TD62103FG [TOSHIBA]
TRANSISTOR 500 mA, 25 V, 7 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, LEAD FREE, SOP-16, BIP General Purpose Small Signal;型号: | TD62103FG |
厂家: | TOSHIBA |
描述: | TRANSISTOR 500 mA, 25 V, 7 CHANNEL, NPN, Si, SMALL SIGNAL TRANSISTOR, LEAD FREE, SOP-16, BIP General Purpose Small Signal 开关 光电二极管 晶体管 |
文件: | 总9页 (文件大小:456K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TD62101,103~105PG/FG
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62101PG,TD62101FG,TD62103PG,TD62103FG
TD62104PG,TD62104FG,TD62105PG,TD62105FG
7CH DARLINGTON SINK DRIVER
The TD62101PG / FG series are high-voltage, high-current
darlington drivers comprised of seven NPN darlington pairs.
This devices are a product for the Pb free(Sn-Ag).
TD62101PG
TD62103PG
TD62104PG
TD62105PG
FEATURES
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Output current (single output) : 500 mA (max)
High sustaining voltage output: 25 V (min)
Inputs compatible with various types of logic.
Package type−PG :
Package type−FG :
DIP−16 pin.
SOP−16 pin.
TD62101FG
TD62103FG
TD62104FG
TD62105FG
TYPE
INPUT BASE RESISTOR
DESIGNATION
General Purpose
TD62101PG / FG
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
External
2.7kΩ
TTL, 5 V CMOS
10.5kΩ
20kΩ
6~15 V CMOS, PMOS
12~25 V CMOS, PMOS
Weight
DIP16−P−300−2.54A : 1.11 g (typ.)
SOP16−P−225−1.27 : 0.16 g (typ.)
PIN CONNECTION
SCHEMATICS
(TOP VIEW)
(EACH DRIVER)
TD62101PG / FG
Note: The input and output parasitic diodes cannot be
used as clamp diodes.
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TD62101,103~105PG/FG
SCHEMATICS (EACH DRIVER)
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
Note: The input and output parasitic diodes cannot be used as clamp diodes.
MAXIMUM RATINGS
(Ta = 25°C)
CHARACTERISTICS
Output Sustaining Voltage
SYMBOL
RATING
UNIT
V
−0.5~25
500
V
mA / ch
V
CE (SUS)
Output Current
Input Voltage
Input Current
I
OUT
V
(Note 1)
(Note 2)
−0.5~30
25
IN
I
mA
IN
PG
FG
PG
FG
1.0
Power Dissipation
P
W
D
0.625 (Note 3)
−30~75
−40~85
−55~150
Operating Temperature
Storage Temperature
T
opr
°C
°C
T
stg
Note 1: Except TD62101PG / FG
Note 2: Only TD62101PG / FG
Note 3: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
RECOMMENDED OPERATING CONDITIONS
(Ta = −40~85°C and Ta = −30~75°C for only Type−P)
CHARACTERISTIC
SYMBOL
CONDITION
MIN
TYP.
MAX
UNIT
V
Output Sustaining Voltage
V
0
0
―
―
25
CE (SUS)
DC 1 Circuit
= 25 ms, Duty = 10%
350
mA /
ch
Output Current
I
OUT
T
pw
0
―
300
7 Circuits, Ta = 85°C, T = 120°C
j
Input Voltage
Input Current
Except TD62101PG / FG
V
0
―
―
―
―
20
10
V
IN
Only TD62101PG / FG
PG
I
―
―
―
mA
IN
0.44
0.325
Power Dissipation
P
W
D
FG
(Note)
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
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TD62101,103~105PG/FG
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
TEST
CIR−
CUIT
CHARACTERISTIC
SYMBOL
TEST CONDITION
MIN
TYP.
MAX
UNIT
µA
PG
FG
Ta = 75°C
= 25 V
―
―
―
―
―
1000
―
―
―
―
―
50
50
―
―
―
―
―
―
―
―
―
―
―
―
―
―
100
100
2.2
2.0
1.8
―
Output Leakage
Current
V
CE
I
1
CEX
I
= 0
IN
Ta = 85°C
I
I
I
= 350 mA, I = 600 µA
IN
1.3
1.1
1.0
―
OUT
OUT
OUT
Collector−Emitter Saturation Voltage
V
2
2
V
= 200 mA, I = 400 µA
IN
CE (sat)
= 100 mA, I = 200 µA
IN
DC Current Transfer Ratio
TD62101PG / FG
h
V
V
V
V
V
V
= 2 V, I
= 350 mA
OUT
FE
CE
= 1.5 V, I
= 350 mA
0.25
1.00
0.4
1.2
1.0
65
―
IN
IN
IN
IN
IN
OUT
= 1.75 V, I
= 2.4 V, I
= 350 mA
―
OUT
Output On
I
3
4
mA
µA
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
PG
= 350 mA
0.7
1.7
1.5
―
IN (ON)
OUT
Input
Current
= 13.5 V, I
= 20.0 V, I
= 350 mA
= 350 mA
OUT
OUT
Ta = 75°C
Ta = 85°C
I
=
OUT
Output Off
I
IN (OFF)
500 µA
FG
65
―
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
―
2.1
4
I
=
OUT
―
125 mA
―
6.4
2.7
7
―
Input
Voltage
I
=
OUT
Output On
V
5
V
= 2 V
CE
V
―
IN (ON)
250 mA
―
12
3.3
8.8
15
―
―
I
=
OUT
―
350 mA
―
Input Capacitance
Turn−On Delay
Turn−Off Delay
C
IN
6
7
V
V
= 0, f = 1 MHz
15
pF
µs
IN
t
0.1
0.2
―
ON
= 25 V, R = 70 Ω
OUT
L
C
L
= 15 pF
t
―
OFF
TEST CIRCUIT
1. I
2. h , V
3. I
IN (ON)
CEX
FE CE (sat)
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TD62101,103~105PG/FG
TEST CIRCUIT
4. I
5. V
6. C
IN
IN (OFF)
IN (ON)
7. t , t
ON OFF
INPUT CONDITION
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns
r
f
Note 2: See right.
TYPE NUMBER
R
V
IH
I
Note 3: C includes probe and jig capacitance.
L
TD62101PG / FG
TD62103PG / FG
TD62104PG / FG
TD62105PG / FG
2.7 kΩ
0 Ω
3 V
3 V
0 Ω
8 V
0 Ω
15 V
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, GND line since IC may be destroyed due to
short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62101,103~105PG/FG
TD62103PG/FG
TD62105PG/FG
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TD62101,103~105PG/FG
①
②
Type-PG Free Air
Type-FG On Glass Epoxy PCB
30×30×1.6mm Cu 50%
Type-FG Free Air
③
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TD62101,103~105PG/FG
PACKAGE DIMENSIONS
DIP16−P−300−2.54A
Unit: mm
Weight: 1.11 g (typ.)
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TD62101,103~105PG/FG
PACKAGE DIMENSIONS
SOP16−P−225−1.27
Unit: mm
Weight: 0.16 g (typ.)
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TD62101,103~105PG/FG
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
030619EBA
• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
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