XDL605B75D82-Q [TOREX]
36V Operation 600mA Inductor Built-in Step-down âmicro DC/DCâ Converter;
| 型号： | XDL605B75D82-Q |
| 厂家： | 
Torex Semiconductor |
| 描述： | 36V Operation 600mA Inductor Built-in Step-down âmicro DC/DCâ Converter |
| 文件： | 总29页 (文件大小：1384K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XDL605/XDL606Series
ETR44002-001
36V Operation 600mA Inductor Built-in Step-down “micro DC/DC” Converter
☆AEC-Q100 Grade2
■GENERAL DESCRIPTION
The XDL605/XDL606 series is an ultra compact step-down DC / DC converter that integrates a coil and a control IC in one tiny
package. By adding a ceramic capacitor for input / output and a resistor for output voltage setting to external parts, a power
supply circuit of up to 600mA can be created. An internal coil simplifies the circuit and enables minimization of noise and other
operational trouble due to the circuit wiring.
XDL605/XDL606 series has operating voltage range of 3.0V~36.0V and it can support 600mA as an output current with high-
efficiency. They use synchronous rectification at an operating frequency of 2.2MHz. The output voltage can be set to a value
from 1.8V to 5.0V using external resistors.
They have a fixed internal soft start time which is 2.0ms(TYP.), additionally the time can be extended by using an external
resistor and capacitor.The output state can be monitored using the power good function.
Over current protection, short-circuit protection and thermal shutdown are embedded and they secure a safety operation.
The XDL605/XD606 series employ the wettable flank plated packaging. This provides a visual indicator of solderability and
lowers the inspection time.
■FEATURES
Input Voltage Range
Output Voltage Range
FB Voltage
■APPLICATIONS
● Automotive Body Control
● Automotive Infortainment
● Automotive accessories
・Drive recorder
・Car-mounted camera
・ETC
● Industrial Equipment
:
3.0V ~ 36.0V (Absolute Max 40V)
1.8V ~ 5.0V
:
:
:
0.75V ± 1.5%
Oscillation Frequency
Output Current
2.2MHz
600mA
Quiescent Current
Control Methods
13.5μA (XDL606)
:
PWM control (XDL605)
PWM/PFM Auto (XDL606)
Efficiency 81%@12V→5V, 300mA
Soft-start External settings
Function
:
:
Power good
Over Current Protection
(Automatic recovery)
Thermal Shutdown
Protection Circuits
UVLO
Output Capacitor
:
:
:
:
Ceramic Capacitor
-40℃ ~ +105℃
Operating Ambient Temperature
Packages
DFN3625-11B (Wettable Flank)
EU RoHS Compliant, Pb Free
Environmentally Friendly
■ TYPICAL PERFORMANCE
■TYPICAL APPLICATION
CHARACTERISTICS
XDL605B75D82/XD606B75D82
(VIN=12V, VOUT=5V)
CIN=2.2μF(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
100
90
80
70
60
50
40
30
20
10
0
XDL605B75D82
XDL606B75D82
0.1
1
10
100
Output Current :IOUT[mA]
1/29
XDL605/XDL606 Series
■BLOCK DIAGRAM
L1
L2
L
VIN
Current
SENSE
LocalReg
each
circuit
Chip
Enable
EN/SS
Current
feed
back
Current
Limit
PFM
Current
Limit
High
Side
Buffer
Gate
CLAMP
Under
Voltage
Lock Out
Lx
Low
Side
Buffer
Thermal
Shutdown
each
circuit
Operation
Enable
Vref
Soft Start
+
Err Amp
-
+
-
PWM/PFM
ControlLOGIC
FB
PWM
Comparator
PG
+
-
Ramp
Wave
OSC
GND
Power-Good
Comparator
* Diodes inside the circuit are an ESD protection diodes and a parasitic diodes.
2/29
XDL605/XDL606
Series
■PRODUCT CLASSIFICATION
●Ordering Information
(*1)
XDL605①②③④⑤⑥-⑦
XDL606①②③④⑤⑥-⑦
PWM control
(*1)
PWM/PFM Automatic Switching Control
DESIGNATOR
ITEM
Type
SYMBOL
DESCRIPTION
Refer to Selection Guide
①
B
75
②③
④
Adjustable Output Voltage
Oscillation Frequency
Packages (Order Unit)
Output voltage can be adjusted in 1.8V to 5.0V
2.2MHz
D
(*1)
⑤⑥-⑦
82-Q
DFN3625-11B (2,000pcs/Reel) (*2)
(*1) The “-Q” suffix denotes “AEC-Q100” and “Halogen and Antimony free” as well as being fully EU RoHS compliant.
(*2) The XDL605/XDL606 reels are shipped in a moisture-proof packing.
