XCL208 [TOREX]
400mA Inductor Built-in Step-Down âmicro DC/DCâ Converters; 400毫安电感内置步下了????微型DC / DCA ????转换器型号: | XCL208 |
厂家: | Torex Semiconductor |
描述: | 400mA Inductor Built-in Step-Down âmicro DC/DCâ Converters |
文件: | 总22页 (文件大小:824K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XCL208/XCL209 Series
ETR28003-001a
400mA Inductor Built-in Step-Down “micro DC/DC” Converters
☆GreenOperation Compatible
■GENERAL DESCRIPTION
The XCL208/XCL209 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in
one tiny package (2.5mm×2.15mm, h=1.05mm). A stable power supply with an output current of 400mA is configured using only
two capacitors connected externally.
An internal coil simplifies the circuit and enables minimization of noise and other operational trouble due to the circuit wiring.
A wide operating voltage range of 1.8V (2.0V) to 6.0V enables support for applications that require an alkaline battery (2-cell) or
AC adapter (5V) power supply. An internally fixed output voltage (0.8V to 4.0V) or an externally set output voltage can be selected.
The XCL208/XCL209 series uses synchronous rectification at an operating frequency of 3.0MHz. PWM control (XCL208) or
automatic PWM/PFM switching control (XCL209) can be selected. The XCL208 series has a fixed frequency, enabling the
suppression of output ripple. The XCL209 series achieves high efficiency while holding down output ripple across the full range of
loads, from light to heavy, enabling the extension of battery operation time.
Soft start and on/off functions with CL discharge are provided, and the IC can be put in the standby state by inputting a Low level
signal into the CE pin.
■FEATURES
■APPLICATIONS
●Mobile phones, Smart phones
●Bluetooth Headsets
●Tablet PCs
Input Voltage
: 1.8V ~ 6.0V (Type F)
: 2.0V ~ 6.0V (Type A/B)
: 0.8V ~ 4.0V (±2.0%)
: 90% (VIN=4.2V, VOUT=3.3V)
: 400mA
Fixed Output Voltage
High Efficiency
●PND
Output Current
●PC peripheral devices
●DSC, Camcorders
Oscillation Frequency
CE Function
: 3.0MHz (±15%)
: Active High
Soft-start Circuit Built-in
CL High Speed Auto Discharge
: Current Limiter Built-in
(Constant Current & Latching)
: PWM (XCL208)
Protection Circuits
Control Methods
■TYPICAL APPLICATION CIRCUIT
PWM/PFM (XCL209)
Operating Ambient Temperature : -40℃~+85℃
Package
: USP-10B03
Environmentally Friendly
: EU RoHS Compliant, Pb Free
■TYPICAL PERFORMANCE
CHARACTERISTICS
●Efficiency vs. Output Current
XCL208x333DR/XCL209x333D
XCL208A / XCL208B / XCL209A / XCL209B Type
100
XCL209(PWM/PFM)
80
60
VIN= 4.2V
40
5.0V
XCL208(PWM)
VOUT =3.3V
20
0
0.01
0.1
1
10
100
1000
Output Current:IOUT (mA)
XCL208F / XCL209F Type
1/22
XCL208/XCL209 Series
■BLOCK DIAGRAM
1)XCL208A / XCL209A Type
2) XCL208B / XCL209B Type
L1
L2
L1
L2
VOUT
VOUT
LX
LX
VIN
VIN
PVSS
PVSS
AVSS
AVSS
CE
CE
3)XCL208F / XCL209F Type
L1
L2
FB
LX
VIN
PVSS
AVSS
CE
NOTE:
The XCL208 offers a fixed PWM control, a signal from CE Control Logic to PWM/PFM Selector is fixed to "L" level inside. The XCL209 control
scheme is PWM/PFM automatic switching, a signal from CE Control Logic to PWM/PFM Selector is fixed to "H" level inside. The diodes placed
inside are ESD protection diodes and parasitic diodes.
2/22
XCL208/XCL209
Series
■PRODUCT CLASSIFICATION
XCL208①②③④⑤⑥ Fixed PWM
XCL209①②③④⑤⑥ PWM/PFM Auto Switching
DESIGNATOR
ITEM
Type
SYMBOL
A
DESCRIPTION
VIN≧2.0V Fixed Output Voltage
Standard soft-start , No CL auto discharge
VIN≧2.0V Fixed Output Voltage
①
B
F
CL auto discharge, High speed soft-start
VIN≧1.8V Output Voltage External Setting
CL auto discharge, High speed soft-start
10
12
15
18
25
28
2L
30
33
08
3
1.0V
1.2V
1.5V
1.8V
2.5V
②③
Output Voltage (*1)
2.8V
2.85V
3.0V
3.3V
External Setting 0.8V (XCL208F/XCL209F)
3.0MHz
④
Oscillation Frequency
Package (Order Unit)
(*2)
⑤⑥
DR
USP-10B03 (3,000/Reel)
(*1) When other output voltages (semi-custom) are needed, please contact your local Torex sales office for more information.
Output voltage range is 0.8~4.0V.
(*2) Halogen free and RoHS compliant.
