XCL210D331GR-G [TOREX]
50MA INDUCTOR BUILT-IN PFM STEP-;型号: | XCL210D331GR-G |
厂家: | Torex Semiconductor |
描述: | 50MA INDUCTOR BUILT-IN PFM STEP- |
文件: | 总25页 (文件大小:1306K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ETR28009-005a
50mA/200mA Inductor Built-in Step-Down “micro DC/DC” Converters
☆Green Operation Compatible
■GENERAL DESCRIPTION
The XCL210 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control IC in one
tiny package (2.0mm×2.5mm, h=1.0mm). An internal coil simplifies the circuit and enables minimization of noise and other
operational trouble due to the circuit wiring. A wide operating voltage range of 2.0V to 6.0V enables support for applications that
require an internally fixed output voltage from 1.0V to 4.0V in increments of 0.05V.
During stand-by, all circuits are shutdown to reduce current consumption to as low as 0.1μA or less.
With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF when
input voltage becomes UVLO detect Voltage or lower.
The XCL210 integrate CL discharge function which enables the electric charge at the output capacitor CL to be discharged via
the internal discharge switch located between the LX and VSS pins. When the devices enter stand-by mode, output voltage
quickly returns to the VSS level as a result of this function.
■FEATURES
■APPLICATIONS
● Wearable Devices
Input Voltage
:
:
:
:
2.0V ~ 6.0V
Output Voltage
Control Methods
Output Current
1.0V ~ 4.0V (±2.0%)
PFM control
● Smart meters
200mA (Type A/C)
50mA (Type B/D)
0.5μA
● Bluetooth units
● Energy Harvest devices
● Backup power supply circuits
● Portable game consoles
● Devices with 1 Lithium cell
Supply Current
High Efficiency
Function
:
:
:
93% (VIN=3.6V,VOUT=3.0V/100μA)
UVLO
Short Circuit Protection
CL Discharge(Type C/D)
Low ESR Ceramic Capacitor
-40℃ ~ 85℃
Capacitor
:
:
:
:
Operating Ambient Temperature
Packages
CL-2025-02
Environmentally Friendly
EU RoHS Compliant, Pb Free
■TYPICALAPPLICATION CIRCUIT
■ TYPICAL PERFORMANCE
CHARACTERISTICS
XCL210B301GR-G (VOUT=3.0V)
100
7
VIN
80
60
40
20
1 Lx
6
5
4
VIN
NC
CE
CIN
GND
2
3
10μ F
CL
50mA 22μ F
VOUT
8
VIN=3.6V
VIN=4.2V
0
0.01
0.1
1
10
100
Output Current : IOUT [mA]
1/25
XCL210 Series
■BLOCK DIAGRAM
XCL210 Series, Type A/B
L2
L1
Inductor
Short
Protection
VOUT
VDD
PFM
Comparator
R1
R2
CFB
Current
Sense
Vref
Synch
Buffer
Drive
PFM
Controller
Lx
CE Controller Logic
CE
VIN
VDD
UVLO
VIN Start Up
Controller
GND
* XCL210A and B type do not have CL Discharge function.
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
XCL210 Series, Type C/D
L1
L2
Inductor
Short
Protection
VOUT
VDD
PFM
Comparator
R1
R2
CFB
Current
Sense
CL
Discharge
Vref
Synch
Buffer
Drive
PFM
Controller
Lx
CE Controller Logic
CE
VIN
VDD
UVLO
VIN Start Up
Controller
GND
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
2/25
XCL210
Series
■PRODUCT CLASSIFICATION
●Ordering information
XCL210①②③④⑤⑥-⑦ PFM control
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A
B
C
D
IOUT=200mA , Without CL Auto Discharge
IOUT=50mA Without CL Auto Discharge
IOUT=200mA , With CL Auto Discharge
IOUT=50mA, With CL Auto Discharge
①
Product Type
Output voltage options
e.g.) 1.2V → ② = 1 ③ = 2
1.25V→ ② = 1 ③ = C
0.05V increments :
②③
④
Output Voltage
10 ~ 40
0.05=A, 0.15=B, 0.25=C, 0.35=D, 0.45=E,
0.55=F, 0.65=H, 0.75=K, 0.85=L, 0.95=M
Fixed number
1
Fixed number
(*1)
⑤⑥-⑦
Package (Order Unit)
GR-G
CL-2025-02 (3,000pcs/Reel)
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
3/25
XCL210 Series
■PIN CONFIGURATION
L1
7
* The dissipation pad for the CL-2025-02 package should be solder-plated in
recommended mount pattern and metal masking so as to enhance mounting
strength and heat release.
VIN
6
1
2
3
Lx
GND
VOUT
NC
CE
5
4
The mount pattern should be connected to GND pin (No.2).
