TB7102AF(TE85L,F) [TOSHIBA]
IC SWITCHING REGULATOR, 1150 kHz SWITCHING FREQ-MAX, PDSO8, 3 X 3 MM, 0.65 MM PITCH, PLASTIC, SON-8, Switching Regulator or Controller;
| 型号： | TB7102AF(TE85L,F) |
| 厂家： | 
TOSHIBA |
| 描述： | IC SWITCHING REGULATOR, 1150 kHz SWITCHING FREQ-MAX, PDSO8, 3 X 3 MM, 0.65 MM PITCH, PLASTIC, SON-8, Switching Regulator or Controller CD 开关 光电二极管 |
| 文件： | 总17页 (文件大小：275K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB7102AF
Toshiba BiCD Integrated Circuit Silicon Monolithic
TB7102AF
Buck DC-DC Converter IC
The TB7102AF is a single-chip buck DC-DC converter IC. The
TB7102AF contains high-speed and low-on-resistance power
MOSFETs for the main switch and synchronous rectifier to
achieve high efficiency.
Features
•
Enables up to 1 A of load current (I ) with a minimum of
OUT
external components.
•
High efficiency (η = 95% typ.)
Weight: 0.017 g (typ.)
(@V = 5 V, V
= 3.3 V and I
= 300 mA)
IN
OUT
OUT
•
•
•
•
•
•
•
Operating voltage (V ) range: 2.7 V to 5.5 V
IN
A high 1-MHz oscillation frequency (typ.) allows the use of small external components.
Uses internal phase compensation to achieve high efficiency with a minimum of external components.
Allows the use of a small surface-mount ceramic capacitor as an output filter capacitor.
Enable threshold voltage : V
= 1.5 V, V
= 0.5 V(@V = 5 V)
IL(EN) IN
IH(EN)
Housed in a small surface-mount package (PS-8) with low thermal resistance.
Undervoltage lockout (UVLO), thermal shutdown (TSD) and overcurrent protection (OCP)
Part Marking
Pin Assignment
Part Number (Abbrev.)
Lot No.
L
V
N.C.
6
N.C.
5
X
FB
8
7
7 1 0 2A
*
1
2
3
4
The dot (•) on the top surface indicates pin 1.
PGND
V
EN SGND
IN
*: The lot number consists of three digits. The first digit represents the last digit of the year of manufacture, and the
following two digits indicates the week of manufacture between 01 and either 52 or 53.
Manufacturing week code
(The first week of the year is 01; the last week is 52 or 53.)
Manufacturing year code (last digit of the year of manufacture)
This product has a MOS structure and is sensitive to electrostatic discharge. Handle with care.
The product(s) in this document (“Product”) contain functions intended to protect the Product from temporary
small overloads such as minor short-term overcurrent, or overheating. The protective functions do not necessarily
protect Product under all circumstances. When incorporating Product into your system, please design the system (1)
to avoid such overloads upon the Product, and (2) to shut down or otherwise relieve the Product of such overload
conditions immediately upon occurrence. For details, please refer to the notes appearing below in this document and
other documents referenced in this document.
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2009-10-26
TB7102AF
Ordering Information
Part Number
Shipping
Embossed tape (3000 units per reel)
TB7102AF (TE85L, F)
Block Diagram
V
IN
Undervoltage
lockout & soft-start
EN
reference voltage
Current detection
Driver
Oscillator
L
X
Control logic
PWM comparator
Slope
compensation
Driver
PGND
Phase
compensation
Error amplifier
0.8 V (typ.)
Thermal
shutdown
V
COMP
V
FB
SGND
Pin Description
Pin No.
Symbol
PGND
Description
1
2
Ground for the output section
Input pin
V
IN
This pin is placed in the standby state if V
= low. Standby current is 1 μA or less.
EN
Enable pin
3
EN
When EN ≥ 1.5 V (@V = 5 V), the control logic is allowed to operate and thus enable the switching
IN
operation of the output section.
Ground for the control logic
No-connect
4
5
6
SGND
N.C.
N.C.
No-connect
Feedback pin
7
8
V
FB
This input is fed into an internal error amplifier with a reference voltage of 0.8 V (typ.).
Switch pin
L
X
This output is connected to the high-side P-channel MOSFETs and low-side N-channel MOSFET.
