TIM1213-8 [TOSHIBA]

TRANSISTOR KU BAND, GaAs, N-CHANNEL, RF POWER, MOSFET, 2-11C1B, 3 PIN, FET RF Power;
TIM1213-8
型号: TIM1213-8
厂家: TOSHIBA    TOSHIBA
描述:

TRANSISTOR KU BAND, GaAs, N-CHANNEL, RF POWER, MOSFET, 2-11C1B, 3 PIN, FET RF Power

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文件: 总4页 (文件大小:130K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MICROWAVE POWER GaAs FET  
MICROWAVE SEMICONDUCTOR  
TIM1213-8L  
TECHNICAL DATA  
FEATURES  
„ LOW INTERMODULATION DISTORTION  
IM3=-45 dBc at Pout= 28.0dBm  
Single Carrier Level  
„ HIGH GAIN  
G1dB=5.0 dB at 12.7 GHz to 13.2 GHz  
„ BROAD BAND INTERNALLY MATCHED FET  
„ HERMETICALLY SEALED PACKAGE  
„ HIGH POWER  
P1dB=39.5 dBm at 12.7 GHz to 13.2 GHz  
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 C )  
°
CHARACTERISTICS  
Output Power at 1dB Gain  
Compression Point  
Power Gain at 1dB Gain  
Compression Point  
Drain Current  
SYMBOL  
CONDITIONS  
UNIT MIN. TYP. MAX.  
P1dB  
dBm 38.5 39.5  
G1dB  
VDS= 9V  
f= 12.7 to 13.2GHz  
dB  
4.0  
5.0  
IDS1  
ηadd  
IM3  
A
%
3.4  
20  
4.4  
Power Added Efficiency  
3rd Order Intermodulation  
Distortion  
dBc  
-42  
-45  
Two-Tone Test  
Po=28. 0dBm  
Drain Current  
IDS2  
A
3.4  
4.4  
80  
(Single Carrier Level)  
(VDS X IDS + Pin – P1dB)  
X Rth(c-c)  
C
°
Channel Temperature Rise  
ΔTch  
Recommended gate resistance(Rg) : Rg= 150 Ω(MAX.)  
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )  
CHARACTERISTICS  
SYMBOL  
CONDITIONS  
VDS= 3V  
UNIT MIN. TYP. MAX.  
Transconductance  
gm  
mS  
2400  
-3.5  
8.0  
-2.0  
-5.0  
IDS= 4.0 A  
VDS= 3V  
IDS= 120mA  
VDS= 3V  
Pinch-off Voltage  
VGSoff  
IDSS  
V
Saturated Drain Current  
A
VGS= 0V  
Gate-Source Breakdown  
Voltage  
VGSO  
Rth(c-c)  
IGS= -120μA  
V
-5  
C/W  
Thermal Resistance  
Channel to Case  
1.6  
2.5  
°
‹ The information contained herein is presented only as a guide for the applications of our products. No responsibility is  
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may results from its use,  
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.  
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA  
before proceeding with design of equipment incorporating this product.  
Rev. May 2007  
TIM1213-8L  
ABSOLUTE MAXIMUM RATINGS ( Ta= 25 C )  
°
CHARACTERISTICS  
Drain-Source Voltage  
SYMBOL  
VDS  
VGS  
IDS  
UNIT  
V
RATING  
15  
-5  
Gate-Source Voltage  
Drain Current  
V
A
10.4  
Total Power Dissipation (Tc= 25 C)  
PT  
W
60  
°
C
Channel Temperature  
Storage Temperature  
Tch  
175  
°
C
°
Tstg  
-65 to +175  
PACKAGE OUTLINE (2-11C1B)  
Unit in mm  
(1) Gate  
(2) Source  
(3) Drain  
HANDLING PRECAUTIONS FOR PACKAGE MODEL  
Soldering iron should be grounded and the operating time should not exceed 10 seconds  
at 260°C.  
2
TIM1213-8L  
RF PERFORMANCE  
Output Power (Pout) vs. Frequency  
VDS=9V  
41  
40  
39  
38  
37  
IDS3.4A  
Pin=34.5 dBm  
12.7  
12.95  
13.2  
Frequency(GHz)  
Output Power(Pout) vs. Input Power(Pin)  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
freq.=13.2GHz  
VDS=9V  
40  
30  
20  
10  
IDS3.4A  
0
27  
29  
31  
33  
35  
37  
Pin(dBm)  
3
TIM1213-8L  
Power Dissipation(PT) vs. Case Temperature(Tc)  
60  
30  
0
0
40  
80  
120  
160  
200  
Tc( C )  
°
IM3 vs. Output Power Characteristics  
-10  
-20  
-30  
-40  
-50  
-60  
VDS=9V  
freq.=13.2GHz  
Δf=5MHz  
23  
25  
27  
Pout(dBm) @Single carrier level  
29  
31  
33  
4

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