TLP2631(LF5) [TOSHIBA]

Optocoupler - IC Output, 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 10 Mbps, DIP-8;
TLP2631(LF5)
型号: TLP2631(LF5)
厂家: TOSHIBA    TOSHIBA
描述:

Optocoupler - IC Output, 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 10 Mbps, DIP-8

输出元件 光电
文件: 总8页 (文件大小:171K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TLP2631  
TOSHIBA photocoupler GaAAs IRed & Photo IC  
TLP2631  
Isolated Line Receiver  
Simplex / Multiplex Data Transmission  
Computer-Peripheral Interface  
Unit: mm  
Microprocessor System Iinterface  
Digital Isolation for A / D, D / A Conversion  
The TOSHIBA TLP2631 dual photocoupler consists of a pair of GaAAs  
light emitting diode and integrated high gain, high speed photodetector.  
This unit is 8-lead DIP.  
The output of the detector circuit is an open collector, Schottky clamped  
transistor.  
A Faraday shield integrated on the photodetector chip reduces the effects  
of capacitive coupling between the input LED emitter and the high gain  
stages of the detector. This provides an effective common mode transient  
immunity of 1000 V/μs.  
Input current threshold: I = 5 mA (max)  
F
Switching speed: 10MBd (typ.)  
Common mode transient immunity: ±1000 V/μs (min)  
Guaranteed performance over temperature: 0 to 70°C  
Isolation voltage: 2500 V  
(min)  
rms  
TOSHIBA  
1110C4  
UL recognized: UL1577, file no. E67349  
Weight: 0.54 g (typ.)  
Truth Table (positive logic)  
Pin Configuration (top view)  
Input  
H
Output  
1 : Anode 1  
2 : Cathode 1  
L
V
1
2
3
4
CC  
8
7
6
5
L
H
3 : Cathode 2  
4 : Anode 2  
5 : GND  
A 0.01 to 0.1μF bypass capacitor must  
connected between pins 8 and 5(see Note 1).  
6 : V (Output 2)  
O2  
GND  
Shield  
7 : V (Output 1)  
O1  
8 : V  
CC  
Schematic  
I
I
F1  
Shield  
CC  
8
7
1
V
V
CC  
O1  
+
I
O1  
V
F1  
2
I
I
O2  
F2  
6
5
4
3
V
+
O2  
V
F2  
GND  
2007-10-01  
1
TLP2631  
Absolute Maximum Ratings (no derating required up to 70°C)  
Characteristic  
Symbol  
Rating  
20  
Unit  
mA  
Forward current (each channel)  
I
F
Pulse forward current  
(each channel)*  
I
30  
mA  
FP  
Reverse voltage (each channel)  
Output current (each channel)  
Output voltage (each channel)  
Supply voltage  
V
5
V
mA  
V
R
I
16  
O
V
0.5~7  
O
V
CC  
7
V
(1 minute maximum)  
Output collector power  
dissipation (each channel)  
Operating temperature range  
Storage temperature range  
Lead soldering temperature  
(10s)**  
P
40  
mW  
O
T
55~125  
40~85  
°C  
°C  
stg  
opr  
T
T
sol  
260  
°C  
Isolation voltage  
BV  
2500  
Vrms  
S
(AC, 1 min., R.H.60%, Note 3)  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings and the operating ranges.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
*
t 1 msec duration.  
** 2mm below seating plane.  
Recommended Operating Conditions  
Characteristic  
Input current, low level, each channel  
Input current, high level, each channel  
Supply voltage**, output  
Symbol  
Min  
0
Typ.  
Max  
250  
20  
Unit  
μA  
mA  
V
I
FL  
I
6.3*  
4.5  
FH  
V
CC  
5
5.5  
Fan out (TTL load, each channel)  
Operating temperature  
N
8
T
opr  
0
70  
°C  
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the  
device. Additionally, each item is an independent guideline respectively. In developing designs using this  
product, please confirm specified characteristics shown in this document.  
*6.3mA is a guard banded value which allows for at least 20% CTR degradation.  
Initial input current threshold value is 5.0mA or less.  
**This item denotes operating ranges, not meaning of recommended operating conditions.  
2
2007-10-01  
TLP2631  
Electrical Characteristics (Ta = 0~70°C unless otherwise noted)  
Characteristic  
Symbol  
Test Condition  
I = 10mA, Ta = 25°C  
Min.  