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2009-10-26
TB7102AF
Timing Diagram
Normal Operation
OSC
0
I
OUT
OUT
0
0
V
V
COMP
0
0
I
L
V
LX
T
ON
OSC:
Internal oscillator output signal
T
I
:
Converter output current
Converter output voltage
Output voltage of error amplifier
Inductor current
OUT
V
V
:
OUT
:
COMP
I :
L
V
:
Switch pin voltage
LX
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2009-10-26
TB7102AF
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Input voltage
Enable pin voltage
−V voltage difference
V
−0.3 to 6
−0.3 to 6
V
V
IN
V
EN
V
V
− V
V − V < 0.3
EN IN
V
EN IN
EN
V
IN
Feedback pin voltage
Switch pin voltage
Switch pin current
Power dissipation
−0.3 to 6
−0.3 to 6
±1.3
V
FB
LX
LX
V
V
I
A
(Note 1)
P
0.7
W
°C
°C
°C
D
Operating junction temperature
T
−40 to 125
150
jopr
Junction temperature
Storage temperature
(Note 2)
T
j
T
stg
−55 to 150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc)
Thermal Resistance Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance, junction to ambient
R
th (j-a)
178.6 (Note 1)
°C/W
Note 1:
Glass epoxy board
Material: FR-4
25.4 × 25.4 × 0.8
(Unit: mm)
Note 2: The TB7102AF may go into thermal shutdown at the rated maximum junction temperature. Thermal design is
required to ensure that the rated maximum operating junction temperature, T , will not be exceeded.
jopr
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2009-10-26
TB7102AF
Electrical Characteristics (unless otherwise specified: T = 25°C and V = 2.7 to 5.5 V)
j
IN
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Operating input voltage
V
⎯
2.7
⎯
⎯
0.68
0.55
⎯
5.5
0.9
0.69
1
V
mA
mA
μA
μA
V
IN (OPR)
I
I
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= 5 V, V = 5 V, V = 5 V
EN FB
IN1
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
IN
Operating current
Standby current
= 2.7 V, V = 2.7 V, V = 2.7 V
EN FB
⎯
IN2
I
I
= 5 V, V = 0 V, V = 0 V
EN FB
⎯
IN (STBY) 1
IN (STBY) 2
= 2.7 V, V = 0 V, V = 0 V
EN FB
⎯
⎯
1
V
V
= 5 V
1.5
1.5
⎯
⎯
⎯
IH (EN) 1
IH (EN) 2
= 2.7 V
= 5 V
⎯
⎯
V
EN threshold voltage
EN input current
V
V
⎯
0.5
0.5
12.4
6.7
0.824
0.824
1
V
IL (EN) 1
IL (EN) 2
IH (EN) 1
IH (EN) 2
= 2.7 V
⎯
⎯
V
I
I
= 5 V, V = 5 V
EN
7.6
4.1
0.776
⎯
μA
μA
V
= 2.7 V, V = 2.7 V
EN
⎯
V
V
= 5 V, V = 5 V, I
EN OUT
= 10 mA
0.8
0.8
⎯
FB1
FB2
FB1
FB2
V
V
input voltage
input current
FB
FB
= 2.7 V, V = 2.7 V, I
EN OUT
= 10 mA 0.776
V
I
I
= 5 V, V = 5 V
EN
−1
−1
μA
μA
Ω
= 2.7 V, V = 2.7 V
EN
⎯
1
R
R
R
= 5 V, V = 5 V, I = −0.5 A
EN LX
⎯
⎯
0.27
0.36
0.27
0.36
⎯
⎯
DS (ON) (H) 1
DS (ON) (H) 2
DS (ON) (L) 1
High-side switch on-state resistance
Low-side switch on-state resistance
= 2.7 V, V = 2.7 V, I = −0.5 A
EN LX
⎯
Ω
= 5 V, V = 5 V, I = 0.5 A
EN LX
⎯
⎯
Ω
R
= 2.7 V, V = 2.7 V, I = 0.5 A
EN LX
⎯
⎯
Ω
DS (ON) (L) 2
High-side switch leakage current
Low-side switch leakage current
I
= 5 V, V = 0 V, V = 0 V
EN LX
⎯
−1
μA
μA
MHz
MHz
ms
ms
LEAK (H)
I
= 5 V, V = 0 V, V = 5 V
EN LX
⎯
⎯
1
LEAK (L)
f
f
= 5 V, V = 5 V
EN
0.85
0.85
1
1
1.15
1.15
⎯
osc1
osc2
Oscillation frequency
= 2.7 V, V = 2.7 V
EN
1
t
t
= 5 V, V = 5 V, I
= 0 A
= 0 A
OUT
2
ss1
EN OUT
Soft-start time
Detection
= 2.7 V, V = 2.7 V, I
1.3
2.4
⎯
ss2
EN
T
SD
V
= 5 V
= 5 V
⎯
160
⎯
°C
IN
Thermal
shutdown (TSD)
temperature
Hysteresis
ΔT
SD
V
V
V
V
V
⎯
2.2
2.3
⎯
20
2.4
2.5
0.1
2.8
⎯
2.6
2.7
⎯
°C
V
IN
IN
IN
IN
IN
Detection votage
Recovery voltage
Hysteresis
V
= V
= V
= V
UV
EN
EN
EN
Undervoltage
lockout (UVLO)
V
V
UVR
ΔV
V
UV
L
X
current limit
I
= 5 V
1.3
⎯
A
LIM
Note on Electrical Characteristics
The test condition T = 25°C means a state where any drifts in electrical characteristics incurred by an increase in
j
the chip’s junction temperature can be ignored during pulse testing.