●Selection Guide
FUNCTION
Chip Enable
UVLO
B TYPE
Yes
Yes
Thermal Shutdown
Soft Start
Yes
Yes
Power-Good
Yes
Current Limiter
Yes
(Automatic Recovery)
3/29
XDL605/XDL606 Series
■PIN CONFIGURATION
8
7
6
5
1
2
3
4
9
10
11
11
DFN3625-11B
(BOTTOM VIEW)
10
* The dissipation pad(No.9) pin for the DFN3625-11B package should be solder-plated in recommended mount pattern and metal
masking so as to enhance mounting strength and heat release.
If the pad needs to be connected to other pins, it should be connected to the GND (No.4,5,7) pin.
■ PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
Power-good Output
Enable Soft-start
Power Input
1
2
PG
EN/SS
VIN
3
4
GND
GND
LX
Ground
5
Ground
6
Switching Output
Ground
7
GND
FB
8
Output Voltage Sense
Ground
9
GND
L1
10
11
Inductor Electrodes
Inductor Electrodes
L2
4/29
XDL605/XDL606
Series
■ FUNCTION CHART
PIN NAME
SIGNAL
STATUS
Stand-by
L
H
EN/SS
Active
OPEN
Undefined State(*1)
(*1)
Please do not leave the EN/SS pin open. Each should have a certain voltage.
PIN NAME CONDITION
SIGNAL
VFB > VPGDET
H (High impedance)
L (Low impedance)
L (Low impedance)
VFB ≦ VPGDET
EN/SS = H
EN/SS = L
Thermal Shutdown
PG
UVLO
Undefined State
(VIN < VUVLOD
)
Stand-by
L (Low impedance)
■ ABSOLUTE MAXIMUM RATINGS
PARAMETER
VIN Pin Voltage
EN/SS Pin Voltage
FB Pin Voltage
PG Pin Voltage
PG Pin Current
Lx Pin Voltage
SYMBOL
VIN
RATINGS
-0.3 ~ 40
-0.3 ~ 40
-0.3 ~ 6.2
-0.3 ~ 6.2
8
UNITS
V
V
VEN/SS
VFB
V
VPG
V
IPG
mA
V
VLx
-0.3 ~ VIN + 0.3 or 40 (*1)
Power Dissipation
Pd
2100 (JESD51-7 board) (*2)
mW
(Ta=25℃)
Surge Voltage
VSURGE
Topr
46 (*3)
V
Operating Ambient Temperature
Storage Temperature
-40 ~ 105
-55 ~ 125
℃
℃
Tstg
All voltages are described based on the GND pin.
(*1) The maximum value should be either VIN+0.3V or 40V in the lowest.
(*2) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION
(*3) Applied Time≦400ms
5/29
XDL605/XDL606 Series
■ELECTRICAL CHARACTERISTICS
XDL605/XDL606 Series
Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB
CONDITIONS
VFB=0.731V→0.769V
MIN. TYP. MAX. UNIT CIRCUIT
0.739 0.750 0.761
VFB Voltage when Lx pin voltage
changes from "H" level to "L" level
V
②
-40℃≦Ta
-40℃≦Ta
≦
105
℃
0.731
1.8
-
-
0.769
5.0
Output Voltage
Setting Range(*1)
Operating Input
Voltage Range
VOUTSET
VIN
-
-
≦
105
105
℃
V
V
-
-
-40℃≦Ta
≦
℃
3.0
-
2.70
-
36.0
2.80
2.87
2.90
2.97
VEN/SS=12V, VIN:2.87V→2.53V
2.60
2.53
2.70
2.63
UVLO Detect
Voltage
VUVLOD VFB=0V, VIN Voltage which Lx pin
voltage holding "H" level
V
V
②
②
-40℃≦Ta
-40℃≦Ta
≦
105
105
℃
℃
VEN/SS=12V, VIN:2.63V→2.97V
VUVLOR VFB=0V, VIN Voltage which Lx pin
voltage holding "L" level
2.80
-
UVLO Release
Voltage
≦
-
-
-
-
-
-
13.5
22.0
30
Quiescent Current
(XDL606)
Iq
VFB=0.825V
μA
μA
μA
④
④
⑤
-40℃≦Ta
-40℃≦Ta
-40℃≦Ta
≦
105
105
105
℃
-
290
-
500
550
2.5
Quiescent Current
(XDL605)
Iq
VFB=0.825V
≦
≦
℃
℃
1.65
-
Stand-by Current
ISTB
VIN=12V, VEN/SS=VFB=0V
3.9
Connected to
2.013 2.200 2.387
Oscillation Frequency
fOSC
external components,
IOUT=200mA
MHz
①
-40℃≦Ta
≦105
℃
1.936
-
2.464
Minimum On Time
Minimum Duty Cycle
Maximum Duty Cycle
tONMIN
DMIN
Connected to external components
VFB=0.825V
-
-
85 (*1)
-
0
-
ns
%
%
①
②
②
-40℃≦Ta
-40℃≦Ta
≦
105
105
℃
℃
-
-
DMAX
VFB=0.675V
≦
100
Lx SW "H"
On Resistance
Lx SW "L"
RLxH
RLxL
VFB=0.675V, ILX=200mA
VFB=0.825V, ILX=200mA
-
-
1.20
1.38
-
Ω
Ω
②
②
0.60
(*1)
On Resistance
Connected to
PFM Switch Current
(XDL606 only)
IPFM
external components,
VIN=VEN/SS=12V, IOUT=1mA
-
400
1.3
-
-
mA
A
①
②
High side
Current Limit (*2)
ILIMH
VFB=VFBE×0.98
1.0
L
Test Freq.=1MHz
μH
Inductance
-
-
2.2
1.6
-
-
-
-
IDC
ΔT=+40deg
Inductor Rated Current
A
Test Condition: Unless otherwise stated: VIN=12V, VEN/SS=12V, PG=OPEN
Peripheral parts connection conditions：RFB1=680kΩ,RFB2=120kΩ,CFB=47pF,CL=10μF×2parallel, CIN=4.7μF
(*1) Design reference value. This parameter is provided only for reference.
