
VIN = VCE= 5.0V, VFB = 0.72V (*8)
Current Limit (*10)
ILIM
900
1050
1350
⑥
Output Voltage
Temperature Characteristics (VOUT・△Topr)
△
VOUT
/
IOUT =30mA
-40℃≦Topr≦85℃
-
±100
-
ppm/ ℃
①
VFB =0.72V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
VCEL
0.65
VSS
-
-
6.0
V
V
③
③
Voltage changes Lx to “H” level (*11)
VFB =0.72V, Applied voltage to VCE
Voltage changes Lx to “L” level (*11)
,
0.25
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes 1020kHz≦fOSC≦1380kHz (*13)
When connected to external components,
IOUT=1mA (*6), Voltage which oscillation frequency
becomes fOSC<1020kHz (*13)
PWM "H" Level Voltage
PWM "L" Level Voltage
VPWMH
-
-
-
VIN - 1.0
V
V
①
①
VIN
0.25
-
VPWML
-
CE "H" Current
CE "L" Current
Soft Start Time (D series)
Soft Start Time (F series)
ICEH
ICEL
VIN = VCE =5.0V, VFB =0.72V
VIN =5.0V, VCE = 0V, VFB =0.72V
When connected to external components,
- 0.1
- 0.1
0.5
-
-
-
0.1
0.1
2.5
μA
μA
⑤
⑤
1.0
0.25
tSS
ms
ms
①
⑦
V
CE = 0V → VIN , IOUT=1mA
0.40
VIN=VCE=5.0V, VFB=0.64, Short Lx at 1Ω
Latch Time
tLAT
1.0
-
20.0
resistance (*7)
Short Protection Threshold
Voltage
VIN = VCE =5.0V, The VFB at Lx=”Low" (*11) while
decreasing FB pin voltage from 0.4V.
VSHORT
RDCHG
0.15
0.200
0.25
V
⑦
⑧
CL Discharge
VIN = 5.0V ,LX = 5.0V, VCE = 0V, VFB= open
200
300
450
Ω
Test conditions: VOUT=1.2V when the external components are connected. Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is
OUT→VIN→VCE
NOTE:
*1: Including hysteresis operating voltage range.
V
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: R&D value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
*7: Time until it short-circuits VFB with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
*8: When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
*9: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*10: Current limit denotes the level of detection at peak of coil current.
*11: “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
*12: XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
*13: XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
10/40
XC9235/XC9236/XC9237
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9235D(F)08Dxx/XC9236D(F)08Dxx/XC9237D(F)08Dxx, FB, fOSC=3.0MHz, Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB
CONDITIONS
MIN.
TYP.
MAX.
UNIT CIRCUIT
V
IN = VCE =5.0V, The VFB at Lx=”High"(*11) while
decreasing FB pin voltage from 0.9V.
0.784
0.800 0.816
V
③
Operating Voltage Range
Maximum Output Current
VIN
1.8
-
-
6.0
-
V
①
①
VIN=3.2V, VCE=1.0V
When connected to external components (*9)
IOUTMAX
600
mA
VCE = VIN , VFB = 0.4V ,
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Voltage which Lx pin holding “L” level (*1, *11)
VIN =VCE=5.0V, VFB= 0.88V
Supply Current
IDD
-
-
21
0
35
μA
μA
②
②
Stand-by Current
ISTB
VIN =5.0V, VCE=0V, VFB= 0.88V
1.0
When connected to external components,
Oscillation Frequency
PFM Switching Current
fOSC
IPFM
2550
170
3000
220
3450
270
kHz
mA
①
①
V
IN = 3.2V, VCE=1.0V, IOUT=100mA
When connected to external components,
IN =3.2V, VCE = VIN , IOUT=1mA (*12)
V
PFM Duty Limit
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM
DMAX
VCE= VIN =2.2V IOUT=1mA (*12)
200
300
%
%
%
①
③
③
VIN = VCE =5.0V, VFB = 0.72V
100
-
-
-
-
DMIN
VIN = VCE =5.0V, VFB = 0.88V
0
When connected to external components,
VCE = VIN = 2.4V, IOUT = 100mA
VIN = VCE = 5.0V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 3.6V, VFB = 0.72V,ILX = 100mA (*3)
VIN = VCE = 5.0V (*4)
Efficiency(*2)
EFFI
-
86
-
%
①
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
Lx SW "H" Leak Current (*5)