3/22
XCL208/XCL209 Series
■PIN CONFIGURATION
VIN 8
L1
9
PVSS
LX
1
2
NC
CE
7
6
3
4
NC
10
AVSS 5
VOUT
L2
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
USP-10B03
PVSS
LX
1
2
3
(Power) Ground
Switching Output
No Connection
NC
FB
Output Voltage Sense Pin (Type F)
4
VOUT
AVSS
CE
Fixed Output Voltage Pin (Type A/B)
(Analog) Ground
5
6
Active High Enable
No Connection
NC
7
VIN
L1
8
Power Supply Input
Inductor Electrodes
Inductor Electrodes
9
L2
10
■FUNCTION
PIN NAME
SIGNAL
CONDITIONS
AVSS≦VCE≦0.25V
0.65V≦VCE≦6V
STATUS
L
Stand-by
Active
CE
H
* When the CE pin is left open, the IC may operate unstable. Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
Lx Pin Voltage
VIN
VLx
-0.3~6.5
-0.3~VIN+0.3≦6.5
-0.3~6.5
V
V
Output Voltage
VOUT
VCE
ILX
V
CE Input Voltage
-0.3~6.5
V
Lx Pin Current
±1500
mA
mW
℃
℃
Power Dissipation (*1)
Operating Ambient Temperature
Storage Temperature
Pd
500
Topr
Tstg
-40~+85
-40~+125
Each voltage rating uses the VSS pin as a reference.
(*1) The value is an example data which is taken with the PCB mounted.
4/22
XCL208/XCL209
Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
1) XCL208Axx3DR/XCL209Axx3DR
PARAMETER
Output Voltage
SYMBOL
VOUT
CONDITIONS
MIN.
TYP.
MAX.
<E-3>
6.0
UNIT
V
CIRCUIT
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
<E-1> <E-2>
①
①
Operating Voltage Range
VIN
2.0
-
-
V
VIN=VOUT(T)+2.0V, VCE=1.0V,
Maximum Output Current
UVLO Voltage
IOUTMAX
400
-
mA
V
①
③
When connected to external components (*8)
VCE =VIN, VOUT =0V, Voltage which Lx pin holding
“L” level (*1),(*10)
VUVLO
1.00
1.40
1.78
Supply Current (XCL208)
Supply Current (XCL209)
Stand-by Current
-
-
-
46
21
0
65
35
1
IDD
ISTB
fOSC
VIN=VCE=5.0V, VOUT=VOUT(T)×1.1
μA
μA
②
②
①
VIN=5.0V, VCE=0V, VOUT=VOUT(T)×1.1
When connected to external components,
VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
2.55
3.00
3.45
MHz
When connected to external components,
VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA
PFM Switching Current (*11)
IPFM
<E-4> <E-5>
<E-6>
mA
⑩
PFM Duty Limit (*11)
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VCE=VIN=<C-1>, IOUT=1mA
-
100
-
200
300
%
%
%
①
③
③
DMAX
DMIN
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9
VIN=VCE=5.0V, VOUT=VOUT(T)×1.1
-
-
-
0
When connected to external components,
VCE=VIN=VOUT(T)+1.2V, IOUT=100mA
Efficiency (*2)
EFFI
-
<E-7>
-
%
①
LX SW "H" ON Resistance 1
LX SW "H" ON Resistance 2
LX SW "L" ON Resistance 1
LX SW "L" ON Resistance 2
RLxH1
RLxH2
RLxL1
RLxL2
VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3)
VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3)
VIN=VCE=5.0V (*4)
-
-
-
-
0.35
0.42
0.45
0.52
0.55
0.67
0.65
0.77
Ω
Ω
Ω
Ω
④
④
-
VIN=VCE=3.6V (*4)
-
LX SW "H" Leakage Current (*5)
ILeakH
VIN=VOUT=5.0V, VCE=0V, VLX=0V
-
0.01
1.00
μA
⑤
LX SW "L" Leakage Current (*5)
ILeakL
VIN=VOUT=5.0V, VCE= 0V, VLX=5.0V
-
600
-
0.01
800
1.00
1000
-
μA
⑤
⑥
①
Current Limit (*9)
Output Voltage Temperature
Characteristics
ILIM
ΔVOUT
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9V (*7)
IOUT=30mA,
mA
/
±100
ppm/
V
℃
(VOUT
・
ΔTopr) -40℃≦Topr≦85℃
VOUT=0V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
0.65
VSS
-
-
VIN
③
③
Voltage changes Lx to “L” level (*10)
VOUT=0V, Applied voltage to VCE,
Voltage changes Lx to “L” level (*10)
VCEL
0.25
V
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE= 5.0V, VOUT=0V
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
VIN=5.0V, VCE=0V, VOUT=0V
When connected to external components,
VCE=0V→VIN, IOUT=1mA
Soft-start Time
Latch Time
tSS
0.5
1
0.90
-
2.50
20
ms
ms
①
⑦
VIN=VCE=5.0V, VOUT=0.8×VOUT(T)
Short Lx at 1Ω resistance (*6)
Sweeping VOUT, VIN=VCE=5.0V,
,
tLAT
Short Protection Threshold Voltage
VSHORT
<E-8> <E-9> <E-10>
V
⑦
Short Lx at 1Ω resistance, VOUT voltage which
Lx becomes “L” level within 1ms
Test Frequency=1MHz
Inductance Value
L
-
-
1.5
-
-
μH
-
-
Allowed Inductor Current
IDC
ΔT=+40℃
700
mA
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage
NOTE:
(*1) Including hysteresis operating voltage range.
(*2) EFFI={ (output voltage×output current) / (input voltage×input current) }×100
(*3) ON resistance (Ω)=(VIN - Lx pin measurement voltage) / 100mA
(*4) Design value
(*5) When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9) Current limit denotes the level of detection at peak of coil current.
