CMS15I40A(TE12L,QM [TOSHIBA]
X35 PB-F DIODE M-FLAT MOQ=3000 V=60 I=3A F=60HZ;
| 型号： | CMS15I40A(TE12L,QM |
| 厂家： | 
TOSHIBA |
| 描述： | X35 PB-F DIODE M-FLAT MOQ=3000 V=60 I=3A F=60HZ 测试 光电二极管 |
| 文件： | 总7页 (文件大小：277K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMS15I40A
Schottky Barrier Diode
CMS15I40A
1. Applications
•
Secondary Rectification in Switching Regulators
•
Reverse-Current Protection in Mobile Devices
2. Features
(1) Peak forward voltage: VFM = 0.49 V (max) @IFM = 1.5 A
(2) Average forward current: IF(AV) = 1.5 A
(3) Repetitive peak reverse voltage: VRRM = 40 V
(4) Small, thin package suitable for high-density board assembly
Toshiba Nickname: M-FLATTM
3. Packaging and Internal Circuit
1: Anode
2: Cathode
3-4E1S
4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Repetitive peak reverse voltage
Symbol
Note
Rating
Unit
VRRM
IF(AV)
IFSM
Tj
40
1.5
V
A
Average forward current
(Note 1)
(Note 2)
Non-repetitive peak forward surge current
Junction temperature
25
150
Storage temperature
Tstg
-55 to 150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Tℓ = 126 , square wave (α = 180°), VR = 20 V
Note 2: f = 50 Hz, half-sine wave
Start of commercial production
2010-10
2014-04-14
Rev.1.0
1
CMS15I40A
5. Thermal Characteristics
Characteristics
Symbol
Note
Test Condition
Max
60
Unit
Thermal resistance (junction-to-ambient)
Rth(j-a)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land size: 2 mm × 2 mm)
(board thickness: 0.64 mm)
/W
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land size: 6 mm × 6 mm)
(board thickness: 1.6 mm)
135
16
Thermal resistance (junction-to-lead)
Rth(j-ℓ)
Junction to cathode lead
/W
6. Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Peak forward voltage
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
V
VFM(1)
VFM(2)
VFM(3)
IRRM(1)
IRRM(2)
Cj
IFM = 0.1 A (pulse measurement)
IFM = 1 A (pulse measurement)
IFM = 1.5 A (pulse measurement)
VRRM = 5 V (pulse measurement)
VRRM = 40 V (pulse measurement)
VR = 10 V, f = 1 MHz
0.26
0.37
0.41
8
0.49
Repetitive peak reverse current
Junction capacitance
µA
17
100
62
pF
7. Marking
Fig. 7.1 Marking
Marking Code
SR
Part Number
CMS15I40A
2014-04-14
Rev.1.0
2
CMS15I40A
8. Usage Considerations
(1) Schottky barrier diodes (SBDs) have reverse current greater than other types of diodes. This makes
SBDs more vulnerable to damage due to thermal runaway under high-temperature and high-voltage
conditions. Thus, both forward and reverse power losses of SBDs should be considered for thermal and
safety design.
(2) The absolute maximum ratings are rated values that must not be exceeded during operation, even for an
instant. The following are the recommended general derating methods for designing a circuit board using
this device.
VRRM:Use this rating with reference to (1) above. VRRM has a temperature
coefficient of 0.1 %/ at low temperatures. Take this coefficient into account when designing a
circuit board that will be operated in a low-temperature environment.
IF(AV):We recommend that the worst-case current be no greater than 80 % of the absolute maximum
rating of IF(AV) and that the worst-case junction temperature, Tj, be kept below 120 . When using
this device,
allow margins, referring to the Ta(max)-IF(AV) curve.
IFSM:This rating specifies peak non-repetitive forward surge current. This only applies to an abnormal
operation, which seldom occurs during the lifespan of a device.
Tj:
Derate device parameters in proportion to this rating in order to ensure high reliability.
We recommend that the junction temperature (Tj) of a device be kept below 120 .
(3) Thermal resistance (junction-to-ambient) varies with the mounting conditions of a device on a circuit
board. An appropriate thermal resistance value should be used, considering the heat sink, circuit board
design and land pattern dimensions (provided for reference only).
(4) For other design considerations, see the Rectifiers databook or the Toshiba Semiconductor website.
9. Land Pattern Dimensions (for reference only)
Fig. 9.1 Land Pattern Dimensions for Reference Only (Unit: mm)
2014-04-14
Rev.1.0
3
CMS15I40A
10. Characteristics Curves (Note)
Fig. 10.1 IF - VF
Fig. 10.2 PF(AV) - IF(AV)
Fig. 10.3 Ta(max) - IF(AV)
Fig. 10.4 Tℓ(max) - IF(AV)
Fig. 10.5 Peak Repetitive Forward Current
2014-04-14
Rev.1.0
4
CMS15I40A
Fig. 10.6 rth(j-a) - t
Fig. 10.7 Cj - VR
Fig. 10.8 IR - Tj
NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2014-04-14
Rev.1.0
5
CMS15I40A
Package Dimensions
Unit: mm
Weight: 0.023 g (typ.)
Package Name(s)
TOSHIBA: 3-4E1S
Nickname: M-FLAT
2014-04-14
Rev.1.0
6
CMS15I40A
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDEDUSE").Exceptforspecificapplicationsasexpresslystatedinthisdocument, UnintendedUseincludes, withoutlimitation,
equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles,
trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices,
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representative.
•
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Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
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INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
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OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and
regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration
Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all
applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING
AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
2014-04-14
Rev.1.0
7
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