8
L2
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
LX
FUNCTIONS
Switching
1
2
3
4
5
6
7
8
GND
VOUT
CE
Ground
Output Voltage
Chip Enable
NC
No Connection
Power Input
VIN
L1
Inductor Electrodes
Inductor Electrodes
L2
■CE PIN FUNCTION
PIN NAME
SIGNAL
STATUS
H
L
Operation (All Types)
Stand-by (All Types)
CE
* Please do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
VIN Pin Voltage
LX Pin Voltage
SYMBOL
RATINGS
UNITS
VIN
-0.3 ~ 7.0
V
V
V
V
VLX
-0.3 ~ VIN + 0.3 or 7.0 (*1)
-0.3 ~ VIN + 0.3 or 7.0 (*1)
-0.3 ~ 7.0
VOUT Pin Voltage
CE Pin Voltage
VOUT
VCE
LX Pin Current
ILX
1000
mA
Power Dissipation (Ta=25˚C)
Operating Ambient Temperature
Storage Temperature
Pd
1000 (40mm x 40mm Standard board) (*2)
mW
˚C
Topr
Tstg
-40 ~ 85
-55 ~ 125
˚C
* All voltages are described based on the GND.
(*1) The maximum value is the lower of either VIN + 0.3V or 7.0V.
(*2) The power dissipation figure shown is PCB mounted and is for reference only.
Please refer to PACKAGING INFORMATION for the mounting condition.
4/25
XCL210
Series
■ELECTRICAL CHARACTERISTICS
●XCL210Axx1GR-G, without CL discharge function
Ta=25˚C
PARAMETER
SYMBOL
CONDITIONS
MIN.
2.0
TYP.
-
MAX.
6.0
UNITS
CIRCUIT
Input Voltage
VIN
-
V
V
①
Resistor connected with LX pin. Voltage which LX pin
changes “L” to “H” level while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VIN is increasing.
(*2)
Output Voltage
VOUT(E)
E1
②
②
UVLO Release Voltage
VUVLO(E)
1.65
0.11
1.80
1.95
0.24
V
V
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
UVLO Hysteresis
Voltage
VHYS(E)
0.15
②
VIN=VCE=VOUT(T)+0.5V (*1), VIN=2.0V, if VOUT(T)≦1.5V
(*1), VOUT=VOUT(T)+0.5V (*1), LX=Open.
Supply Current
Iq
E2
0.1
0.1
μA
μA
μA
③
③
③
Standby Current
LX SW “H” Leak
Current
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
-
1.0
1.0
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
LX SW “L” Leak Current
ILEAKL
IPFM
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(T)×0.95V(*1), VCE=1.2V
-
0.1
1.0
μA
③
①
PFM Switching Current
Maximum
260
330
400
mA
MAXDTY
100
-
-
%
②
Duty Ratio(*3)
Resistor connected with LX pin.
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
EFFI
EFFI
EFFI
VIN=VCE=5.0V, VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
-
-
93
93
87
-
-
-
%
%
%
⑥
⑥
⑥
LX SW “Pch”
ON Resistance (*5)
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
VIN=VCE=5.0V.
-
-
0.4
0.65
-
Ω
Ω
④
LX SW “Nch”
RLXN
0.4 (*6)
-
ON Resistance
Output Voltage
Temperature
ΔVOUT
/
-40℃≦Topr≦85℃.
-
±100
-
ppm/
V
℃
②
⑤
⑤
(VOUT ΔTopr)
・
Characteristics
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
CE “High” Voltage
CE “Low” Voltage
VCEH
1.2
-
-
6.0
0.3
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
VCEL
GND
V
CE “High” Current
CE “Low” Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
Resistor connected with LX pin.
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
Short Protection
VSHORT
Voltage which LX pin changes “H” to “L” level while
0.4
0.5
0.6
V
②
Threshold Voltage
VOUT= VOUT(T)+0.1V→0V(*1)
.
Inductance Value
L
Test Frequency=1MHz
-
-
8.0
-
-
μH
Inductor Rated Current
IDC_L
ΔT=+40℃
600
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
5/25
XCL210 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCL210Bxx1GR-G, without CL discharge function
Ta=25˚C
PARAMETER
SYMBOL
CONDITIONS
MIN.
2.0
TYP.
-
MAX.
6.0
UNITS
V
CIRCUIT
Input Voltage
VIN
-
①
②
Resistor connected with LX pin.Voltage which LX pin
changes “L” to “H” level while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VIN is increasing.
(*2)
Output Voltage
VOUT(E)
E1
V
UVLO Release Voltage
VUVLO(E)
1.65
0.11
1.80
1.95
0.24
V
②
②
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
UVLO Hysteresis
Voltage
VHYS(E)
0.15
V
VIN=VCE=VOUT(T)+0.5V (*1),VIN=2.0V, if VOUT(T)≦1.5V
(*1), VOUT=VOUT(T)+0.5V (*1), LX=Open.
Supply Current
Iq
E2
0.1
0.1
μA
μA
μA
③
③
③
Standby Current
LX SW “H” Leak
Current
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
-
1.0
1.0
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
LX SW “L” Leak Current
ILEAKL
IPFM
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(T)×0.95V(*1), VCE=1.2V
-
0.1
1.0
μA
③
PFM Switching Current
Maximum
115
180
250
mA
①
MAXDTY
100
-
-
%
②
Duty Ratio(*3)
Resistor connected with LX pin.
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
EFFI
EFFI
EFFI
VIN=VCE=5.0V,VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
-
-
95
95
89
-
-
-
%
%
%
⑥
⑥
⑥
LX SW “Pch”
ON Resistance (*5)
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
VIN=VCE=5.0V.
