TA2152FLG [TOSHIBA]
Low Current Consumption Headphone Amplifier (for 1.5-V/3-V Use); 低电流消耗耳机放大器( 1.5 -V / 3 -V使用)型号: | TA2152FLG |
厂家: | TOSHIBA |
描述: | Low Current Consumption Headphone Amplifier (for 1.5-V/3-V Use) |
文件: | 总18页 (文件大小:302K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TA2152FLG
TOSHIBA Bipolar Linear IC Silicon Monolithic
TA2152FLG
Low Current Consumption Headphone Amplifier (for 1.5-V/3-V Use)
The TA2152FLG is a headphone amplifier of low current
consumption type developed for portable digital audio.
It is especially suitable for portable CD players, portable MD
players etc.
Features
•
Low current consumption
•
The power amplifier output stage can be driven using a
single battery.
Weight: 0.05 g (typ.)
Marking: 2152
As a result, overall current consumption is low.
•
•
Built-in center amplifier switch
For the output-coupling type, the consumption current has been decreased still further.
Current value (V = 2.4 V, V = 1.2 V, f = 1 kHz, R = 16 Ω, Ta = 25°C, typ.)
CC1 CC2
L
• Output-coupling type
•
•
•
No Signal: I
(V
) = 0.4 mA, I
CC1
(V ) = 0.3 mA
CC CC2
CC
0.1 mW × 2 ch: I
0.5 mW × 2 ch: I
(V
(V
) = 0.5 mA, I
) = 0.5 mA, I
(V
(V
) = 2.2 mA
CC2
) = 5.0 mA
CC2
CC
CC
CC1
CC
CC
CC1
• OCL type
•
•
•
No Signal: I
(V
) = 0.7 mA, I
CC1
(V ) = 0.7 mA
CC CC2
CC
0.1 mW × 2 ch: I
0.5 mW × 2 ch: I
(V ) = 0.7 mA, I
CC1
CC1
(V
(V
) = 4.5 mA
CC
CC
CC
CC
CC2
CC2
(V
) = 0.8 mA, I
) = 10.0 mA
•
Output power: P = 8 mW (typ.)
o
(V
CC1
= 2.4 V, V = 1.2 V, f = 1 kHz, R = 16 Ω, THD = 10%, Ta = 25°C)
CC2 L
•
•
•
•
•
•
Voltage gain: G = 11.5dB (typ.)
V
Built-in beep function
Built-in low-pass compensation (output-coupling type)
Built-in mute switch
Built-in power switch
Operating supply voltage range (Ta = 25°C)
V
V
= 1.8 V~4.5 V
= 0.9 V~4.5 V
CC1 (opr)
CC2 (opr)
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TA2152FLG
Block Diagram (of OCL Application)
V
CC1
V
CC1
ON
ON
OFF
PW
SW
OFF
MUTE
SW
BEEP
IN
BIAS
OUT
C-AMP
SW
GND
18
17
16
15
14
13
MUTE TC
RF IN
12
C-AMP SW
19 PW/MUTE SW
BEEP
BIAS
IN
V
CC1
V
CC1
20
21
11
BIAS
OUT
ADJ
10
IN
B
IN
NC
A
22
23
24
9
8
7
V
CC2
NC
V
CC2
PW
PW
PW
B
A
C
BEEP
OUT
BEEP
OUT
A
B
1
2
3
4
5
6
OUT
EQ
PW
GND
OUT
EQ
OUT
B
A
A
C
B
RL
RL
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2006-04-19
TA2152FLG
Pin Descriptions
Pin Voltage: Typical pin voltage for test circuit when no input signal is applied
(VCC1 = 2.4 V, VCC2 = 1.2 V, Ta = 25°C)
Pin
Pin
Voltage (V)
Function
Internal Circuit
No.
1
Name
OUT
A
C
B
23
1
V
CC2
Outputs from power amplifier
GND for power drive stage
0.6
4
6
OUT
OUT
3
PW GND
0
3
23
V
V
CC
for power drive stage
1.2
CC2
20 kΩ
2
5
EQ
EQ
A
B
Low-pass compensation pins
0.6
22
1
21
IN
B
Inputs to power amplifier
0.6
15 kΩ
43 kΩ
2
22
7
IN
A
V
CC2
BEEP OUT
B
Outputs for beep signal
⎯
24
24
14
BEEP OUT
GND
A
GND for everything other than
power drive stage
⎯
0
8
9
NC
NC
Not connected
⎯
⎯
DC output voltage adjustment
Either connect this pin or leave it
open depending on the level of
V
CC2
V
CC2
.