Current Limit (*10)
RLxH
RLxH
RLxL
RLxL
ILEAKH
ILIM
-
-
-
-
-
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.65
0.77
1.0
Ω
Ω
④
④
-
-
⑨
Ω
VIN = VCE = 3.6V (*4)
Ω
VIN = VFB = 5.0V, VCE = 0V, LX= 0V
VIN = VCE= 5.0V, VFB = 0.72V (*8)
μA
mA
900
1350
⑥
IOUT =30mA
-40℃≦Topr≦85℃
Output Voltage
Temperature Characteristics
△
VOUT/
-
±100
-
ppm/ ℃
①
③
③
(VOUT・△Topr)
V
FB =0.72V , VCE,
Voltage changes Lx to “H” level (*11)
FB =0.72V, VCE
CE "H" Voltage
CE "L" Voltage
VCEH
0.65
VSS
-
-
6.0
0.25
V
V
V
,
VCEL
Voltage changes Lx to “L” level (*11)
When connected to external components,
IOUT = 1mA (*6), Voltage which oscillation frequency
becomes 2550kHz≦fOSC≦3450kHz (*13)
When connected to external components,
IOUT = 1mA (*6), Voltage which oscillation frequency
becomes fOSC<2550kHz (*13)
PWM "H" Level Voltage
PWM "L" Level Voltage
VPWMH
-
-
-
VIN - 1.0
V
V
①
①
VIN
0.25
-
VPWML
-
CE "H" Current
CE "L" Current
Soft Start Time (D series)
Soft Start Time (F series)
ICEH
ICEL
VIN = VCE =5.0V, VFB =0.72V
VIN =5.0V, VCE = 0V, VFB =0.72V
When connected to external components,
- 0.1
- 0.1
0.5
-
-
-
0.1
0.1
2.5
μA
μA
⑤
⑤
1.0
0.25
tSS
tLAT
ms
ms
V
①
⑦
⑦
V
CE = 0V → VIN , IOUT=1mA
VIN VCE = 5.0V, VFB = 0.64,
Short Lx at 1
resistance (*7)
IN = VCE =5.0V, The VFB at Lx=”Low"(*11) while
0.40
=
Latch Time
1.0
-
20.0
0.25
Ω
V
Short Protection Threshold
Voltage
VSHORT
0.15
0.200
decreasing FB pin voltage from 0.4V.
CL Discharge
RDCHG
VIN = 5.0V ,LX = 5.0V ,VCE = 0V ,VFB= open
200
300
450
Ω
⑧
Test conditions: VOUT=1.2V when the external components are connected. Unless otherwise stated, VIN=5.0V, VOUT(E)=Nominal Voltage, applied voltage sequence is
OUT→VIN→VCE
NOTE:
*1: Including hysteresis operating voltage range.
V
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: R&D value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: The CE/MODE pin of the XC9237A series works also as an external switching pin of PWM control and PWM/PFM control. When the IC is in the operation,
control is switched to the automatic PWM/PFM switching mode when the CE/MODE pin voltage is equal to or greater than VIN minus 0.3V, and to the PWM
mode when the CE/MODE pin voltage is equal to or lower than VIN minus 1.0V and equal to or greater than VCEH
.
*7: Time until it short-circuits VFB with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse generating.
*8: When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
*9: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*10: Current limit denotes the level of detection at peak of coil current.
*11: “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
*12: XC9235 series exclude IPFM and DTYLIMIT_PFM because those are only for the PFM control’s functions.
*13: XC9235/XC9236 series exclude VPWMH and VPWML because those are only for the XC9237 series’ functions.
11/40
XC9235/XC9236/XC9237 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●PFM Switching Current (IPFM) by Oscillation Frequency and Setting Voltage
(mA)
MAX.
1.2MHz
3.0MHz
TYP.
260
SETTING VOLTAGE
MIN.
140
130
120
TYP.
180
170
160
MAX.
240
MIN.
190
180
170
VOUT(E) ≦1.2V
350
300
270
1.2V<VOUT(E) ≦1.75V
1.8V≦VOUT(E)
220
240
200
220
●Input Voltage (VIN) for Measuring PFM Duty Limit (DTYLIMIT_PFM
)
fOSC
C-1
1.2MHz
3.0MHz
VOUT(E)+1.0V
VOUT(E)+0.5V
Minimum operating voltage is 2.0V.
ex.) Although when VOUT(E) is 1.2V and fOSC is 1.2MHz, (C-1) should be 1.7V, (C-1) becomes 2.0V for the minimum operating voltage 2.0V.
●Soft-Start Time, Setting Voltage(XC9235B(G)/XC9236B(G)/XC9237B(G) Series only)
(μs)
SERIES
fOSC
SETTING VOLTAGE
MIN.
TYP.
MAX.
