TB2924AFG [TOSHIBA]
IC 21 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36, 0.65 MM PITCH, PLASTIC, HSOP-36, Audio/Video Amplifier;
| 型号： | TB2924AFG |
| 厂家： | 
TOSHIBA |
| 描述： | IC 21 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO36, 0.65 MM PITCH, PLASTIC, HSOP-36, Audio/Video Amplifier 放大器 信息通信管理 光电二极管 商用集成电路 |
| 文件： | 总16页 (文件大小：375K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB2924AFG
TOSHIBA Bi-CMOS Digital Integrated Circuit Silicon Monolithic
TB2924AFG
Class D, 20 W × 2-channel (BTL) Low-Frequency Power Amplifier IC
The TB2924AFG is an audio output IC that employs the highly
efficient class D method, developed for TV and home audio
applications.
The TB2924AFG eliminates the need for heatsink(Note), thus
allowing the design of an end product with a small footprint. It
also incorporates a range of features, such as standby and muting,
as well as different protective circuits.
Features
Weight: 0.85 g (typ.)
•
Output: P
= 13 W × 2ch (typ.) BTL
OUT
V
P
V
P
V
P
V
= 12 V, R = 4 Ω, THD = 10%, f = 1 kHz
L
CC
= 7.5 W × 2ch (typ.) BTL
OUT
= 12 V, R = 8 Ω, THD = 10%, f = 1 kHz
CC
L
= 19.5 W × 2ch (typ.) BTL
OUT
= 15 V, R = 4 Ω, THD = 10%, f = 1 kHz
CC
L
= 21 W × 2ch (typ.) BTL
OUT
= 20 V, R = 8 Ω, THD = 10%, f = 1 kHz
CC
L
•
•
•
•
•
•
•
•
•
High efficiency: When output is 10 W η = 88% (V
Distortion: 0.1% (1 W output, f = 1 kHz)
Gain: 34dB (typ.)
= 15 V, R = 8 Ω)
CC L
Small flat package: HSOP36-P-450-0.65
Muting/standby features
Thermal AGC features
Master and slave oscillation frequencies
Oscillation frequency: f = 200 kHz (typ.)
sw
Operating supply voltage range (4 Ω): V
(opr) = 11 V to 18 V (T
= 0°C to 75°C),
CC
opr
V
CC
(opr) = 11.4 V to 18 V (T
= −20°C to 75°C)
opr
•
•
Operating supply voltage range (8 Ω): V
(opr) = 11 V to 20 V (T
(opr) = 11.4 V to 20 V (T
= 0°C to 75°C),
CC
opr
V
CC
= −20°C to 75°C)
opr
Protective circuits: thermal shutdown, short-circuit protection (load)
These protection functions are intended to avoid some output short circuits or other abnormal conditions
temporarily.
These protect functions do not warrant to prevent the IC from being damaged.
In case of the product would be operated with exceeded guaranteed operating ranges, these protection features
may not operate and some output short circuits may result in the IC being damaged.
The TB2924AFG does not contain protection circuitry for shorts against V
and ground. Extra cares, such as
CC
incerting fuses, should be exercised when output pins serve as line output or adjacent pins are shorted together
on the board.
Note: Generally, the average power of the audio signal constitutes only one-fifth to one-tenth of the maximum output
power, and in practice, will not exceed the permissible loss. However, care should be exercised so that it will
not be really exceeded, considering the board’s thermal resistance, ambient temperature, average output
power and so forth. Toshiba has verified that the TB2924AFG works properly without a heatsink on the
Toshiba PC board for up to 10-watt by 2-channel output typical (V
with a sine-wave input.
= 15 V, R = 8 Ω, THD = 10%, f = 1 kHz)
L
CC
•
•
This product are sensitive to electrostatic discharge. When handling this product, protect the environment to avoid
electrostatic discharge.(MM: ±200 V OK, HBM: ±1500 V OK)
Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the product or
equipment.