(*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series.
5/22
XCL208/XCL209 Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25℃
2) XCL208Bxx3DR/XCL209Bxx3DR
PARAMETER
SYMBOL
CONDITIONS
When connected to external components,
VIN=VCE=5.0V, IOUT=30mA
MIN.
<E-1>
2.0
TYP.
<E-2>
-
MAX.
<E-3>
6.0
UNIT CIRCUIT
Output Voltage
VOUT
V
V
①
①
Operating Voltage Range
VIN
VIN=VOUT(T)+2.0V, VCE=1.0V,
Maximum Output Current
UVLO Voltage
IOUTMAX
VUVLO
400
-
-
mA
V
①
③
When connected to external components (*8)
VCE=VIN, VOUT=0V,
1.00
1.40
1.78
Voltage which Lx pin holding “L” level (*1),(*10)
Supply Current (XCL208)
Supply Current (XCL209)
Stand-by Current
-
-
-
46
21
0
65
35
1
IDD
VIN=VCE=5.0V, VOUT=VOUT(T) ×1.1
μA
μA
②
②
ISTB
VIN=5.0V, VCE=0V, VOUT=VOUT(T) ×1.1
When connected to external components,
VIN=VOUT(T)+2.0V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
fOSC
2.55
3.00
3.45
MHz
mA
①
⑩
When connected to external components,
VIN=VOUT(T)+2.0V, VCE=VIN , IOUT=1mA
PFM Switching Current (*11)
IPFM
<E-4>
<E-5>
<E-6>
PFM Duty Limit (*11)
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VCE=VIN=<C-1>, IOUT=1mA
-
100
-
200
-
-
300
-
0
%
%
%
①
③
③
DMAX
DMIN
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9
VIN=VCE=5.0V, VOUT=VOUT(T)×1.1
When connected to external components,
VCE=VIN=VOUT(T)+1.2V, IOUT=100mA
Efficiency (*2)
EFFI
-
<E-7>
-
%
①
LX SW "H" ON Resistance 1
LX SW "H" ON Resistance 2
LX SW "L" ON Resistance 1
LX SW "L" ON Resistance 2
RLxH1
RLxH2
RLxL1
RLxL2
VIN=VCE=5.0V, VOUT=0V, ILX=100mA (*3)
VIN=VCE=3.6V, VOUT=0V, ILX=100mA (*3)
VIN=VCE=5.0V (*4)
-
-
-
-
0.35
0.42
0.45
0.52
0.55
0.67
0.65
0.77
Ω
Ω
Ω
Ω
④
④
-
VIN=VCE=3.6V (*4)
-
LX SW "H" Leakage Current (*5)
Current Limit (*9)
ILeakH
VIN=VOUT=5.0V, VCE=0V, VLX=0V
VIN=VCE=5.0V, VOUT=VOUT(T)×0.9V (*7)
IOUT=30mA, -40℃≦Topr≦85℃,
-
600
-
0.01
800
1.00
1000
-
μA
⑨
⑥
①
ILIM
ΔVOUT
mA
Output Voltage Temperature
Characteristics
/
±100
ppm/℃
(VOUT
・
ΔTopr)
VOUT=0V, Applied voltage to VCE Voltage
changes Lx to “L” level
CE "H" Voltage
CE "L" Voltage
VCEH
0.65
VSS
-
VIN
V
V
③
③
*10
)
(
VOUT=0V, Applied voltage to VCE Voltage
VCEL
0.25
*10
)
(
changes Lx to “L” level
VIN=VCE=5.0V, VOUT=0V
-
CE "H" Current
CE "L" Current
ICEH
ICEL
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
VIN=5.0V, VCE=0V, VOUT=0V
When connected to external components,
VCE=0V→VIN, IOUT=1mA
Soft-start Time
Latch Time
tSS
-
<E-11> <E-12>
ms
ms
①
⑦
VIN=VCE=5.0V, VOUT=0.8×VOUT(T)
Short Lx at 1Ω resistance(*6)
Sweeping VOUT, VIN=VCE=5.0V,
,
tLAT
1
-
20
Short Protection Threshold Voltage
VSHORT
<E-8>
<E-9>
<E-10>
V
⑦
Short Lx at 1Ω resistance, VOUT voltage which
Lx becomes “L” level within 1ms
CL Discharge
RDCHG
VIN=5.0V, LX=5.0V, VCE=0V, VOUT=Open
200
300
450
Ω
⑧
Inductance Value
Allowed Inductor Current
L
IDC
Test Frequency=1MHz
ΔT=+40℃
-
-
1.5
700
-
-
μH
mA
-
-
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT (T)=Nominal Voltage
NOTE:
(*1) Including hysteresis operating voltage range.
(*2) EFFI={ ( output voltage×output current ) / ( input voltage×input current) }×100
(*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
(*4) Design value
(*5) When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9) Current limit denotes the level of detection at peak of coil current.
(*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series which have PFM control function. (Not for the XCL 208 series)
6/22
XCL208/XCL209
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25℃
3) XCL208F083DR/XCL209F083DR
PARAMETER
FB Voltage
SYMBOL
VFB
CONDITIONS
MIN.
TYP.
MAX.
