CRS03(TE85R) [TOSHIBA]
DIODE 1 A, 30 V, SILICON, SIGNAL DIODE, S-FLAT-2, Signal Diode;
| 型号： | CRS03(TE85R) |
| 厂家： | 
TOSHIBA |
| 描述： | DIODE 1 A, 30 V, SILICON, SIGNAL DIODE, S-FLAT-2, Signal Diode |
| 文件： | 总8页 (文件大小：352K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Sm a ll Su rfa ce -Mo u n t
Re ctifie rs
S-FLATTM a nd M-FLATTM Series
Today’s mobile and office automation equipment is becoming ever smaller
and slimmer. In response to this market trend, Toshiba have developed an
ultra-small surface-mount S-Flat package rectifier which allows high-density
mounting.Toshiba offer a slim, miniature S-FLAT package with a height of
0.98 mm (typ.) and a mounting area 50% smaller than that of existing
Toshiba products.The M-FLAT package has been achieved the height of
0.98 mm (approximately the half of existing I-FLAT package) and high
current capacity (up to 5 A).
S-FLATTM
M-FLATTM
Applications
General-Purpose
SBD/HED
Power Zener Diodes
Rectification
portable products
Approx. 7.5 V: Voltage regulation
Reverse connection protection
Free-wheeling
Reverse-current protection
Secondary rectification
DC-DC converter
12 V~18 V: Gate protection for
power MOSFETs
24 V~47 V: Surge absorption
Features
S-FLATTM Features
Toshiba offer a slim, miniature S-FLAT package with a height of 0.98 mm (typ.) and a mounting area 50% smaller than an
existing I-FLAT packag.
M-FLATTM Features
The M-FLAT package has been developed the I-FLAT as a base. By reducing the height to 0.98 mm (approximately the
half of existing I-FLAT package) and optimizing the internal package frame, Toshiba have produced a device which offers
high current capacity (up to 5 A) and lower power dissipation.
Common Features
High surge current capability due to solder clamp structure.
Flat pins allow stable mounting on the PCB
Package comparison (Toshiba products only)
S-FLATTM M-FLATTM
(Unit: mm)
I-FLAT
2.6
3.5
3.8
4.7
4.3
4.7
2
TM
S-FLAT
Line-up
Type
Prodect Number
CRG01
CRG02
CRS01
Ratings
0.7A/100V
0.7A/400V
1A/30V
Features
Small package
Small package
General - Purpose
Low - V Type (V
= 0.37 V@0.7 A,I
= 1.5 mA@30 V)
F
FM
= 0.40 V@0.7 A,I
RRM
= 0.05 mA@30 V)
CRS02
1A/30V
Trench-SBD (V
FM
RRM
= 0.45 V@0.7 A,I
CRS03
1A/30V
Low - I Type (V
= 0.1 mA@30 V)
R
FM
RRM
= 0.49 V@0.7 A,I
CRS04
1A/40V
