TB6590FTG [TOSHIBA]
IC BRUSH DC MOTOR CONTROLLER, 0.5 A, PQCC16, 3 X 3 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, VQON-16, Motion Control Electronics;
| 型号： | TB6590FTG |
| 厂家： | 
TOSHIBA |
| 描述： | IC BRUSH DC MOTOR CONTROLLER, 0.5 A, PQCC16, 3 X 3 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, VQON-16, Motion Control Electronics 电动机控制 信息通信管理 |
| 文件： | 总10页 (文件大小：190K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB6590FTG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB6590FTG
Dual DC Motor Driver
The TB6590FTG is a dual DC motor driver IC using LDMOS
output transistors with low ON-resistance.
Four operation modes are selectable via IN1 and IN2: forward,
reverse, short brake and stop.
Features
•
•
•
Power supply voltage: V = 6 V (max)
M
Output current: I
= 0.5 A (max)
OUT
Output ON-resistance: 2.5 Ω
Weight: 0.01 g (typ.)
(upper and lower sum (typ.) @V ≥ 5 V)
M
•
•
•
•
•
Dedicated standby (power-save) pin
Forward, reverse, short brake and stop
Thermal shutdown (TSD) and undervoltage lockout (UVLO) circuits
Small surface-mount package (VQON16: 0.5-mm lead pitch)
Lead(Pb)-free solderable
*: This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure
that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an
ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels.
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TB6590FTG
Block Diagram
V
15
13 GND
10 VM1
UVLO
CC
STBY 14
AIN1 12
AIN2 11
Standby
Control
logic
A
9
7
8
AO1
H-Bridge
A
AO2
PGND1
TSD
2
6
4
5
3
VM2
BO1
BO2
PGND2
NC
BIN1 16
Control
logic
A
H-Bridge
A
BIN2
1
Pin Functions
Pin No.
1
Symbol
Function
Remarks
• TTL compatible
• Internal pull-down resistor of 200 kΩ
V = 2.2 to 5.5 V
BIN2
Channel-B input 2
2
3
VM2
NC
Motor power supply 2
No connect
M
4
BO2
Channel-B output 2
Power ground 2
5
PGND2
BO1
6
Channel-B output 1
Channel-A output 2
Power ground 1
7
AO2
8
PGND1
AO1
9
Channel-A output 1
Motor power supply 1
Channel-A input 2
Channel-A input 1
Small signal ground
Standby control input
10
11
12
13
14
15
VM1
V
= 2.2 to 5.5 V
M
AIN2
AIN1
GND
STBY
• TTL compatible
• Internal pull-down resistor of 200 kΩ
L = standby; internal pull-down resistor of 200 kΩ
V
V
power supply pin
V
(opr.) = 2.7 to 5.5 V
CC
CC
CC
• TTL compatible
16
BIN1
Channel-B input 1
• Internal pull-down resistor of 200 kΩ
2
2008-04-24
TB6590FTG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
V
Remarks
V
6
6
M
Supply voltage
V
CC
Input voltage
V
−0.2 to 6
6
V
V
AIN1, AIN2, BIN1, BIN2 and STBY pins
AO1, AO2, BO1 and BO2 pins
IN
Output voltage
V
OUT
OUT
Output current
I
0.5
A
Power dissipation
Operating temperature
Storage temperature
P
0.275
−20 to 85
−55 to 150
W
°C
°C
(Note)
D
T
opr
T
stg
Note: The rated power dissipation should be derated by 2.2 mW/°C above 25°C ambient.
Operating Ranges (Ta = −20 to 85°C)
Characteristics
Symbol
Min
Typ.