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2007-01-26
TB2924AFG
Pin Assignment and Block Diagram
Pre
FEEDFEED OSC OSC
BOOT OUT PW OUT
NC 2 (+) 2 (+) GND2 2 (−) NC NC 2 (−) V
BOOT PW
Pre OSC
GND2 SW IN2 2 (−) 2 (+) OUT IN
V
CC
NC
CC2
36 35 34 33 32 31 30 29 28
27 26 25 24 23 22 21 20 19
AGC
V
CC
/2
V
V
/2
/2
CC
AGC
AGC
CC
V
CC
/2
AGC
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16 17 18
Pre Rip/F NC IN1 FEED FEED STBYMUTE V /2
V
BOOT OUT NC PW OUT NC BOOT PW
1 (+) 1 (+)
REG
CC
GND1 1 (−)
1 (−) V
GND1
1 (−) 1 (+)
CC1
*: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purpose.
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2007-01-26
TB2924AFG
Pin Functions
Pin No.
1
Symbol
Description
V
Reference supply voltage
CH1 bootstrap pin (+)
REG
2
BOOT1 (+)
OUT1 (+)
NC
3
CH1 main amplifier output pin (+)
4
No-connection pin (not connected inside the IC)
GND for CH1 main amplifier output stage
CH1 main amplifier output pin (−)
No-connection pin (not connected inside the IC)
CH1 bootstrap pin (−)
5
PW GND1
OUT1 (−)
NC
6
7
8
BOOT1 (−)
9
PW V
Power supply pin for CH1 main amplifier output stage
Signal GND
CC1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
Pre-GND1
Rip/F
Ripple filter pin
NC
No-connection pin (not connected inside the IC)
CH1 main amplifier input pin
IN1
FEED1 (−)
FEED1 (+)
STBY
CH1 main amplifier feedback pin (−)
CH1 main amplifier feedback pin (+)
Standby control pin
MUTE
Muting control pin
V
/2
CC
Midpoint potential pin
NC
Pre V
No-connection pin (not connected inside the IC)
Signal power supply pin
CC
OSC IN
OSC OUT
FEED2 (+)
FEED2 (−)
IN2
PWM oscillation frequency input pin
PWM oscillation frequency output pin
CH2 main amplifier feedback pin (+)
CH2 main amplifier feedback pin (−)
CH2 main amplifier input pin
OSC SW
Pre-GND2
Oscillator on/off switch pin
Signal GND
PW V
Power supply pin for CH2 main amplifier output stage
CH2 bootstrap pin (−)
CC2
BOOT2 (−)
NC
No-connection pin (not connected inside the IC)
No-connection pin (not connected inside the IC)
CH2 main amplifier output pin (−)
GND for CH2 main amplifier output stage
CH2 main amplifier output pin (+)
CH2 bootstrap pin (+)
NC
OUT2 (−)
PW GND2
OUT2 (+)
BOOT2 (+)
NC
No-connection pin (not connected inside the IC)
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2007-01-26
TB2924AFG
Supplementary Explanation
<Control switches>
1. Pin 17 (muting switch)
•
•
Enable or disable audio muting.
The input amplifier is switched to a dummy amplifier within the IC, so that the audio output is
muted with the amplifier still operating (PWM switched operation with 50% duty ratio).
•
•
Pin 17 outputs a voltage of approximately 2.4 V (approx. 4 V ) when open, while V
switch is lower than 1.8 V. Leaving the pin open, therefore, disables muting.
for the built-in
TH
F
Logic
“H” or open: Demute
“L” (GND): Mute on
2. Pin 16 (standby switch)
•
When the voltage on pin 16 becomes 1.8 V or higher, the bias circuit activates, enabling the IC to
operate.
•
Logic
“H”: IC active
“L” (GND): IC standby on
<Others>
3. Thermal AGC Function and Thermal Shutdown Circuit
•
If the chip temperature exceeds the junction temperature (150°C min.), the thermal AGC function
attenuates the input signal to maintain the chip temperature below the junction temperature.