40 V withstand voltage SBD (V
= 0.1 mA@40 V)
RRM
FM
= 0.45 V@1 A,I = 5µA@5 V)
RRM
SBDs
CRS05
1A/30V
Low - I Type (V
R
FM
CRS06
1A/20V
Low - V Type (V
= 0.36 V@1 A,I
= 0.33 V@1 A,I
= 1 mA@20 V)
= 1 mA@20 V)
F
FM
FM
FM
FM
RRM
RRM
CRS07
1A/20V
Low - V Type (V
F
CRS08
1.5A/30V
1.5A/30V
0.7W/7.5~47V
1A/200V
Low - V Type (V
= 0.36 V@1.5 A,I
= 1.0 mA@30 V)
= 0.05 mA@30 V)
F
RRM
RRM
CRS09
Low - I Type (V
= 0.46 V@1.5 A,I
R
CRZ ser
CRH01
High surge-protection capability
Power zener diodes
HEDs
High-speed, high-efficiency rectifiers (t = 35 ns max V
= 0.98 V@1.0 A)
rr FM
Low - I Type SBD
Low - V Type SBD
R
F
i - v charactevistics (T = 25˚C) (max)
i - v charactevistics (T = 25˚C) (max)
F
F
j
F
F
j
10
10
CRS03
CRS08
CRS06
CRS09
CRS02
CRS02
CRS04
CRS01
1
1
0.1
0.1
0
0.2
0.4
0.6
0.8
1
1.2
1.4
0
0.2
0.4
0.6
0.8
1
1.2
1.4
v (V)
v (V)
F
F
SBD I - T @V = 5 V (T = 25˚C)
(actual data for reference only)
SBD I - T @V = 10 V (T = 25˚C)
(actual data for reference only)
R
j
R
j
R
j
R
j
100
10
100
10
1
1
0.1
0.01
0.1
0.01
CRS01
CRS02
CRS01
CRS02
CRS03
CRS03
0.001
0.001
CRS06
CRS08
CRS06
CRS08
CRS09
CRS09
0.0001
0.0001
0
20
40
60
80
100
120
0
20
40
60
80
100
120
Junction Temperature T (˚C)
Junction Temperature T (˚C)
j
j
3
TM
M-FLAT
Line-up
Type
Prodect Number
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
Ratings
Features
3A/30V Low - V SBD
F
V
V
V
V
V
V
V
V
V
V
V
= 0.37 V@3 A,I
= 0.40 V@3 A,I
= 0.45 V@3 A,I
= 0.37 V@5 A,I
= 0.45 V@5 A,I
= 0.37 V@2 A,I
= 0.45 V@2 A,I
= 0.37 V@1 A,I
= 0.45 V@1 A,I
= 0.55 V@1 A,I
= 0.55 V@2 A,I
= 5 mA@30 V
= 0.5 mA@30 V
= 0.5 mA@30 V
= 8 mA@30 V
= 0.8 mA@30 V
= 3 mA@30 V
= 0.5 mA@30 V
= 1.5 mA@30 V
= 0.5 mA@30 V
= 0.5 mA@40 V
= 0.5 mA@40 V
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
FM
RRM
RRM
RRM
RRM
RRM
RRM
RRM
RRM
RRM
RRM
RRM
3A/30V Trench SBD
3A/30V Low - I SBD
R
5A/30V Low - V SBD
F
5A/30V Low - I SBD
R
SBDs
2A/30V Low - V SBD
F
2A/30V Low - I SBD
R
1A/30V Low - V SBD
F
1A/30V Low - I SBD
R
1A/40V Normal SBD
2A/40V Normal SBD
CMS01/CMS02/CMS03
CMS06/CMS07/CMS08/CMS09
i - v Charactevistics (T = 25˚C) (max)
i - v Charactevistics (T = 25˚C) (max)
F
F
j
F
F
j
10
10
CMS01
(3 A low - V
)
F
CMS06
(2 A low - V
)
F
CMS08
CMS09
(1 A low - V
)
F
1
1
(1 A low - I
)
R
CMS02
(3 A trench)
CMS07
(2 A low - I
)
R
CMS03
(3 A low - I
)
R
0.1