0.816
UNIT
V
CIRCUIT
VIN=VCE=5.0V, VFB voltage which Decrease
VFB from 0.9V, Lx becomes “L” (*10) level
0.784
0.800
③
Operating Voltage Range
Maximum Output Current
VIN
1.8
-
-
6.0
-
V
①
①
VIN=3.2V, VCE=1.0V,
IOUTMAX
400
mA
When connected to external components (*8)
VCE=VIN, VFB=0.4V,
Voltage which Lx pin holding “L” level (*1), (*10)
UVLO Voltage
VUVLO
1.00
1.40
1.78
V
③
Supply Current (XCL208)
Supply Current (XCL209)
Stand-by Current
-
-
-
46
21
0
65
35
IDD
ISTB
fOSC
VIN=VCE= 5.0V, VFB=0.88V
μA
μA
②
③
①
VIN=5.0V, VCE=0V, VFB=0.88V
1.0
When connected to external components,
VIN=3.2V, VCE=1.0V, IOUT=100mA
Oscillation Frequency
2.55
3.00
3.45
MHz
When connected to external components,
VIN=3.2V, VCE= VIN, IOUT=1mA
PFM Switching Current (*11)
IPFM
<E-4>
<E-5>
<E-6>
mA
⑩
PFM Duty Limit (*11)
Maximum Duty Cycle
Minimum Duty Cycle
DTYLIMIT_PFM VIN=VCE=2.2V, IOUT=1mA
-
100
-
200
300
%
%
%
①
③
③
MAXDTY
MINDTY
VIN=VCE=5.0V, VFB=0.72V
VIN=VCE=5.0V, VFB=0.88V
-
-
-
0
When connected to external components,
VCE=VIN=2.4V, IOUT=100mA
Efficiency (*2)
EFFI
-
<E-7>
-
%
①
LX SW "H" ON Resistance 1
LX SW "H" ON Resistance 2
LX SW "L" ON Resistance 1
LX SW "L" ON Resistance 2
RLxH1
RLxH2
RLxL1
RLxL2
VIN=VCE=5.0V, VFB=0.72V, ILX=100mA (*3)
VIN=VCE=3.6V, VFB=0.72V, ILX=100mA (*3)
VIN=VCE=5.0V (*4)
-
-
-
-
0.35
0.42
0.45
0.52
0.55
0.67
0.65
0.77
Ω
Ω
Ω
Ω
④
④
-
VIN=VCE=3.6V (*4)
-
LX SW "H" Leakage Current (*5)
ILeakH
VIN=VFB=5.0V, VCE=0V, VLX=0V
VIN=VCE=5.0V, VFB=0.72V (*7)
IOUT=30mA, -40℃≦Topr≦85℃,
-
600
-
0.01
800
1.00
1000
-
μA
mA
⑨
⑥
①
PFM Duty Limit (*9)
Output Voltage Temperature
Characteristics
ILIM
ΔVOUT
(VOUT ΔTopr)
/
±100
ppm/
V
℃
・
VFB=0.72V, Applied voltage to VCE
Voltage changes LX to “L” level (*10)
VFB=0.72V, Applied voltage to VCE
,
CE "H" Voltage
CE "L" Voltage
VCEH
0.65
VSS
-
-
VIN
③
③
,
VCEL
0.25
V
Voltage changes LX to “L” level (*10)
CE "H" Current
CE "L" Current
ICEH
ICEL
VIN=VCE=5.0V, VFB=0.72V
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
VIN=5.0V, VCE=0V, VFB=0.72V
When connected to external components,
VCE=0V→VIN, IOUT=1mA
Soft-start Time
Latch Time
tSS
-
0.25
-
0.40
20
ms
ms
①
⑦
VIN=VCE=5.0V, VFB=0.64V,
tLAT
1
Short Lx at 1Ω resistance(*6)
VIN=VCE=5.0V, VFB voltage which Decrease
VFB from 0.9V, Lx becomes “L” (*10) level
VIN=5.0V, LX=5.0V, VCE=0V, VFB=Open
Test Frequency=1MHz
Short Protection Threshold Voltage
VSHORT
0.150
0.200
0.250
V
⑦
CL Discharge
Inductance Value
RDCHG
L
200
300
1.5
450
Ω
⑧
-
-
-
-
-
μH
mA
Allowed Inductor Current
IDC
ΔT=40℃
700
-
Test conditions: Unless otherwise stated, VIN=5.0V, VOUT(T)=Nominal Voltage, and the order of voltage application is VFB→VIN→VCE
NOTE:
(*1) Including hysteresis operating voltage range.
(*2) EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
(*3) ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
(*4) Design value
(*5) When temperature is high, a current of approximately 10μA (maximum) may leak.
(*6) Time until it short-circuits VOUT with GND via 1Ω of resistor from an operational state and is set to Lx=0V from current limit pulse generating.
(*7) When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
(*8) When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
(*9) Current limit denotes the level of detection at peak of coil current.
(*10) “H”=VIN~VIN-1.2V, “L”=+0.1V~-0.1V
(*11) IPFM and DTYLIMIT_PFM are defined only for the XCL209 series which have PFM control function.
7/22
XCL208/XCL209 Series
■ELECTRICAL CHARACTERISTICS (Continued)
PFM
VOUT (V)
IPFM (mA)
EFFI (%)
VSHORT (ms)
tss (ms)
TYP. MAX.
Duty
VOUT
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
TYP.
MIN.
TYP. MAX.