(*2) Current limit denotes the level of detection at peak of coil current.
6/29
XDL605/XDL606
Series
■ELECTRICAL CHARACTERISTICS
XDL605/XDL606 Series
Ta=25℃
PARAMETER
SYMBOL
tSS1
CONDITIONS
MIN. TYP. MAX. UNIT CIRCUIT
Internal
Soft-Start Time
External
VFB=0.675V
VFB=0.675V
1.0
21
2.0
26
4.0
33
ms
ms
②
③
tSS2
Soft-Start Time
RSS=430KΩ, CSS=0.47μF
VFB=0.72V→0.63V
0.638 0.675 0.712
RPG:100kΩ pull-up to 5V,
PG Detect Voltage
VPGDET
V
②
V
FB Voltage when PG pin voltage
-40℃≦Ta
-40℃≦Ta
≦
105
105
℃
℃
0.630
-
-
0.720
0.3
-
changes from "H" level to "L" level
≦
PG Output Voltage
Efficiency
VPG
VFB=0.6V, IPG=1mA
-
-
V
②
①
Connected to external components,
EFFI
81
%
VIN=12V, VOUT=5V, IOUT=300mA
FB “‘H” Current
FB “L” Current
IFBH
IFBL
VIN=VEN/SS=36V, VFB=3.0V
VIN=VEN/SS=36V, VFB=0V
-40℃≦Ta
≦
105
105
℃
℃
-0.1
-0.1
0.0
0.0
0.1
0.1
μA
μA
④
④
-40℃≦Ta
≦
VEN/SS=0.3V→2.5V
VFB=0.71V, VEN/SS Voltage when
Lx pin voltage changes
from "L" level to "H"
EN/SS "H" Voltage
EN/SS "L" Voltage
VEN/SSH
-40℃≦Ta
≦
105
105
℃
℃
2.5
-
-
36.0
0.3
V
V
②
②
VEN/SS=2.5V→0.3V
VFB=0.71V, VEN/SS Voltage when
Lx pin voltage changes
from "H" level to "L"
VEN/SSL
-40℃≦Ta
-40℃≦Ta
≦
GND
EN/SS ‘H’ Current
EN/SS ‘L’ Current
IEN/SSH
IEN/SSL
VIN=VEN/SS=36V, VFB=0.825V
≦
105
105
℃
℃
-
0.1
0.0
0.3
0.1
μA
μA
④
④
VIN=36V, VEN/SS=0V, VFB=0.825V -40℃≦Ta
Junction Temperature
≦
-0.1
Thermal Shutdown
Temperature
TTSD
THYS
-
-
150
25
-
-
℃
℃
-
-
Hysteresis Width
Junction Temperature
Test Condition: Unless otherwise stated: VIN=12V、VEN/SS=12V、PG=OPEN
Peripheral parts connection conditions：
Peripheral parts connection conditions：RFB1=680kΩ,RFB2=120kΩ,CFB=47pF,CL=10μF×2parallel, CIN=4.7μF
7/29
XDL605/XDL606 Series
■TEST CIRCUITS
CIRCUIT①
Probe
LX
L1
CL :10μF×2pcs
VOUT
VIN
L2
FB
PG
CFB:47pF
CIN : 4.7μF
A
A
RFB1:680kΩ
IOUT
EN/SS
V
V
RFB2:120kΩ
V
GND
CIRCUIT②
Probe
LX
L1
VIN
L2
FB
PG
V
A
CIN : 4.7μF
EN/SS
V
Probe
V
100kΩ
RPG:100kΩ
V
GND
A
V
Probe
CIRCUIT③
Probe
LX
L1
CIN : 4.7μF
VIN
L2
FB
PG
V
Probe
R
SS:430kΩ
EN/SS
GND
V
C
SS:0.47μF
V
100kΩ
V
8/29
XDL605/XDL606
Series
■TEST CIRCUITS (Continued)
CIRCUIT④
L
X
L1
V
IN
L2
FB
PG
A
V
EN/SS
GND
A
V
V
A
CIRCUIT⑤
L
X
L1
V
IN
L2
A
V
EN/SS
GND
FB
PG
V
9/29
XDL605/XDL606 Series
■TYPICAL APPLICATION CIRCUIT / Parts Selection Method
* The inductor is dedicated to this product. Please do not use it for purposes other than this product.