-
-
0.4
0.65
-
Ω
Ω
④
LX SW “Nch”
RLXN
0.4 (*6)
-
ON Resistance
Output Voltage
Temperature
ΔVOUT
/
-40℃≦Topr≦85℃.
-
±100
-
ppm/
V
℃
②
⑤
⑤
(VOUT ΔTopr)
・
Characteristics
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
CE “High” Voltage
CE “Low” Voltage
VCEH
1.2
-
-
6.0
0.3
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
VCEL
GND
V
CE “High” Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
Resistor connected with LX pin.
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
CE “Low” Current
Short Protection
VSHORT
Voltage which LX pin changes “H” to “L” level while
0.4
0.5
0.6
V
②
Threshold Voltage
VOUT=VOUT(T)+0.1V→0V(*1)
Test Frequency=1MHz
ΔT=+40℃
.
Inductance Value
L
-
-
8.0
-
-
μH
Inductor Rated Current
IDC_L
600
mA
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
6/25
XCL210
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCL210Cxx1GR-G, with CL Discharge Function
Ta=25˚C
PARAMETER
SYMBOL
CONDITIONS
MIN.
2.0
TYP.
-
MAX.
6.0
UNITS
V
CIRCUIT
Input Voltage
VIN
-
①
Resistor connected with LX pin. Voltage which LX pin
changes “L” to “H” level while VOUT is decreasing.
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VIN is increasing.
(*2)
Output Voltage
VOUT(E)
E1
V
②
②
UVLO Release Voltage
VUVLO(E)
VHYS(E)
Iq
1.65
0.11
1.80
1.95
0.24
V
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
UVLO Hysteresis
Voltage
0.15
E2
V
②
③
VIN=VCE=VOUT(T)+0.5V (*1),VIN=2.0V, if VOUT(T)≦1.5V
(*1)
Supply Current
,
μA
VOUT=VOUT(T)+0.5V (*1), LX=Open.
Standby Current
LX SW “H” Leak
Current
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
-
0.1
0.1
1.0
1.0
μA
μA
③
③
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
LX SW “L” Leak Current
ILEAKL
IPFM
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(T)×0.95V(*1), VCE=1.2V
-
0.1
1.0
μA
③
①
PFM Switching Current
Maximum
260
330
400
mA
MAXDTY
100
-
-
%
②
Duty Ratio(*3)
Resistor connected with LX pin.
Efficiency (*4)
Efficiency (*4)
Efficiency (*4)
EFFI
EFFI
EFFI
VIN=VCE=5.0V, VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
-
-
93
93
87
-
-
-
%
%
%
⑥
⑥
⑥
LX SW “Pch”
ON Resistance (*5)
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
VIN=VCE=5.0V.
-
-
0.4
0.65
-
Ω
Ω
④
LX SW “Nch”
RLXN
0.4 (*6)
-
ON Resistance
Output Voltage
Temperature
ΔVOUT
/
-40℃≦Topr≦85℃.
-
±100
-
ppm/
V
℃
②
⑤
⑤
(VOUT ΔTopr)
・
Characteristics
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
CE “High” Voltage
CE “Low” Voltage
VCEH
1.2
-
-
6.0
0.3
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
VCEL
GND
V
CE “High” Current
CE “Low” Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
Resistor connected with LX pin.
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
Short Protection
VSHORT
Voltage which LX pin changes “H” to “L” level while
0.4
0.5
0.6
V
②
Threshold Voltage
VOUT= VOUT(T)+0.1V→0V(*1)
.
CL Discharge
Inductance Value
RDCHG
L
VIN=VOUT=5.0V, VCE=0V, LX=Open.
Test Frequency=1MHz
ΔT=+40℃
55
-
80
8.0
600
105
Ω
③
-
-
μH
mA
Inductor Rated Current
IDC_L
-
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
7/25
XCL210 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCL210Dxx1GR-G, with CL Discharge Function
Ta=25˚C
CIRCUIT
①
PARAMETER
SYMBOL
CONDITIONS
MIN.
2.0
TYP.
-
MAX.
6.0
UNITS
V
Input Voltage
VIN
-
Resistor connected with LX pin. Voltage which LX
pin changes “L” to “H” level while VOUT is
decreasing.
(*2)
Output Voltage
VOUT(E)
E1
1.80
0.15
E2
V
V
②
②
②
③
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level
while VIN is increasing.
UVLO Release
Voltage
VUVLO(E)
VHYS(E)
Iq
1.65
0.11
1.95
0.24
VCE=VIN, VOUT=0V. Resistor connected with LX pin.
VUVLO(E) - Voltage which LX pin changes “H” to “L”
level while VIN is decreasing.
UVLO Hysteresis
Voltage
V
VIN=VCE=VOUT(T)+0.5V (*1)
VIN=2.0V, if VOUT(T)≦1.5V (*1)
,
Supply Current
,
μA
VOUT=VOUT(T)+0.5V (*1), LX=Open.
Standby Current
LX SW “H” Leak
Current
ISTB
VIN=5.0V, VCE=VOUT=0V, LX=Open.