•
If the chip temperature further increases, the thermal shutdown circuit activates. The chip recovers
from the thermal shutdown state once the chip temperature falls below the junction temperature.
4. Master and Slave Oscillation Frequencies (OSC IN, OSC OUT, OSC SW)
•
When configuring a multichannel amplifier system with three or more channels, the oscillation
frequency for a single IC can be used as a master and supplied to other ICs to prevent a beat due to a
difference among switching frequencies.(Max.6ch (3ICs))
•
The oscillators for slave ICs should be turned off using the OSC SW pin.
“H”: Turn the oscillator on
“L” (GND): Turn the oscillator off
(Example with multiple ICs)
Pre
V
CC
V
/2
CC
Pre
GND
Open
22
26
22
21
26
21
OSC SW OSC OUT OSC IN
OSC SW OSC OUT OSC IN
Master IC
Slave IC
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2007-01-26
TB2924AFG
5. Reduction of Pop Noise Generated when Turning on and Off the Power Supply
•
To reduce pop noise, it is recommended to enable muting by setting pin 17 (mute switch) to logic low
before turning on or off the power supply or standby mode.
When turning on or off the standby mode (When the power supply is not turned on or off)
Mute Pin
Standby Pin
Turn on or off the standby mode after turning on muting.
When the power supply is off
Mute Pin
Standby Pin
Power Supply Pin
Turn off the power supply after turning on muting.
Don’t turn off the standby mode before turning off the power supply.
When the power supply is on
Mute Pin
Standby Pin
Turn on the power supply after turning on muting.
Timing charts may be simplified for explanatory purpose.
6. Board Mounting Consideration
The switching of the TB2924AFG is controlled with a rectangular-wave signal of approximately
200 kHz (typical). It is recommended to place the TB2924AFG far from the tuner portion, etc. that might
be affected.
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2007-01-26
TB2924AFG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Power supply
Symbol
Rating
Unit
V
23
V
A
CC
Output current
I
8
o(peak)
Power dissipation
Operating temperature
Storage temperature
P
14.7 (Note)
−20 to 75
−55 to 150
W
°C
°C
D
T
opr
T
stg
Note: When the IC is used at 25°C or higher with infinite heat sink, reduce 117.6 mW per 1°C.
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not
be exceeded during operation, even for an instant.
If any of these rating would be exceeded during operation, the device electrical characteristics may be irreparably
altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, these operations with exceeded ratings may cause break down, damage and/or degradation to any
other equipment.
Applications using the device should be designed such that each absolute maximum rating will never be exceeded
in any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this documents.
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2007-01-26
TB2924AFG
Electrical Characteristics 1
(unless otherwise specified, V = 15 V, f = 1 kHz, R = 600 Ω, R = 8 Ω, Ta = 25°C)
CC
g
L
Test
Circuit
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
Quiescent supply current
I
1
1
1
Vin = 0
THD = 10%
= 18 V, THD = 10%
⎯
9
55
10.5
15
70
⎯
⎯
CCQ
P
P
(1)
(2)
OUT
OUT
V
12.5
CC
= 4 Ω, V
R
= 12 V,
Output power
Efficiency
W
L
CC
P
P
(3)
(4)
1
1
11.5
18
13
⎯
⎯
OUT
OUT
THD = 10%
R
= 4 Ω, V
= 15 V,
L
CC
19.5
THD = 10%
η (1)
η (2)
THD
1
1
1
1
1
1
P
P
P
V
V
= 10 W
80
63
88
66
0.1
34
0
⎯
⎯
OUT
OUT
OUT
OUT
OUT
%
= 1.0 W
= 1 W
Total harmonics distortion
Voltage gain
⎯
0.3
35.5
1.0
⎯
%
G
V
= 0.775 Vrms
= 0.775 Vrms
⎯
32.5
−1.0
⎯
dB
dB
kΩ
Channel balance
Input impedance
CB
R
30
IN
R
= 10 kΩ,
g
Crosstalk
C.T.