【Typical Examples】
conditions MANUFACTURER
PRODUCT NUMBER
VALUE
VIN＜20V
TDK
4.7uF/50V
(*1)
CIN1
CGA6P3X7R1H475K250AB
VIN≧20V
4.7uF/50V 2parallel
0.1uF/50V
CIN2
-
TDK
Murata
Murata
TDK
CGA3E2X7R1H104K080AA
GRT21BR71A106KE13
GRM21BZ71C106KE15
CGA5L1X7R1C106K160AC
10μF/10V 2parallel
10μF/16V 2parallel
10μF/16V 2parallel
(*2)
-
CL
Select parts considering the DC bias characteristics and rated voltage of ceramic capacitors.
(*1) For CIN1, use a capacitor with the same or higher effective capacity value as the recommended components.
(*2) For CL, use a capacitor with the same or higher effective capacity value as the recommended components.
If a capacitor with a low effective capacity value is used, the output voltage may become unstable.
However, if large capacity capacitors, such as electrolytic capacitors, are connected in parallel,
the inrush current during startup could increase or the output could become unstable.
10/29
XDL605/XDL606
Series
■TYPICAL APPLICATION CIRCUIT / Parts Selection Method (Continued)
< Output Voltage Setting Value VOUTSET Setting >
The output voltage can be set by adding an external dividing resistor.
The output voltage is determined by the equation below based on the values of RFB1 and RFB2
.
VOUT=VFB × (RFB1+RFB2) / RFB2
With RFB2 ≦ 200kΩ and RFB1 + RFB2 ≦ 1MΩ
Under the condition that the difference between VIN and VOUT is big, the ripple voltage can be big due to the unstable duty.
When the ripple voltage needs to be reduced, please be sure to use this product within the Operation Area stated in the Electric
Characteristics Example of "VIN-VOUT Operation Area".
<CFB setting>
Adjust the value of the phase compensation speed-up capacitor CFB using the equation below.
1
CFB
=
2π × fzfb× RFB1
1
fzfb =
2π CL × L
【Setting Example】
XDL605
RFB2
CFB
CFB
VOUTSET
CL
fzfb
RFB1
(Calculated)
369pF
(E24 series)
390pF
1.8V
3.3V
5.0V
20μF
20μF
20μF
24kHz
24kHz
24kHz
18kΩ
51kΩ
68kΩ
13kΩ
15kΩ
12kΩ
130pF
98pF
130pF
100pF
XDL606
CFB
CFB
(E24 series)
39pF
VOUTSET
CL
fzfb
RFB1
RFB2
(Calculated)
36.9pF
1.8V
3.3V
5.0V
20μF
20μF
20μF
24kHz
24kHz
24kHz
180kΩ
510kΩ
680kΩ
130kΩ
150kΩ
120kΩ
13.0pF
9.8pF
13pF
10pF
11/29
XDL605/XDL606 Series
■OPERATIONAL EXPLANATION
The XDL605/XDL606 series consists internally of a reference voltage supply with soft-start function, a ramp wave circuit, an error
amp, a PWM comparator, a High side driver FET, a Low side driver FET, a High side buffer circuit, a Low side buffer circuit, a
current sense circuit, a phase compensation (Current feedback) circuit, a current limiting circuit, an under voltage lockout (UVLO)
circuit, an internal power supply (Local Reg) circuit, a gate clamp (CLAMP) circuit and other elements.
The control method is the current mode control method for handling low ESR ceramic capacitors.
L1
L2
L
VIN
Current
SENSE
LocalReg
each
circuit
Chip
Enable
EN/SS
Current
feed
back
Current
Limit
PFM
Current
Limit
High
Side
Buffer
Gate
CLAMP
Under
Voltage
Lock Out
Lx
Low
Side
Buffer
Thermal
Shutdown
each
circuit
Operation
Enable
Vref
Soft Start
+
Err Amp
-
+
-
PWM/PFM
ControlLOGIC
FB
PWM
Comparator
PG
+
-
Ramp
Wave
OSC
GND
Power-Good
Comparator
*
Diodes inside the circuits are ESD protection diodes and parasitic diodes.
12/29
XDL605/XDL606
Series
■OPERATIONAL EXPLANATION(Continued)
< Normal Operation >
The standard voltage Vref and FB pin voltage are compared using an error amplifier and then the control signal to which phase
compensation has been added to the error amplifier output is input to the PWM comparator. The PWM comparator compares the
above control signal and lamp wave to control the duty width during PWM control. Continuously conducting these controls
stabilizes the output voltage.