Max
Unit
V
2.7
2.2
⎯
3
5
5.5
5.5
0.4
200
V
V
CC
Supply voltage
V
M
Output current
I
⎯
⎯
A
OUT
PWM frequency
f
⎯
kHz
PWM
3
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TB6590FTG
Function Table for H-Bridge Control
Input
IN2
Output
OUT1
Function Mode
Short brake
IN1
H
STBY
H
OUT2
L
H
L
L
H
L
H
H
L
H
L
CCW
CW
H
H
OFF
L
L
H
L
Stop
(high impedance)
OFF
H/L
H/L
Standby
(high impedance)
Functional Description of H-Bridge Driver
To eliminate shoot-through current, a dead time (t2, t4) is inserted when the PWM is turned on and off.
V
V
V
M
M
M
OUT1
M
OUT2
OUT1
M
OUT2
OUT1
M
OUT2
GND
GND
GND
<ON>
t1
<OFF>
t2
<Short break>
t3
V
V
M
M
OUT1
M
OUT2
OUT1
M
OUT2
GND
GND
<OFF>
t4
<ON>
t5
V
M
t1
t5
OUT1
Output voltage waveform
t3
GND
t2
t4
4
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TB6590FTG
Electrical Characteristics (unless otherwise specified, Ta = 25°C, V = 3 V, V = 5 V)
CC
M
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
I
STBY = V
⎯
⎯
⎯
0.3
⎯
0.6
10
1
CC
CC
Supply current
I
CC (STB)
STBY = 0 V
μA
V
I
⎯
M (STB)
V
+
CC
0.2
V
2
⎯
IH
Control input voltage
Control input current
Standby input voltage
V
−0.2
5
⎯
15
⎯
0.8
25
1
IL
I
V
V
= 3 V
= 0 V
IH
IN
IN
μA
V
I
⎯
IL
V
+
CC
0.2
V
2
⎯
IH (STB)
V
−0.2
5
⎯
15
0.8
25
1
IL (STB)
I
V
V
= 3 V
= 0 V
IH (STB)
IN
IN
Standby input current
Output saturation voltage
Output leakage current
μA
V
I
⎯
⎯
⎯
−1
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
IL (STB)
V
I
= 0.2 A
O
0.5
⎯
0.7
1
sat (U + L)
I
V
V
= V
= 6 V
L (U)
M
M
OUT
μA
I
= 6 V, V
= 0 V
OUT
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
L (L)
V
0.9
0.9
2.2
2.4
170
20
F (U)
I = 0.4 A
F
Forward voltage of a regenerative
diode
V
(Design target only)
V
F (L)
Undervoltage lockout trip threshold
Undervoltage lockout recovery
Thermal shutdown threshold
Thermal shutdown hysteresis
UVLD
UVLC
TSD
V
V
(Design target only)
°C
°C
(Design target only)
ΔTSD
t
10
r
t
10
f
R = 100 Ω
L
Output transistor switching
characteristics
ns
ns
(Design target only)
t
t
50
PLH
PHL
50
Dead time for shoot-through
prevention
tdead
(Design target only)
⎯
100
⎯
5
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TB6590FTG
Application Circuit Example
V
GND
CC
15
14
13
UVLO
STBY
AIN1
AIN2
Standby
VM1
10
9
12
11
AO1
Control
logic
A
H-Bridge
A
M
AO2
7
PGND1
8
MCU
TSD
VM2
2
6
4
5
3
BIN1
BIN2
16
1
BO1
Control
logic
A
H-Bridge
A
M
BO2
PGND2
NC
Note 1: Bypass capacitors (C1, C2, C3 and C4) should be placed as close as possible to the IC.
Note 2: Excessive power might be introduced into the IC in case of a short-circuit between power supply and ground,
an output short-circuit to power supply, an output short-circuit to ground or a short-circuit across the load. If
any of these events occur, the device may be degraded or permanently damaged.
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TB6590FTG
Package Dimensions
Note: The burr size as viewed from the top should not exceed 0.15 mm (max) per side.
Weight: 0.01 g (typ.)
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TB6590FTG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
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TB6590FTG
Points to Remember on Handling of ICs
(1) Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(2) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(3) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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TB6590FTG
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
070122EBA_R6
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third
parties. 070122_C
• Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and
regulations. 060819_AF
• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
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