PPC11001CLF7 [TTELEC]

Metal Glaze Surface Mount Precision Power Chip; 金属釉表面贴装精密功率芯片


型号：	PPC11001CLF7
厂家：	TT Electronics
描述：	Metal Glaze Surface Mount Precision Power Chip 金属釉表面贴装精密功率芯片
文件：	总3页 (文件大小：186K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Metal Glaze^™Surface Mount

Precision Power Chip

™

Metal Glaze thick

film element fired

at 1000°C to solid

ceramic substrate

PPC Series

• Surge tolerant

• Up to 1000 volts

• Tight TCR - 25 ppm/°C

• Tolerance down to ±0.1%

High

temperature

dielectric

coating

Solder over nickel

barrier

Electrical Data

Power

Rating at

70°C (W)

Resistance

Range

(ohms)

Size

Industry

IRC

Type

Working

Voltage

Tolerance

(±%)

Qty /

Reel (7")

Qty /

Reel (13")

Code

Footprint

1206

2010

2512

3610

PPC1/8

PPC1/2

PPC1

1/8 W

1/2 W

200

300

350

500

100 - 10K

2500

1500

N/A

10000

5000

1500

0.1% (B)

0.25% (C)

0.5% (D)

1 W

PPC2

2W 1.33W

N/A

Environmental Data

Characteristics

Maximum Change

As speciﬁed

Test Method

MIL-R-55342E Par 4.7.9 (-55°C + 125°C)

Temperature Coefﬁcient

Thermal Shock

±0.5% + 0.01 ohm

±0.25% + 0.01 ohm

±0.5% + 0.01 ohm

MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)

MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)

Low Temperature Operation

Short Time Overload

√

MIL-R-55342E Par 4.7.5 2.5 x

for 5 seconds

High Temperature Exposure

MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)

MIL-R-55342E Par 4.7.7 (Reﬂow soldered to board at 260°C

for 10 seconds)

Resistance to Bonding

±0.25% + 0.01 ohm

Exposure

95% minimum coverage

±0.5% + 0.01 ohm

MIL-STD-202, Method 208 (245°C for 5 seconds)

MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)

MIL-R-55342E Par 4.7.10 (2000 hours at 70°C intermittent)

Solderability

Moisture Resistance

±0.5% + 0.01 ohm

1200 gram push from underside of mounted chip for 60

seconds

Life Test

±1% + 0.01 ohm

no mechanical damage

Chip mounted in center of 90mm long board, deﬂected 1mm

so as to exert pull on chip contacts for 5 seconds

Terminal Adhesion Strength

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

A subsidiary of

TT electronics plc

Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

PPC Series Issue November 2008 Sheet 1 of 3

Metal Glaze^™Surface Mount

Precision Power Chip

Physical Data

Dimensions (Inches and (mm))

Industry

Footprint

Size Code

Actual Size

0.128 ± 0.007

(3.25 ± 0.18)

0.057 ± 0.006

(1.45 ± 0.15)

0.020 ± 0.010

(0.51 ± 0.25)

1206

0.200 ± 0.010

(5.08 ± 0.25)

0.079 ± 0.006

(2.01 ± 0.15)

0.030 ± 0.010

(0.761 ± 0.25)

2010

2512

3610

0.251 ± 0.010

(6.38 ± 0.25)

0.079 ± 0.006

(2.01 ± 0.15)

0.040 ± 0.010

(1.02 ± 0.25)

0.367 ± 0.010

(9.32 ± 0.25)

0.105 ± 0.006

(2.67 ± 0.15)

0.050 ± 0.010

(1.27 ± 0.25)

Recommended Solder Pad Dimensions (Reﬂow):

To ensure excellent solderability performance, IRC recommends the following pad design. This design will provide

a large repeatable solder ﬁllet to the PPC resistor on reﬂow processes and will provide maximum heat transfert

to the PC board in high power applications. By placing the PPC on the solder paste while the paste is in the

"tacky" state, the PPC will be held in position until solder reﬂow begins. The pad design thes uses the surface

tension of the molten solder to pull the component to the center of the solder pad. The placement of a via rising

above the board level directly beneath the PPC is not recommended.

Recommended Solder Pad Dimensions (Reﬂow):

Dimensions (Inches and mm))

Size

Industry

Code

Footprint

0.076

(1.93)

0.093

(2.36)

0.058

(1.47)

0.098

(2.49)

0.032

(0.81)

0.211

(5.36)

1206

2010

2512

3610

0.111

(2.82)

0.126

(3.20)

0.096

(2.44)

0.152

(3.86)

0.040

(1.02)

0.318

(8.08)

0.121

(3.07)

0.126

(3.20)

0.127

(3.23)

0.183

(4.65)

0.040

(1.02)

0.369

(9.37)

0.170

(4.32)

0.160

(4.06)

0.213

(5.41)

0.273

(6.93)

0.044

(1.12)

0.553

(14.05)

Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

PPC Series Issue November 2008 Sheet 2 of 3

Metal Glaze^™Surface Mount

Precision Power Chip

Standard Reel Packaging Per EIA-481

Size

Code

Industry

Footprint

Reel

Diameter*

Quantity Per Reel

2,500 max., 10,000 max.

1,500 max., 5,000 max.

5,000 max.

Carrier Tape Width

8mm

Component Pitch

1206

2010

2512

3610

7", 13"

13"

4mm

12mm

1,500 max.

24mm

* The 13" reel is considered standard and will be supplied unless otherwise speciﬁed.

Power Derating Curve

Repetitive Surge Curve

100

1000

PPC 1/8, 1/2, 1

PPC 2

PPC 1

100

PPC 2

PPC 1/8

30 40 50 60 70 80 90 100 110 120 130 140 150

Ambient Temperature (°C)

0.0001

0.0010

0.0100

0.1000

1.0000

.1msec

1msec

10msec

100msec

10000msec

Surge or Pulse Duration (seconds)

Ordering Data

Specify type, resistance, tolerance, RoHS-Compliance and packaging.

This example is for a Surface Mount Precision Power Chip.

Sample Part No.

PPC1 25

1001

LF 13

IRC Type

PPC 1/8, 1/2, 1, 2

Resistance Value (EIA 4-digit code)

(≥100Ω - First 3 signiﬁcant digits plus 4th digit multiplier)

Example: 100Ω = 1000; 1000Ω = 1001

(>100Ω - "R" is used to designate decimal)

Example: 10Ω = 10R0; 0.25Ω = R250

Tolerance (EIA format)

B = ±0.1%, C = ±0.25%, D = ±0.5%

RoHS Indicator

LF indicates RoHS compliance

Blank designates 60% Sn / 40% Pb Solder

Packaging

(BLK = Bulk, 7 = 7" Reel, 13 = 13" Reel)

Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

PPC Series Issue November 2008 Sheet 3 of 3

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