In addition, the current detecting circuit monitors the driver FET current for each switching and modulates the error amplifier
output signal into a multiple feedback signal (current feedback circuit). This achieves stable feedback control even when low ESR
capacitors, such as ceramic capacitors, are used to stabilize the output voltage.
XDL605 Series
The XDL605 Series (PWM control) performs switching at a set switching frequency fOSC regardless of the output current. At light
loads the on time is short and the circuit operates in discontinuous mode, and as the output current increases, the on time becomes
longer and the circuit operates in continuous mode.
fOSC
fOSC
tON
tON
Lx
Lx
0V
0V
IOUT
Coil
Current
Coil
Current
IOUT
0mA
0mA
XDL605 series: Example of light load operation
XDL605 series: Example of heavy load operation
XDL606 Series
The XDL606 Series (PWM/PFM automatic switching control) lowers the switching frequency during light loads by turning on the
High side driver FET when the coil current reaches the PFM current (IPFM). This operation reduces the loss during light loads and
achieves high efficiency from light to heavy loads. As the output current increases, the switching frequency increases proportional
to the output current, and when the switching frequency increases fOSC, the circuit switches from PFM control to PWM control and
the switching frequency becomes fixed.
fOSC
tON
tON
Lx
Lx
0V
0V
IPFM
IOUT
Coil
Current
Coil
Current
IOUT
0mA
0mA
XDL606 series: Example of light load operation
XDL606 series: Example of heavy load operation
< 100% Duty Cycle Mode >
When the dropout voltage is low or there is a transient response, the circuit might change to the 100% Duty cycle mode where
the High side driver FET is continuously on.
The 100% Duty cycle mode operation makes it possible to maintain the output current even when the dropout voltage is low
such as when the input voltage declines due to cranking, etc.
13/29
XDL605/XDL606 Series
■OPERATIONAL EXPLANATION(Continued)
< CE Function >
When an “H” voltage (VEN/SSH) is input to the EN/SS pin, normal operation is performed after the output voltage is started up by
the soft start function, normal operation is performed. When the “L” voltage (VEN/SSL) is input to the EN/SS pin, the circuit enters
the standby state, the supply current is suppressed to the standby current ISTB (TYP. 1.65μA), and the High side driver FET and
Low side driver FET are turned off.
< Soft Start Function >
This function gradually starts up the output voltage to suppress the inrush current.
The soft start time is the time until the output voltage from VEN/SSH reaches 90% of the output voltage set value, and when the
output voltage increases further, the soft start function is cancelled to switch to normal operation.
Internal Soft Start Time
The internal soft start time (tSS1) is configured so that after the “H” voltage (VEN/SSH) is input to the EN/SS pin, the standard voltage
connected to the error amplifier increases linearly during the soft-start period. This causes the output voltage to increase
proportionally to the standard voltage increase. This operation suppresses the inrush current and smoothly increases the output
voltage.
tss1
EN/SS
V1
V1
90% of setting voltage
VOUT
< Overview of internal soft start >
< Internal soft start EN/SS circuit >
External Setting Soft Start Time
The external setting soft start time (tSS2) can adjust the increase speed of the standard voltage in the IC by adjusting the EN/SS
pin voltage inclination during startup using externally connected component RSS and CSS. This makes it possible to externally
adjust the soft start time.
Soft start time (tSS2) is approximated by the equation below according to values of V1, RSS, and CSS
When tss2 is shorter than tss1, the output voltage rises at the internal soft start time.
tss2=Css×Rss× ln ( V1 / (V1-1.45V) )
【Setting Example】
CSS = 0.47μF, RSS = 430kΩ, V1 = 12V
tSS2 = 0.47μF x 430kΩ x ( ln (12V/(12V-1.45V)) = 26ms
tss2
V1
RSS
EN/SS
CSS
V1
1.45V
EN/SS
VOUT
90% of setting voltage
< External soft start EN/SS circuit >
< Overview of external soft start >
14/29
XDL605/XDL606
Series
■OPERATIONAL EXPLANATION (Continued)
< Power Good >
The output state can be monitored using the power good function. The PG pin is an Nch open drain output, therefore a pull-up
resistor (approx. 100kΩ) must be connected to the PG pin.
The pull-up voltage should be 5.5V or less. When not using the power good function, connect the PG terminal to GND or leave
it open.
CONDITION
SIGNAL
VFB > VPGDET
H (High impedance)
L (Low impedance)
L (Low impedance)
Undefined State
VFB ≦ VPGDET
EN/SS = H
EN/SS = L
Thermal Shutdown
UVLO (VIN < VUVLOD
Stand-by
)
L (Low impedance)
< UVLO Function >
When the VIN pin voltage falls below VUVLOD (TYP. 2.7V), the high side driver FET and low side driver FET are forcibly turned off
to prevent false pulse output due to instable operation of the internal circuits. When the VIN pin voltage rises above VUVLOR (TYP.