1
1
−56
−65
⎯
dB
V
= 0.775 Vrms
OUT
R
g
= 10 kΩ,
Output noise voltage
V
⎯
0.2
0.3
mVrms
NO
B.W. = DIN AUDIO
Switching frequency
f
1
1
1
1
1
1
⎯
During standby
⎯
160
⎯
200
0.2
0.3
−78
⎯
300
0.34
⎯
kHz
mA
Ω
sw
Standby supply current
Power transistor ON resistance
Mute attenuation level
I
STB
R
⎯
DS-ON
ATT
0dB = V
= 0.775 Vrms
OUT
−71
1.8
⎯
dB
MUTE
MUTE off
MUTE on
V
V
Not muted
Muted
V
CC
Control voltage for pin 17 muting
switch
V
V
V
GND
⎯
0.9
Amplifier operating
(not standby)
V
1
1.8
⎯
V
STB off
CC
Control voltage for pin 16 standby
switch
V
1
1
1
Amplifier stopped (standby on)
Oscillator operating
GND
1.8
⎯
⎯
⎯
1.1
STB on
OSC on
OSC off
V
V
V
CC
Control voltage for pin 26 oscillator
on/off switch
Oscillator stopped
GND
0.5
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2007-01-26
TB2924AFG
Test Circuit Diagram 1
GND
V
CC
Test
point
2200 µF
330 µF
C7
1 µF
C8
330 µF
*
*
LPF
LPF
IN2
C13
OUT2
R
L
8 Ω
OUT2
1 µF
(+)
(−)
C14
Out C
C1
Out C
C2
560 pF R1
C3 150
R2 560 pF
150
C4
0.1 µF
C5
36 35 34 33 32 31 30 29 28
NC BOOT OUT PW OUT NC NC BOOT PW
Heat sink
27 26 25 24 23 22 21 20 19
Pre OSC IN2 FEED FEED OSC OSC Pre NC
2 (+) 2 (+) GND2 2 (−)
2 (−) V
GND2 SW
2 (−) 2 (+) OUT IN
V
CC
CC2
BOOT OUT
PW OUT1
BOOT PW
Pre
FEED FEED
V
REG
1 (+) 1 (+) NC GND1 (−)
NC 1 (−) V
GND1 Rip/F NC IN1 1 (−) 1 (+) STBYMUTEV /2
CC1
CC
1
2
3
4
5
6
7
8
9
Heat sink
10 11 12 13 14 15 16 17 18
C16
C21
C24
0.1 µF
0.1 µF
4.7 µF
560 pF R3 R4 560 pF
C17 150
150 C18
Out C
C19
Out C
C20
OUT1
R
L
8 Ω
OUT1
(+)
(−)
1 µF
C22
330 µF
C23
IN1
*
*
LPF
LPF
Test
point
*: Output L (4 Ω): 10 µH (A7502BY-100M: TOKO, INC.)
*: Output C (4 Ω): 1.0 µF
*: Output L (8 Ω): 18 µH (A7502BY-180M: TOKO, INC.)
*: Output C (8 Ω): 0.47 µF
*: Components in the test circuits are only used to obtain and confirm the device characteristics. These components
and circuits do not warrant to prevent the application equipment from malfunction or failure.
*: In addition to the low-pass filters (chebyshev LPFs) shown above, a fourth low-pass filter with a cut-off frequency
of 30 kHz is used for device characterization.