If the power supply of a 1.5 V
system is applied to V
connect this pin to BIAS IN
(pin11)
10
OUT ADJ
,
0.6
CC2
12
If the power supply of a 3 V
V
CC1
system is applied to V
this pin open.
, leave
CC2
10
11
20
15
11
12
15
BIAS IN
RF IN
Bias circuit input
Ripple filter input
Bias circuit output
0.6
1.1
0.6
BIAS OUT
V
for everything other than
CC
20
V
2.4
CC1
power drive stage
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TA2152FLG
Pin
Name
Pin
Voltage (V)
Function
Internal Circuit
No.
V
CC1
Center amplifier switch
C-Cup type: GND
OCL type: Open
13
13
C-AMP SW
⎯
to center amplifier
10 kΩ
Beep signal input
If the beep function is not used,
this pin is connected to GND.
16
16
BEEP IN
⎯
V
CC1
Mute switch
Mute OFF: L level
Mute ON: H level
Refer to application note (6)
62 kΩ
17
MUTE SW
⎯
17
V
CC1
100 kΩ
18
Power switch
IC ON: H level
IC OFF: L level
18
PW SW
⎯
Refer to application note (6)
V
CC1
19
Mute smoothing
19
MUTE TC
Reduces pop noises during
switching.
⎯
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TA2152FLG
Application Notes
(1) Beep function
In Power Mute Mode, the beep signal from the microcomputer or other controlling device is input on the
BEEP IN pin (pin 16). This signal is output as a current which flows to the load via the BEEP output pin (pin
7/24). The beep level is set to V = −50dBV (R = 16 Ω (typ.) ). For the beep signal timing, please refer to
o
L
Figure 1.
ON
OFF
ON
PW SW
MUTE SW
BEEP
OFF
OUT
100 ms
200 ms
100 ms
100 ms
10 ms
10 ms
100 ms
100 ms
OCL type
Output-coupling type
Figure 1 Timing chart for beep and output signals
(2) Low-cut compensation
For output-coupling type, the low-frequency range can be decreased using an output-coupling capacitor and a
load (f = 45 Hz at C = 220 µF, R = 16 Ω). However, since the capacitor is connected between the IC’s output pin
c
(pin 1/6) and EQ pin (pin 2/5), the low-frequency gain of the power amplifier increases, enabling low-cut
compensation to be performed. For the response of capacitors of different values, please refer to
Figure 2.
RES − f
4
2
0.18 µF
0
0.22 µF
−2
−4
−6
−8
0.33 µF
0.47 µF
0.68 µF
No compensation
20
50
100 200
500 1 k
f (Hz)
2 k
Frequency
Figure 2 Capacitor response
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TA2152FLG
(3) Adjustment of DC output voltage
Please perform the OUT ADJ pin (pin 10) as follows by the power supply of V
and V .
CC2
CC1
•
If a boost voltage is applied to V
, V
CC1 CC2
is connected to a battery and the difference between V
and
CC1
V
CC2
is greater than or equal to 0.7 V, short pins 10 and 11 together. In this case the DC output voltage
V
CC2
2
will be
.
•
If the difference between V
CC1
and V
is less than 0.7 V, or if V
and V are connected to the same
CC2
CC2
CC1
power supply, leave pin 10 open.
V
− 0.7 V
2
CC2
In these cases the DC output voltage will be
.
However, when the voltage level of V
is high, the DC output voltage is will be set to approximately 1.4 V.
CC2
(4) RF IN pin
The ripple rejection ratio can by improved by connecting a capacitor to this pin. Connection of a capacitor is
recommended, particularly for output-coupling type.
