CMS14(TE12L) [TOSHIBA]

RECTIFIER DIODE,SCHOTTKY,60V V(RRM),SOD-123VAR;


型号：	CMS14(TE12L)
厂家：	TOSHIBA
描述：	RECTIFIER DIODE,SCHOTTKY,60V V(RRM),SOD-123VAR 二极管
文件：	总5页 (文件大小：144K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CMS14

TOSHIBA Schottky Barrier Diode

CMS14

Switching Mode Power Supply Applications

(Output voltage: ≤12 V)

Unit: mm

DC/DC Converter Applications

•

Forward voltage: V

Average forward current: I

Repetitive peak reverse voltage: V

Suitable for compact assembly due to small surface-mount package

“M−FLAT^TM” (Toshiba package name)

= 0.58 V (max)

= 2.0 A

F (AV)

= 60 V

RRM

Absolute Maximum Ratings (Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Repetitive peak reverse voltage

Average forward current

RRM

2.0 (Note 1)

40 (50 Hz)

−40~150

F (AV)

Non-repetitive peak surge current

Junction temperature

FSM

°C

Storage temperature range

stg

Note 1: Tℓ = 112°C

JEDEC

JEITA

―

Device mounted on a ceramic board

Board size: 50 mm × 50 mm

Soldering size: 2 mm × 2 mm

Board thickness: 0.64 t

TOSHIBA

3-4E1A

Rectangular waveform (α = 180°), V = 30 V

Weight: 0.023 g (typ.)

Note 2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating

conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

= 1.0 A (pulse test)

Min

Typ.

Max

Unit

⎯

0.45

0.53

0.6

⎯

0.58

⎯

FM (1)

FM (2)

Peak forward voltage

= 2.0 A (pulse test)

= 5 V (pulse test)

= 60 V (pulse test)

RRM (1)

RRM (2)

RRM

Peak repetitive reverse current

Junction capacitance

μA

200

⎯

= 10 V, f = 1.0 MHz

Device mounted on a ceramic board

(board size: 50 mm × 50 mm)

(soldering land: 2 mm × 2 mm)

(board thickness: 0.64 t)

⎯

Device mounted on a glass-epoxy board

(board size: 50 mm × 50 mm)

(soldering land: 6 mm × 6 mm)

(board thickness: 1.6 t)

Thermal resistance

(junction to ambient)

th (j-a)

°C/W

135

Device mounted on a glass-epoxy board

(board size: 50 mm × 50 mm)

(soldering land: 2.1 mm × 1.4 mm)

(board thickness: 1.6 t)

⎯

210

Thermal resistance

(junction to lead)

th (j-ℓ)

⎯

°C/W

2006-11-13

CMS14

Marking

Abbreviation Code

Part No.

CMS14

Standard Soldering Pad

Unit: mm

1.4

3.0

1.4

Handling Precaution

1) Schottky barrier diodes have reverse current characteristics compared to other diodes.

There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.

Please take forward and reverse loss into consideration during design.

2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be

exceeded during operation, even for an instant. The following are the general derating methods that we

recommend when you design a circuit with a device.

RRM

: Use this rating with reference to (1) above. V

has a temperature coefficient of 0.1%/°C. Take

RRM

this temperature coefficient into account designing a device at low temperature.

I : We recommend that the worst case current be no greater than 80% of the absolute maximum

F (AV)

rating of

and T be below 120°C. When using this device, take the margin into consideration by

F (AV)

using an allowable Tamax-I

curve.

F (AV)

: This rating specifies the non-repetitive peak current. This is only applied for an abnormal

operation, which seldom occurs during the lifespan of the device.

FSM

T : Derate this rating when using a device in order to ensure high reliability.

We recommend that the device be used at a T of below 120°C.

3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.

When using a device, design a circuit board and a soldering land size to match the appropriate thermal

resistance value.

4) Please refer to the Rectifiers databook for further information.

2006-11-13

CMS14

– v

– I

F (AV) F (AV)

2.0

1.6

1.2

0.8

0.4

Rectangular

waveform

Pulse test

T = 150°C

0° α 360°

180°

125°C

75°C

Conduction angle α

120°

α = 60°

25°C

0.1

0.01

0.2

0.4

0.6

0.8

1.0

1.2

0.6

1.2

1.8

2.4

3.0

Instantaneous forward voltage

(V)

Average forward current

(A)

F (AV)

Ta max – IF (AV)

Tℓ max – I

F (AV)

160

140

120

100

160

140

120

100

Device mounted on a ceramic board: Rectangular

waveform

board size: 50 mm × 50 mm

soldering land:

2 mm × 2 mm

board thickness:

0° α 360°

0.64 t

F (AV)

Conduction

angle α

= 30 V

α = 60°

120°

180°

Rectangular

waveform

0° α 360°

180°

1.6

F (AV)

Conduction

angle α

= 30 V

120°

1.2

α = 60°

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

0.4

0.8

2.0

2.4

2.8

3.2

Average forward current

(A)

Average forward current

(A)

F (AV)

– t

th (j-a)

1000

Device mounted on a glass-epoxy board:

board size: 50 mm × 50 mm

Soldering land: 2.1 mm × 1.4 mm

board thickness: 1.6 t

500

300

100

Device mounted on a glass-epoxy board:

board size: 50 mm × 50 mm

Soldering land: 6.0 mm × 6.0 mm

board thickness: 1.6 t

Device mounted on a ceramic board:

board size: 50 mm × 50 mm

Soldering land: 2.0 mm × 2.0 mm

board thickness: 0.64 t

0.001 0.003

0.01

0.03

0.1

0.3

100

300

1000

Time

t (s)

2006-11-13

CMS14

Surge forward current

(non-repetitive)

C – V

(typ.)

500

300

Ta = 25°C

f = 50 Hz

Ta = 25°C

f = 1 MHz

100

Reverse voltage

(V)

Number of cycles

– T

(typ.)

– V

(typ.)

R (AV)

0.40

0.32

0.24

0.16

0.08

0.00

Rectangular

waveform

Pulse test

0°

360°

48 V

40 V

0.1

Conduction angle α

T = 125°C

30 V

300°

240°

20 V

0.01

0.001

0.0001

180°

10 V

= 5 V

120°

α = 60°

100

120

140

160

Junction temperature

(°C)

Reverse voltage

(V)

2006-11-13

CMS14

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must

also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,

the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

•

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious

public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used

in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric

power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

document.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product

or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2006-11-13

CMS14(TE12L) [TOSHIBA]

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