TESDD5V0HC [TSC]
Bi-directional ESD Protection Diode; 双向ESD保护二极管
| 型号： | TESDD5V0HC |
| 厂家： | 
TAIWAN SEMICONDUCTOR COMPANY, LTD |
| 描述： | Bi-directional ESD Protection Diode |
| 文件： | 总3页 (文件大小：231K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TESDD5V0HC
Bi-directional ESD Protection Diode
Small Signal Diode
SOD-523F
Features
Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
Meet IEC61000-4-4 (EFT) rating. 40A (5/50ήs)
Protects one birectional I/O line
Working Voltage : 5V
Pb free version, RoHS compliant, and Halogen free
Unit (mm)
Unit (inch)
Min Max
Mechanical Data
Case : SOD-523F flat lead small outline plastic package
Dimensions
Min
0.70
1.50
0.25
1.10
0.60
0.10
Max
A
B
C
D
E
F
0.90 0.028 0.035
1.70 0.059 0.067
0.35 0.010 0.014
1.30 0.043 0.051
0.70 0.024 0.028
0.14 0.004 0.006
Terminal: Matte tin plated, lead free., solderable
per MIL-STD-202, Method 208 guaranteed
High temperature soldering guaranteed: 260°C/10s
Mounting position: Any
Weight :2 mg (approximately)
Marking Code : TB
Applications
Cell Phone Handsets and Accessories
Pin Configutation
Microprocessor based equipment
Personal Digital Assistants (PDA’s)
Portable Instrumentation
Peripherals
Suggested PAD Layout
0.40
Ordering Information
0.40
Packing Code
Part No.
Package
Packing
Marking
1.00
1.80
RKG
TESDD5V0HC SOD-523F 3K / 7" Reel
TB
Unit : mm
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Maximum Ratings
Type Number
Symbol
Value
Units
Peak Pulse Power (tp=8/20μs waveform)
PPP
100
W
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
±15
±8
VESD
KV
Junction and Storage Temperature Range
TJ, TSTG
.
-55 to + 150
.
°C
Electrical Characteristics
Type Number
Symbol
VRWM
V(BR)
Min
Max
5
Units
V
Reverse Stand-Off Voltage
Reverse Breakdown Voltag
Reverse Leakage Current
-
6
-
IR=
-
V
1mA
5V
VR=
IR
1
uA
IPP
=
=
-
10
15
1A
Clamping Voltage
Vc
V
IPP
-
5A
Junction Capacitance
VR=0V, f=1.0MHz
CJ
35 (Typ.)
pF
Notes: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts
may vary despending on application.
Version : A11
TESDD5V0HC
Bi-directional ESD Protection Diode
Small Signal Diode
Rating and Characteristic Curves
FIG 1 Non-Repetitive Peak Pulse Power vs. Pulse Time
FIG 2 Pulse Waveform
10
110
Waveform Parameters:
tr = 8μs, td = 20μs
100
90
80
70
60
50
40
30
20
10
0
1
e-1
td=Ipp/2
0.1
0.01
0.1
1
10
100
1000
0
5
10
15
20
25
30
Pulse Duration (us)
Time (us)
FIG 3 Admissible Power Dissipation Curve
FIG 4 Typical Junction Capacitance
120
40
35
30
25
20
15
10
5
100
80
60
40
20
0
f = 1.0MHz
4
0
0
1
2
3
5
0
20
40
60
80
100
120
140
160
180
Ambient Tempeatature (oC)
Reverse Voltage (V)
FIG 5 Clamping Voltage vs. Peak Pulse Current)
25
20
15
10
5
Waveform Parameters:
tr = 8μs, td = 20μs
0
0
1
2
3
4
5
Peak Pulse Current (A)
Version : A11
TESDD5V0HC
Bi-directional ESD Protection Diode
Small Signal Diode
Applications Information
Designed to protect one data, I/O, or power supply line.
Designed to protect sensitive electronics from damage or latch-up due to ESD
Designed to replace multilayer varistors (MLVs) in portable applications
Offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs
The combination of small size and high ESD surge capability makes them ideal for use in portable applications.
Circuit Board Layout Recommendations
Good circuit board layout is critical for the suppression of ESD induced transients.
Place the ESD Protection Diode near the input terminals or connectors to restrict transient coupling.
Minimize the path length between the ESD Protection Diode and the protected line.
Minimize all conductive loops including power and ground loops.
The ESD transient return path to ground should be kept as short as possible.
Tape & Reel specification
TSC label
Dimension
(mm)
Item
Symbol
Top Cover Tape
Carrier depth
K
D
2.40 Max.
1.50 +0.10
178 ± 1
Sprocket hole
Reel outside diameter
Reel inner diameter
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Embossment center
Overall tape thickness
Tape width
A
Carieer Tape
D1
D2
E
50 Min.
13.0 ± 0.5
1.75 ±0.10
3.50 ±0.05
4.00 ±0.10
2.00 ±0.10
0.6 Max.
Any Additional Label (If Required)
10 Pitches Cumulative
Tolerance on Tape
±2.0mm ( ±0.008")
P0
P1
F
D
T
P0
P1
T
E
F
K0
W
W
W1
8.30 Max.
14.4 Max.
B0
B1
D'
Top
Cover Tape
See Note1
Reel width
For Components
2.0mm X 1.2mm
and Larger
Center Lines
of Cavity
K
A0
Embossment
For Machine Reference
Only
Including Draft and RADLL
Concentric Around B0
W1
D1
A
D2
Direction of Feed
Note 1: A , B , and K are determined by component size. The clearance between the components and the cavity must be
0
0
0
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Version : A11
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