Typ. *  
1.65  
Max.  
Unit  
V
Input forward voltage  
(each channel)  
V
F
1.75  
F
Input diode temperature  
coefficient (each channel)  
ΔV / ΔTa  
I = 10mA  
F
2.0  
mV / °C  
F
Input reverse breakdown  
voltage (each channel)  
BV  
I
= 10μA, Ta = 25°C  
5
V
R
R
Input capacitance  
(each channel)  
C
T
V = 0, f = 1MHz  
45  
pF  
F
High level output current  
(each channel)  
V
= 5.5V, V = 5.5V  
CC O  
I
1
250  
μA  
OH  
I = 250μA  
F
Low level output voltage  
(each channel)  
V
= 5.5V, I = 5mA  
(sinking) = 13mA  
CC F  
V
0.4  
14  
24  
0.6  
30  
38  
V
OL  
I
OL  
High level supply current  
(both channels)  
I
V
= 5.5V, I = 0  
mA  
mA  
CCH  
CC  
CC  
F
Low level supply current  
(both channels)  
I
V
V
= 5.5V, I = 10mA  
CCL  
F
Isolation voltage  
R
S
= 500V, R.H. 60%  
(Note 3) 5×1010  
1014  
0.6  
Ω
S
Capacitance (inputoutput)  
C
f = 1MHz  
(Note 3)  
pF  
S
Inputinput leakage  
current  
R.H. 60%, t = 5s  
I
II  
0.005  
μA  
V
II  
= 500V  
(Note 6)  
(Note 6)  
(Note 6)  
Resistance (inputinput)  
Capacitance (inputinput)  
R
C
V
II  
= 500V  
1011  
0.25  
Ω
II  
f = 1MHZ  
pF  
II  
* All typical values are at VCC = 5V, Ta = 25°C.  
3
2007-10-01  
TLP2631  
Switching Characteristics (Ta = 25°C, V = 5V)  
CC  
Test  
Circuit  
Characteristic  
Symbol  
t HL  
Test Condition  
Min.  
Typ.  
60  
Max.  
75  
Unit  
ns  
Propagation delay time to  
low output level  
I = 07.5mA, R = 350Ω  
F
L
L
1
p
C = 15pF (each channel)  
Propagation delay time to  
high output level  
I = 7.5mA0, R = 350Ω  
F L  
L
t LH  
1
1
60  
75  
ns  
p
C = 15pF (each channel)  
Output rise time, output  
fall time (10~90%)  
I = 0 7.5mA, R = 350Ω  
F L  
t , t  
30  
ns  
r
f
C = 15pF (each channel)  
L
I = 0, R = 350Ω  
CM  
F
V
L
Common mode transient  
immunity at high output  
level  
= 400V,  
CM  
2
2
1000  
10000  
V / μs  
V / μs  
H
V (min.) = 2V  
O
(each channel, Note 4)  
I = 7.5mA, R = 350Ω  
F
L
Common mode transient  
immunity at low output  
level  
V
CM  
= 400V  
CM  
1000  
10000  
L
V (max.) = 0.8V  
O
(each channel, Note 5)  
(Note 1) 2mm below seating plane  
(Note 2) The VCC supply voltage to each TLP2631 isolator must be bypassed by a 0.01μF capacitor or larger. This  
can be either a ceramic or solid tantalum capacitor with good high frequency characteristic and should  
be connected as close as possible to the package V  
CC  
and GND pins each device.  
(Note 3) Device considered a twoterminal device: Pins 1, 2, 3 and 4 shorted together, and pins 5, 6, 7 and 8  
shorted together.  
(Note 4) CM the maximum tolerable rate of rise of the common mode voltage to ensure the output will remain in  
H
the high state (i.e., V  
OUT  
> 2.0V).  
Measured in volts per microsecond (V / μs).  
Volts/ microsecond can be translated to sinusoidial voltages:  
(dVCM)  
V / μs =  
Max. = f  
V
(p.p.)  
CM CM  
dt  
Example:  
V
= 319V when f  
= 1MHz using CM and CM = 1000V / μs data sheet specified minimum.  
CM L H  
CM  
pp  
(Note 5) CM the maximum tolerable rate of fall of the common mode voltage to ensure the output will remain in  
L
the low output state (i.e., V  
> 0.8V).  
OUT  
Measured in volts per microsecond (V / μs).  
