2SK2611_06 [TOSHIBA]
Silicon N Channel MOS Type DC−DC Converter, Relay Drive and Motor Drive Applications; 硅N沟道MOS型DC-DC转换器,继电器驱动器和电机驱动应用型号: | 2SK2611_06 |
厂家: | TOSHIBA |
描述: | Silicon N Channel MOS Type DC−DC Converter, Relay Drive and Motor Drive Applications |
文件: | 总6页 (文件大小:701K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2SK2611
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π−MOSIII)
2SK2611
DC−DC Converter, Relay Drive and Motor Drive
Applications
Unit: mm
z Low drain−source ON resistance
z High forward transfer admittance
: R
= 1.1 Ω (typ.)
DS (ON)
: |Y | 7.0 S (typ.)
fs
=
z Low leakage current
z Enhancement−mode
: I
= 100 μA (max) (V
= 720 V)
DSS
DS
: V = 2.0~4.0 V (V
= 10 V, I = 1 mA)
D
th
DS
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Drain−source voltage
Symbol
Rating
Unit
V
900
900
±30
9
V
V
DSS
Drain−gate voltage (R
Gate−source voltage
= 20 kΩ)
V
GS
DGR
V
V
GSS
DC (Note 1)
Pulse (Note 1)
I
A
D
1. GATE
Drain current
2. DRAIN (HEAT SINK)
3. SOURCE
I
27
A
DP
Drain power dissipation (Tc = 25°C)
P
150
W
D
AS
AR
Single pulse avalanche energy
E
663
mJ
JEDEC
―
(Note 2)
JEITA
SC-65
2-16C1B
Avalanche current
I
9
15
A
Repetitive avalanche energy (Note 3)
Channel temperature
E
mJ
°C
°C
TOSHIBA
AR
T
ch
150
Weight: 4.6 g (typ.)
Storage temperature range
T
−55~150
stg
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Thermal Characteristics
Characteristics
Symbol
Max
0.833
50
Unit
Thermal resistance, channel to case
R
°C / W
°C / W
th (ch−c)
th (ch−a)
Thermal resistance, channel to
ambient
R
Note 1: Please use devices on condition that the channel temperature is below 150°C.
Note 2: = 90 V, T = 25°C (initial), L = 15 mH, R = 25 Ω, I = 9 A
V
DD
ch
G
AR
Note 3: Repetitive rating: Pulse width limited by maximum channel temperature
This transistor is an electrostatic sensitive device.
Please handle with caution.
1
2006-11-10
2SK2611
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= ±30 V, V = 0 V
Min
Typ.
Max
Unit
Gate leakage current
I
V
—
±30
—
—
—
±10
—
μA
V
GSS
GS
DS
Gate−source breakdown voltage
Drain cut−off current
V
V
I
= ±10 μA, V = 0 V
G DS
(BR) GSS
I
V
= 720 V, V
= 0 V
—
100
—
μA
V
DSS
DS
GS
Drain−source breakdown voltage
Gate threshold voltage
I
= 10 mA, V
= 0 V
900
2.0
—
—
(BR) DSS
D
GS
= 10 V, I = 1 mA
V
V
V
V
—
4.0
1.4
—
V
th
DS
GS
DS
D
Drain−source ON resistance
Forward transfer admittance
Input capacitance
R
= 10 V, I = 4 A
1.1
7.0
2040
45
Ω
DS (ON)
|Y |
D
= 15 V, I = 4 A
3.0
—
S
fs
D
C
C
—
iss
V
= 25 V, V
= 0 V, f = 1 MHz
GS
pF
Reverse transfer capacitance
Output capacitance
—
—
DS
rss
C
—
190
—
oss
Rise time
t
—
—
—
25
60
20
—
—
—
r
Turn−on time
Switching time
t
on
ns
Fall time
t
f
Turn−off time
t
—
—
95
58
—
—
off
Total gate charge (gate−source
plus gate−drain)
Q
g
V
≈ 400 V, V
= 10 V, I = 9 A
nC
DD
GS
D
Gate−source charge
Q
—
—
32
26
—
—
gs
Gate−drain (“miller”) Charge
Q
gd
Source−Drain Ratings and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
—
Typ.
—
Max
9
Unit
A
Continuous drain reverse current
(Note 1)
I
—
—
DR
Pulse drain reverse current
(Note 1)
I
—
—
27
A
DRP
Forward voltage (diode)
Reverse recovery time
Reverse recovery charge
V
I
I
= 9 A, V
= 9 A, V
= 0 V
—
—
—
—
1.6
20
−1.9
—
V
DSF
DR
DR
GS
GS
t
μs
μC
rr
= 0 V, dI
/ dt = 100 A / μs
DR
Q
—
rr
Marking
TOSHIBA
K2611
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
2
2006-11-10
2SK2611
3
2006-11-10
2SK2611
4
2006-11-10
2SK2611
R
V
= 25 Ω
G
1
2
B
⎛
⎜
⎞
⎟
VDSS
E
=
⋅L ⋅I2 ⋅
AS
= 90 V, L = 15 mH
DD
B
− V
DD
VDSS
⎝
⎠
5
2006-11-10
2SK2611
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
6
2006-11-10
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