RR − C (RF IN)
30
Output-coupling type
40
50
60
70
V
V
= 2.4 V
CC1
CC2
= 1.2 V (ripple signal applied)
f
r
= 100 Hz
80
V
r
= −20dBV
BIAS IN = 4.7 µF
Open 0.1
RF IN capacitance
0.2
0.5
1
2
5
10
C
(µF)
Figure 3 Improvement of ripple rejection ratio
(5) Output application of power amplifier
For output-coupling type the center amplifier is not used with the result that current consumption is low.
Please set the C-AMP SW pin (pin 13) accordingly.
Output-coupling type: Pin 13 is connected to GND.
OCL type: Pin 13 is open.
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TA2152FLG
(6) Switching pins
(a) PW SW
The device is ON when this pin is set to High. To prevent the IC being turned ON by external noise, it is
necessary to connect an external pull-down resistor to the PW SW pin. The pin is highly sensitive.
(b) MUTE SW
If the MUTE SW pin is fixed to High, current will flow through the pin, even when the PW SW pin is in
OFF Mode. To prevent the IC being turned ON by external noise, it is necessary to connect an external
pull-down resistor.
The pop noise heard when the MUTE SW switch is turned ON or OFF can be reduced by connecting an
external capacitor to the MUTE TC pin.
(c) Switch sensitivity (Ta = 25°C)
PW SW
MUTE SW
5
4
3
2
1
0
5
4
3
2
1
0
4.5 V
4.5 V
H
H
1.5 V
0.3 V
1.0 V
0.3 V
L
L
0
1
2
3
4
5
0
1
2
3
4
5
Supply voltage
V
(V)
Supply voltage
V
(V)
CC1
CC1
PW SW
IC ON
MUTE SW
Mute ON
Mute OFF
H level
L level
H level
L level
IC OFF
Figure 4 Switch sensitivity
(7) Miscellaneous
The following capacitors must have excellent temperature and frequency characteristics.
•
•
•
•
•
Capacitor between V
Capacitor between V
Capacitor between BIAS IN (pin 11) and GND (pin 14)
Capacitor between BIAS OUT (pin 15) and GND (pin 14)
Capacitor between RF IN (pin 12) and GND (pin 14)
(pin 20) and GND (pin 14)
(pin 23) and PW GND (pin 3)
CC1
CC2
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TA2152FLG
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Supply voltage 1
Symbol
Rating
Unit
V
V
V
4.5
4.5
CC1
CC2
Supply voltage 2
Output current
I
100
mA
mW
°C
o (peak)
Power dissipation
Operating temperature
Storage temperature
P
(Note)
350
D
T
opr
−25~75
−55~150
T
stg
°C
Note: Derated by 2.8 mW/°C above Ta = 25°C
Electrical Characteristics
(Unless otherwise specified VCC1 = 2.4 V, VCC2 = 1.2 V, Rg = 600 Ω, R = 16 Ω,
L
f = 1 kHz, Ta = 25°C, SW1: a, SW2: b, SW3: a)
Characteristic
Symbol
Test conditions
Min
Typ.
Max
Unit
I
I
I
I
I
I
I
I
I
IC OFF (V
IC OFF (V
), SW1: b
), SW1: b
⎯
⎯
0.1
0.1
400
650
170
85
5
5
CCQ1
CCQ2
CCQ3
CCQ4
CCQ5
CCQ6
CCQ7
CCQ8
CCQ9
CC1
CC2
OCL, Mute ON (V
OCL, Mute ON (V
), SW2: a
), SW2: a
⎯