1.2MHz
1.2MHz
1.2MHz
1.2MHz
0.8≦V OUT(E)<1.5
1.5≦V OUT(E)<1.8
1.8≦V OUT(E)<2.5
2.5≦V OUT(E)<4.0
-
-
-
-
250
320
250
320
400
500
400
500
XC9235B(G)/XC9237B(G)
1.2MHz
1.2MHz
0.8≦V OUT(E)<2.5
2.5≦V OUT(E)<4.0
0.8≦V OUT(E)<1.8
1.8≦V OUT(E)<4.0
-
-
-
-
250
320
250
320
400
500
400
500
XC9236B(G)
3.0MHz
3.0MHz
XC9235B(G)/
XC9236B(G)/XC9237B(G)
12/40
XC9235/XC9236/XC9237
Series
■TYPICAL APPLICATION CIRCUIT
●XC9235/XC9236/XC9237A, B, C, E, G Series (Output Voltage Fixed)
VOUT
600mA
L
●fOSC=3.0MHz
VIN
Lx
VIN
L:
CIN:
CL:
1.5μH
4.7μF
10μF
(NR3015, TAIYO YUDEN)
(Ceramic)
VSS
VSS
C
IN
(ceramic)
C
L
CE/
MODE
(Ceramic)
VOUT
(ceramic)
CE/MODE
●fOSC=1.2MHz
L:
CIN:
CL:
4.7μH
4.7μF
10μF
(NR4018, TAIYO YUDEN)
(Ceramic)
(Ceramic)
●XC9235/XC9236/XC9237D, F Series (Output Voltage External Setting)
<Setting for Output Voltage>
Output voltage can be set externally by adding two resistors to the FB pin. The output voltage is calculated by the RFB1 and
FB2 value. The total of RFB1 and RFB2 is usually selected less than 1MΩ.
R
Output voltages can be set in the range of 0.9V to 0.6V by use of 0.8V±2.0% reference voltage. However, when input
voltage (VIN) is lower than the setting output voltage, output voltage (VOUT) can not be higher than the input voltage (VIN).
VOUT=0.8 × (RFB1+RFB2)/RFB2
The value of the phase compensation speed-up capacitor CFB is calculated by the formula of fZFB = 1/(2×π×CFB×RFB1) with
f
ZFB <10kHz. For optimization, fZFB can be adjusted in the range of 1kHz to 20kHz depending on the inductance L and
the load capacitance CL which are used.
【Formula】
When RFB1=470kΩ and RFB2=150k, VOUT1=0.8 × (470k+150k) / 150k=3.3V
【Example】
VOUT
(V)
RFB1
(kΩ)
100
RFB2
(kΩ)
820
CFB
(pF)
150
100
220
150
VOUT
(V)
RFB1
(kΩ)
510
RFB2
(kΩ)
240
120
150
30
CFB
(pF)
100
150
100
470
0.9
1.2
1.5
1.8
2.5
3.0
3.3
4.0
150
300
330
130
150
470
300
240
120
13/40
XC9235/XC9236/XC9237 Series
■OPERATIONAL DESCRIPTION
The XC9235/XC9236/XC9237 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM
comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS
switching transistor for the synchronous switch, current limiter circuit, UVLO circuit and others. (See the block diagram
above.) The series ICs compare, using the error amplifier, the voltage of the internal voltage reference source with the feedback
voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error
amplifier output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM
comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave
circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This
process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-channel MOS
driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple
feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used
ensuring stable output voltage.
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or
3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to
synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
voltage divided by the internal split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the
output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier output are fixed
internally to deliver an optimized signal to the mixer.
<Current Limit>
The current limiter circuit of the XC9235/XC9236/XC9237 series monitors the current flowing through the P-channel MOS
driver transistor connected to the Lx pin, and features a combination of the current limit mode and the operation suspension
mode.
① When the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx
pin at any given timing.
② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over
current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for a
few ms and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the
driver transistor, and goes into operation suspension mode. Once the IC is in suspension mode, operations can be
resumed by either turning the IC off via the CE/MODE pin, or by restoring power to the VIN pin. The suspension mode does
not mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in
operation. The current limit of the XC9235/XC9236/XC9237 series can be set at 1050mA at typical. Besides, care must
be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending on the state
of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the
board should be laid out so that input capacitors are placed as close to the IC as possible.
Limit<#ms
Limit>#ms
ILIM
ILx
VOUT
Lx
0mA
VSS
VCE
VIN
Restart
14/40
XC9235/XC9236/XC9237
Series
■OPERATIONAL DESCRIPTION (Continued)
<Short-Circuit Protection>
The short-circuit protection circuit monitors the internal R1 and R2 divider voltage from the VOUT pin (refer to FB point in
the block diagram shown in the previous page). In case where output is accidentally shorted to the Ground and when
the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the ILIM flows to
the Pch MOS driver transistor, the short-circuit protection quickly operates to turn off and to latch the driver transistor.