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
v (V)
v (V)
F
F
SBD I - T @V = 5 V (T = 25˚C)
(actual data for reference only)
SBD I - T @V = 15 V (T = 25˚C)
(actual data for reference only)
R
j
R
j
R
j
R
j
100
10
1
100
10
1
0.1
0.1
CMS01 (3 A low - V
CMS03 (3 A low - I
)
CMS01 (3 A low - V
CMS03 (3 A low - I
)
F
F
0.01
0.001
)
0.01
0.001
)
R
R
CMS06 (2 A low - V
CMS07 (2 A low - I
)
CMS06 (2 A low - V
CMS07 (2 A low - I
)
F
)
F
)
R
R
CMS08 (1 A low - V
CMS09 (1 A low - I
)
CMS08 (1 A low - V
CMS09 (1 A low - I
)
F
)
F
)
R
R
CMS10 (1 A - 40 V)
CMS10 (1 A - 40 V)
0.0001
0.0001
20
40
60
80
100
20
40
60
80
100
Junction Temperature T (˚C)
Junction Temperature T (˚C)
j
j
4
M-FLATTM Electrical Characteristics of SBDs
Maximum Ratings
Electrical Characteristics
Product
Number
I (AV)
F
(A)
V
I
T
T
V
I
RRM
RRM
(V)
FSM
(A)
j
stg
FM
(˚C)
(˚C)
(V)
I
(A)
FM
(mA)
V
(V)
RRM
30
CMS01
CMS02
CMS03
CMS04
CMS05
CMS06
CMS07
CMS08
CMS09
CMS10
CMS11
3
30
30
30
30
30
30
30
30
30
40
40
40
40
40
60
60
40
40
25
25
25
40
-40~125
-40~125
-40~150
-40~125
-40~150
-40~125
-40~150
-40~125
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
0.37
0.4
3
3
3
5
5
2
2
1
1
1
2
5
3
0.5
0.5
8
30
30
30
30
30
30
30
30
40
40
3
0.45
0.37
0.45
0.37
0.45
0.37
0.45
0.55
0.55
5
5
0.8
3
2
2
0.5
1.5
0.5
0.5
0.5
1
1
1
2
S-FLATTM Electrical Characteristics of Rectifiers
Maximum Ratings
Electrical Characteristics
Product
Number
Type
I (AV)
F
(A)
V
I
T
T
V
I
t
rr
RRM
(V)
FSM
(A)
j
stg
FM
RRM
(˚C)
(˚C)
(V)
0.37
0.4
I
(A)
FM
0.7
(mA)
V
(V)
(ns)
RRM
30
CRS01
CRS02
CRS03
CRS04
CRS05
CRS06
CRS07
CRS08
CRS09
CRH01
CRG01
CRG02
1
30
30
20
20
20
20
20
20
30
30
30
15
15
15
-40~125
-40~125
-40~150
-40~150
-40~150
-40~125
-40~125
-40~125
-40~150
-40~150
-40~150
-40~150
-40~125
-40~125
-40~150
-40~150
-40~150
-40~125
-40~150
-40~150
-40~150
-40~150
-40~150
-40~150
1.5
-
-
1
0.7
0.7
0.7
1
0.05
0.1
30
30
1
30
0.45
0.49
0.45
0.36
0.33
0.36
0.46
0.98
1.1
-
1
40
0.1
40
-
SBDs
HEDs
1
30
0.005
1
5
-
1
20
1
20
-
1
20
1
1
20
-
1.5
1.5
1
30
1.5
1.5
1
1
30
-
30
0.05
0.01
0.01
0.01
30
-
200
100
400
200
100
400
35
-
General-
purpose
recfifiers
0.7
0.7
0.7
0.7
1.1
-
S-FLATTM Electrical Charactevistics of Zener Diodes
Zener Voltage
Forward Voltage
Reverse Current
V
Z
measuring current
V
measuring current
I
measuring current
Product
Number
F
R
(V)
typ.