VIN (V)
<C-1> <E-1> <E-2> <E-3> <E-4> <E-5> <E-6>
<E-7>
79
<E-8> <E-9> <E-10> <E-11> <E-12>
1.00
1.20
1.50
1.80
2.50
2.80
2.85
3.00
3.30
2.0V
2.20
2.50
2.80
3.50
3.80
3.85
4.00
4.30
0.980 1.000 1.020
1.176 1.200 1.224
1.470 1.500 1.530
1.764 1.800 1.836
2.450 2.500 2.550
2.744 2.800 2.856
2.793 2.850 2.907
2.940 3.000 3.060
3.234 3.300 3.366
190
190
180
170
170
170
170
170
170
260
260
240
220
220
220
220
220
220
350
350
300
270
270
270
270
270
270
0.375 0.500
0.450 0.600
0.563 0.750
0.675 0.900
0.938 1.250
1.050 1.400
1.069 1.425
1.125 1.500
1.238 1.650
0.625
0.750
0.938
1.125
1.563
1.750
1.781
1.875
2.063
0.25
0.25
0.25
0.32
0.32
0.32
0.32
0.32
0.32
0.40
0.40
0.40
0.50
0.50
0.50
0.50
0.50
0.50
82
84
85
86
86
86
86
86
<XCL208/XCL209 F type output voltage setting>
The output voltage can be set by adding external dividing resistors. The output voltage is determined by R1 and R2 in the
equation below. The sum of R1 and R2 is normally kept 1MΩ or less. The output voltage range can be set from 0.9V to 6.0V
based on the 0.8V ±2.0% reference voltage source.
Note that when the input voltage (VIN) is less than or equal to the set output voltage, an output voltage (VOUT) higher than the
input voltage (VIN) cannot be output.
VOUT=0.8×(R1+R2)/R2
Adjust the value of the phase compensation speedup capacitor CFB so that fzfb=1/(2×π×CFB×R1) is 10kHz or less. It is
optimum to adjust to a value from 1kHz to 20kH based on the components used and the board layout.
[Calculation example]
When R1=470kΩ, R2=150kΩ, VOUT=0.8×(470k+150k)/150k=3.3V
e.g.
VOUT (V)
Circuit (XCL208F/XCL209F Type)
R1 (kΩ)
100
R2 (kΩ)
820
300
150
240
240
120
150
30
CFB (pF)
150
0.9
1.2
1.5
1.8
2.5
3.0
3.3
4.0
150
100
130
220
300
150
510
100
330
150
470
100
120
470
8/22
XCL208/XCL209
Series
■TEST CIRCUITS
9/22
XCL208/XCL209 Series
■OPERATIONAL DESCRIPTION
The XCL208/XCL209 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator,
phase compensation circuit, output voltage adjustment resistors, P-ch MOSFET driver transistor, N-ch MOSFET switching
transistor for the synchronous switch, current limiter circuit, UVLO circuit with control IC, and an inductor. (See the block
diagram below.) Using the error amplifier, the voltage of the internal voltage reference source is compared with the feedback
voltage from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier
output, to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator
compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and
delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle.
This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-ch MOS
driver transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple
feedback signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used
ensuring stable output voltage.
Type A
L1
L2
VOUT
LX
VIN
PVSS
AVSS
CE
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally 3.0MHz. Clock pulses generated in
this circuit are used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
(Type F: FB pin voltage) divided by the internal split resistors, R1 and R2. When a feed back voltage is lower than the reference
voltage, the output voltage of the error amplifier is increased. The gain and frequency characteristics of the error amplifier
output are fixed internally to deliver an optimized signal to the mixer.
<Current Limit>
The current limiter circuit of the XCL208/XCL209 series monitors the current flowing through the P-ch MOS driver transistor
connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode.
① When the driver current is greater than a current limit level, the current limit function operates to turn off the pulses from the
Lx pin at any given timing.
② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over
current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for a latch
time and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the driver
transistor, and goes into operation suspension state. Once the IC is in suspension state, operations can be resumed by either
turning the IC off via the CE pin, or by restoring power to the VIN pin. The suspension state does not mean a complete shutdown,
but a state in which pulse output is suspended; therefore, the internal circuitry remains in operation. The current limit of the
XCL208/XCL209 series can be set at 800mA at typical. Depending on the state of the PC Board, latch time may become longer
and latch operation may not work. In order to avoid the effect of noise, an input capacitor is placed as close to the IC as possible.
Limit<#ms
Limit>#ms
Current Limit Level
0mA
ILx
VOUT
VSS
Lx
VCE
Restart
VIN
10/22
XCL208/XCL209
Series
■OPERATIONAL DESCRIPTION(Continued)
<Short-Circuit Protection>
The short-circuit protection circuit monitors the internal R1 and R2 divider voltage (Type F: FB pin voltage). In case where
output is accidentally shorted to the Ground and when the FB point voltage decreases less than half of the reference voltage
(Vref) and a current more than the ILIM flows to the driver transistor, the short-circuit protection quickly operates to turn off
and to latch the driver transistor. In the latch state, the operation can be resumed by either turning the IC off and on via the
CE pin, or by restoring power supply to the VIN pin.
Also, when sharp load transient happens, a voltage drop at the VOUT is propagated through CFB, as a result, short circuit
protection may operate in the voltage higher than short-circuit protection voltage.