For the D/E/F/G series, it does not matter how much the current limit, once the FB voltage become less than the
quarter of reference voltage (VREF), the short-circuit protection operates to latch the Pch MOS driver transistor. In
latch mode, the operation can be resumed by either turning the IC off and on via the CE/MODE pin, or by restoring
power supply to the VIN pin.
When sharp load transient happens, a voltage drop at the VOUT is propagated to the FB point through CFB, as a result,
short circuit protection may operate in the voltage higher than 1/2 VOUT voltage.
<UVLO Circuit>
When the VIN pin voltage becomes 1.4V or lower, the Pch MOS driver transistor output driver transistor is forced OFF to
prevent false pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V
or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to
initiate output startup operation. The soft start function operates even when the VIN pin voltage falls momentarily below
the UVLO operating voltage. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to
be suspended; therefore, the internal circuitry remains in operation.
<PFM Switch Current>
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the Pch MOS driver transistor
on. In this case, time that the Pch MOS driver transistor is kept on (TON) can be given by the following formula.
tON= L×IPFM / (VIN-VOUT) →IPFM①
< PFM Duty Limit >
In PFM control operation, the PFM duty limit (DTYLIMIT_PFM) is set to 200% (TYP.). Therefore, under the condition that the
duty increases (e.g. the condition that the step-down ratio is small), it’s possible for Pch MOS driver transistor to be turned
off even when coil current doesn’t reach to IPFM. →IPFM②
15/40
XC9235/XC9236/XC9237 Series
■OPERATIONAL DESCRIPTION (Continued)
<CL High Speed Discharge>
XC9235B(C)(D)(E)(F)(G)/ XC9236B(C)(D)(E)(F)(G)/ XC9237B(C)(D)(E)(F)(G) series can quickly discharge the electric
charge at the output capacitor (CL) when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is
inputted via the Nch MOS switch transistor located between the LX pin and the VSS pin. When the IC is disabled, electric
charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the
output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant
of a CL auto-discharge resistance value [R] and an output capacitor value (CL) as τ(τ=C x R), discharge time of the
output voltage after discharge via the N channel transistor is calculated by the following formulas.
τ
V = VOUT(E) x e –t/ or t=τLn (VOUT(E) / V)
V : Output voltage after discharge
VOUT(E) : Output voltage
t: Discharge time
τ: C x R
C= Capacitance of Output capacitor (CL)
R= CL auto-discharge resistance
Output Voltage Dischage Characteristics
Rdischg = 300Ω(TYP)
100
90
80
70
60
50
40
30
20
10
CL=10uF
CL=20uF
CL=50uF
0
0
10
20
30
40
50
60
70
80
90 100
Discharge Time t (ms)
16/40
XC9235/XC9236/XC9237
Series
■OPERATIONAL DESCRIPTION (Continued)
<CE/MODE Pin Function>
The operation of the XC9235/XC9236/XC9237 series will enter into the shut down mode when a low level signal is input to the
CE/MODE pin. During the shutdown mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high
impedance at the Lx pin and VOUT pin. The IC starts its operation by inputting a high level signal to the CE/MODE pin. The
input to the CE/MODE pin is a CMOS input and the sink current is 0μA (TYP.).
●XC9235/XC9236 series - Examples of how to use CE/MODE pin
(A)
SW_CE
ON
STATUS
Stand-by
Operation
OFF
(B)
SW_CE
ON
STATUS
Operation
Stand-by
OFF
(B)
(A)
●XC9237 series - Examples of how to use CE/MODE pin
(A)
SW_CE
ON
SW_PWM/PFM
STATUS
PWM/PFM Automatic Switching Control
PWM Control
*
OFF
ON
OFF
OFF
Stand-by
(B)
SW_CE
ON
SW_PWM/PFM
STATUS
Stand-by
*
(B)
(A)
OFF
ON
OFF
PWM Control
OFF
PWM/PFM Automatic Switching Control
Intermediate voltage can be generated by RM1 and RM2. Please set the value of each R1, R2, RM1, RM2 from
few hundreds kΩ to few hundreds MΩ. For switches, CPU open-drain I/O port and transistor can be used.
17/40
XC9235/XC9236/XC9237 Series
■OPERATIONAL DESCRIPTION (Continued)
<Soft Start>
Soft start time is available in two options via product selection.