600
1400
250
170
1.1
1.5
0.6
0.6
⎯
CC1
CC2
µA
⎯
C-Cup, Mute ON (V
C-Cup, Mute ON (V
), SW2: a
), SW2: a
⎯
CC1
CC2
Quiescent supply current
⎯
OCL, no signal (V
OCL, no signal (V
)
)
⎯
0.7
0.7
0.4
0.3
0.8
10.0
0.5
5.0
11.5
0
CC1
CC2
⎯
mA
C-Cup, no signal (V
C-Cup, no signal (V
)
)
⎯
CC1
CC2
I
⎯
CCQ10
I
I
I
I
OCL, 0.5 mW × 2 ch (V
OCL, 0.5 mW × 2 ch (V
)
)
⎯
CC1
CC2
CC3
CC4
CC1
CC2
⎯
⎯
Power supply current during
drive
mA
dB
C-Cup, 0.5 mW × 2 ch (V
C-Cup, 0.5 mW × 2 ch (V
)
)
⎯
⎯
CC1
CC2
⎯
⎯
Voltage gain
G
V
o
V
o
= −22 dBV
= −22 dBV
9.5
−1.5
5
13.5
+1.5
⎯
V
Channel balance
Output power
CB
P
THD = 10%
= 1 mW
8
mW
%
o
Total harmonic distortion
Output noise voltage
Cross talk
THD
P
⎯
0.1
−100
−35
1.0
−96
⎯
o
V
Rg = 600 Ω, Filter: IHF-A, SW3: b
= −22 dBV
⎯
dBV
no
CT
V
−25
o
Inflow to V
f = 100 Hz, V = −20 dBV
r
, SW3: b
CC1
Ripple rejection ratio 1
Ripple rejection ratio 2
RR1
−65
−85
−85
⎯
⎯
r
dB
Inflow to V
, SW3: b
CC2
RR2
ATT
−100
f = 100 Hz, V = −20 dBV
r
r
Muting attenuation
V
o
= −12 dBV
−100
−115
−50
⎯
⎯
−45
⎯
Beep sound output voltage
PW SW ON current
PW SW OFF voltage
Mute SW ON current
Mute SW OFF voltage
V
V
V
V
V
V
= 2 V
−55
5
dBV
µA
V
BEEP (OUT)
I18
BEEP (IN)
p-p
= 1.8 V, V
= 1.8 V, V
= 1.8 V, V
= 1.8 V, V
= 0.9 V
= 0.9 V
= 0.9 V
= 0.9 V
CC1
CC1
CC1
CC1
CC2
CC2
CC2
CC2
V18
I17
0
⎯
0.3
⎯
5
⎯
µA
V
V17
0
⎯
0.3
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2006-04-19
TA2152FLG
Test Circuit
V
CC1
V
CC1
(a) SW1 (a) SW2
(b) (b)
18
17
16
BEEP
IN
15
14
GND C-AMP SW
RF IN 12
13
PW SW
MUTE
SW
BIAS
OUT
0.47 µF
19 MUTE TC
4.7 µF
V
20 V
BIAS IN 11
OUT ADJ 10
NC 9
CC1
CC1
600 Ω
(b)
(a)
10 µF
21 IN
B
SW3b
BIAS
OUT
Rg = 600 Ω
T A 2 1 5 2 F L G
600 Ω
(b)
10 µF
22 IN
A
(a)
SW3a
Rg = 600 Ω
V
CC2
23 V
NC 8
CC2
24 BEEP OUT
BEEP OUT
7
A
B
PW
OUT
A
EQ
2
OUT
4
EQ
5
OUT
B
GND
3
A
C
B
1
6
RL
RL
16 Ω
16 Ω
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2006-04-19
TA2152FLG
Characteristic Curves (unless otherwise specified, VCC1 = 2.4 V, VCC2 = 1.2 V, R = 600 Ω,
g
R = 16 Ω, f = 1 kHz, Ta = 25°C)
L
I
– VCC2
I
– VCC1
CCQ
CCQ
1.5
1.5
1.5 V application
= 1.2 V
1.5 V application
= 2.4 V
V
V
CC2
CC1
OCL: V
CC2
current
1
1
OCL: V
CC1
current
OCL: V
CC1
current
OCL: V
CC2
current
0.5
0.5
C-Cup: V
CC1
current
C-Cup: V
CC1
current
C-Cup: V
current
C-Cup: V
CC2
current
CC2
0
0
0
1
1.5
2
2.5
0
1
2
3
4
5
Supply voltage of power drive stage
V
(V)
Supply voltage
V
(V)
CC2
CC1
I
– V
V – VCC2
O (DC)
CCQ
CC
1.5
1
1.5
OCL
Pin 10, 11: Short
1.5 V application
1
0.5
0
Pin 10, 11: Open
3 V application
C-Cup
0.5
0
3 V application
= V
V
CC1
CC2
I
(V
+ V )
CC2
CCQ CC1
0
1
2
3
4
5
0
1
2
3
4
5
Supply voltage
V (V)
CC
