CMZB15(TE12L) [TOSHIBA]
ZENER DIODE,SINGLE, TWO TERMINAL,15V V(Z),10%,DO-215VAR;型号: | CMZB15(TE12L) |
厂家: | TOSHIBA |
描述: | ZENER DIODE,SINGLE, TWO TERMINAL,15V V(Z),10%,DO-215VAR |
文件: | 总5页 (文件大小:151K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CMZB12~CMZB53
TOSHIBA Zener Diode Silicon Diffused Type
CMZB12~CMZB53
○Communication, Control and
Unit: mm
Measurement Equipment
○Constant Voltage Regulation
○Transient Suppressors
②
•
•
•
Average power dissipation: P = 1.0 W
Zener voltage: V = 12 to 53 V
Z
Suitable for high-density board assembly due to the use of a small
TM
surface-mount package, M−FLAT
①
0.16
1.75 ± 0.1
Absolute Maximum Ratings (Ta = 25°C)
+ 0.2
2.4 − 0.1
Characteristics
Power dissipation
Symbol
P
Rating
Unit
1.0 (Note 1)
−40 to 150
−40 to 150
W
°C
°C
① ANODE
② CATHODE
Junction temperature
T
j
Storage temperature range
T
stg
Note 1: Ta = 40°C
JEDEC
―
―
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering size: 6 mm × 6 mm
Board thickness: 1.6 mm
JEITA
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating temperature / current /
voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
1
2008-10-30
CMZB12~CMZB53
Electrical Characteristics (Ta = 25°C)
Temperature
Coefficient
Of Zener
Zener Voltage
Vz (V)
Zener Impedance
r (Ω)
Forward Voltage
Reverse Current
V
(V)
I (μA)
R
d
F
Type
Measure-
ment
Measure-
ment
αT (mV/°C)
Measure-
ment
Measure-
ment
Current
Current
Current
Voltage
Min
Typ.
Max
Max
Typ.
Max
Max
Max
I
(mA)
I
Z
(mA)
I
(A)
V (V)
R
Z
F
CMZB12
CMZB13
CMZB15
CMZB16
CMZB18
CMZB20
CMZB22
CMZB24
CMZB27
CMZB30
CMZB33
CMZB36
CMZB39
CMZB43
CMZB47
CMZB51
CMZB53
10.8
11.7
13.5
14.4
16.2
18.0
19.8
21.6
24.3
27.0
29.7
32.4
35.1
38.7
42.3
45.9
47.7
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
53
13.2
14.3
16.5
17.6
19.8
22.0
24.2
26.4
29.7
33.0
36.3
39.6
42.9
47.3
51.7
56.1
58.3
10
30
30
30
30
30
30
30
30
30
30
30
30
35
40
65
65
85
10
8
13
14
17
19
23
26
28
32
36
40
41
45
48
53
60
68
77
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
0.2
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
8
10
10
10
10
10
10
10
10
10
10
9
10
10
10
10
10
10
10
10
10
10
9
9
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
9
11
12
14
16
18
20
23
25
26
28
30
33
38
43
49
10
11
13
14
16
17
19
21
26.4
28.8
31.2
34.4
37.6
40.8
42.4
8
8
7
7
6
6
6
6
5
5
2
2008-10-30
CMZB12~CMZB53
Marking
Abbreviation Code
Part No.
Part No.
Abbreviation Code
B12
B13
B15
B16
B18
B20
B22
B24
B27
CMZB12
CMZB13
CMZB15
CMZB16
CMZB18
CMZB20
CMZB22
CMZB24
CMZB27
B30
B33
B36
B39
B43
B47
B51
B53
CMZB30
CMZB33
CMZB36
CMZB39
CMZB43
CMZB47
CMZB51
CMZB53
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even
for a moment. Do not exceed any of these ratings. The following are the general derating methods that we
recommend when you design a circuit with a device.
P:
We recommend that the worst case power dissipation be no greater than 50% of the
absolute maximum rating of power dissipation. Carry out adequate heat design.
P
RSM:
We recommend that a device be used within the recommended area in the figure,
P
-tw.
RSM
T :
j
Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at T of below 120°C.
j
2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
3) Please refer to the Rectifiers databook for further information.
3
2008-10-30
CMZB12~CMZB53
Ta max – P
P
– tW (reference value)
RSM
160
120
80
1000
100
10
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
P
RSM
t
W
Ta = 25°C
Rectangular pulse
Recommended
40
0
0
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1
10
Power dissipation
P
(W)
Pulse width
t
W
(ms)
α
T – VZ
(typ.)
α
T – VZ
(typ.)
50
25
20
15
10
5
CMZB12 to CMZB27
CMZB30 to CMZB53
45
40
35
30
25
26
10
15
20
25
30
30
34
38
42
46
50
54
58
Zener voltage VZ (V)
Zener voltage VZ (V)
r
– t
th (j-a)
1000
100
10
Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
Board thickness: 1.6 mm
Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
Board thickness: 1.6 mm
1
Device mounted on a ceramic board:
Board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
Board thickness: 0.64 mm
0.1
0.001
0.01
0.1
1
10
100
1000
Time
t (s)
4
2008-10-30
CMZB12~CMZB53
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
5
2008-10-30
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