<UVLO Circuit>
When the VIN pin voltage becomes 1.4V (TYP.) or lower, the P-channel output driver transistor is forced OFF to prevent false
pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V or higher, by
releasing the UVLO state then the soft-start function initiates output startup operation. The soft-start function operates even
when the VIN pin voltage falls momentarily below the UVLO operating voltage same as releasing the UVLO function. The
UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be suspended; therefore, the internal
circuitry remains in operation.
<PFM Switch Current>
In PFM control operation, until coil current reaches to IPFM, the IC keeps the P-ch MOSFET on.
In this case, on-time (tON) that the P-ch MOSFET is kept on can be given by the following formula.
t
ON = L×IPFM / (VIN-VOUT) →IPFM①
<PFM Duty Limit>
In the PFM control operation, the maximum PFM Duty Limit is set to 200% (TYP.). Therefore, under the condition that the
step-down ratio is small, it’s possible for P-ch MOSFET to be turned off even when coil current doesn’t reach to IPFM. →IPFM②
IPFM①
IPFM②
<CL High Speed Discharge>
The XCL208B/XCL209B and the XCL208F/XCL209F can quickly discharge the electric charge at the output capacitor (CL)
when a low signal to the CE pin which enables a whole IC circuit put into OFF state, is inputted via the N-ch transistor located
between the LX pin and the VSS pin. When the IC is disabled, electric charge left at the output capacitor (CL) is quickly
discharged so that it may avoid application malfunction. Discharge time is set by the CL auto-discharge resistance (RDCHG) and
the output capacitance (CL). By setting time constant as τ(τ=CL x RDCHG), discharge time of the output voltage is calculated
by the following formula.
V = VOUT(T) x e –t/ or t=τln (VOUT(T) / V)
τ
V : Output voltage after discharge
100
CL=10uF
CL=20uF
CL=50uF
90
80
70
60
50
40
30
20
10
0
V
OUT(T) : Output voltage
t: Discharge time,
τ: CL x RDCHG
CL : Output capacitance (CL)
R
DCHG : CL auto-discharge resistance
0
10
20
30
40
50
60
70
80
90 100
11/22
XCL208/XCL209 Series
■OPERATIONAL DESCRIPTION(Continued)
<CE Pin Function>
The operation of the XCL208/XCL209 series will enter into the stand-by mode when a low level signal is input to the CE pin.
During the stand-by mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high impedance at the Lx pin
and VOUT pin. The IC starts its operation by inputting a high level signal to the CE pin. The input to the CE pin is a CMOS input
and the sink current is 0μA (TYP.).
(A)
(B)
(A)
VDD
SW_CE
ON
OPERATIONAL STATES
Stand-by
VDD
VIN
CE
VIN
CE
SW_CE
R1
OFF
Active
(B)
SW_CE
R2
SW_CE
ON
OPERATIONAL STATES
Active
< IC inside >
< IC inside >
OFF
Stand-by
<Soft-Start>
Soft-start time is internally set. Soft-start time is defined as the time to reach 90% of the output nominal voltage when the CE pin
is turned on.
tSS
VCEH
0V
90% of setting voltage
VOUT
0V
12/22
XCL208/XCL209
Series
■NOTE ON USE
1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2. The XCL208/XCL209 series is designed for use with ceramic output capacitors. If, however, the potential difference is too
large between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching
energy and oscillation could occur on the output. In this case, increase 10μF to the output capacitance for adding
insufficient capacitance. Also, if the output capacitance is too large, the output voltage is slowly rising and the IC may not
operate. Adjust the output capacitance so that the output voltage can go up within the soft-start time.
3. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
4. Depending on the input-output voltage differential, or load current, some pulses may be skipped as 1/2, 1/3 and the ripple voltage
may increase.
5. When the difference between input and output is large in PWM control, very narrow pulses will be outputted, and there is the
possibility that 0% duty cycles may be continued during some cycles.
6. When the difference between input and output is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that 100% duty cycles may be continued during some cycles.
7. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current of the coil increases
when dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the
peak current according to the following formula:
Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT
L: Coil Inductance Value
fOSC: Oscillation Frequency
8. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off.
During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current
flows; therefore, care must be taken when selecting the rating for the external components such as a coil.
9. When VIN is less than 2.4V, limit current may not be reached because voltage falls caused by ON resistance.
10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid
the effect of noise, the board should be laid out so that input capacitors are placed as close to the IC as possible.
11. Use of the IC at voltages below the minimum operating voltage range may lead to instability.
12. This IC should be used within the stated absolute maximum ratings of external components in order to prevent damage to
the device.
13. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the
leak current of the driver transistor.
14. The current limit is set to 1000mA (MAX.) at typical. However, the current of 1000mA or more may flow.
In case that the current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential
difference for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By
contrast, when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is
shorted to the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this
operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of
current, which is supposed to be limited originally. Even in this case, however, after the over current state continues for
several ms, the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent
damage to the device.
①Current flows into P-ch MOSFET to reach the current limit (ILIM).
②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to OFF of P-ch MOSFET.
③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
④Lx oscillates very narrow pulses by the current limit for several ms.
⑤The circuit is latched, stopping its operation.
②
①
③
④
⑤
Limit >#ms
Delay
Lx
ILIM
ILx
13/22
XCL208/XCL209 Series
■NOTE ON USE (Continued)
15. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected
as close as possible to the VIN & VSS pins.