Supply voltage of power drive stage
V
(V)
CC2
I
– P
I
– P
CC
CC
o
o
100
100
OCL mode
f = 1 kHz
C-Cup mode
f = 1 kHz
Dual input
Dual input
V
CC2
10
10
V
CC2
1
1
V
CC1
V
CC1
0.1
0.01
0.1
0.01
0.1
1
10
(mW)
100
0.1
1
10
(mW)
100
Output power
P
Output power
P
o
o
10
2006-04-19
TA2152FLG
P
o
– VCC2
P – V
o CC
100
50
30
20
3 V application
= V
V
CC1
f = 1 kHz
= 16 Ω
CC2
R
L
30
20
10
5
10
5
1.5 V application
= 2.4 V
V
CC1
3
2
f = 1 kHz
3
2
R
= 16 Ω
L
0
1
1.5
2
2.5
0
1
2
3
4
5
Supply voltage of power drive stage
V
(V)
Supply voltage
V
CC
(V)
CC2
THD – V
THD – V
o
o
100
10
100
10
1.5 V application
3 V application
V
V
= 2.4 V
= 1.2 V
V
CC1
= V
CC2
= 2.4 V
CC1
R
= 16 Ω
CC2
L
R
= 16 Ω
L
1
0.1
1
0.1
f = 10 kHz
f = 100 Hz
f = 10 kHz
f = 100 Hz
f = 1 kHz
f = 1 kHz
0.01
0.01
−60
−50
−40
−30
−20
(dBV)
−10
0
−60
−50
−40
−30
−20
(dBV)
−10
0
Output voltage
V
Output voltage
V
o
o
V
no
– VCC2
V – V
no CC
−90
−90
−100
−110
−120
OCL
OCL
−100
−110
−120
C-Cup
C-Cup
1.5 V application
= 2.4 V
3 V application
V
V
= V
CC1
CC1
CC2
R = 600 Ω
g
R
= 600 Ω
g
Filter: IHF-A
Filter: IHF-A
0
1
2
3
4
5
0
1
1.5
2
2.5
Supply voltage of power drive stage
V
(V)
Supply voltage
V
CC
(V)
CC2
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TA2152FLG
CT – VCC2
CT – V
CC
1.5 V application
= 2.4 V
3 V application
V = V
CC1
0
−20
−40
−60
0
−20
−40
−60
V
CC1
CC2
f = 1 kHz
f = 1 kHz
OCL
OCL
C-Cup
1.5
C-Cup
0
1
2
2.5
0
1
2
3
4
5
Supply voltage of power drive stage
V
(V)
Supply voltage
V
CC
(V)
CC2
RR – V
RR – V
CC
CC2
1.5 V application
= 100 Hz
3 V application
f
r
−40
−60
−40
−60
f
r
= 100 Hz
V
r
= −20 dBV
V
r
= −20 dBV
RR1: Inflow to V
CC1
CC2
V
CC1
= V
CC2
RR2: Inflow to V
RR2 (C-Cup)
C-Cup
−80
−80
RR1 (OCL)
RR1 (C-Cup)
OCL
3
−100
−100
RR2 (OCL)
1.5
0
1
2
2.5
0
1
2
4
5
Supply voltage of power drive stage
V
(V)
Supply voltage
V
CC
(V)
CC2
V
– V
BEEP (IN)
BEEP (OUT)
0
f = 400 Hz (rectangle wave)
−10
−20
−30
R
= 16 Ω
L
−40
−50
−60
−70
−80
−90
−100
0.1
0.3
0.5
1
3
5
10
Beep input voltage
V
(V
)
p-p
BEEP (IN)
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2006-04-19
TA2152FLG
I
− Ta
G , Po, THD – Ta
V
CCQ
V
V
= 2.4 V
= 1.2 V
CC1
0.8
0.6
0.4
0.2
0
0.8
0.6
0.4
0.2
0
CC2
15
10
5
OCL: V
CC2
current
OCL: V
CC1
current
G
V
C-Cup: V
CC1
current
Po
C-Cup: V
CC2
current
V
V
= 2.4 V
= 1.2 V
THD
CC1
CC2
0
−20
0
20
40
60
80
80
80
−20
0
20
40
60
80
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
CT – Ta
V
, V
− Ta
no BEEP (OUT)
V
V
= 2.4 V
= 1.2 V
V
= 2.4 V
CC1
CC1
−40
−60
0
−20
−40
−60
−80
V
CC2
= 1.2 V
CC2
V
BEEP (OUT)
OCL
−80
V
no
(OCL)
C-Cup
−100
−120
V
no
(C-Cup)
−20
0
20
40
60
−20
0
20
40
60
80
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
RR – Ta