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
I
(V)
I
(µA)
max
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
V
R
Z
F
min
6.75
7.38
8.19
9
max
8.25
9.02
10.01
11
(mA)
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
9
max
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
(A)
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
(V)
4.5
4.9
5.5
6
CRY7.5
CRY8.2
CRY9.1
CRZ10
CRZ11
CRZ12
CRZ13
CRZ15
CRZ16
CRZ18
CRZ20
CRZ22
CRZ24
CRZ27
CRZ30
CRZ33
CRZ36
CRZ39
CRZ43
CRZ47
9.9
12.1
13.2
14.3
16.5
17.6
19.8
22
7
10.8
11.7
13.5
14.4
16.2
18
8
9
10
11
13
14
19.8
21.6
24.3
27
24.2
26.4
29.7
33
16
17
19
21
29.7
32.4
35.1
38.7
42.3
36.3
39.6
42.9
47.3
51.7
26.4
28.8
31.2
34.4
37.6
8
7
6
5
Package Dimensions
S-FLATTM
M-FLATTM
2
Unit: mm
Unit: mm
2
Soldering pad dimensions
(reference only)
Soldering pad dimensions
(reference only)
1.2
2.8
1.4
3.0
1.4
0.16
0.16
0.9 ± 0.1
1.75 ± 0.1
1.6 +0.2
-0.1
1
1
2.4 +0.2
-0.1
1: Anode
2: Cathode
1: Anode
2: Cathode
S-FLATTM Embossed Tape Packing(TE85R,TE85L)
Unit: mm
Tape dimensions
Reel dimensions
F
9.0 ± 0.3
E
K
ø180 ± 3
ø180 ± 3
H
ø3
110
ø160
4 ± 0.2
5 ± 0.2
*1
*3
18min
*2
ø10
ø3
ø76
A
D
3 ± 0.2
M
M
L
R type
C
N
L type
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
N
1.2 ± 0.5
1.2 ± 0.5
Position of label
Tepe feed direction
Unit: mm
Item
Symbol
Dimension
1.9 ± 0.1
3.8 ± 0.1
ø1.1 ± 0.1
4.0 ± 0.1
Remarks
Length
A
B
C
D
E
F
G
H
I
Inside bottom surface
Inside bottom surface
Internal space
Width
Diameter
Pitch
Device Recess
—
—
Diameter
Pitch
ø1.5 +0.1
-0
Feed Hole
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.1
3.5 ± 0.1
8.0 ± 0.3
0.2 ± 0.05
1.25 ± 0.1
5˚max
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Lateral position
Distance between tape edge and center of the recess
Lengthwise direction
Crosswise direction
Width
Distance between recess center and feed hole center
Center - line Gap
Distance between recess center and feed hole center
J
—
—
—
—
—
Thickness
Depth
K
L
Carrier Tape
Angle
M
N
Curvature
R0.3 max
Leader and trailer dimensions
Leading empty length: 200 mm(min)
Leader: 400 mm(min)
Trailing empty length
more than 10 pitches
6
M-FLATTM Embossed Tape Packing(TE12R,TE12L)
Unit: mm
Tape dimensions
Reel dimensions
F
13 ± 0.3
E
K
ø180 ± 3
ø180 ± 3
H
ø3
110
ø160
4 ± 0.2
5 ± 0.2
*1
*3
18min
*2
ø10
ø3
ø76
A
D
3 ± 0.2
M
M
L
R type
C
N
L type
*1 2 ± 0.2
*2 4 ± 0.5
*3 ø44
N
1.2 ± 0.5
1.2 ± 0.5
Position of label
Tepe feed direction
Unit: mm
Item
Symbol
Dimension
2.7 ± 0.1
5.0 ± 0.1
ø1.5 ± 0.1
4.0 ± 0.1
ø1.5 + 0.1
4.0 ± 0.1
1.75 ± 0.1
2.0 ± 0.05
5.5 ± 0.05
12.0 ± 0.3
0.3 ± 0.05
1.25 ± 0.1
2˚max
Remarks
Length
A
B
C
D
E
F
G
H
I
Inside bottom surface
Inside bottom surface
Internal space
Width
Diameter
Pitch
Device Recess
—
—
Diameter
Pitch
Feed Hole
Cumulative pitch error rate: ± 0.2 mm max / 10 pitches
Lateral position
Distance between tape edge and center of the recess
Lengthwise direction
Crosswise direction
Width
Distance between recess center and feed hole center
Center - line Gap
Distance between recess center and feed hole center
J
—
—
—
—
—
Thickness
Depth
K
L
Carrier Tape
Angle
M
N
Curvature
R0.2 max
Leader and trailer dimensions
Leading empty length: 180 mm(min)
Trailing empty length: 180 mm(min)
Leader: 400 mm(min)
7
OVERSEAS SUBSIDIARIES AND AFFILIATES
000816(D)
Toshiba Electronics Europe GmbH
Toshiba Electronics Asia, Ltd.
Toshiba America
Electronic Components, Inc.