16. High step-down ratio and very light load may lead an intermittent oscillation when PWM mode.
17. For the XCL209, when PWM/PFM automatic switching goes into continuous mode, the IC may be in unstable operation for
the range of MAXDUTY area with small input/output differential. Once the design has been completed, verification with
actual components should be done.
18. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
19. Instructions of pattern layouts
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN (No.8) and PVSS (No.1) pins.
(2) Please mount each external component as close to the IC as possible.
(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
(4) Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
(5) Internal driver transistors bring on heat because of the output current and ON resistance of the driver transistors.
(6) Please connect Lx (No.2) pin and L1 (No.9) pin on the PCB layout.
(7) Please connect VOUT (No.4) pin and L2 (No.10) pin on the PCB layout. (Type A/B)
<Type A/B (VOUT)>
(PCB mounted TOP VIEW)
(TOP VIEW)
(BOTTOM VIEW)
<Type F (FB)>
(PCB mounted TOP VIEW)
(TOP VIEW)
(BOTTOM VIEW)
XCL208/209
XCL208/209
GND
CE
VOUT
CFB
GND
CE
VOUT
CFB
CL
CL
RFB1
RFB1
IC
IC
LX
LX
CIN
CIN
GND
VIN
GND
VIN
TOREX
FB
TOREX
FB
USP-10B03
USP-10B03
: IC
: Ceramic Cap
: Chip Resistance
14/22
XCL208/XCL209
Series
■NOTE ON USE (Continued)
20. Typical application circuit
<Typical application circuits Type A/B>
< Typical application circuits Type F>
Example of external components
Example of external components (VOUT=1.8V)
CIN: 10V/4.7μF(LMK107BJ475KA TAIYO YUDEN)
CL: 10V/10μF(LMK107BBJ106MA TAIYO YUDEN)
CIN: 10V/4.7μF(LMK107BJ475KA TAIYO YUDEN)
CL: 10V/10μF(LMK107BBJ106MA TAIYO YUDEN)
R
R
C
FB1: 300kΩ
FB2: 240kΩ
FB: 150pF(C1005CH1H151J TDK)
NOTE:
The integrated Inductor can be used only for this DC/DC converter. Please do not use this inductor for other reasons.
Please use B, X5R, and X7R grades in temperature characteristics for the CIN and CL capacitors.
These grade ceramic capacitors minimize capacitance-loss as a function of voltage stress.
If necessary, increase capacitance by adding or replacing.
Examples of external components
PART NUMBER
LMK107BJ475KA
LMK212B7475KG
LMK107BBJ106MA
LMK212B7106MG
MANUFACTURE RATED VOLTAGE / INDUCTANCE / FEATURES
Size (L×W)
TAIYO YUDEN
TAIYO YUDEN
TAIYO YUDEN
TAIYO YUDEN
10V/4.7μF/X5R
10V/4.7μF/X7R
10V/10μF/X5R
10V/4.7μF/X7R
1.6mm×0.8mm
2.0mm×1.25mm
1.6mm×0.8mm
2.0mm×1.25mm
CIN
CL
15/22
XCL208/XCL209 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
(2) Output Voltage vs. Output Current
XCL208B183DR/XCL209B183DR
XCL209(PWM/PFM)
XCL208B183DR/XCL209B183DR
100
80
60
40
20
0
2.1
2.0
1.9
1.8
1.7
1.6
1.5
XCL208/XCL209
VIN=4.2V,3.6V,2.4V
2.4V
3.6V
ꢀꢀꢀꢀ
VIN= 4.2V
XCL208
(PWM)
0.1
1
10
100
1000
0.1
1
10
100
1000
1000
100
Output Current:IOUT (mA)
Output Current:IOUT (mA)
(3) Ripple Voltage vs. Output Current
(4) Oscillation Frequency vs. Ambient Temperature
XCL208B183DR/XCL209B183DR
3.5
XCL208B183DR/XCL209B183DR
100
80
60
40
20
0
3.4
3.3
3.2
3.1
3.0
2.9
2.8
2.7
2.6
2.5
VIN=3.6V
XCL208
VIN=2.4
XCL209
VIN=2.4V
3.6V,4.2V
3.6V,4.2
0.1
1
10
100
-50
-25
0
25
50
75
100
Output Current:IOUT (mA)
Ambient Temperature: Ta (
)
℃
(5) Supply Current vs. Ambient Temperature
(6) Output Voltage vs. Ambient Temperature
XCL209B183DR
40
XCL208B183DR/XCL209B183DR
2.1
2.0
1.9
1.8
1.7
1.6
1.5
VIN=6.0V
35
30
25
20
15
10
5
4.0V
VIN=3.6V
2.0V
0
-50
-25
0
25
50
75
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
Ambient Temperature: Ta (
)
℃
℃
16/22
XCL208/XCL209
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) UVLO Voltage vs. Ambient Temperature
(8) CE "H" Voltage vs. Ambient Temperature
XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR
1.8
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
CE=VIN
1.5
1.2
0.9
0.6
0.3
0.0
VIN=5.0V