-
-
0.1
0.1
1.0
1.0
μA
μA
③
③
ILEAKH
VIN=5.0V, VCE=VOUT=0V, VLX=0V.
LX SW “L” Leak
Current
ILEAKL
IPFM
VIN=5.0V, VCE=VOUT=0V, VLX=5.0V.
VIN=VCE=VOUT(T)+2.0V (*1), IOUT=10mA.
VIN=VOUT=VOUT(T)×0.95V(*1), VCE=1.2V
-
0.1
180
-
1.0
250
-
μA
mA
%
③
①
②
PFM Switching Current
115
100
Maximum
MAXDTY
Duty Ratio(*3)
Efficiency (*4)
Efficiency (*4)
Resistor connected with LX pin.
EFFI
EFFI
EFFI
VIN=VCE=5.0V,VOUT(T)=4.0V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=3.3V (*1), IOUT=30mA.
VIN=VCE=3.6V, VOUT(T)=1.8V (*1), IOUT=30mA.
-
-
-
95
95
89
-
-
-
%
%
%
⑥
⑥
⑥
Efficiency (*4)
LX SW “Pch”
ON Resistance (*5)
RLXP
VIN=VCE=5.0V, VOUT=0V, ILX=100mA.
VIN=VCE=5.0V.
-
-
0.4
0.65
-
Ω
Ω
④
LX SW “Nch”
RLXN
0.4 (*6)
-
ON Resistance
Output Voltage
Temperature
Characteristics
ΔVOUT
/
-40℃≦Topr≦85℃.
-
±100
-
ppm/
V
℃
②
⑤
⑤
(VOUT ΔTopr)
・
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “L” to “H” level while
VCE=0.2→1.5V.
CE “High” Voltage
CE “Low” Voltage
VCEH
1.2
-
-
6.0
0.3
VOUT=0V. Resistor connected with LX pin.
Voltage which LX pin changes “H” to “L” level while
VCE=1.5→0.2V.
VCEL
GND
V
CE “High” Current
CE “Low” Current
ICEH
ICEL
VIN=VCE=5.0V, VOUT=0V, LX=Open.
VIN=5.0V, VCE=VOUT=0V, LX=Open.
Resistor connected with LX pin.
-0.1
-0.1
-
-
0.1
0.1
μA
μA
⑤
⑤
Short Protection
VSHORT
Voltage which LX pin changes “H” to “L” level while
0.4
0.5
0.6
V
②
③
Threshold Voltage
VOUT= VOUT(T)+0.1V→0V(*1)
.
CL Discharge
Inductance Value
RDCHG
L
VIN=VOUT=5.0V, VCE=0V, LX=Open.
Test Frequency=1MHz
ΔT=+40℃
55
-
80
8.0
600
105
Ω
-
-
μH
mA
Inductor Rated Current
IDC
-
Unless otherwise stated, VIN=VCE=5.0V
(*1) VOUT(T)=Nominal Output Voltage
(*2) VOUT(E)=Effective Output Voltage
The actual output voltage value VOUT(E) is the PFM comparator threshold voltage in the IC.
Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.
Please refer to the characteristic example.
(*3) Not applicable to the products with VOUT(T) < 2.15V since it is out of operational volatge range.
(*4) EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100
(*5) LX SW “Pch” ON resistance = (VIN – VLX pin measurement voltage) / 100mA
(*6) Designed value
8/25
XCL210
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XCL210 Series voltage chart
SYMBOL
E1
E2
SYMBOL
E1
E2
PARAMETER OUTPUT VOLTAGE
SUPPLY CURRENT PARAMETER OUTPUT VOLTAGE
SUPPLY CURRENT
UNITS: μA
UNITS: V
OUTPUT
VOLTAGE
1.00
UNITS: V
UNITS: μA
TYP.
UNITS: V
OUTPUT
VOLTAGE
2.50
UNITS: V
MIN.
MAX.
MAX.
MIN.
MAX.
TYP.
MAX.