5
2009-10-26
TB7102AF
Application Circuit Example
V
IN
EN
V
IN
V
FB
TB7102AF
L
L
X
V
OUT
SGND
PGND
GND
GND
Figure 1 TB7102AF Application Circuit Example
Component values (@V = 5 V, V
= 3.3 V, Ta = 25°C)
IN
OUT
These values are presented only as a guide.
C
IN
:
Input filter capacitor = 10 μF
(ceramic capacitor: GRM21BB30J106K from Murata Manufacturing Co., Ltd.)
C : Output filter capacitor = 10 μF
OUT
(ceramic capacitor: GRM21BB30J106K from Murata Manufacturing Co., Ltd.)
R
R
: Output voltage setting resistor = 7.5 kΩ
: Output voltage setting resistor = 2.4 kΩ
FB1
FB2
L:
Inductor = 3.3 μH (NP04SB3R3N from Taiyo Yuden Co., Ltd.)
Component values (@V = 5 V, V
= 1.2 V, Ta = 25°C)
IN
OUT
These values are presented only as a guide.
C
IN
:
Input filter capacitor = 10 μF
(ceramic capacitor: GRM21BB30J106K from Murata Manufacturing Co., Ltd.)
C : Output filter capacitor = 22 μF
OUT
(ceramic capacitor: GRM31CB30J226K from Murata Manufacturing Co., Ltd.)
R
R
: Output voltage setting resistance = 1.2 kΩ
: Output voltage setting resistance = 2.4 kΩ
FB1
FB2
L:
Inductor = 3.3 μH (NP04SB3R3N from Taiyo Yuden Co., Ltd.)
Component values need to be adjusted, depending on the TB7102AF’s input/output conditions and the board layout.
Application Notes
Inductor Selection
The inductance required for inductor L can be calculated as follows:
V
V
:
Input voltage (V)
Output voltage (V)
Oscillation frequency = 1 MHz (typ.)
Inductor ripple current (A)
IN
V
− V
V
V
IN
:
IN
f
OUT OUT
OUT
:
L =
⋅
········· (1)
⋅ ΔI
f
osc
osc
L
ΔI :
L
*: Generally, ΔI should be set to approximately 30% of the maximum output current. Since the maximum output
L
current of the TB7102AF is 1 A, ΔI should be 0.3 A or so. Therefore, the inductor should have a current rating
L
greater than the peak output current of 1.15 A. If the inductor current rating is exceeded, the inductor becomes
saturated, leading to an unstable DC-DC converter operation.
When V = 5 V and VOUT = 3.3 V, the required inductance can be calculated as follows. Be sure to select an
IN
appropriate inductor, taking the V range into account.