2.8V), the UVLO function is released, the soft start function activates, and output start operation begins. Stopping by UVLO is not
shutdown; only pulse output is stopped and the internal circuits continue to operate.
< Thermal Shutdown Function >
Athermal shutdown (TSD) function is built in for protection from overheating. When the junction temperature reaches the thermal
shutdown detection temperature TTSD, the High side driver FET and Low side driver FET are compulsorily turned off.
If the driver FET continues in the off state, the junction temperature declines, and when the junction temperature falls to the
thermal shutdown cancel temperature, the thermal shutdown function is cancelled and the soft-start function operates to start up
the output voltage.
15/29
XDL605/XDL606 Series
■OPERATIONAL EXPLANATION (Continued)
< Current Limit Function >
The current limiting circuit of the XDL605/XDL606 series monitors the current that flows through the High side driver FET and
Low side driver FET, and when over current is detected, the current limiting function activates.
① High side driver FET current limiting
The current in the High side driver FET is detected to equivalently monitor the peak value of the coil current. The High side driver
FET current limiting function forcibly turns off the High side driver FET when the peak value of the coil current reaches the High
side driver current limit value ILIMH
.
High side driver FET current limit value ILIMH=1.3A (TYP.)
② Low side driver FET current limiting
The current in the Low side driver FET is detected to equivalently monitor the bottom value of the coil current. The Low side
driver FET current limiting function operates when the High side driver FET current limiting value reaches ILIMH. The Low side
driver FET current limiting function prohibits the High side driver FET from turning on in an over current state where the bottom
value of the coil current is higher than the Low side driver FET current limit value ILIML
.
Low side driver FET current limit value ILIML=0.9A (TYP.)
When the output current increases and reaches the current limit value, the current foldback circuit operates and lowers the
output voltage and FB voltage. The ILIMH and ILIML decline accompanying the FB voltage decrease to restrict the output current.
When the overcurrent state is removed, the foldback circuit operation increases the ILIMH and ILIML together with output voltage
to return the output to the output voltage set value.
Current Limit
ILIMH=1.3A(TYP.)
ILIML=0.9A(TYP.)
Coil
Current
0A
Lx
0V
VOUT
0V
RLOAD
0Ω
16/29
XDL605/XDL606
Series
■NOTES ON USE
1) In the case of a temporary and transient voltage drop or voltage rise.
If the absolute maximum ratings are exceeded, the IC may be deteriorate or destroyed.
If a voltage exceeding the absolute maximum voltage is applied to the IC due to chattering caused by a mechanical switch
or an external surge voltage, please use a protection element such as a TVS and a protection circuit as a countermeasure.
Please see the countermeasures from (a) to (d) shown below.
(a) When voltage exceeding the absolute maximum ratings comes into the VIN pin due to the transient change on the
power line, there is a possibility that the IC breaks down in the end.
To prevent such a failure, please add a TVS between VIN and GND as a countermeasure
(b) When the input voltage decreases below the output voltage, there is a possibility that an overcurrent will flow in the IC’s
Internal parasitic diode and exceed the absolute maximum rating of the Lx pin.
If the current is pulled into the input side by the low impedance between VIN -GND, then countermeasures, such as adding
an SBD between VOUT-VIN, should be taken.
(c) When a negative voltage is applied to the input voltage by a reverse connection or chattering, an overcurrent could flow
in the IC’s parasitic diode and damage the IC. Take countermeasures, such as adding a reverse touching protection diode
(d) When a sudden surge of electrical current travels along the VOUT pin and GND due to a short-circuit, electrical resonance
of a circuit involving parasitic inductor of cable related to short circuit and an output capacitor (CL) and impedance such as
VOUT line generates a negative voltage exceeding the breakdown voltage and may damage the device.
Take countermeasures, such as connecting a schottky diode between the VOUT and GND.
17/29
XDL605/XDL606 Series
■NOTES ON USE(Continued)
2) Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded.
3)
The DC/DC converter characteristics depend greatly on the externally connected components as well as on the
characteristics of this IC, so refer to the specifications and standard circuit examples of each component when carefully
considering which components to select.
Be especially careful of the capacitor characteristics and use X7R or X5R (EIA standard) ceramic capacitors.
The capacitance decrease caused by the bias voltage may become large depending on the external size of the
capacitor.
4)
The current limit value is the coil current peak value when switching is not conducted.
The coil current peak value when the actual current limit function begins to operate may exceed the current limit of the
electrical characteristics due to the effect of the propagation delay inside the circuit.
5)
6)
7)
When the On time is less than the Min On Time (tONMIN) and the dropout voltage is large or the load is low, the PWM control
operates intermittently and the ripple voltage may become large or the output voltage may become unstable.
