SSM3J02T [TOSHIBA]

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type; 东芝场效应晶体管的硅P沟道MOS型
SSM3J02T
型号: SSM3J02T
厂家: TOSHIBA    TOSHIBA
描述:

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type
东芝场效应晶体管的硅P沟道MOS型

晶体 小信号场效应晶体管 开关 光电二极管
文件: 总5页 (文件大小:141K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
                                                        
                                                        
SSM3J02T  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type  
SSM3J02T  
Power Management Switch  
High Speed Switching Applications  
Unit: mm  
·
·
·
Component package suitable for high-density mounting  
Small Package  
Low ON Resistance : R = 0.5 (max) (@V  
on  
= 4 V)  
GS  
: R = 0.7 (max) (@V  
on  
= 2.5 V)  
GS  
·
Low-voltage operation possible  
Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Drain-Source voltage  
Gate-Source voltage  
DC  
V
-30  
±10  
-1.5  
V
V
DS  
V
GSS  
I
D
Drain current  
A
I
DP  
(Note2)  
Pulse  
-3.0  
P
D
JEDEC  
JEITA  
Drain power dissipation (Ta = 25°C)  
1250  
mW  
(Note1)  
Channel temperature  
Storage temperature range  
T
T
150  
-55 to 150  
°C  
°C  
ch  
TOSHIBA  
2-3S1A  
stg  
Weight: 10 mg (typ.)  
Note1: Mounted on FR4 board  
(25.4 mm ´ 25.4 mm ´ 1.6 t, Cu pad: 645 mm2, t = 10 s)  
Note2: The pulse width limited by max channel temperature.  
Marking  
Equivalent Circuit  
3
3
D D  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment  
is protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other  
objects that come into direct contact with devices should be made of anti-static materials.  
1
2002-01-17  
                                                                     