IN
6
2009-10-26
TB7102AF
V
− V
V
V
IN
IN
f
OUT OUT
L =
⋅
I
L
⋅ ΔI
osc
L
5 V − 3.3 V
1 MHz⋅300 mA 5 V
3.3 V
0
=
⋅
······ (2)
V
OUT
1
T
= Τ ⋅
T =
ON
V
f
IN
osc
= 3.7 μH
Figure 2 Inductor Current Waveform
Setting the Output Voltage
A resistive voltage divider is connected as shown in Figure 3 to set the output voltage; it is given by Equation 3
based on the reference voltage of the error amplifier, which is connected to the Feedback pin, V . RFB1 should
FB
be up to 10 kΩ or so, because an extremely large value RFB1 incurs a delay due to parasitic capacitance at the
V
FB
pin. If the difference between the input and output voltages is small, the output voltage may drop,
depending on the load current conditions. For optimal operation, output voltage should be set to 0.8 V (typ.) at
the minimum and to (V −1) V at the maximum. It is recommended that resistors with a precision of ±1% or
IN
higher be used for R
and R
.
FB1
FB2
L
V
OUT
⎛
⎞
⎟
⎟
⎠
R
R
X
FB1
⎜
V
= V ⋅ 1+
OUT
FB
⎜
FB2
⎝
FB
⎛
⎜
⎝
⎞
R
R
FB1
⎜
⎟
⎟
⎠
= 0.8 V × 1+
······ (3)
FB2
Figure 3 Output Voltage Setting Resistors
Output Capacitor Selection
Use a ceramic capacitor as the output filter capacitor. Since a ceramic capacitor is generally sensitive to
temperature, choose one with excellent temperature characteristics (such as the JIS B characteristic). As a rule
of thumb, its capacitance should be 10 μF or greater for applications where V
≥ 2.0 V, and 20 μF or greater
OUT
for applications where V
< 2.0 V. The capacitance should be set to an optimal value that meets the system's
OUT
ripple voltage requirement and transient load response characteristics. Since the ceramic capacitor has a very
low ESR value, it helps reduce the output ripple voltage; however, because the ceramic capacitor provides less
phase margin, it should be thoroughly evaluated.
Component Values (@V = 5 V, Ta = 25°C)
IN
These values are presented only as a guide.
The following values may need tuning depending on the TB7102AF’s input/output conditions and the board
layout.
Output Voltage
Inductance
Input Capacitance Output Capacitance Feedback Resistor Feedback Resistor
Setting
V
L
C
IN
C
OUT
R
FB1
R
FB2
OUT
1.2 V
1.5 V
1.8 V
2.5 V
3.3 V
3.3 μH
3.3 μH
3.3 μH
3.3 μH
3.3 μH
10 μF
10 μF
10 μF
10 μF
10 μF
22 μF
22 μF
22 μF
10 μF
10 μF
1.2 kΩ
2.1 kΩ
3.0 kΩ
5.1 kΩ
7.5 kΩ
2.4 kΩ
2.4 kΩ
2.4 kΩ
2.4 kΩ
2.4 kΩ
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2009-10-26
TB7102AF
Undervoltage Lockout (UVLO)
The TB7102AF has undervoltage lockout (UVLO) protection circuitry. The TB7102AF does not provide output
voltage (V ) until the input voltage has reached V (2.5 V typ.). UVLO has hysteresis of 0.1 V (typ.). After
OUT
UVR
the switch turns on, if V drops below V
(2.4 V typ.), UVLO shuts off the switch at V
.
IN
UV
OUT
Undervoltage lockout
recovery voltage: V
UVR
Undervoltage lockout
detection voltage: V
UV
V
IN
Hysteresis: ΔVUV
GND
Switching operation starts
V
OUT
GND
Switching operation stops
Soft start
Figure 4 Undervoltage Lockout Operation
Thermal Shutdown (TSD)
The TB7102AF provides thermal shutdown. When the junction temperature continues to rise and reaches T
SD
(160°C typ.), the TB7102AF goes into thermal shutdown and shuts off the power supply. TSD has a hysteresis of
about 20°C. The device is enabled again when the junction temperature has dropped by approximately 20°C from
the TSD trip point. The device resumes the power supply when the soft-start circuit is used upon recovery from
the TSD state .
Thermal shutdown is intended to protect the device against abnormal system conditions. It should be ensured
that the TSD circuit will not be activated during normal operation of the system.
TSD Detection threshold: T
SD
Recovery from TSD
Hysteresis: ΔT
SD
T
j
0
Switching operation starts
Soft start
V
OUT
GND
Switching operation stops
Figure 5 Thermal Shutdown Operation
8
2009-10-26
TB7102AF
Usage Precautions
•
The input voltage, output voltage, output current and temperature conditions should be considered when
selecting capacitors, inductors and resistors. These components should be evaluated on an actual system
prototype for best selection.
