ULRB12512R010JLFSLT [TTELEC]
Metal Element Current Sense Resistor; 金属元素电流检测电阻器
| 型号： | ULRB12512R010JLFSLT |
| 厂家： | 
TT Electronics |
| 描述： | Metal Element Current Sense Resistor |
| 文件： | 总6页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Metal Element
Current Sense Resistor
ULR Series
• Robust metal strip able to withstand high temperature and high current.
• Low TCR and Inductance
• Resistance Range from 0.5 mΩ to 20 mΩ
• Power ratings from 1W to 3W in 1206, 2010 and 2512 chip size
• Designed for current sense circuits in power electronic systems
• Higher wattage devices feature PCB clearance gap to maximize thermal
performance
Electrical Data
1
IRC Type Coating
Power rating
at 80°C (Watts)
Standard Resistance
TCR
(±ppm/°C)
Tolerance
(±%)
Dielectric
Withstanding Voltage
(Volts)
2
Values (mΩ)
1206 Chip Size
ULRG1
Green
1
1, 2, 3, 5, 7, 10
1, 2, 3, 5, 7, 10
50
50
1, 5
1, 5
100
100
2010 Chip Size
ULRG15
Green
1.5
2512 Chip Size
ULRG1
1
2
11 - 20
7 - 10
4 - 6
50
50
ULRG2
ULRG25
Green
2.5
50
0.5 - 0.75
1 - 3
100
50
ULRG3
3
1, 5
200
2.5 - 3
4 - 5
150
100
75
ULRB1
ULRB2
1
2
Black
6 - 7
0.5 - 2
50
Notes:
1
.Black coating = wave or IR reflow soldering; Green coating = IR reflow solder. Wave reflow - solder mask must match the W and D dimensions on page 2
2
of data sheet. Non-standard resistance values available (contact factory). For resistance values above 20 mΩ, please refer to our LRC / LRF series.
3
Package sizes 2010 and 1206 with the green coating are uncoated on the top surface and unmarked for resistance value.
Environmental Data
Test
Short Term Overload (5x rated power for 5 seconds)
Load at rated power (1000 hours cyclic load @ 70°C)
Temperatature Cycling (-55°C to +150°C; 1000 cycles)
Dry Heat (+170°C, no load; 1000 hours)
Resistance to Solder Heat (260°C for 10 seconds)
Solderability (235°C for 2 seconds)
∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
∆R/R ≤ ± 1% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
∆R/R ≤ ± 1% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
∆R/R ≤ ± 0.5% + 0.5 mΩ (black); ∆R/R ≤ ± 1% (green)
Minimum 95% coverage
Resistance to Solvents
No deterioration of protective coating or marking
-55°C to 170°C
Operating Temperature
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A Subsidiary of
TT electronics plc
Wire and Film Technologies Division• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
ULR Issue July 2009 Sheet 1 of 6
Physical Data
D
L
T
W
Coating
Resistance
L
W
T
D
Value (mΩ)
1206 Chip Size (1 Watt)
Green
1 - 10
3.2 ± 0.25
1.6 ± 0.10
0.6 ± 0.2
0.6 ± 0.2
0.98 ± 0.38
1.67 ± 0.63
2010 Chip Size (1.5 Watt)
Green
1 - 10
5.08 ± 0.25
2.54 ± 0.15
2512 Chip Size (1 Watt, 2 Watt, 2.5 Watt, and 3 Watt)
0.5
2.68 ± 0.25
2.48 ± 0.25
1.43 ± 0.25
1.18 ± 0.25
2.18 ± 0.25
1.93 ± 0.25
1.43 ± 0.25
1.18 ± 0.25
0.75
1 - 1.5
2 - 3
Green
6.35 ± 0.25
3.0 ± 0.2
0.6 ± 0.2
4
5 - 6
7
8 - 20
0.5
0.75
1
1.4 ± 0.2 1
1.0 ± 0.2 1
0.8 ± 0.2 1
0.65 ± 0.2 1
0.5 ± 0.2 1
0.85 ± 0.2 1
0.7 ± 0.2 1
0.6 ± 0.2 1
0.5 ± 0.2 1
1.5
2
Black
6.35 ± 0.25
3.18 ± 0.25
1.43 ± 0.38
2.5
3
4
5 - 7
Note:
1
Dimensions are for reference only
Wire and Film Technologies Division• 4222 South Staples Street • Corpus Christi Texas 78411 USA
ULR Issue July 2009 Sheet 2 of 6
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Electrical Connections
4-wire pad layout
2512
2-wire pad layout
2512
4-wire measurement points
5.4
2512
a
a
1.2
L
1.5
1.0
3.45
0.5
Probe dia.