                                                                     
SSM3J02T  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Gate leakage current  
Symbol  
Test Condition  
= ±10 V, V = 0  
Min  
Typ.  
Max  
Unit  
I
V
¾
-30  
¾
¾
¾
±1  
¾
mA  
V
GSS  
GS  
DS  
Drain-Source breakdown voltage  
Drain Cut-off current  
V
I
= -1 mA, V  
= 0  
GS  
(BR) DSS  
D
I
V
V
V
= -30 V, V = 0  
GS  
¾
-1  
-1.1  
¾
mA  
V
DSS  
DS  
DS  
DS  
Gate threshold voltage  
V
= -3 V, I = -0.1 mA  
-0.6  
0.6  
¾
¾
th  
D
Forward transfer admittance  
|Y |  
fs  
= -3 V, I = -0.3 A  
(Note3)  
(Note3)  
(Note3)  
¾
S
D
I
I
= -0.3 A, V  
= -4 V  
0.4  
0.55  
150  
21  
0.5  
0.7  
¾
D
D
GS  
GS  
Drain-Source ON resistance  
R
W
DS (ON)  
= -0.3 A, V  
= -2.5 V  
¾
Input capacitance  
C
V
V
V
= -10 V, V  
= -10 V, V  
= -10 V, V  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
¾
pF  
pF  
pF  
iss  
rss  
oss  
on  
DS  
DS  
DS  
GS  
GS  
GS  
Reverse transfer capacitance  
Output capacitance  
C
¾
¾
C
t
¾
61  
¾
Turn-on time  
Turn-off time  
¾
55  
¾
V
V
= -15 V, I = -0.3 A,  
D
DD  
GS  
Switching time  
ns  
= 0 to -2.5 V, R = 4.7 W  
G
t
¾
52  
¾
off  
Note3: Pulse test  
Switching Time Test Circuit  
(a) Test circuit  
0
10%  
90%  
(b) V  
(c) V  
IN  
GS  
0
V
OUT  
IN  
-2.5 V  
DS (ON)  
-2.5 V  
V
90%  
10%  
OUT  
10 ms  
IN  
V
DS  
V
V
DD  
V
DD  
t
t
f
r
V
R
= -15 V  
DD  
G
t
t
off  
on  
= 4.7 W  
<
D.U. 1%  
=
V
: t , t < 5 ns  
r f  
IN  
COMMON SOURCE  
Ta = 25°C  
Precaution  
V
can be expressed as voltage between gate and source when low operating current value is I = -100 mA  
D
th  
for this product. For normal switching operation, V  
requires higher voltage than V and V  
th  
GS (on)  
GS (off)  
requires lower voltage than V  
.
th  
(relationship can be established as follows: V  
< V < V  
)
GS (off)  
th GS (on)  
Please take this into consideration for using the device.  
V
GS  
recommended voltage of -2.5 V or higher to turn on this product.  
2
2002-01-17  
SSM3J02T  
I
– V  
I – V  
D GS  
D
DS  
-1.4  
-1.2  
-1  
-10000  
-1000  
-100  
-10  
Common Source  
Common Source  
Ta = 25°C  
-4.0 -2.5  
-2.2  
V
DS  
= -3 V  
-2.0  
Ta = 100°C  
-0.8  
-0.6  
-0.4  
-0.2  
0
25°C  
-1  
-1.8  
-1.6  
-25°C  
-0.1  
-0.01  
V
= -1.4 V  
GS  
-1.5  
(V)  
-0.001  
0
-0.5  
-1  
-2  
-1.2  
-4  
0
-0.5  
-1  
-1.5  
-2  
-2.5  
(V)  
-3  
Drain-source voltage  
V
D
Gate-source voltage  
V
GS  
DS  
R
– I  
R
Ta  
DS (ON)  
DS (ON)  
1.5  
1
1
0.8  
0.6  
0.4  
0.2  
0
Common Source  
Ta = 25°C  
Common Source  
I = -0.3 A  
D
V
GS  
= -2.5 V  
-4 V  
V
GS  
= -2.5 V  
0.5  
0
-4 V  
-50  
0
50  
100  
150  
0
-0.2  
-0.4  
-0.6  
-0.8  
(A)  
-1  
Drain current  
I
D
Ambient temperature Ta (°C)  
|Y | – I  
C – V  
DS  
fs  
D
1000  
10  
Common Source  
V
= -3 V  
DS  
Ta = 25°C  
3
1
300  
100  
C
iss  
C
oss  
0.3  
0.1  
30  
10  
C
rss  
Common Source  
= 0 V  
V
GS  
0.03  
0.01  
3
1
f = 1 MHz  
Ta = 25°C  
-0.001  
-0.01  
-0.1  
-1  
-0.1  
-1  
-10  
-100  
(V)  
-400  
Drain current  
I
D
(A)  
Drain-Source voltage  
V
DS  
3
2002-01-17  
SSM3J02T  
t – I  
P – Ta  
D
D
10000  
1.5  
1.25  
1
Common Source  
Mounted on FR4 board  
(25.4 mm ´ 25.4 mm ´ 1.6 t,  
Cu Pad: 645 mm2)  
V
V
= -15 V  
= 0 to -2.5 V  
= 4.7 W  
DD  
t = 10 s  
3000  
1000  
GS  
R
G
Ta = 25°C  
t
off  
t
f
300  
100  
0.75  
0.5  
0.25  
0
DC  
t
on  
30  
10  
t
r
-0.001  
-0.01  
-0.1  
-1  
-4  
0
25  
50  
75  
100  
125  
150  
Drain current  
I
D
(A)  
Ambient temperature Ta (°C)  
Safe operating area  
-10  
I
I
max (pulsed)*  
D
1 ms*  
max (continuous)  
D
10 ms*  
-1  
10 s  
DC operation  
Ta = 25°C  
-0.1  
Mounted on FR4 board  
(25.4 mm ´ 25.4 mm  
´ 1.6 t,  
-0.01  
Cu Pad: 645 mm2)  
*: Single nonrepetitive Pulse  
Ta = 25°C  
Curves must be derated  
linearly with increase in  
temperature.  
V
DSS  
max  
-0.001  
-0.1  
-1  
-10  
-100  
Drain-Source voltage  
V
(V)  
DS  
r
th  
– tw  
1000  
100  
10  
Single pulse  
Mounted on FR4 board  
(25.4 mm ´ 25.4 mm ´ 1.6 t,  
Cu Pad: 645 mm2)  
1
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse width tw (s)  
4
2002-01-17  
SSM3J02T  
RESTRICTIONS ON PRODUCT USE  
000707EAA  
· TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
· The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
· The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other  
rights of the third parties which may result from its use. No license is granted by implication or otherwise under  
any intellectual property or other rights of TOSHIBA CORPORATION or others.  
· The information contained herein is subject to change without notice.  
5
2002-01-17  

相关型号:

SSM3J05FU

Power Management Switch High Speed Switching Applications
TOSHIBA

SSM3J05FU(TE85L)

SSM3J05FU(TE85L)
TOSHIBA

SSM3J05FU(TE85L,F)

SSM3J05FU(TE85L,F)
TOSHIBA

SSM3J09FU

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type
TOSHIBA

SSM3J09FU(T5LPED,F

Small Signal Field-Effect Transistor, 0.2A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET
TOSHIBA

SSM3J09FU(T5LSAN,F

Small Signal Field-Effect Transistor, 0.2A I(D), 30V, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET
TOSHIBA

SSM3J09FU(TE85L,F)

TRANSISTOR,MOSFET,P-CHANNEL,30V V(BR)DSS,200MA I(D),SOT-323
TOSHIBA

SSM3J09FU,LF

Small Signal Field-Effect Transistor
TOSHIBA

SSM3J09FUTE85L

200mA, 30V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET
TOSHIBA

SSM3J108TU

Field Effect Transistor Silicon P-Channel MOS Type High Speed Switching Applications
TOSHIBA

SSM3J108TU(TE85L)

MOSFETs Vds=-20V Id=-1.8A 3Pin
TOSHIBA

SSM3J108TU(TE85L,F)

Small Signal Field-Effect Transistor
TOSHIBA