8
2007-01-26
TB2924AFG
Example Application Circuit
GND
V
CC
1 µF
1000 µF
1 µF
OUT2
(+)
R
8 Ω
OUT2
(−)
L
IN2
Out C
Out C
0.1 µF
36 35 34 33 32 31 30 29 28
NC BOOT OUT PW OUT NC NC BOOT PW
Heat sink
27 26 25 24 23 22 21 20 19
Pre OSC IN2 FEED FEED OSC OSC Pre NC
2 (+) 2 (+) GND2 2 (−)
2 (−) V
GND2 SW
2 (−) 2 (+) OUT IN
V
CC2
CC
BOOT OUT
PW OUT1
BOOT PW
Pre
FEED FEED
V
REG
1 (+) 1 (+) NC GND1 (−)
NC 1 (−) V
GND1 Rip/F NC IN1 1 (−) 1 (+) STBYMUTEV /2
CC1
CC
1
2
3
4
5
6
7
8
9
Heat sink
10 11 12 13 14 15 16 17 18
0.1 µF
0.1 µF
4.7 µF
Out C
Out C
OUT1
(+)
OUT1
(−)
R
L
8 Ω
1 µF
IN1
*: Output L (4 Ω ): 10 µH (A7502BY-100M, A7503AY-100M, #953AS-100M: TOKO, INC.)
*: Output C (4 Ω): 1.0 µF
*: Output L (8 Ω): 18 µH (A7502BY-180M, A7503AY-180M, #953AS-180M: TOKO, INC.)
*: Output C (8 Ω): 0.47 µF
*: The application circuits shown in this document are provided for reference purposes only. Especially, thorough
evaluation is required on the phase of mass production design.
Toshiba dose not grant the use of any industrial property rights with these examples of application circuits.
*: When no signal is present, the power supply current varies with the characteristics of the output inductance
(Out L).
*: For all capacitors that are not indicated by the electrolytic capacitor symbol, use ceramic capacitors with an
appropriate withstand voltage.
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2007-01-26
TB2924AFG
Toshiba’s PC Board Layout (Mounting side)
(Back side)
10
2007-01-26
TB2924AFG
DATAs for Reference (Typ.)
THD – P
_f
THD – P
_V
OUT CC
OUT
50
30
50
30
V
= 15 V
f = 1 kHz
= 8 Ω
CC
= 8 Ω
R
L
R
L
100: to 30 k
1 k: 400 to 30 k
10k: 400 to
1 k: 400 to 30 k
10
10
+30 kHz LPF
5
3
5
3
+30 kHz LPF
OUT2_10 k
OUT1_10 k
1
1
OUT1_12 V
0.5
0.3
0.5
0.3
OUT1_15 V
OUT2_15 V
OUT2_1 k
OUT1_1 k
0.1
0.1
0.05
0.03
0.05
0.03
OUT2_100
OUT1_100
OUT2_12 V
0.3
0.01
0.01 0.03
0.01
0.01 0.03
0.1
0.3
1
3
10
30
100
0.1
1
3
10
30
100
P
OUT
(W)
P
OUT
(W)
THD – f
P
_V
OUT CC
50
30
25
20
15
10
5
f = 1 kHz
= 8 Ω
V
= 15 V
CC
R
L
R
= 8 Ω
L
THD = 10%
P
= 1 W
OUT
10
Analyzer filter:
400 Hz to 30 kHz
Output: 30 k LPF
Filtr: to 30 k (f = 20~800)
400 to 30 k (f = 1 k to 2 k)
400 to 80 k (f = 4 k to 6 k)
400 to (f = 8 k to 40 k)
+30 kHz LPF
5
3
OUT1
1
0.5
0.3
OUT2
OUT2
0.1
0.05
0.03
OUT1
0
0
0.01
10
5
10
15
20
100
1000
10000
100000
f
(Hz)
V
CC
(V)
η – P
P – P
D OUT
OUT
100
80
5
4
3
2
1
0
V
= 15 V
CC
f = 1 kHz
R
= 8 Ω
L
60
40
20
0
V
= 15 V
CC
f = 1 kHz
R
= 8 Ω
L
0
2
4
6
8
10
12
14
16
0
2
4
6
8
10
12
P
OUT
(W)
P
OUT
(W)
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2007-01-26
TB2924AFG
G
V
– f
I
– V
CCQ CC
40
35
30
25
20
15
10
5
140
120
100
80
R
= 8 Ω
L
OUT1
V
= 0 V
IN
L = 18 µH
OUT2
60
40
V
R
V
= 15 V
= 8 Ω
CC
L
20
= 0.775 Vrms
OUT
Output: 30 k LPF
0
10
0
0
100
1000
10000
100000
5
10
15
20
25
30
f
(Hz)
V
CC
(V)
I
– V
ATT – V
MUTE MUTE
STBY
STB
60
50
40
30
20
10
0
20
0
V
= 15 V
f = 1 k
CC
R
= 8 Ω
R = 8 Ω
L
L
V
= 0 V
V
V
= 1 Vrms
IN
OUT
= 15 V
CC
−20
−40
−60
−80
−100
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