0.980
1.029
1.078
1.127
1.176
1.225
1.274
1.323
1.372
1.421
1.470
1.519
1.568
1.617
1.666
1.715
1.764
1.813
1.862
1.911
1.960
2.009
2.058
2.107
2.156
2.205
2.254
2.303
2.352
2.401
1.020
1.071
1.122
1.173
1.224
1.275
1.326
1.377
1.428
1.479
1.530
1.581
1.632
1.683
1.734
1.785
1.836
1.887
1.938
1.989
2.040
2.091
2.142
2.193
2.244
2.295
2.346
2.397
2.448
2.499
2.450
2.499
2.548
2.597
2.646
2.695
2.744
2.793
2.842
2.891
2.940
2.989
3.038
3.087
3.136
3.185
3.234
3.283
3.332
3.381
3.430
3.479
3.528
3.577
3.626
3.675
3.724
3.773
3.822
3.871
3.920
2.550
2.601
2.652
2.703
2.754
2.805
2.856
2.907
2.958
3.009
3.060
3.111
3.162
3.213
3.264
3.315
3.366
3.417
3.468
3.519
3.570
3.621
3.672
3.723
3.774
3.825
3.876
3.927
3.978
4.029
4.080
1.05
2.55
1.10
2.60
1.15
2.65
1.20
2.70
0.500
0.500
0.600
0.800
0.700
1.500
1.25
2.75
1.30
2.80
1.35
2.85
1.40
2.90
1.45
2.95
1.50
3.00
1.55
3.05
1.60
3.10
1.65
3.15
1.70
3.20
0.900
0.800
2.100
1.75
3.25
1.80
3.30
1.85
3.35
1.90
3.40
1.95
3.45
2.00
3.50
2.05
3.55
2.10
3.60
2.15
3.65
2.20
3.70
1.100
2.25
3.75
1.500
3.000
2.30
3.80
2.35
3.85
2.40
3.90
2.45
3.95
4.00
9/25
XCL210 Series
■TEST CIRCUITS
< Circuit No.① >
< Circuit No.② >
Wave Form Measure Point
L
Wave Form Measure Point
L2
L1
L2
L1
VOUT
Lx
VOUT
Lx
VIN
A
VIN
CL
V
V
RL
RPulldown
CIN
CIN
CE
CE
GND
GND
※External Components
※External Components
ꢀCIN:10μ F(Ceramic)
ꢀ RPULLDOWN:100Ω
ꢀL:10μ H(Selected goods)
ꢀCIN:10μ F(Ceramic)
ꢀ CL:22μ F(Ceramic)
< Circuit No.③ >
< Circuit No.④ >
L2
L1
L2
L1
VOUT
Lx
VOUT
Lx
A
VIN
VIN
V
A
A
ILX
CIN
CIN
CE
GND
CE
GND
※External Components
ꢀCIN:10μ F(Ceramic)
※External Components
ꢀCIN:10μ F(Ceramic)
< Circuit No.⑤ >
< Circuit No.⑥ >
Wave Form Measure Point
L2
L1
L2
L1
VOUT
Lx
VOUT
Lx
V
VIN
VIN
CL
RL
ICEH
A
RPulldown
A
CIN
CE
GND
CIN
CE
GND
A
ICEL
※External Components
ꢀCIN:10μ F(Ceramic)
ꢀ RPULLDOWN:100Ω
※External Components
ꢀCIN:10μ F(Ceramic)
ꢀ CL:22μ F(Ceramic)
10/25
XCL210
Series
■TYPICAL APPLICATION CIRCUIT
7
VIN
1 Lx
6
5
4
VIN
NC
CE
CIN
NOTE:
GND
2
3
The integrated Inductor can be used only for this DC/DC converter.
Please do not use this inductor for other reasons.
CL
VOUT
VOUT
8
Manufacturer
Taiyo Yuden
Part Number
VALUE
LMK107BBJ106MALT
LMK212ABJ106MG
C1608X5R1A106M
C2012X5R1A106M
LMK107BBJ226MA
LMK212BBJ226MG
C1608X5R1A226M
C2012X5R1A226M
10μF/10V
10μF/10V
CIN
CL
10μF/10V
10μF/10V
22μF/10V
22μF/10V
22μF/10V
22μF/10V
TDK
Taiyo Yuden
TDK
* Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components.
11/25
XCL210 Series
■OPERATIONAL EXPLANATION
The XCL210 series consists of a reference voltage supply, PFM comparator, Pch driver Tr, Nch synchronous rectification switch
Tr, current sensing circuit, PFM control circuit, CE control circuit, and others. (Refer to the block diagram below.)
L1
L1
L2
L2
Inductor
Inductor
Short
Protection
Short
Protection
VOUT
VOUT
VDD
VDD
PFM
Comparator
PFM
Comparator
R1
R2
CFB
R1
R2
CFB
Current
Sense
Current
Sense
CL
Discharge
Vref
Vref
Synch
Buffer
Drive
Synch
Buffer
Drive
PFM
Controller
PFM
Controller
Lx
Lx
CE Controller Logic
CE Controller Logic
CE
VIN
CE
VIN
VDD
VDD
UVLO
VIN Start Up
Controller
UVLO
VIN Start Up
Controller
GND
GND
<BLOCK DIAGRAM TYPE A/B >
<BLOCK DIAGRAM TYPE C/D >
An ultra-low quiescent current circuit and synchronous rectification enable a significant reduction of dissipation in the IC, and the
IC operates with high efficiency at both light loads and heavy loads. Current limit PFM is used for the control method, and even
when switching current superposition occurs, increases of output voltage ripple are suppressed, allowing use over a wide voltage
and current range. The IC is compatible with low-capacitance ceramic capacitors, and a small, high-performance step-down DC-
DC converter can be created.
The actual output voltage VOUT(E) in the electrical characteristics is the threshold voltage of the PFM comparator in the block
diagram. Therefore the average output voltage of the step-down circuit, including peripheral components, depends on the ripple
voltage. Before use, test fully using the actual device.
VIN=VCE=3.6V、VOUT=1.8V、IOUT=5mA、L=8.0μH、CL=22uF、Ta=25℃
VIN=VCE=3.6V、VOUT=1.8V、IOUT=30mA、L=8.0μH、CL=22uF、Ta=25℃
VLX
VLX
VLX : 2[V/div]
VOUT
VOUT
VOUT : 50[mV/div]
ILX : 100[mA/div]
VOUT(E)
Voltage
ILX
ILX
IPFM
10[μs/div]
10[μs/div]
<Reference voltage supply (VREF)>
Reference voltage for stabilization of the output voltage of the IC.