The A,C,D,and E types of XC9235/XC9236/XC9237 series provide 1.0ms (TYP).
The B,F, and G types of XC9235/ XC9236/XC9237 series provide 0.25ms (TYP). However, for the D/F the soft-start time can
be set by the external components. Soft start time is defined as the time interval to reach 90% of the output voltage from the
time when the CE pin is turned on.
tSS
VCEH
0V
90% of setting voltage
VOUT
0V
18/40
XC9235/XC9236/XC9237
Series
■NOTE ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XC9235/XC9236/XC9237 series is designed for use with ceramic output capacitors. If, however, the potential
difference is too large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting
high switching energy and oscillation could occur on the output. If the input-output potential difference is large, connect an
electrolytic capacitor in parallel to compensate for insufficient capacitance.
3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
4. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage may
increase.
5. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the
possibility that some cycles may be skipped completely.
6. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that some cycles may be skipped completely.
7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when
dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate
the peak current according to the following formula:
Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT
L: Coil Inductance Value
fOSC: Oscillation Frequency
8. When the peak current which exceeds limit current flows within the specified time, the built-in Pch MOS driver transistor
turns off. During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit
current flows; therefore, care must be taken when selecting the rating for the external components such as a coil.
9. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
10. Care must be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending
on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of
noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
11. Use of the IC at voltages below the recommended voltage range may lead to instability.
12. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the
leak current of the driver transistor.
14. The current limit is set to 1350mA (MAX.) at typical. However, the current of 1350mA or more may flow. In case that the
current limit functions while the VOUT pin is shorted to the GND pin, when Pch MOS driver transistor is ON, the potential
difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By
contrast, when Nch MOS driver transistor is ON, there is almost no potential difference at both ends of the coil since the
VOUT pin is shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the
repetition of this operation, and the delay time of the circuit, coil current will be converged on a certain current value,
exceeding the amount of current, which is supposed to be limited originally. Even in this case, however, after the over
current state continues for several ms, the circuit will be latched. A coil should be used within the stated absolute
maximum rating in order to prevent damage to the device.
①Current flows into Pch MOS driver transistor to reach the current limit (ILIM).
②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to
OFF of Pch MOS driver transistor.
③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
④Lx oscillates very narrow pulses by the current limit for several ms.
⑤The circuit is latched, stopping its operation.
19/40
XC9235/XC9236/XC9237 Series
■NOTE ON USE (Continued)
15. In order to stabilize VIN’s voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be
connected as close as possible to the VIN & VSS pins.
16. High step-down ratio and very light load may lead an intermittent oscillation.
17. During PWM / PFM automatic switching mode, operating may become unstable at transition to continuous mode.
Please verify with actual parts.
18. Please note the inductance value of the coil. The IC may enter unstable operation if the combination of ambient
temperature, setting voltage, oscillation frequency, and L value are not adequate.
In the operation range close to the maximum duty cycle, The IC may happen to enter unstable output voltage operation
even if using the L values listed below.
●The Range of L Value
<External Components>
fOSC
VOUT
L Value
3.0MHz
0.8V<VOUT<4.0V
1.0μH~2.2μH
3.3μH~6.8μH
4.7μH~6.8μH
V
OUT≦2.5V
1.2MHz
2.5V<VOUT
*When
a coil less value of 4.7μH is used at
f
OSC=1.2MHz or when a coil less value of 1.5μH is
used at fOSC=3.0MHz, peak coil current more easily
reach the current limit ILMI. In this case, it may
happen that the IC can not provide 600mA output
current.
19. It may happen to enter unstable operation when the IC goes into continuous operation mode under the condition of large
input-output voltage difference. Care must be taken with the actual design unit.
<External Components>
20. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
20/40
XC9235/XC9236/XC9237
Series
■NOTE ON USE (Continued)
21. Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN & VSS pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver transistors.
22. NOTE ON MOUNTING (WLP-5-03)
(1) Mount pad design should be optimized for user's conditions.
(2) Sn-AG-Cu is used for the package terminals. If eutectic solder is used, mounting reliability is decreased. Please do not
use eutectic solder paste.
(3) When underfill agent is used to increase interfacial bonding strength, please take enough evaluation for selection. Some
underfill materials and applied conditions may decrease bonding reliability.
(4) The IC has exposed surface of silicon material in the top marking face and sides so that it is weak against mechanical
damages. Please take care of handling to avoid cracks and breaks.
(5) The IC has exposed surface of silicon material in the top marking face and sides. Please use the IC with keeping the
circuit open (avoiding short-circuit from the out).
(6) Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage under strong lights
may affects device performance.