Düsseldorf Head Office
Hansaallee 181, D-40549 Düsseldorf
Germany
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Level 11, Top Glory Insurance Building, Grand Century
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a
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1
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Edison, NJ
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Seoul Head Office
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Tel: (503)629-0818 Fax: (503)629-0827
Toshiba Electronics Asia
(Singapore) Pte. Ltd.
Singapore Head Office
438BAlexandraRoad, #06-08/12Alexandra
Technopark,Singapore119968
Tel: (278)5252 Fax: (271)5155
Toshiba Technology Development
(Shanghai) Co., Ltd.
23F, ShanghaiSenmaoInternationalBuilding, 101
Yin Cheng East Road, Pudong New Area, Shanghai,
200120,China
Richardson, TX(Dallas)
777 East Campbell Rd., Suite 650, Richardson,
TX 75081, U.S.A.
Tel: (972)480-0470 Fax: (972)235-4114
Tel: (021)6841-0666 Fax: (021)6841-5002
BangkokOffice
San Jose Engineering Center, CA
1060 Rincon Circle, San Jose, CA 95131, U.S.A.
Tel:(408)526-2400 Fax:(408)526-2410
135 Moo 5 Bangkadi Industrial Park, Tivanon Rd.,
BangkadiAmphurMuangPathumthani, Bangkok, 12000,
Thailand
Tsurong Xiamen Xiangyu Trading
Co., Ltd.
8N, Xiamen SEZ Bonded Goods Market Building,
Xiamen, Fujian, 361006, China
Tel: (0592)562-3798 Fax: (0592)562-3799
Wakefield,MA(Boston)
401 Edgewater Place, Suite #360, Wakefield,
Tel: (02)501-1635 Fax: (02)501-1638
Toshiba Electronics Trading
(Malaysia)Sdn. Bhd.
Kuala Lumpur Head Office
Suite W1203, Wisma Consplant, No.2,
Jalan SS 16/4, Subang Jaya, 47500 Petaling Jaya,
Selangor Darul Ehsan, Malaysia
MA01880-6229, U.S.A.
Tel: (781)224-0074 Fax: (781)224-1095
Toshiba Electronics Taiwan
Corporation
Taipei Head Office
Toshiba Do Brasil S.A.
17F, Union Enterprise Plaza Bldg. 109
Min Sheng East Rd., Section 3, 0446 Taipei,
Taiwan
Electronic Components Div.
Tel: (3)731-6311 Fax: (3)731-6307
Estrada Dos Alvarengas, 5. 500-Bairro Alvarenga
09850-550-Sao Bernardo do campo - SP
Tel: (011)7689-7171 Fax: (011)7689-7189
Penang Office
Tel: (02)514-9988 Fax: (02)514-7892
Suite 13-1, 13th Floor, Menard Penang Garden,
42-A, Jalan Sultan Ahmad Shah,
100 50 Penang, Malaysia
KaohsiungOffice
16F-A, Chung-Cheng Bldg., Chung-Cheng 3Rd.,
80027, Kaohsiung, Taiwan
Tel: 4-226-8523 Fax: 4-226-8515
Tel: (07)222-0826 Fax: (07)223-0046
Toshiba Electronics Philippines, Inc.
26th Floor, Citibank Tower, Valero Street, Makati,
Manila, Philippines
Tel: (02)750-5510 Fax: (02)750-5511
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in
general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the
responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for
the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of
human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used
within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind
the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor
Reliability Handbook" etc..
The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or
reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage
include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed
in this document shall be made at the customer’s own risk.
Electronic Devices Sales & Marketing Group
1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan
Tel: (03)3457-3405 Fax: (03)5444-9431
Website: http://doc.semicon.toshiba.co.jp/indexus.htm
©2000TOSHIBACORPORATION
Printed in Japan
相关型号：
CRS04
SCHOTTKY BARRIER TYPE (SWITCHING TYPE POWER SUPPLY, PORTABLE EQUIPMENT BATTERY APPLICATIONS)
TOSHIBA
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