12/25
XCL210
Series
■OPERATIONAL EXPLANATION (Continued)
<PFM control>
(1) The feedback voltage (FB voltage) is the voltage that results from dividing the output voltage with the IC internal dividing
resistors RFB1 and RFB2. The PFM comparator compares this FB voltage to VREF. When the FB voltage is lower than VREF, the PFM
comparator sends a signal to the buffer driver through the PFM control circuit to turn on the Pch driver Tr. When the FB voltage is
higher than VREF, the PFM comparator sends a signal to prevent the Pch driver Tr from turning on.
(2) When the Pch driver Tr is on, the current sense circuit monitors the current that flows through the Pch driver Tr connected to the
Lx pin. When the current reaches the set PFM switching current (IPFM), the current sense circuit sends a signal to the buffer driver
through the PFM control circuit. This signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(3) The on time (off time) of the Nch synchronous rectification switch Tr is dynamically optimized inside the IC. After the off time
elapses and the PFM comparator detects that the VOUT voltage is higher than the set voltage, the PFM comparator sends a signal
to the PFM control circuit that prevents the Pch driver Tr from turning on. However, if the VOUT voltage is lower than the set voltage,
the PFM comparator starts Pch driver Tr on.
By continuously adjusting the interval of the linked operation of (1), (2) and (3) above in response to the load current, the output
voltage is stabilized with high efficiency from light loads to heavy loads.
<PFM Switching Current >
The PFM switching current monitors the current that flows through the Pch driver Tr, and is a value that limits the Pch driver Tr
current. The Pch driver Tr remains on until the coil current reaches the PFM switching current (IPFM). An approximate value for this
on-time tON can be calculated using the following equation:
tON = L × IPFM / (VIN – VOUT
)
<Maximum on-time function>
To avoid excessive ripple voltage in the event that the coil current does not reach the PFM switching current within a certain
interval even though the Pch driver Tr has turned on and the FB voltage is above VREF, the Pch driver Tr can be turned off at any
timing using the maximum on-time function of the PFM control circuit. If the Pch driver Tr turns off by the maximum on-time function
instead of the current sense circuit, the Nch synchronous rectification switch Tr will not turn on and the coil current will flow to the
VOUT pin by means of the parasite diode of the Nch synchronous rectification switch Tr.
<Through mode>
When the VIN voltage is lower than the output voltage, through mode automatically activates and the Pch driver Tr stays on
continuously.
(1) In through mode, when the load current is increased and the current that flows through the Pch driver Tr reaches a load current
that is several tens of mA lower than the set PFM switching current (IPFM), the current sense circuit sends a signal through the PFM
control circuit to the buffer driver. This signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.
(2) After the on-time (off-time) of the Nch synchronous rectification switch Tr, the Pch driver Tr turns on until the current reaches
the set PFM switching current (IPFM) again.
If the load current is large as described above, operations (1) and (2) above are repeated. If the load current is several tens of
mA lower than the PFM switching current (IPFM), the Pch driver Tr stays on continuously.
<VIN start mode>
When the VIN voltage rises, VIN start mode stops the short-circuit protection function during the interval until the FB voltage
approaches VREF. After the VIN voltage rises and the FB voltage approaches VREF by step-down operation, VIN start mode is
released. In order to prevent an excessive rush current while VIN start mode is activated, the coil current flows to the VOUT pin by
means of the parasitic diode of the Nch synchronous rectification Tr. In VIN start mode as well, the coil current is limited by the
PFM switching current.
13/25
XCL210 Series
■OPERATIONAL EXPLANATION (Continued)
<Short-circuit protection function>
The short-circuit protection function monitors the VOUT pin voltage, and if the VOUT pin voltage drops below the Short Protection
Threshold Voltage (VSHORT) due to a short circuit or overcurrent, the short circuit protection function operates.
When the short-circuit protection function is activated, the Pch driver Tr and Nch Synchronous Switch Tr are held off. If the VOUT
pin voltage exceeds the Short Protection Threshold Voltage (VSHORT) after the short-circuit protection function is activated, normal
operation resumes.
To cancel the short-circuit protection function, it is necessary to start the IC after putting the IC in the standby state with the CE
function, or to raise the input voltage after setting the input voltage below the UVLO detection voltage (VUVLO(E)-VHYS(E)).
<UVLO function>
When the VIN pin voltage drops below the UVLO detection voltage, the IC stops switching operation at any selected timing, turns
off the Pch driver Tr and Nch synchronous rectification switch Tr (UVLO mode). When the VIN pin voltage recovers and rises above
the UVLO release voltage, the IC restarts operation.
<CL discharge function>
On the XCL210 series, a CL discharge function is available as an option (Type C/D). This function enables quick discharging of
the CL load capacitance when “L” voltage is input into the CE pin by the Nch Tr connected between the VOUT-GND pins, or in
UVLO mode. This prevents malfunctioning of the application in the event that a charge remains on CL when the IC is stopped.
The discharge time is determined by CL and the CL discharge resistance RDCHG, including the Nch Tr (refer to the diagram below).