ATT – Ta
−20
−40
−60
−80
V
= 2.4 V
= 1.2 V
CC1
CC2
V
CC1
= 2.4 V
V
V
CC2
= 1.2 V
f
= 100 Hz
r
V
= −20 dBV
r
RR1: Inflow to V
CC1
CC2
RR2: Inflow to V
−60
−100
−120
−140
RR2 (C-Cup)
OCL
−80
RR1 (OCL)
C-Cup
RR1 (C-Cup)
RR2 (OCL)
−100
−20
0
20
40
60
−20
0
20
40
60
80
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
13
2006-04-19
TA2152FLG
Application Circuit1 (1.5 V Output Coupling Type)
V
CC1
V
CC1
ON
ON
OFF
PW
SW
OFF
MUTE
SW
BEEP
IN
BIAS
OUT
C-AMP
SW
GND
18
17
16
15
14
13
MUTE TC
RF IN
2.2 µF
C-AMP SW
19 PW/MUTE SW
BEEP
12
0.47 µF
BIAS
IN
11
V
CC1
4.7 µF
20
21
BIAS
OUT
ADJ
10
3 V application
: Open
IN
B
1 µF
1 µF
IN
NC
A
22
23
24
9
8
7
V
CC2
NC
PW
PW
PW
B
A
C
BEEP
OUT
BEEP
OUT
A
B
1
2
3
4
5
6
OUT
EQ
PW
OUT
EQ
OUT
B
A
A
C
B
GND
0.22 µF
0.22 µF
RL
RL
14
2006-04-19
TA2152FLG
Application Circuit2 (1.5 V OCL Type)
V
CC1
V
CC1
ON
ON
OFF
PW
SW
OFF
MUTE
SW
BEEP
IN
BIAS
OUT
C-AMP
SW
GND
18
17
16
15
14
13
MUTE TC
RF IN
12
C-AMP SW
19 PW/MUTE SW
BEEP
0.47 µF
BIAS
IN
11
V
CC1
4.7 µF
20
21
BIAS
OUT
ADJ
10
3 V application
: Open
IN
B
1 µF
1 µF
IN
NC
A
22
23
24
9
8
7
V
CC2
NC
PW
PW
PW
B
A
C
BEEP
OUT
BEEP
OUT
A
B
1
2
3
4
5
6
OUT
EQ
PW
OUT
EQ
OUT
B
A
A
C
B
GND
RL
RL
15
2006-04-19
TA2152FLG
Markings
Markings (example)
*1
*1
9
0
*2
*1 Product name: 2152
*2 Weekly code: 9 0 1 K A
Toshiba internal
management code
Weekly code
Orientation marking
*2
Year (last digit only)
Precautions when using QON
Package outline
(Upper surface)
(lower surface)
Please take into account the following points regarding the QON package
(1)
(2)
Do not attempt to strengthen the device mechanically by performing soldering on the island sections
at the four corners of the package (the sections illustrated by diagonal lines) on the diagram of the
lower surface.
This island sections on the package surfaces (the sections illustrated by diagonal lines on the upper
and lower surface diagrams) must be electrically insulated.
*1:
Ensure that the island sections on the lower surface (as indicated by the diagonal lines on the
diagram) do not come into contact with solder from via holes in the board.
•
When mounting or soldering, take care to ensure that neither static electricity nor electrical
overstress is applied to the IC (by taking measures to prevent antistatic, leaks etc.).
•
When incorporating the device into an item of equipment employ a set design which does not
result in voltage being applied directly to the island section.
16
2006-04-19
TA2152FLG
Package Dimensions
Weight: 0.05 g (typ.)
17
2006-04-19
TA2152FLG
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
18
2006-04-19
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