0.5
1.0
1.5
2.0
V
STB
(V)
V
MUTE
(V)
C.T. – f
C.T. – R
g
0
−20
−40
−60
−80
0
−10
−20
−30
−40
−50
−60
−70
−80
f = 1 k
V
= 15 V
CC
R
V
= 8 Ω
L
= 0.775 Vrms
= 15 V
R
= 8 Ω
rip
L
V
CC
R
= 10 kΩ
g
V
= 0.775 Vrms
OUT
OUT1 → OUT2
OUT2 → OUT1
OUT1 → OUT2
OUT2 → OUT1
10
100
1000
10000
100000
10
100
1000
10000
f
(Hz)
R
g
(Ω)
12
2007-01-26
TB2924AFG
V
– V
V
– R
g
NO
CC
NO
0.5
0.4
0.3
0.2
0.1
0
1
0.8
0.6
0.4
0.2
0
R
R
= 8 Ω
R = 8 Ω
L
L
= 10 kΩ
V
V
= 15 V
CC
= 0 V
IN
g
V
= 0 V
IN
Filt: DIN_AUDIO
Filt: DIN_AUDIO
OUT1
OUT2
OUT1
OUT2
0
5
10
15
20
10
100
1000
10000
V
CC
(V)
R
g
(Ω)
R.R. – f ripp
R.R. – R
g
0
−10
−20
−30
−40
−50
−60
0
−10
−20
−30
−40
−50
−60
R
R
= 620 Ω
= 8 Ω
= 0.775 Vrms
= 15 V
g
L
R
R
V
= 620 Ω
= 8 Ω
g
L
V
V
rip
CC
= 0.775 Vrms
= 15 V
rip
V
CC
OUT2
OUT2
OUT1
OUT1
10
100
1000
10000
10
100
1000
10000
100000
f ripp (Hz)
R
g
(Ω)
P
– Ta
D
16
14
12
10
8
(1) Infinite heat sink
(2) No heat sink
(when mounted on
Toshiba’s PC Board)
6
4
2
0
0
25
50
75
100
125
150
Ambient temperature Ta (°C)
13
2007-01-26
TB2924AFG
Package Dimensions
Weight: 0.85 g (typ.)
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2007-01-26
TB2924AFG
Strong Electrical and Magnetic Fields
Devices exposed to strong magnetic fields can undergo a polarization phenomenon in their plastic material, or
within the chip, which gives rise to abnormal symptoms such as impedance changes or increased leakage current.
Failures have been reported in LSIs mounted near malfunctioning deflection yokes in TV sets. In such cases the
device’s installation location must be changed or the device must be shielded against the electrical or magnetic field.
Shielding against magnetism is especially necessary for devices used in an alternating magnetic field because of
the electromotive forces generated in this type of environment.
• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over
current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum
ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In
addition, depending on the method of use and usage conditions, if over current continues to flow for a long time
after operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit
to not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC
chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of
silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and
heat sink installation, refer to individual technical datasheets or IC databooks.
15
2007-01-26
TB2924AFG
RESTRICTIONS ON PRODUCT USE
060925EBF
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
• This product generates heat during normal operation. However, substandard performance or malfunction may
cause the product and its peripherals to reach abnormally high temperatures.
The product is often the final stage (the external output stage) of a circuit. Substandard performance or
malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the
product. 030619_R
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
16
2007-01-26
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