Using this time constant τ= CL×RDCHG, the discharge time of the output voltage is calculated by means of the equation below.
V = VOUT × e - t /τ, or in terms of t, t = τIn(VOUT / V)
V
VOUT
t
: Output voltage after discharge
: Set output voltage
: Discharge time
CL
RDCHG
τ
: Value of load capacitance (CL)
: Value of CL discharge resistance Varies by power supply voltage.
: CL × RDCHG
VOUT
R
RDCHG = R + RON
CE / UVLO
Signal
RON
The CL discharge function is not available on the Type A/B
14/25
XCL210
Series
■NOTE ON USE
1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.
2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally
connected components, so refer to the specifications of each component and be careful when selecting the components. Be
especially careful of the characteristics of the capacitor used for the load capacity CL and use a capacitor with B characteristics
(JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor.
3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause
the IC operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.
5. When the voltage difference between VIN and VOUT is small, switching energy increases and there is a possibility that the ripple
voltage will be too large. Before use, test fully using the actual device.
6. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.
7. If other than the recommended inductance and capacitance values are used, excessive ripple voltage or a drop in efficiency
may result.
8. If other than the recommended inductance and capacitance values are used, a drop in output voltage when the load is excessive
may cause the short-circuit protection function to activate. Before use, test fully using the actual device.
9. At high temperature, excessive ripple voltage may occur and cause a drop in output voltage and efficiency. Before using at high
temperature, test fully using the actual device
10. At light loads or when IC operation is stopped, leakage current from the Pch driver Tr may cause the output voltage to rise.
11. The average output voltage may vary due to the effects of output voltage ripple caused by the load current. Before use, test
fully using the actual device.
12. If the CL capacitance or load current is large, the output voltage rise time will lengthen when the IC is started, and coil current
overlay may occur during the interval until the output voltage reaches the set voltage (refer to the diagram below).
XCL210A Series、VIN=VCE=0→6.0V、VOUT=1.0V、IOUT=200mA、CL=22uF、Ta=25℃
VLX
VLX : 10[V/div ]
IPFM
ILX
IL : 200[mA/div ]
VOUT : 1[V/div ]
VIN : 5[V/div ]
VOUT
VIN
Zoom
200[μs/div]
VLX
ILX
VLX : 10[V/div ]
IL : 200[mA/div ]
VOUT
VIN
VOUT : 1[V/div ]
VIN : 5[V/div ]
5[μs/div]
13. When the IC is started, the short-circuit protection function does not operate during the interval until the VOUT voltage reaches
a value near the set voltage.
14. If the IC is started at a VIN voltage that activates through mode, it is possible that the short-circuit protection function will not
operate. Before use, test fully using the actual device.
15. If the load current is excessively large when the IC is started, it is possible that the VOUT voltage will not rise to the set voltage.
Before use, test fully using the actual device.
15/25
XCL210 Series
■NOTE ON USE (Continued)
16. In actual operation, the maximum on-time depends on the peripheral components, input voltage, and load current. Before use,
test fully using the actual device.
17. When the VIN voltage is turned on and off continuously, excessive rush current may occur while the voltage is on. Before use,
test fully using the actual device.
18. When the VIN voltage is high, the Pch driver may change from on to off before the coil current reaches the PFM switching
current (IPFM), or before the maximum on-time elapses. Before use, test fully using the actual device.
19. When the IC change to the Through Mode at light load, the supply current of this IC can increase in some cases.
20. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
21. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their
systems.
22. The UVLO function can be activated when the UVLO hysteresis width gets to about 0mV and after several tens ms elapses
at light loads.
Before use, test fully using the actual device.
23. Please use within the power dissipation range below. Please also note that the power dissipation may change by test
conditions, the power dissipation figure shown is PCB mounted.
24. The proper position of mounting is based on the coil terminal
Pd vs Operating Temperature
Package Body Temperature vs Operating Temperature
the power loss of micro DC/DC according to the following formula:
power loss = VOUT×IOUT×((100/EFFI) – 1) (W)
VOUT : Output Voltage (V)
IOUT : Output Current (A)
EFFI : Conversion Efficiency (%)
16/25
XCL210
Series
■NOTE ON USE (Continued)
●Instructions of pattern layouts
1. To suppress fluctuations in the VIN potential, connect a bypass capacitor (CIN) in the shortest path between the VIN pin and
ground pin.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at
the time of switching may result in instability of the IC.
5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.