21/40
XC9235/XC9236/XC9237 Series
■TEST CIRCUITS
< Circuit No.1 >
Wave Form Measure Point
・A/B/C/E/G series
・D/F series
Wave Form Measure Point
IOUT
L
L
VIN
Lx
A
VIN
Lx
A
Cfb
CIN
R1
R2
CL
CE/MODE
VOUT
V
RL
RL
V
CE/MODE
FB
CIN
CL
VSS
VSS
※
External Components
L
: 1.5μH(NR4018) 3.0MHz
: 4.7μH (NR3015) 1.2MHz
VOUT=VFB×(R1+R2)/R2
※
External Components
CIN : 4.7μF
CL : 10μF
R1 : 150kΩ
R2 : 300kΩ
Cfb : 120pF
L
:
1.5uH(NR3015) 3.0MHz
4.7uH(NR4018) 1.2MHz
CIN : 4.7μF(ceramic)
CL :10μF(ceramic)
< Circuit No.2 >
< Circuit No.3 >
Wave Form Measure Point
VIN
Lx
VIN
Lx
A
VOUT
(FB)
VOUT
(FB)
Rpulldown
200Ω
CE/MODE
CE/MODE
1uF
1uF
VSS
VSS
< Circuit No.4 >
< Circuit No.5 >
VIN
Lx
VIN
Lx
A
ICEH
VOUT
(FB)
VOUT
(FB)
100mA
CE/MODE
CE/MODE
V
A
1uF
1uF
VSS
VSS
ICEL
ON resistance = (VIN-VLx)/100mA
< Circuit No.7 >
< Circuit No.6 >
Wave Form Measure Point
Wave Form Measure Point
VIN
Lx
VIN
Lx
Ilat
VOUT
(FB)
VOUT
(FB)
ILIM
CE/MODE
CE/MODE
VSS
V
1uF
1uF
VSS
Rpulldown
1Ω
< Circuit No.8 >
< Circuit No.9 >
ILx
VIN
Lx
VIN
Lx
A
A
VOUT
(FB)
VOUT
(FB)
CE/MODE
VSS
CE/MODE
1uF
CIN
VSS
22/40
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XC9237A18C
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
L=4.7μH (NR40Ambient Temperature: Ta (℃)
PWM/PFM Automatic Sw itching Control
PWM/PFM Automatic Sw itching Control
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN= 4.2V
VIN= 4.2V
3.6V
PWM Control
VIN= 4.2V
3.6V
2.4V
3.6V
2.4V
PWM Control
VIN= 4.2V
2.4V
3.6V
2.4V
0.1
1
100
1000
Output Current: IOUT (mA)
0.1
1
00
Output Current:IOUT(mA)
1000
Output Current: IOUT (mA)
Output Current:IOUT(mA)
(2) Output Voltage vs. Output Current
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
XC923 ● Soft-Start Time, Setting
2.1
2.0
1.9
1.8
1.7
1.6
1.5
2.1
2.0
1.9
1.8
1.7
1.6
1.5
PWM/PFM Automatic Sw itching Control
PWM/PFM Automatic Sw itching Control
VIN 4.2V,3.6V,2.4V
=
VIN 4.2V,3.6V,2.4V
=
PWM Control
PWM Control
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
(3) Ripple Voltage vs. Output Current
XC9237A18C
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
100
80
60
40
20
0
100
80
60
40
20
0
PWM/PFM Automatic
PWM Control
PWM/PFM A utomatic
Sw itching Control
Sw itching Control
VIN 4.2V,3.6V,2.4V
=
VIN 4.2V
=
PWM Control
VIN 4.2V
=
3.6V
VIN 4.2V,3.6V,2.4V
=
3.6V
2.4V
ꢀꢀ
2.4V
ꢀꢀ
0.1
1
10
t:
100
1000
0.1
1
10
t:
100
ly
1000
O
u
tp
u
t
C
ur
r
n
I
O
U
(m
A
)
O
u
tp
u
t
C
u
r
re
n
I
O
U
T
S
u
pp
23/40
XC9235/XC9236/XC9237 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Oscillation Frequency vs. Ambient Temperature
XC9237A18D
XC9237A18C
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
3.5
3.4
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
VIN=3.6V
VIN=3.6V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃
Ambient Temperature: Ta (℃)
)
(5) Supply Current vs. Ambient Temperature
XC9237A18D
XC9237A18C
40
40
VIN=6.0V
35
30
35
30
25
20
15
10
5
VIN=4.0V
VIN=6.0V
VIN=2.0V
25
20
15
10
5
VIN=4.0V
VIN=2.0V
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
(6) Output Voltage vs. Ambient Temperature
(7) UVLO Voltage vs. Ambient Temperature
XC9237A18D
XC9237A18D
2.1
1.8
CE=VIN
2.0
1.5
1.2
0.9
0.6
0.3
0.0
1.9
VIN=3.6V
1.8
1.7
1.6
1.5
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
24/40
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) CE "H" Voltage vs. Ambient Temperature
(9) CE "L" Voltage vs. Ambient Temperature
XC9237A18D
XC9237A18D
1.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.9