The ripple voltage could be increased when switching from discontinuous conduction mode to continuous conduction mode
and when switching to 100% Duty cycle.
The PWM/PFM auto series may cause superimposed ripple voltage by continuous pulses if used in high temperature and
no load conditions. It is necessary to set an idle current of higher than 100μA from VOUT if used at no load.
It can have the same effect as when RFB2 is lower than 7.5kΩ. Please refer to the
< Output Voltage Setting Value VOUTSET Setting > section under TYPICAL APPLICATION CIRCUIT.
8)
9)
If the voltage at the EN/SS Pin does not start from 0V but is at the midpoint potential when the power is switched on, the
soft start function may not work properly and it may cause larger inrush current and bigger ripple voltages.
Torex places an importance on improving our products and their reliability. We request that users incorporate fail safe
designs and post aging protection treatment when using Torex products in their systems.
18/29
XDL605/XDL606
Series
■NOTES ON USE(Continued)
10) Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high,
please place the input capacitor(CIN1,CIN2) and the output capacitor (CL) as close to the IC as possible.
(1)
In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible
to the VIN and GND pins.
(2)
Please mount each external component as close to the IC as possible.
Please place the external parts on the same side of the PCB as the IC, not on the reverse side of the PCB and
elsewhere.
(3)
(4)
(5)
Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
This product has a built in driver FET and inductor, which causes heat generation from the on resistance, so take
measures to dissipate the heat when necessary.
●Recommended Pattern Layout
Layer 1
Layer 2
19/29
XDL605/XDL606 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output current
XDL605/XDL606
(VIN=12V, VOUT=5V)
XDL605/XDL606
(VIN=12V, VOUT=3.3V)
CIN=2.2μF(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
CIN=2.2μF(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
XDL605B75D
XDL606B75D
XDL605B75D
XDL606B75D
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
(2) Output Voltage vs. Output Current
XDL605/XDL606
XDL605/XDL606
(VIN=12V, VOUT=3.3V)
(VIN=12V, VOUT=5V)
CIN=2.2μF(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
CIN=2.2μF(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
3.6
3.5
3.4
3.3
3.2
3.1
3.0
5.3
5.2
5.1
5.0
4.9
4.8
4.7
XDL605B75D
XDL606B75D
XDL605B75D
XDL606B75D
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
(3) Ripple Voltage vs. Output Current
(4) FB Voltage vs. Ambient Temperature
XDL605/XDL606
(VIN=12V, VOUT=5V)
XDL605/XDL606
VIN=12V
CIN=2.2μF(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
0.760
100
90
80
70
60
50
40
30
20
10
0
0.755
0.750
0.745
0.740
XDL605B75D
XDL606B75D
0.1
1
10
100
1000
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Output Current :IOUT[mA]
20/29
XDL605/XDL606
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) UVLO Voltage vs. Ambient Temperature
(6) Oscillation Frequency vs. Ambient Temperature
XDL605/XDL606
XDL605/XDL606
VIN=12V
2650
3.0
2.9
2500
2350
2200
2050
1900
1750
VUVLOR
2.8
2.7
2.6
2.5
VUVLOD
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(7) Stand-by Current vs. Ambient Temperature
XDL605/XDL606
(8) Lx SW ON Resistance vs. Ambient Temperature
XDL605/XDL606
VIN=12V
VIN=12V
4
3
2
1
0
2.0
RLXH
1.5
1.0
RLXL
0.5
0.0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(9) Quiescent Current vs. Ambient Temperature
XDL605
XDL606
VIN=12V
VIN=12V
40
35
30
25
20
15
10
5
400
350
300
250
200
150
100
50
0
0
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
21/29
XDL605/XDL606 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Internal Soft-Start Time vs. Ambient
(11) External Soft-Start Time vs. Ambient
XDL605/XDL606
XDL605/XDL606
VIN=12V
VIN=12V, RSS=430kΩ, CSS=0.47μF
2.6
2.4
2.2
2.0
1.8
1.6
1.4
31
29
27
25
23
21
19
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(12) PG Detect Voltage vs. Ambient Temperature
(13) PG Output Voltage vs. Ambient Temperature
XDL605/XDL606
XDL605/XDL606
0.75
VIN=12V, IPG=1mA