(Note 6) Measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together.  
4
2007-10-01  
TLP2631  
Test Circuit 1. t HL and t LH  
p
p
5V  
Pulse input  
PW = 10μs  
Duty cycle = 1/10  
7.5mA  
3.75mA  
0mA  
V
CC  
I
F
1
2
3
4
8
7
6
5
R
350Ω  
L
t
r
t
f
I
Monitor  
F
5V  
4.5V  
V
Monitor  
O
C
L
V
GND  
O
1.5V  
0.5V  
V
t
t
OL  
pHL  
pLH  
* C is approximately 15pF which includes probe and stray  
L
wiring capacitance.  
Test Circuit 2. Transient Immunity And Typical Waveforms.  
400V  
0V  
I
F
90%  
V
CC  
5V  
350Ω  
Monitor  
V
1
2
3
4
8
7
6
5
CM  
R
L
10%  
t
f
t
r
B
A
V
O
C
L
5V  
2V  
V
FF  
GND  
V
O
(I = 0mA)  
F
V
CM  
+
0.8V  
V
O
V
OL  
Pulse generator  
(I = 7.5mA)  
F
Z
O =  
50Ω  
320(V)  
320(V)  
CM  
=
,CM =  
L
H
t (μs)  
r
t (μs)  
r
* CL is approximately 15pF which includes probe and stray  
wiring capacitance.  
5
2007-10-01  
TLP2631  
I
F
– V  
F
ΔV / ΔTa – I  
F
F
100  
10  
1
2.6  
2.4  
2.2  
2.0  
Ta = 25 °C  
1.8  
1.6  
1.4  
0.1  
0.01  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
0.1  
0.3  
1
30  
10  
50  
3
Forward voltage  
V
F
(V)  
Forward current  
I
F
(mA)  
I
Ta  
V
– I  
F
OH  
O
100  
8
6
4
2
0
V
= 5 V  
I
= 250 μA  
CC  
F
Ta = 25 °C  
V
= 5.5 V  
CC  
50  
30  
V
= 5.5 V  
O
R
= 350Ω  
L
1kΩ  
4kΩ  
10  
5
3
0
2
1
3
4
6
5
1
Forward current  
I
F
(mA)  
10  
30  
40  
60  
0
20  
50  
70  
Ambient temperature Ta (°C)  
V
– I  
F
V
– T  
OL a  
O
10  
I
= 5 mA  
F
V
= 5 V  
CC  
V
V
= 5.5 V  
CC  
0.5  
0.4  
R
R
= 350Ω  
= 4kΩ  
L
= 2 V  
E
8
6
4
L
I
=16mA  
OL  
12.8mA  
9.6mA  
6.4mA  
Ta = 70°C  
0°C  
0.3  
0.2  
2
0
20  
80  
0
40  
60  
Ambient temperature Ta (°C)  
0
2
6
1
3
4
5
Forward current  
I
F
(mA)  
6
2007-10-01  
TLP2631  
t
t
– I  
F
t
t
Ta  
pHL, pLH  
pHL, pLH  
120  
120  
100  
R
L
= 4kΩ  
R
L
= 4kΩ  
1kΩ  
t
t
pLH  
t
pLH  
100  
80  
350kΩ  
1kΩ  
pLH  
t
80  
60  
pLH  
350Ω  
350Ω  
350Ω  
t
pHL  
60  
1kΩ  
4kΩ  
t
1kΩ  
4kΩ  
pHL  
40  
20  
0
40  
T
= 25 °C  
a
V
= 5 V  
V
= 5 V  
CC  
CC  
20  
0
I
= 7.5 mA  
F
9
5
11  
13  
15  
17  
19  
7
10  
20  
30  
0
40  
50  
60  
70  
Forward current  
I
F
(mA)  
Ambient temperature Ta (°C)  
t t Ta  
r, f  
320  
300  
V
= 5 V  
CC  
I
= 7.5 mA  
F
R
L
= 4kΩ  
1kΩ  
t
t
f
280  
80  
f
60  
40  
350Ω  
350Ω  
t
f
t
r
20  
0
1kΩ  
4kΩ  
10  
20  
30  
0
40  
50  
60  
70  
Ambient temperature Ta (°C)  
7
2007-10-01  
TLP2631  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must  
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,  
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA  
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are  
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the  
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any  
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other  
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO  
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or  
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
8
2007-10-01  

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