0.8
VIN=5.0V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
VIN=5.0V
VIN=3.6V
VIN=3.6V
VIN=2.4V
VIN=2.4V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient TempOutput Current: IOUT (mA)
Ambient Temperature: Ta (℃)
(10) Soft Start Time vs. Ambient Temperature
XC9237A18C
XC9237A18D
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
5
4
3
2
1
0
5
4
3
2
1
0
VIN=3.6V
VIN=3.6V
-50
-25
0
25
Ambient Temperature: Ta (℃)
50
75
100
-50
-25
0
25
50
75
100
AmbiRipple Voltage: Vr (mV)
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage
XC9237A18D
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Nch on Resistance
Pch on Resistance
0
1
2
3
4
5
6
Input Voltage: VIN (V)<External Components>
25/40
XC9235/XC9236/XC9237 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) XC9235B/36B/37B Rise Wave Form
XC9237B12C
XC9237B33D
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
VIN=5.0V
VIN=5.0V
IOUT=1.0mA
IOUT=1.0mA
VOUT:1.0V/div
VOUT:0.5V/div
CE:0.0V⇒1.0V
100μs/div
CE:0.0V⇒1.0V
100μs/div
(13) XC9235B/36B/37B
Soft-Start Time vs. Ambient Temperature
XC9237B12C
XC9237B33D
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
500
400
300
200
100
0
500
400
300
200
100
0
VIN=5.0V
IOUT=1.0mA
VIN=5.0V
IOUT=1.0mA
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta(℃)
Ambient Temperature: Ta(℃)
(14) XC9235B/36B/37B
CL Discharge Resistance vs. Ambient Temperature
XC9237B33D
600
500
400
300
200
100
VIN=6.0V
VIN=4.0V
VIN=2.0V
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
26/40
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response
XC9237A18C
L=4.7μH (NR4018), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=VIN (PWM/PFM Automatic Switching Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
50μs/div
50μs/div
I
OUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
V
OUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
27/40
XC9235/XC9236/XC9237 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
XC9237A18C
L=4.7μH (NR4018), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=1.8V (PWM Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
50μs/div
50μs/div
I
OUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
V
OUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
28/40
XC9235/XC9236/XC9237
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=VIN (PWM/PFM Automatic Switching Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
50μs/div
50μs/div
I
OUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
29/40
XC9235/XC9236/XC9237 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
XC9237A18D
L=1.5μH (NR3015), CIN=4.7μF (ceramic), CL=10μF (ceramic), Topr=25℃
VIN=3.6V, VCE=1.8V (PWM Control)
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
50μs/div
50μs/div
I
OUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
30/40
XC9235/XC9236/XC9237
Series
■PACKAGING INFORMATION
●SOT-25 Reference Pattern Layout
●SOT-25
(unit : mm)
0.7
2.9±0.2
+0.1
-0.05
0.4
5
4
3
0~0.1
1
2
+0.1
-0.05
0.15
(0.95)
1.9±0.2
0.95
0.95
31/40
XC9235/XC9236/XC9237 Series
■PACKAGING INFORMATION (Continued)
●USP-6C
(unit : mm)
●USP-6C Reference Pattern Layout
●USP-6C Reference Metal Mask Design
2.4
0.45
0.45
1
2
3
6
5
4
0.05
0.05
1.0
32/40
XC9235/XC9236/XC9237
Series
■PACKAGING INFORMATION (Continued)
●USP-6EL
(unit : mm)
* A part of the pin may appear from the side of the package
because of it’s structure, but reliability of the package and
strength will not be changed below the standard.