L
unit: mm
unit: mm
unit: mm
4-wire pad layout
2010
2-wire pad layout
2010
4-wire measurement points
4.32
2010
a
a
1.05
L
0.8
1.2
2.9
L
0.5
Probe dia.
unit: mm
unit: mm
unit: mm
4-wire pad layout
1206
2-wire pad layout
1206
4-wire measurement points
1206
a
a
2.6
0.7
L
0.5
1.9
1.25
L
0.5
Probe dia.
unit: mm
unit: mm
unit: mm
Resistance
(m-ohm)
Resistance
(m-ohm)
Package
a
L
Package
a
L
2512 - Black All
0.5
1.85
2.78
2.58
1.53
1.28
2.28
2.03
1.53
1.28
2.9
0.9
1.3
3.4
3.9
1.9
2.4
3.4
3.9
1
2
3
2.04
1.74
1.24
2.04
1.74
1.49
1.3
1.2
1.8
2.8
1.2
1.8
2.3
0.8
1.8
0.8
1.2
1.8
0.75
2010
1 - 1.5
2 - 3
4
4 - 5
6 - 8
9 - 10
1
2512 - Green
5 - 6
7
2 - 3
4 - 6
7 - 9
10
0.8
8 - 20
1206
1.3
1.1
0.8
Note:
1
Green parts require the use of “D” dimensions on page 2 for parts being assembled in a wave reflow processes.
Wire and Film Technologies Division• 4222 South Staples Street • Corpus Christi Texas 78411 USA
ULR Issue July 2009 Sheet 3 of 6
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Construction
Black Type
Green Type
A low TCR resistance alloy plate with plated connection
A low TCR alloy plate is grooved to set the final resistance.
The lower faces are solder plated for connections, and the top
surface is protectively coated and numerically marked with the
resistance value, as described in Product Marking. This part
is suitable for wave and IR reflow soldering processes. Wave
reflow requires the solder mask to be dimensioned according to
page 2 using the W and D dimensions of the part.
bands is protectively coated and numerically marked with
the resistance value, as described in Product Marking. This
version has standard plated connection and is suitable for
wave or IR reflow soldering processes.
Power Derating Curve
Note:
100
The power derating curve is a guidance based on a
conservative design model. The ULR is a solid metal
alloy construction that can withstand significantly greater
operating temperatures than the conservative model per-
mits. The protective coating will operate up to 260°C and
the alloy can withstand in exess of 350°C. Therefore, the
system thermal design will be a more significant design
parameter due to the heat limitations of the solder joint.
50
0
0
85
170
Ambient Temperature (°C)
Plastic Tape Specification
Top Tape
ψ D
0
E
A
F
W
B
1.4Min.
1
ψ D
direction of unreeling
T
P1
P2
P0
Resistor
Emboss Tape
Resistance
Size
A
B
W
E
F
P
P
P
Φ D
0
T
0
1
2
(mΩ)
0.5 - 7
0.5 - 20
1 - 10
6.73±0.1
6.75±0.1
1.5+0.1, -0 0.81±0.1
1.5+0.1, -0 0.80±0.1
2512
3.4±0.1
12±0.1
1.75±0.1 5.5±0.05
4±0.1
4±0.1
2±0.05
2010
1206
2.85±0.1 5.55±0.1 12±0.1
1.9±0.1 3.6±0.1 8±0.2
1.75±0.1 5.5±0.05
1.75±0.1 3.5±0.05
4±0.1
4±0.1
4±0.1
4±0.1
2±0.05 1.55±0.05
2±0.05 1.55±0.05
0.85±0.1
0.87±0.1
1 - 10
Note:
1. The cumulative tolerance of 10 sprocket hole pitch is ± 0.2 mm.
2. Carrier camber shall not be more than 1 mm per 100 mm through a length of 250 mm.
3. A & B measured 0.3 mm from the bottom of the packet.
4. T measured at a point on the inside bottom of the packet to the top surface of the carrier.
5. Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole.