•
•
•
•
External components such as capacitors, inductor and resistors should be placed as close to the TB7102AF as
possible.
The TB7102AF has an ESD diode between the EN and V pins. The voltage between these pins should satisfy
IN
V
EN
− V < 0.3 V.
IN
Operation might become unstable due to board layout. In that case, add a decoupling capacitor (C ) of 0.1 μF to
C
1μF between the SGND and V pins.
IN
The overcurrent protection circuits in the Product are designed to temporarily protect Product from minor
overcurrent of brief duration. When the overcurrent protective function in the Product activates, immediately
cease application of overcurrent to Product. Improper usage of Product, such as application of current to Product
exceeding the absolute maximum ratings, could cause the overcurrent protection circuit not to operate properly
and/or damage Product permanently even before the protection circuit starts to operate.
•
The thermal shutdown circuits in the Product are designed to temporarily protect Product from minor
overheating of brief duration. When the overheating protective function in the Product activates, immediately
correct the overheating situation. Improper usage of Product, such as the application of heat to Product
exceeding the absolute maximum ratings, could cause the overheating protection circuit not to operate properly
and/or damage Product permanently even before the protection circuit starts to operate.
9
2009-10-26
TB7102AF
Typical Performance Characteristics
I
– V
IN
I
– T
j
IN
IN
0.8
1.0
0.8
0.6
0.4
0.2
0
V
V
V
= 2.7 V
IN
= 2.7 V
EN
FB
= V
IN
0.6
0.4
0.2
0
V
= V
= V
FB IN
EN
T = 25°C
j
0
2
4
6
-50
-25
0
25
50
75
100
125
Input voltage,
V
IN
(V)
Junction temperature,
T
(°C)
j
I
– T
j
V
, V – T
IH(EN) IL(EN) j
IN
2
1.0
0.8
0.6
0.4
0.2
0
V
V
V
= 5 V
IN
V
= 2.7 V
IN
= 5 V
= V
IN
EN
FB
1.5
V
V
IH(EN)
IL(EN)
1
0.5
0
-50
-25
0
25
75
100
125
-50
-25
0
25
50
75
100
125
50
Junction temperature,
T
(°C)
Junction temperature,
T
(°C)
j
j
V
V
– T
I
– V
IH(EN) EN
IH(EN), IL(EN)
j
2
20
16
12
8
V = 5.5 V
IN
T = 25°C
j
V
= 5.5 V
IN
1.5
1
V
IH(EN)
V
IL(EN)
0.5
0
4
0
-50
-25
0
25
50
75
j
100
125
0
1
2
3
4
5
6
Junction temperature,
T
(°C)
EN input voltage,
V
EN
(V)
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2009-10-26
TB7102AF
I
– T
V
, V – T
UV UVR j
IH(EN)
j
20
16
12
8
2.6
V
V
= 5 V
IN
= 5 V
EN
Recovery voltage V
UVR
2.5
2.4
2.3
Detection voltage V
UV
4
V
= V
EN
IN
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
j
100
125
Junction temperature,
T
(°C)
Junction temperature,
T
(°C)
j
V
– V
V
– V
FB IN
OUT
IN
0.82
2
1.5
1
V
V
= V
EN
IN
= 1.2 V
V
= V
IN
EN
OUT
T = 25°C
j
T = 25°C
j
0.81
0.8
0.79
0.78
0.5
0
2
3
4
5
6
2.3
2.4
2.5
2.6
2.7
2.2
Input voltage,
V
IN
(V)
Input voltage,
V
IN
(V)
V
– T
V
– T
FB j
FB
j
0.82
0.81
0.8
0.82
0.81
0.8
V
V
