CUS03(TE85L) [TOSHIBA]
Diode Schottky 40V 0.7A 2-Pin US-FLAT T/R;
| 型号： | CUS03(TE85L) |
| 厂家： | 
TOSHIBA |
| 描述： | Diode Schottky 40V 0.7A 2-Pin US-FLAT T/R |
| 文件： | 总5页 (文件大小：181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CUS03
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS03
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Application
•
•
•
•
Forward voltage: V = 0.52 V@I = 0.7 A
FM F
Average forward current: I
= 0.7A
F (AV)
Repetitive peak reverse voltage: V
= 40 V
RRM
Suitable for compact assembly due to small surface-mount package
“US−FLATTM” (Toshiba package name)
Maximum Ratings
(Ta = 25°C)
Characteristics
Symbol
Rating
Unit
V
Repetitive peak reverse voltage
V
40
RRM
0.7
Average forward current
I
A
F (AV)
(Note 1)
Peak one cycle surge forward current
Junction temperature
I
20 (50 Hz)
−40 to 150
−40 to 150
A
FSM
JEDEC
JEITA
―
T
j
°C
°C
Storage temperature range
T
stg
TOSHIBA
3-2B1A
Note 1: Ta = 53°C: Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm,
Weight: 0.004 g (typ.)
Land size: 6 mm × 6 mm
Rectangular waveform (α = 180°), V = 20 V
R
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
V
I
I
= 0.1 A
= 0.7 A
―
―
―
―
―
0.37
0.48
0.4
―
0.52
―
FM (1)
FM (2)
FM
FM
Peak forward voltage
I
V
V
V
= 5 V
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
µA
pF
I
= 40 V
3.0
100
―
C
j
= 10 V, f = 1.0 MHz
R
45
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
―
―
75
Thermal resistance
(junction to ambient)
R
°C/W
°C/W
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
―
―
―
―
150
30
Thermal resistance (junction to lead)
R
Junction to lead of cathode side
th (j-ℓ)
1
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CUS03
Marking
Abbreviation Code
Part No.
CUS03
3
Standard Soldering Pad
Unit: mm
0.8
2.0
0.5
1.1
0.8
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
2) The maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V : Use this rating with reference to (1) above. V has a temperature coefficient of 0.1%/°C. Take
RRM RRM
this temperature coefficient into account when designing a device at low temperature.
I
I
: We recommend that the worst case current be no greater than 80% of the maximum rating of
F (AV)
I
and T be below 120°C. When using this device, please take the margin into consideration
j
F (AV)
by using an allowable Tamax-I
curve.
F (AV)
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal
operation, which seldom occurs during the lifespan of the device.
FSM
T : Derate this rating when using a device to ensure high reliability.
j
We recommend that the device be used at a T of below 120°C.
j
3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
4) Please refer to the Rectifiers databook for further information.
2
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CUS03
i
– v
F
P
– I
F (AV) F (AV)
F
10
0.5
0.4
0.3
0.2
0.1
0
DC
180°
T = 150°C
j
1
120°
75°C
25°C
α = 60°
100°C
Rectangular
waveform
0.1
0.01
0° α 360°
Conduction
angle: α
0.0
0.2
0.4
0.6
0.8
1.0
(V)
1.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous forward voltage
v
Average forward current
I
(A)
F
F (AV)
Ta max – I
Ta max – I
F (AV)
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 6 mm × 6 mm)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm,
land size: 2 mm × 2 mm)
α = 60°
120°
180°
DC
α = 60°
Rectangular
waveform
Rectangular
waveform
60
60
40
40
120°
180°
0.8
DC
0° α 360°
0° α 360°
20
20
Conduction
Conduction
angle: α
angle: α
V
R
= 20 V
0.2
V
R
= 20 V
0.2
0
0.0
0
0.0
0.4
0.6
0.8
1.0
(A)
1.2
0.4
0.6
1.0
(A)
1.2
Average forward current
I
Average forward current
I
F (AV)
F (AV)
Tℓ max – I
r
– t
th (j-a)
F (AV)
10000
1000
160
140
120
100
80
(1) Device mounted on a ceramic board
Soldering land: 2.0 mm × 2.0 mm
(2) Device mounted on a glass-epoxy board
Soldering land: 6.0 mm × 6.0 mm
(3) Device mounted on a glass-epoxy board
Standard soldering pad
(3)
(2)
(1)
100
10
1
α = 60°
120°
180°
DC
Rectangular
waveform
60
40
0° α 360°
Conduction
angle: α
20
0
V
R
= 20 V
0.2
0.0
0.4
0.6
0.8
1.0
1.2
0.001
0.01
1
10
100
1000
0.1
Average forward current
I
(A)
Time
t (s)
F (AV)
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CUS03
Surge forward current (non-repetitive)
C – V
j
(typ.)
R
24
20
16
12
8
1000
100
10
Ta = 25°C
f = 50 Hz
Ta = 25°C
f = 1 MHz
4
0
1
10
100
1
10
100
Number of cycles
Reverse voltage
V
(V)
R
I
– T
(typ.)
P
– V
R
(typ.)
R
j
R (AV)
100
10
1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Rectangular
waveform
Pulse test
V
= 40 V
R
0° α 360°
DC
Conduction
30 V
angle: α
300°
T = 150°C
j
240°
20 V
0.1
0.01
180°
10 V
5 V
120°
60°
0.001
0.0001
0
20
40
60
80
100
120
(°C)
140
160
0
10
20
30
40
Junction temperature
T
j
Reverse voltage
V
(V)
R
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2004-09-07
CUS03
RESTRICTIONS ON PRODUCT USE
030619EAA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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2004-09-07
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