PPC11001BLF7 [TTELEC]
Metal Glaze Surface Mount Precision Power Chip; 金属釉表面贴装精密功率芯片型号: | PPC11001BLF7 |
厂家: | TT Electronics |
描述: | Metal Glaze Surface Mount Precision Power Chip |
文件: | 总3页 (文件大小:186K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Metal Glaze™ Surface Mount
Precision Power Chip
™
Metal Glaze thick
film element fired
at 1000°C to solid
ceramic substrate
PPC Series
• Surge tolerant
• Up to 1000 volts
• Tight TCR - 25 ppm/°C
• Tolerance down to ±0.1%
High
temperature
dielectric
coating
Solder over nickel
barrier
Electrical Data
Power
Rating at
70°C (W)
Resistance
Range
(ohms)
Size
Industry
IRC
Type
Working
Voltage
Tolerance
(±%)
Qty /
Reel (7")
Qty /
Reel (13")
Code
Footprint
B
D
F
1206
2010
2512
3610
PPC1/8
PPC1/2
PPC1
1/8 W
1/2 W
200
300
350
500
100 - 10K
100 - 10K
100 - 10K
100 - 10K
2500
1500
N/A
10000
5000
5000
1500
0.1% (B)
0.25% (C)
0.5% (D)
1 W
H
PPC2
2W 1.33W
N/A
Environmental Data
Characteristics
Maximum Change
As specified
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
Temperature Coefficient
Thermal Shock
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Low Temperature Operation
Short Time Overload
√
MIL-R-55342E Par 4.7.5 2.5 x
for 5 seconds
High Temperature Exposure
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at 260°C
for 10 seconds)
Resistance to Bonding
±0.25% + 0.01 ohm
Exposure
95% minimum coverage
±0.5% + 0.01 ohm
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)
Solderability
Moisture Resistance
±0.5% + 0.01 ohm
1200 gram push from underside of mounted chip for 60
seconds
Life Test
±1% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
Chip mounted in center of 90mm long board, deflected 1mm
so as to exert pull on chip contacts for 5 seconds
Terminal Adhesion Strength
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPC Series Issue November 2008 Sheet 1 of 3
Metal Glaze™ Surface Mount
Precision Power Chip
Physical Data
L
C
W
Dimensions (Inches and (mm))
W
Industry
Footprint
Size Code
B
Actual Size
L
C
0.128 ± 0.007
(3.25 ± 0.18)
0.057 ± 0.006
(1.45 ± 0.15)
0.020 ± 0.010
(0.51 ± 0.25)
1206
0.200 ± 0.010
(5.08 ± 0.25)
0.079 ± 0.006
(2.01 ± 0.15)
0.030 ± 0.010
(0.761 ± 0.25)
D
F
2010
2512
3610
0.251 ± 0.010
(6.38 ± 0.25)
0.079 ± 0.006
(2.01 ± 0.15)
0.040 ± 0.010
(1.02 ± 0.25)
0.367 ± 0.010
(9.32 ± 0.25)
0.105 ± 0.006
(2.67 ± 0.15)
0.050 ± 0.010
(1.27 ± 0.25)
H
Recommended Solder Pad Dimensions (Reflow):
To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide
a large repeatable solder fillet to the PPC resistor on reflow processes and will provide maximum heat transfert
to the PC board in high power applications. By placing the PPC on the solder paste while the paste is in the
"tacky" state, the PPC will be held in position until solder reflow begins. The pad design thes uses the surface
tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising
above the board level directly beneath the PPC is not recommended.
Recommended Solder Pad Dimensions (Reflow):
F
A
C
A
B
E
D
Dimensions (Inches and mm))
Size
Industry
Code
Footprint
A
B
C
D
E
F
0.076
(1.93)
0.093
(2.36)
0.058
(1.47)
0.098
(2.49)
0.032
(0.81)
0.211
(5.36)
B
D
F
1206
2010
2512
3610
0.111
(2.82)
0.126
(3.20)
0.096
(2.44)
0.152
(3.86)
0.040
(1.02)
0.318
(8.08)
0.121
(3.07)
0.126
(3.20)
0.127
(3.23)
0.183
(4.65)
0.040
(1.02)
0.369
(9.37)
0.170
(4.32)
0.160
(4.06)
0.213
(5.41)
0.273
(6.93)
0.044
(1.12)
0.553
(14.05)
H
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPC Series Issue November 2008 Sheet 2 of 3
Metal Glaze™ Surface Mount
Precision Power Chip
Standard Reel Packaging Per EIA-481
Size
Code
Industry
Footprint
Reel
Diameter*
Quantity Per Reel
2,500 max., 10,000 max.
1,500 max., 5,000 max.
5,000 max.
Carrier Tape Width
8mm
Component Pitch
B
D
F
1206
2010
2512
3610
7", 13"
7", 13"
13"
4mm
4mm
4mm
4mm
12mm
12mm
H
7"
1,500 max.
24mm
* The 13" reel is considered standard and will be supplied unless otherwise specified.
Power Derating Curve
Repetitive Surge Curve
100
1000
PPC 1/8, 1/2, 1
80
PPC 2
PPC 1
60
100
PPC 2
40
20
PPC 1/8
10
0
30 40 50 60 70 80 90 100 110 120 130 140 150
1
Ambient Temperature (°C)
0.0001
0.0010
0.0100
0.1000
1.0000
.1msec
1msec
10msec
100msec
10000msec
Surge or Pulse Duration (seconds)
Ordering Data
Specify type, resistance, tolerance, RoHS-Compliance and packaging.
This example is for a Surface Mount Precision Power Chip.
Sample Part No.
PPC1 25
1001
F
LF 13
IRC Type
PPC 1/8, 1/2, 1, 2
Resistance Value (EIA 4-digit code)
(≥100Ω - First 3 significant digits plus 4th digit multiplier)
Example: 100Ω = 1000; 1000Ω = 1001
(>100Ω - "R" is used to designate decimal)
Example: 10Ω = 10R0; 0.25Ω = R250
Tolerance (EIA format)
B = ±0.1%, C = ±0.25%, D = ±0.5%
RoHS Indicator
LF indicates RoHS compliance
Blank designates 60% Sn / 40% Pb Solder
Packaging
(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPC Series Issue November 2008 Sheet 3 of 3
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