Wire and Film Technologies Division• 4222 South Staples Street • Corpus Christi Texas 78411 USA
ULR Issue July 2009 Sheet 4 of 6
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
IRC Solder Reflow Recommendations
Sn-Pb Eutectic and Pb-Free Reflow Profiles
tP
TP
Ramp-up
Critical Zone
TL to TP
TL
tL
Tsmax
Tsmin
ts
Ramp-down
Preheat
25
t 25°C to Peak
Time
* Based on Industry Standards and IPC recommendations
Note 1: All temperatures refer
to topside of the package,
measured on the package
body surface.
Profile Feature
Sn-Pb Eutectic
Assembly
Pb-Free
Assembly
Average Ramp-up rate (T
Preheat
to T )
3°C / second max.
3°C / second max.
smax
p
Note 2: Time within 5 °C of
actual peak temperature (tp)
specified for the reflow profiles
is a “supplier” minimum and a
“user” maximum.
100°C
150°C
60 -120 seconds
150°C
200°C
60 -180 seconds
- Temperature Min (T
- Temperature Max (T
)
)
) (ts)
smin
smax
- Time (T
to T
smin
smax
Time maintained above
- Temperature (T )
- Time (t )
L
183°C
60 - 150 seconds
217°C
60 - 150 seconds
L
Peak Temperature (T )
P
See Table 1
See Table 2
2
Time within 5°C of actual Peak Temperature (tp)
Ramp-down Rate
10 - 30 seconds
6°C / second max.
6 minutes max.
20 - 40 seconds
6°C / second max.
8 minutes max.
Time 25°C to Peak Temperature
Note 1: Package volume excludes external
terminals (balls, bumps, lands, leads) and/or
non-integral heat sinks.
Tabel 1: SnPb Eutectic Process -
Package Peak Reflow Temperatures
Package
3
3
Volume mm < 350
Volume mm ≥ 350
Thickness
< 2.5 mm
≥ 2.5 mm
Note 2: The maximum component temperature
reached during reflow depends on package
thickness and volume. The use of convection
reflow processess reduces the thermal gradients
between packages. However, thermal gradients
due to differences in thermal mass of SMD pack-
ages may still exist.
240 +0/-5°C
225 +0/-5°C
225 +0/-5°C
225 +0/-5°C
Tabel 2: Pb-free Process -
Package Peak Reflow Temperatures
3
3
3
Package
Thickness
Volume mm
< 350
Volume mm
Volume mm
> 2000
Note 3: Components intended for use in “lead-
free” assembly process shall be evaluated using
the “lead-free” peak temperature and profiles
defined in Table 1, 2 and reflow profile whether
or not lead-free.
350 - 2000
260°C *
250°C *
245°C *
< 1.6 mm
1.6 mm - 2.5 mm
≥ 2.5 mm
260°C *
260°C *
250°C *
260°C *
245°C *
245°C *
* Tolerance: The device manufacturer/supplier shall assure process compat-
ibility up to and including the stated classification temperature at the rated MSL
level.
Wire and Film Technologies Division• 4222 South Staples Street • Corpus Christi Texas 78411 USA
ULR Issue July 2009 Sheet 5 of 6
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
Packaging Quantity
Series
Emboss Plastic Tape
2512
2010
1206
2,000
2,000
2,000
Ordering Data
Specify type, resistance, tolerance, ROHS compliance and packaging.
Example: Metal Element Current Sense Resistor, 1-watt, 10 mΩ resistor.
Sample Part No.
ULR
G
1
2512
R010
F
LF
SLT
IRC Type
Coating Color Code
G = Green, B = Black
Power Rating
(see specs table)
Package Size
Resistance Value (EIA 4-digit code)
Example: 0.010 = R010
Tolerance (EIA format)
F = 1%
J = 5%
RoHS - Compliance
LF = RoHS compliant Construction
Packaging
SLT = Standard Lead Tape
Product Marking
Part resistance is indicated by using two marking notation syles:
• 4-digit: R002 = 2 mΩ; R designates the decimal location in ohms.
• 3-digit: 1M5 = 1.5 mΩ; M designates the decimal location in milli-
ohm.
Wire and Film Technologies Division• 4222 South Staples Street • Corpus Christi Texas 78411 USA
ULR Issue July 2009 Sheet 6 of 6
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
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