3.6V
2.4V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
Ambient Temperature: Ta (
)
℃
℃
(9) CE "L" Voltage vs. Ambient Temperature
(10) Soft Start Time vs. Ambient Temperature
XCL208B183DR/XCL209B183DR
XCL208B183DR/XCL209B183DR
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
5.0
4.0
3.0
2.0
1.0
0.0
VIN=5.0V
3.6V
VIN=3.6V
2.4V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
Ambient Temperature: Ta (
)
℃
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage
(12) Rise Wave Form
XCL208B333DR/XCL209B333DR
XCL208B183DR/XCL209B183DR
1.0
VIN = 5.0V
0.9
0.8
IOUT = 1.0mA
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Nch on Resistance
2ch
VOUT
Pch on Resistance
1ch
CE:0.0V⇒1.0V
1ch:1V/div
2ch:1V/div
0
1
2
3
4
5
6
Input Voltage : VIN (V)
Time:100μs/div
17/22
XCL208/XCL209 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(13) Soft-Start Time vs. Ambient Temperature
(14) CL Discharge Resistance vs. Ambient Temperature
XCL208B333DR/XCL209B333DR
500
XCL208B333DR/XCL209B333DR
600
500
400
300
200
100
400
VIN=5.0V
2.0V
IOUT =1.0mA
VIN=6.0V
300
200
100
0
4.0V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
Ambient Temperature: Ta (
)
℃
(15) Load Transient Response
MODE:PWM/PFM Automatic Switching Control
XCL209B183DR
XCL209B183DR
VIN=3.6V,VOUT=1.8V
VIN=3.6V,VOUT=1.8V
IOUT =1mA
100mA
IOUT =1mA
300mA
⇒
⇒
1ch
2ch
1ch
VOUT
VOUT
2ch
1ch:100mA/div 2ch:50mV/div
1ch:100mA/div 2ch:50mV/div
Time:100μs/div
Time:100μs/div
XCL209B183DR
XCL209B183DR
VIN=3.6V,VOUT=1.8V
VIN=3.6V,VOUT=1.8V
IOUT =100mA ⇒1mA
IOUT =300mA ⇒1mA
1ch
2ch
1ch
2ch
VOUT
VOUT
1ch:100mA/div 2ch:50mV/div
1ch:100mA/div 2ch:50mV/div
Time:100μs/div
Time:100μs/div
18/22
XCL208/XCL209
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
MODE:PWM Control
XCL208B183DR
XCL208B183DR
VIN=3.6V,VOUT=1.8V
VIN=3.6V,VOUT=1.8V
IOUT =1mA
100mA
IOUT =1mA
300mA
⇒
⇒
1ch
2ch
1ch
2ch
VOUT
VOUT
1ch:100mA/div 2ch:50mV/div
1ch:100mA/div 2ch:50mV/div
Time:100μs/div
Time:100μs/div
XCL208B183DR
XCL208B183DR
VIN=3.6V,VOUT=1.8V
VIN=3.6V,VOUT=1.8V
IOUT =100mA ⇒1mA
I
OUT =300mA ⇒1mA
1ch
2ch
1ch
2ch
VOUT
VOUT
1ch:100mA/div 2ch:50mV/div
1ch:100mA/div 2ch:50mV/div
Time:100μs/div
Time:100μs/div
19/22
XCL208/XCL209 Series
■PACKAGING INFORMATION
●USP-10B03 (unit: mm)
2.5±0.05
1PIN INDENT
(0.5) 0.9±0.05
(0.6)
0.4±0.05
(0.05)
1
2
3
4
9
10
8
7
(0.65)
6
5
0.3±0.05
(0.05)
●USP-10B03 Reference Pattern Layout (unit: mm)
●USP-10B03 Reference Metal Mask Design (unit: mm)
20/22
XCL208/XCL209
Series
■MARKING RULE
① represents products series
USP-10B03
MARK
PRODUCT SERIES
XCL208******
8
9
1
2
3
4
8
7
6
5
XCL209******
② represents integer of output voltage and oscillation frequency
XCL20*F***** (FB Product)
MARK
OUTPUT VOLTAGE(V)
OSCILLATION FREQUENCY=3.0MHz
(XCL20*F**3**)
0.x
F
XCL20*A*****
MARK
OUTPUT VOLTAGE (V)
OSCILLATION FREQUENCY=3.0MHz
(XCL20*A**3**)
0.x
1.x
2.x
3.x
4.x
0
1
2
3
4
XCL20*B*****
MARK
OUTPUT VOLTAGE (V)
OSCILLATION FREQUENCY=3.0MHz
(XCL20*B**3**)
0.x
1.x
2.x
3.x
4.x
A
B
C
D
E
③ represents the decimal part of output voltage
OUTPUT
OUTPUT
MARK
PRODUCT SERIES
MARK
PRODUCT SERIES
VOLTAGE (V)
VOLTAGE (V)
X.0
X.1
X.2
X.3
X.4
X.5
X.6
X.7
X.8
X.9
0
1
2
3
4
5
6
7
8
9
XCL20***0***
XCL20***1***
XCL20***2***
XCL20***3***
XCL20***4***
XCL20***5***
XCL20***6***
XCL20***7***
XCL20***8***
XCL20***9***
X.05
X.15
X.25
X.35
X.45
X.55
X.65
X.75
X.85
X.95
A
B
C
D
E
F
XCL20***A***
XCL20***B***
XCL20***C***
XCL20***D***
XCL20***E***
XCL20***F***
XCL20***H***
XCL20***K***
XCL20***L***
XCL20***M***
H
K
L
M
Example (Mark ②, ③)
MARK
OSCILLATION
FREQUENCY
XCL20*F08***
XCL20*A18***
XCL20*B3D***
②
③
②
③
②
③
3.0MHz
F
8
1
8
D
D
④,⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
*No character inversion used.
21/22
XCL208/XCL209 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
22/22
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