VIN=12V
0.4
0.3
0.2
0.1
0.0
0.70
0.65
0.60
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(14) EN/SS Voltage vs. Ambient Temperature
XDL605/XDL606
VIN=12V
2.5
EN/SS "H"
EN/SS "L"
2.0
1.5
1.0
0.5
0.0
-50 -25
0
25
50
75 100 125
Ambient Temperature :Ta[℃]
22/29
XDL605/XDL606
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) VIN-VOUT Operation Area
XDL605
XDL606
IOUT>50mA
IOUT≦50mA
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
Operation
Area
Operation
Area
0
0
1
2
3
4
5
6
1
2
3
4
5
6
Output Voltage:VOUT[V]
Output Voltage:VOUT[V]
(16) Output Current Operation Area
XDL605/XDL606
XDL605/XDL606
VOUT= 1.8V
VI N=5V
VOUT= 3.3V
VI N=12V
700
600
500
400
300
200
100
0
700
600
500
400
300
200
100
0
Operation
Area
Operation
Area
-40 -20
0
20 40 60 80 100 120
-40 -20
0
20 40 60 80 100 120
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
XDL605/XDL606
VOUT= 5V
700
600
500
400
300
200
100
0
VI N=12V
VI N=24V
Operation
Area
-40 -20
0
20 40 60 80 100 120
Ambient Temperature :Ta[℃]
23/29
XDL605/XDL606 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) Load Transient Response
XDL605
XDL606
VIN=12V, VOUT=3.3V, IOUT=10mA→300mA,tr=tf =5us
VIN=12V, VOUT=3.3V, IOUT=10mA→300mA,tr=tf =5us
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
1.0ms/div
IOUT=10mA⇔300mA
IOUT=10mA⇔300mA
VOUT: 500mV/div
VOUT: 500mV/div
XDL605
XDL606
VIN=12V, VOUT=5.0V, IOUT=10mA→300mA,tr=tf =5us
VIN=12V, VOUT=5.0V, IOUT=10mA→300mA,tr=tf =5us
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
1.0ms/div
IOUT=10mA⇔300mA
IOUT=10mA⇔300mA
V
OUT: 500mV/div
VOUT: 500mV/div
XDL605
XDL606
VIN=24V, VOUT=5.0V, IOUT=10mA→300mA,tr=tf =5us
VIN=24V, VOUT=5.0V, IOUT=10mA→300mA,tr=tf =5us
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
1.0ms/div
IOUT=10mA⇔300mA
IOUT=10mA⇔300mA
VOUT: 500mV/div
VOUT: 500mV/div
24/29
XDL605/XDL606
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(18) Input Transient Response
XDL605/XDL606
VIN=8V→16V, VOUT=5.0V, IOUT=300mA,tr=tf =100us
XDL605/XDL606
VIN=16V→32V, VOUT=5.0V, IOUT=300mA,tr=tf =100us
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
1.0ms/div
VIN=16V⇔32V
VIN=8V⇔16V
VOUT: 200mV/div
VOUT: 200mV/div
XDL605/XDL606
IN=8V→16V, VOUT=3.3V, IOUT=300mA,tr=tf =100us
V
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
VIN=8V⇔16V
VOUT: 200mV/div
(19) EN/SS Rising Response
XDL605/XDL606
VIN=12V, VENSS=0V→12V, VOUT=5V, IOUT=300mA
XDL605/XDL606
VIN=24V, VENSS=0V→24V, VOUT=5V, IOUT=300mA
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
25/29
XDL605/XDL606 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(19) EN/SS Rising Response
XDL605/XDL606
VIN=12V, VENSS=0V→12V, VOUT=3.3V, IOUT=300mA
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
VEN/SS=0V→12V
VOUT : 2V/div
(20) VIN Rising Response
XDL605/XDL606
IN=0V→12V, VENSS=0V→12V, VOUT=5V, IOUT=300mA
XDL605/XDL606
IN=0V→24V, VENSS=0V→24V, VOUT=5V, IOUT=300mA
V
V
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
1.0ms/div
VEN/SS=0V→24V
VEN/SS=0V→12V
VOUT : 2V/div
VOUT : 2V/div
XDL605/XDL606
VIN=0V→12V, VENSS=0V→12V, VOUT=3.3V, IOUT=300mA
XDL606B75D82-Q
CIN=2.2μF×2(CGA4J3X7R1H225K125AB)
CL=10μF×2 (CGA5L1X7R1C106K160AC)
1.0ms/div
VEN/SS=0V→12V
VOUT : 2V/div
26/29
XDL605/XDL606
Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
OUTLINE / LAND PATTERN
DFN3625-11B PKG
THERMAL CHARACTERISTICS
DFN3625-11B
JESD51-7 Board
DFN3625-11B Power Dissipation
27/29
XDL605/XDL606 Series
■MARKING RULE
●DFN3625-11B
TOREX
① ② ③ ④ ⑤
①represents product series
MARK
PRODUCT SERIES
E
F
XDL605****82-Q
XDL606****82-Q
②represents Type
MARK
Type
B
PRODUCT SERIES
B
XDL60*B**82-Q
③represents FB Voltage
MARK
0
FB(V)
0.75
PRODUCT SERIES
XDL60**75*82-Q
④,⑤represents production lot number 01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order
(G, I, J, O, Q, W excluded*)No Character inversion used
28/29
XDL605/XDL606
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions, excluding when specified for in-vehicle use or other uses.
Do not use the product for in-vehicle use or other uses unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
29/29
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