MP4304_07 [TOSHIBA]
High Power Switching Applications Hammer Drive, Pulse Motor Drive and Inductive Load Switching; 高功率开关应用锤驱动器，脉冲马达驱动器和感性负载开关
| 型号： | MP4304_07 |
| 厂家： | 
TOSHIBA |
| 描述： | High Power Switching Applications Hammer Drive, Pulse Motor Drive and Inductive Load Switching |
| 文件： | 总5页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MP4304
TOSHIBA Power Transistor Module Silicon NPN Epitaxial Type
(Four High Gain Power Transistors inOne)
MP4304
Industrial Applications
Unit: mm
High Power Switching Applications
Hammer Drive, Pulse Motor Drive and Inductive Load
Switching
•
•
Small package by full molding (SIP 12 pin)
High collector power dissipation (4-device operation)
: P = 4.4 W (Ta = 25°C)
T
•
•
High collector current: I
= 3 A (max)
C (DC)
High DC current gain: h
= 600 (min) (V
= 2 V, I = 1 A)
FE
CE C
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Collector-base voltage
Symbol
Rating
Unit
V
CBO
V
CEO
V
EBO
80
80
7
V
V
V
Collector-emitter voltage
Emitter-base voltage
DC
I
3
JEDEC
JEITA
―
―
C
Collector current
A
A
Pulse
I
5
CP
Continuous base current
I
0.5
B
TOSHIBA
2-32C1B
Collector power dissipation
(1-device operation)
P
2.2
4.4
W
Weight: 3.9 g (typ.)
C
Collector power dissipation
(4-device operation)
P
W
T
Junction temperature
T
150
°C
°C
j
Storage temperature range
T
stg
−55 to 150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
Array Configuration
2
3
4
9
10
11
1
6
5
8
12
7
1
2006-10-27
MP4304
Marking
Part No. (or abbreviation code)
Lot No.
MP4304
JAPAN
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
Thermal Characteristics
Characteristics
Symbol
Max
28.4
Unit
Thermal resistance from junction to
ambient
ΣR
th (j-a)
°C/W
(4-device operation, Ta = 25°C)
Maximum lead temperature for
soldering purposes
T
L
260
°C
(3.2 mm from case for 10 s)
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 80 V, I = 0 A
Min
Typ.
Max
Unit
Collector cut-off current
I
V
V
―
―
―
―
10
10
―
μA
μA
V
CBO
CB
EB
E
Emitter cut-off current
I
= 7 V, I = 0 A
C
EBO
Collector-base breakdown voltage
Collector-emitter breakdown voltage
V
V
I
I
= 1 mA, I = 0 A
80
80
600
150
―
―
(BR) CBO
(BR) CEO
C
C
E
= 10 mA, I = 0 A
―
―
V
B
h
h
V
V
= 2 V, I = 1 A
―
―
FE (1)
FE (2)
CE
CE
C
DC current gain
―
= 2 V, I = 2 A
―
―
C
Collector-emitter
Saturation voltage
V
I
I
= 1.5 A, I = 15 mA
0.25
―
0.5
1.2
―
CE (sat)
BE (sat)
C
C
B
V
Base-emitter
V
= 1.5 A, I = 15 mA
―
B
Transition frequency
f
V
V
= 2 V, I = 0.1 A
―
85
50
MHz
pF
T
CE
CB
C
Collector output capacitance
C
= 10 V, I = 0 A, f = 1 MHz
―
―
ob
E
Turn-on time
t
―
―
0.4
2.6
―
―
on
Output
I
I
B1
B2
Input
20 μs
Storage time
Fall time
t
stg
Switching time
μs
V
= 30 V
CC
t
f
―
1.3
―
I
= −I = 15 mA, duty cycle ≤ 1%
B2
B1
Flyback-Diode Rating and Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Maximum forward current
Reverse current
I
―
―
―
80
―
―
―
―
―
3
A
μA
V
FM
I
V
= 80 V
R
0.4
―
R
Reverse voltage
V
I
I
= 100 μA
R
R
F
Forward voltage
V
= 1 A
1.5
V
F
2
2006-10-27
MP4304
I
– V
I – V
C BE
C
CE
10
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
3
2.5
2
Common
emitter
Common emitter
= 1 V
20
V
CE
5
Ta = 25°C
2
1
1.5
1
−55
25
Ta = 100°C
I
= 0.5 mA
B
0.5
0
0
1
2
3
4
5
6
7
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Collector-emitter voltage
V
(V)
Base-emitter voltage
V
(V)
CE
BE
h
– I
V
– I
CE B
FE
C
3000
1000
0.5
0.4
0.3
0.2
0.1
0
Common emitter
Ta = 25°C
100
25
Ta = −55°C
300
100
I
= 3 A
C
2
1
Common emitter
V
= 1 V
CE
0.5
0.1
30
0.01
0.03
0.1
0.3
I
1
3
Collector current
(A)
0.3
1
3
10
30
100
300
1000
C
Base current
I
B
(mA)
V
– I
C
CE (sat)
V
– I
C
3
1
BE (sat)
10
Common emitter
/I = 100
Common emitter
/I = 100
I
C
B
5
3
I
C
B
0.5
0.3
1
Ta = −55°C
0.5
0.3
0.1
25
Ta = 100°C
100
0.05
0.03
25
−55
0.1
0.01
0.01
0.03
0.1
0.3 0.5
1
3
5
0.03
0.1
0.3 0.5
1
3
5
Collector current
I
C
(A)
Collector current
I
C
(A)
3
2006-10-27
MP4304
r
th
– t
w
Curves should be applied in thermal limited area. The figure
shows thermal resistance per device versus pulse width.
These curves are obtained by using single nonrepetitive
pulse under the condition of devices attached on a circuit
board with no heat sink.
(3)
(2)
(4)
(1)
100
10
1
(1) 1 device operation
(2) 2-device operation
(3) 3-device operation
(4) 4-device operation
Circuit board
100
0.001
0.01
0.1
1
10
1000
Pulse width
t
(s)
w
Safe Operating Area
P – Ta
T
8
6
4
2
0
30
10
Attached on a circuit board
(1) 1device operation
(2) 2-device operation
(3) 3-device operation
(4) 4-device operation
(4)
I
max (pulsed)*
C
5
3
(3)
Circuit board
100 μs*
1 ms*
(2)
(1)
10 ms*
1
0
40
80
120
160
200
Ambient temperature Ta (°C)
0.5
0.3
*: Single nonrepetitive
pulse Ta = 25°C
Curves must be derated
linearly with increase in
temperature.
0.1
ΔT – P
j
T
V
max
CEO
50
160
120
80
0.05
5
10
30
100
(V)
200
(2) (3)
Collector-emitter voltage
V
(1)
(4)
CE
Circuit board
Attached on a circuit board
(1) 1-device operation
(2) 2-device operation
(3) 3-device operation
(4) 4-device operation
40
0
0
2
4
6
8
10
Total power dissipation
P
T
(W)
4
2006-10-27
MP4304
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
5
2006-10-27
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