6. As precautions on mounting, please set the mounting position accuracy within 0.05 mm
●Recommended Pattern Layout
Top view
Back side top view
17/25
XCL210 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
1) Output Voltage vs. Output Current
XCL210B121GR-G/XCL210D121GR-G
XCL210A121GR-G/XCL210C121GR-G
1.5
1.4
1.3
1.2
1.1
1.0
0.9
1.5
1.4
1.3
1.2
1.1
1.0
0.9
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
2.1
2.0
1.9
1.8
1.7
1.6
1.5
2.1
2.0
1.9
1.8
1.7
1.6
1.5
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
3.6
3.5
3.4
3.3
3.2
3.1
3.0
3.6
3.5
3.4
3.3
3.2
3.1
3.0
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
18/25
XCL210
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
2) Efficiency vs. Output Current
XCL210A121GR-G/XCL210C121GR-G
XCL210B121GR-G/XCL210D121GR-G
100
80
60
40
20
0
100
80
60
40
20
0
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
100
80
60
40
20
0
100
80
60
40
20
0
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
100
80
60
40
20
0
100
80
60
40
20
0
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
19/25
XCL210 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
3) Ripple Voltage vs. Output Current
XCL210A121GR-G/XCL210C121GR-G
XCL210B121GR-G/XCL210D121GR-G
200
150
100
50
200
150
100
50
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0
0
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
200
150
100
50
200
150
100
50
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=3.0V,CL=22uF×2
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
0
0
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
200
150
100
50
200
150
100
50
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
Vin=4.2V,CL=22uF×2
Vin=5.0V,CL=22uF
Vin=5.0V,CL=22uF×2
0
0
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Output Current: IOUT [mA]
Output Current: IOUT [mA]
20/25
XCL210
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
4) Ambient Temperature vs. Output Voltage
XCL210A121GR-G/XCL210C121GR-G
XCL210B121GR-G/XCL210D121GR-G
1.4
1.3
1.2
1.1
1.0
1.4
1.3
1.2
1.1
1.0
VIN=3.6V
VIN=3.6V
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
IOUT=100mA
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
100
100
Ambient Temperature : Ta [℃]
Ambient Temperature : Ta [℃]
XCL210A181GR-G/XCL210C181GR-G
XCL210B181GR-G/XCL210D181GR-G
2.0
1.9
1.8
1.7
1.6
2.0
1.9
1.8
1.7
1.6
VIN=3.6V
VIN=3.6
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
IOUT=100mA
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta [℃]
Ambient Temperature : Ta [℃]
XCL210A331GR-G/XCL210C331GR-G
XCL210B331GR-G/XCL210D331GR-G
3.5
3.4
3.3
3.2
3.1
3.5
3.4
3.3
3.2
3.1
VIN=5.0V
VIN=5.0V
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
IOUT=100mA
IOUT=0.1mA
IOUT=1mA
IOUT=10mA
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta [℃]
Ambient Temperature : Ta [℃]
21/25
XCL210 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
5) Load Transient Response
(1)XCL210B181GR-G, VIN=3.6V, VOUT=1.8V / IOUT=0.1mA ⇔30mA
VOUT = 1.8V
IOUT = 0.1mA ⇔ 30mA
(2)XCL210B181GR-G, VIN=3.6V, VOUT=1.8V / IOUT=10mA ⇔30mA
VOUT = 1.8V
IOUT = 10mA ⇔ 30mA
22/25
XCL210
Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
CL-2025-02 PKG
THERMAL CHARACTERISTICS
CL-2025-02 Power Dissipation
CL-2025-02
23/25
XCL210 Series
■MARKING RULE
●CL-2025-02
①
represents products series
MARK
0
PRODUCT SERIES
XCL210******-G
② represents integer of the output voltage
1
2
3
6
5
4
OUTPUT
MARK
TYPE
PRODUCT SERIES
VOLTAGE(V)
8
9
1.x
2.x
3.x
4.x
1.x
2.x
XCL210A1****-G
XCL210A2****-G
XCL210A3****-G
XCL210A4****-G
XCL210B1****-G
XCL210B2****-G
A
E
F
H
K
B
C
D
L
M
N
P
R
S
T
3.x
4.x
1.x
2.x
3.x
4.x
1.x
2.x
3.x
4.x
XCL210B3****-G
XCL210B4****-G
XCL210C1****-G
XCL210C2****-G
XCL210C3****-G
XCL210C4****-G
XCL210D1****-G
XCL210D2****-G
XCL210D3****-G
XCL210D4****-G
U
V
X
③
represents the decimal part of output voltage
OUTPUT
MARK
PRODUCT SERIES
VOLTAGE(V)
X.0
X.05
X.1
0
A
1
XCL210**0***-G
XCL210**A***-G
XCL210**1***-G
XCL210**B***-G
XCL210**2***-G
XCL210**C***-G
XCL210**3***-G
XCL210**D***-G
XCL210**4***-G
XCL210**E***-G
XCL210**5***-G
XCL210**F***-G
XCL210**6***-G
XCL210**H***-G
XCL210**7***-G
XCL210**K***-G
XCL210**8***-G
XCL210**L***-G
XCL210**9***-G
XCL210**M***-G
X.15
X.2
B
2
X.25
X.3
C
3
X.35
X.4
D
4
X.45
X.5
E
5
X.55
X.6
F
6
X.65
X.7
H
7
X.75
X.8
K
8
X.85
X.9
L
9
X.95
M
④,⑤ represents production lot number
01~09、0A~0Z、11~9Z、A1~A9、AA~AZ、B1~ZZ in order.
(G, I, J, O, Q, W excluded)
Note: No character inversion used.
24/25
XCL210
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or completeness
of the information contained in this datasheet nor grant any license to any intellectual property rights
of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require extremely
high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human
life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)
nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other
transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless
Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or
property damage resulting from such failure, customers are required to incorporate adequate safety
measures in their designs, such as system fail safes, redundancy and fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
25/25
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