●USP-6EL Reference Pattern Layout
●USP-6EL Reference Metal Mask Design
1.4
1.5
0.3
0.5
0.35
0.55 0.55
0.55 0.55
33/40
XC9235/XC9236/XC9237 Series
■PACKAGING INFORMATION (Continued)
●WLP-5-03
1.06±0.04
1pin INDENT
(0.3)
1
2
4
5
3
(0.5)
●WLP-5-03
●WLP-5-03
●WLP-5-03
Reference Pattern Layout detail
Reference Pattern Layout
Reference Metal Mask Design
0.5
0.5
PCB
0.275
0.3
resist
34/40
25
45
65
85
105
125
Ambient Temperature Ta (℃)237
eries
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
40.0
28.9
Condition Mount on a board
:
Ambient Natural convection
:
Soldering Lead (Pb) free
:
Board Dimensions 40 x 40 mm
:
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material Glass Epoxy (FR-4)
:
Thickness 1.6mm
:
Through-hole 4 x 0.8 Diameter
:
1.4
2.54
Evaluation Board (Unit mm)
:
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125
)
℃
Ambient Temperature
Power Dissipation Pd mW
Thermal Resistance
166.67
W
(℃/ )
(℃)
(
)
25
85
600
240
Pd vs. Ta
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
35/40
XC9235/XC9236/XC9237 Series
●ꢀUSP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition Mount on a board
:
Ambient Natural convection
:
Soldering Lead (Pb) free
:
Board Dimensions 40 x 40 mm
:
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
Material Glass Epoxy (FR-4)
:
Thickness 1.6mm
:
Through-hole 4 x 0.8 Diameter
:
Evaluation Bard (Unimm)
:
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125
)
℃
Ambient Temperature
Power Dissipation Pd mW
Thermal Resistance
W
(℃/ )
(℃)
(
)
25
85
1000
400
100.00
Pd vs Ta
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
36/40
XC9235/XC9236/XC9237
Series
●ꢀUSP-6EL Power Dissipation
Power dissipation data for the USP-6EL is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition Mount on a board
:
Ambient Natural convection
:
Soldering Lead (Pb) free
:
Board Dimensions 40 x 40 mm
:
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
Material Glass Epoxy (FR-4)
:
Thickness
1.6mm
:
Through-hole 4 x 0.8 Diameter
:
Evaluation Bord (Unit mm)
:
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125
)
℃
Ambient Temperature
Power Dissipation Pd mW
Thermal Resistance
100.00
W
(℃/ )
(℃)
(
)
25
85
1000
400
Pd vs. Ta
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
37/40
XC9235/XC9236/XC9237 Series
●WLP-5 Power Dissipation
Power dissipation data for theWLP-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition Mount on a board
:
Ambient Natural convection
:
Soldering Lead (Pb) free
:
Board 40mm×40mm 1600mm2 in one side
:
(
)
1st Metal Layer about 50%
2nd Inner Metal Layer about 50%
3rd Inner Metal Layer about 50%
4th Metal Layer about 50%
4 separations is each layer connected
to each pin
Material Glass Epoxy (FR-4)
:
Thickness 1.6mm
:
Through-hole 4 x 0.8 Diameter
:
Evaluation Board (Unit mm)
:
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125 )
℃
Ambient Temperature
Power Dissipation Pd mW Thermal Resistance ( /W)
( ) ℃
(℃)
25
85
750
300
133.33
Pd vs. Ta
800
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
38/40
XC9235/XC9236/XC9237
Series
■MARKING RULE
●SOT-25
① represents product series
PRODUCT
XC9235
XC9236
XC9237
SERIES
A
B
C
D
E
F
4
C
K
K
4
5
D
L
6
E
M
M
6
L
5
2
7
B
E
G
C
D
SOT-25
② represents integer number of output voltage and oscillation frequency
●A/B/C/F Series
(TOP VIEW)
MARK
OUTPUT
VOLTAGE (V)
fOSC=1.2MHz
fOSC=3.0MHz
●USP-6C/USP-6EL
0.X
1.X
2.X
3.X
4.X
A
B
C
D
E
F
H
K
L
M
●E/G/D Series
OUTPUT
MARK
VOLTAGE (V)
fOSC=1.2MlHz
fOSC=3.0MlHz
USP-6C/USP-6EL
(TOP VIEW)
0.X
1.X
2.X
3.X
4.X
N
P
R
S
T
U
V
X
Y
Z
●WLP-5-03
2
3
1
③ represents decimal point of output voltage
VOUT (V)
X.00
X.10
X.20
X.30
X.40
X.50
X.60
X.70
X.80
X.90
MARK
VOUT (V)
X.05
X.15
X.25
X.35
X.45
X.55
X.65
X.75
X.85
X.95
MARK
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
F
4
5
WLP-5-03
(TOP VIEW)
H
K
L
M
④⑤ represents production lot number
Order of 01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ.
(G, I, J, O, Q, W excluded)
*No character inversion used.
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XC9235/XC9236/XC9237 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent
personal injury and/or property damage resulting from such failure, customers are required to
incorporate adequate safety measures in their designs, such as system fail safes, redundancy and
fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
40/40
相关型号:
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TOREX
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