V
= 5.5 V
V
V
V
= 2.7 V
IN
IN
= 1.2 V
= 1.2 V
OUT
EN
OUT
EN
= V
= V
IN
IN
0.79
0.78
0.79
0.78
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction temperature,
T
(°C)
Junction temperature,
T
(°C)
j
j
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2009-10-26
TB7102AF
f
– V
IN
f
– T
osc j
osc
1.2
1.1
1
1.2
1.1
1
V
= 5 V
V
= 1.2 V
IN
OUT
V
= 1.2 V
T = 25°C
j
OUT
0.9
0.8
0.9
0.8
2
3
4
5
6
-50
-25
0
25
50
75
100
125
Input voltage,
V
IN
(V)
Junction temperature,
T
(°C)
j
ΔV
– I
OUT
ΔV
– I
OUT
OUT
OUT
20
15
10
5
20
15
10
5
V
= 5 V, V
= 1.2 V
= 22 μF
V
= 3.3 V, V
= 1.2 V
= 22 μF
IN
OUT
IN
OUT
L = 3.3 μH, C
Ta = 25°C
L = 3.3 μH, C
Ta = 25°C
OUT
OUT
0
0
-5
-5
-10
-15
-20
-10
-15
-20
0
0.2
0.4
0.6
0.8
1
0
0.2
0.4
0.6
0.8
1
Output current,
I
(A)
Output current,
I
(A)
OUT
OUT
ΔV
– I
OUT
ΔV
– V
OUT IN
OUT
30
20
V
= 5 V, V
= 3.3 V
= 10 μF
IN
OUT
V
= 1.2 V, I
= 0.2 A
OUT
OUT
= 22 μF
L = 3.3 μH, C
Ta = 25°C
15
10
5
OUT
L = 3.3 μH, C
Ta = 25°C
OUT
20
10
0
0
-5
10
15
20
-10
-20
-30
0
0.2
0.4
0.6
0.8
1
2
3
4
5
6
Output current,
I
(A)
Input voltage,
V
IN
(V)
OUT
12
2009-10-26
TB7102AF
ΔV
– V
η – I
OUT
OUT
IN
30
20
10
0
100
80
60
40
20
0
V
= 3.3 V, I
= 0.2 A
OUT
OUT
= 10 μF
L = 3.3 μH, C
T = 25°C
OUT
-10
-20
-30
V
= 5 V, V
= 1.2 V
OUT
IN
L = 3.3 μH, C
Ta = 25°C
= 22 μF
OUT
0
0.2
0.4
0.6
0.8
1
2
3
4
5
6
Input voltage,
V
IN
(V)
Output current,
I
(A)
OUT
η – I
η – I
OUT
OUT
100
80
100
80
60
60
40
20
40
V
V
= 5 V
V
V
= 3.3 V
IN
IN
= 3.3 V
= 1.2 V
OUT
OUT
L = 3.3 μH
= 10 μF
L = 3.3 μH
= 22 μF
20
0
C
C
OUT
Ta = 25°C
OUT
Ta = 25°C
0
0
0.2
0.4
0.6
0.8
1
0
0.2
0.4
0.6
0.8
1
Output current,
I
(A)
Output current,
I
(A)
OUT
OUT
Load Response
Startup Characteristic
V
V
= 5 V
IN
= 1.2 V
OUT
= 0 A
I
OUT
L = 3.3 μH,
= 22 μF
Output voltage V
(500 mV/Div)
:
OUT
C
OUT
Ta = 25°C
Output voltage
(200 mV/Div)
V
OUT
Input Current
: (200 mA/Div)
I
IN
Output current: I
OUT
:
(10 mA→800 mA→10 mA)
V
= 5 V, V
= 3.3 V
OUT
IN
EN voltage: V :L→H
EN
L = 3.3 μH, C
Ta = 25°C
= 10 μF
OUT
100 μs/Div
400 μs/Div
13
2009-10-26
TB7102AF
Board Layout Example
Component side silk
Solder side silk
Component side pattern
Solder side pattern
14
2009-10-26
TB7102AF
TP1
TP3
TP4
IC1
V
P3
OUT
L1
V
1
2
8
7
6
5
IN
PGND
L
x
C1
P1
V
V
FB
IN
C2
1
2
P4
3
4
EN
N.C.
N.C.
R1
GND
SGND
P2
JP1
GND
3
TP2
R2
Figure 6 Circuit of the Board Layout Example
External Component Examples
Label
IC1
C1
Vendor
Part Number
Toshiba Corporation
TB7102AF
GRM21BB30J106K
GRM21BB30J106K
RK73H1ET
Murata Manufacturing Co., Ltd.
Murata Manufacturing Co., Ltd.
KOA Corporation
C2
R1
R2
KOA Corporation
RK73H1ET
L1
Taiyo Yuden Co., Ltd.
NP04SB3R3N
15
2009-10-26
TB7102AF
Package Dimensions
Weight: 0.017 g (typ.)
16
2009-10-26
TB7102AF
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
17
2009-10-26
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