WBDDQSC-A-01-1002-JG [TTELEC]
Wire Bondable Resistor Network Arrays; 线可粘接电阻网络阵列
| 型号： | WBDDQSC-A-01-1002-JG |
| 厂家： | 
TT Electronics |
| 描述： | Wire Bondable Resistor Network Arrays |
| 文件： | 总4页 (文件大小：711K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Wire Bondable
Resistor Network Arrays
Chip Network Array Series
• Absolute tolerances to ±0.1%
• Tight TCR tracking to ±5ppm/°C
• Ratio match tolerances to ±0.05%
• Ultra-stable tantalum nitride resistors
IRC’s TaNSil® network array resistors are ideally suited for applications
that demand a small footprint. The small wire bondable chip package
provides higher component density, lower resistor cost and high reliability.
The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking and low cost.
Excellent performance in harsh, humid environments is a trademark of IRC’s self-passivating TaNSil® resistor film.
For applications requiring high performance resistor networks in a low cost, wire bondable package, specify IRC
network array die.
Electrical Data
TCR/Inspection Code Table
Isolated
Bussed
Commercial
Code
MIL Inspection
Code*
Absolute TCR
Resistance Range
10Ω to 2.5MΩ
10Ω to 1.25MΩ
±300ppm/°C
±100ppm/°C
±50ppm/°C
±25ppm/°C
00
01
02
03
04
05
06
07
Absolute Tolerance
Ratio Tolerance to R1
Absolute TCR
to ±0.1%
to ±0.05%
to ±0.1%
to ±25ppm/°C
to ±5ppm/°C
100mW @ 70°C 50mW @ 70°C
Tracking TCR
Element Power Rating
*Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection
8-Pad 400mW @ 70°C
16-Pad 800mW @ 70°C
24-Pad 1.0W @ 70°C
Package Power Rating
Rated Operating Voltage
Power Derating Data
100V
(not to exceed P x R)
√
Operating Temperature
-55°C to +150°C
<-30dB
Noise
Substrate Material
Oxidized Silicon (10KÅ SiO2 minimum)
0.016˝ ±0.001
(0.406mm ±0.01)
Substrate Thickness
Aluminum
10KÅ minimum
15KÅ minimum
Bond Pad
Metallization
Gold
Silicon
(gold available)
Backside
Passivation
Silicon Dioxide or Silicon Nitride
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 1 of 4
Wire Bondable
Resistor Network Arrays
Manufacturing Capabilities Data
Isolated schematic A
Bussed schematic B
Absolute
TCR
(±ppm/°C)
Best TCR
tracking
(±ppm/°C)
Best TCR
tracking
(±ppm/°C)
Ohmic
range
(Ω)
Available
ratio
tolerances
Ohmic
range
(Ω)
Available
Available
Available
tolerances
ratio
tolerances
tolerances
10 - 25
26 - 50
51 - 200
F G J
D F G J
C D F G J
F G
50
10
5
10 - 25
26 - 50
F G J
F G J
F G
200
100
50
25
20
5
C D F
D F G
C D F G
51 - 100
101 - 200
201 - 500
D F G J
D F G J
C D F G
B C D F G
300
201 - 2.5M B C D F G J A B C D F G
5
B C D F G J B C D F G
501 - 1.25M B C D F G J A B C D F G
26 - 50
D F G J
C D F G
C D F G
A B F G
10
5
26 - 50
51 - 100
101 - 200
201 - 500
F G J
D F G
C D F G
B C D F G
100
50
25
20
5
51 - 200
C D F G J
D F G J
D F G J
100
201 - 2.5M B C D F G J
5
B C D F G J B C D F G
501 - 350K B C D F G J A B C D F G
26 - 50
D F G J
C D F G
C D F G
A B F G
10
5
51 - 100
101 - 200
201 - 500
D F G J
D F G J
C D F G
50
25
20
51 - 200
C D F G J
B C D F G
50
25
201 - 2.5M B C D F G J
5
B C D F G J B C D F G
501 - 1.25M B C D F G J A B C D F G
201 - 500 B C D F G J B C D F G
501 - 1.25M B C D F G J A B C D F G
5
20
5
51 - 200
C D F G J
C D F G
A B F G
5
5
201 - 2.5M B C D F G J
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 2 of 4
Wire Bondable
Resistor Network Arrays
Physical Data
DSS4A
DSS4X
8
7
6
5
0.070˝ ±0.001
(1.778mm ±0.025)
R1
1
8
2
3
4
5
DSS4B
7
6
Pad 1
R1
0.004˝ min Bond Pads
1
2
3
4
DSS8X
DSS8A
0.140˝ ±0.001
(3.556mm ±0.025)
16
15
14
13
12
11
10
9
R1
1
2
3
4
5
6
7
8
9
DSS8B
16
15
14
13
12
11
10
0.004˝ min Bond Pads
R1
1
2
3
4
5
6
7
8
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 3 of 4
Wire Bondable
Resistor Network Arrays
Physical Data
DQSCX
DQSCA
24
23
22
21
20
19
18
17
16
15
14
13
0.115˝ ±0.001
(2.921mm ±0.025)
R1
1
2
3
4
5
6
7
8
9
10
15
11
14
12
13
DQSCB
24
23
22
21
20
19
18
17
16
Pad 1
R1
0.004˝ min Bond Pads
1
2
3
4
5
6
7
8
9
10
11
12
Environmental Data
Ordering Data
Prefix
WBD DSS8 - B - 01 - 1002 - F - B
Style
Test
Method
Max ∆R Typical ∆R
DSS4 = 8-pad Network
DSS8 = 6-pad Network
DQSC = 24-pad Network
MIL-STD-202
Method 107
Test condition F
Schematic and Termination
Thermal Shock
±0.1%
±0.1%
±0.03%
±0.5%
±0.5%
±0.02%
±0.05%
±0.01%
±0.01%
±0.05%
A = Isolated; B = Bussed
TCR/Inspection Code
Reference TCR/Inspection Code Table
MIL-STD-883
Method 1008
150°C, 1000 hours
High Temperature
Exposure
Resistance Code
4-Digit Resistance Code
Ex: 1002 = 10KΩ, 50R1 = 50.1Ω
Absolute Tolerance Code
J = ±5%; G = ±2%; F = ±1%;
D = ±0.5%; C = ±0.25%; B = ±0.1%
Low Temperature
Storage
-55°C, 1000 hours
Ratio Tolerance Code (optional)
G = ±2%; F = ±1%; D = ±0.5%;
C = ±0.25%; B = ±0.1%; A = 0.05%
MIL-STD-202
Method 108
70°C, 1000 hours
Life
Packaging
Standard packaging is 2˝ x 2˝ chip tray. For additional information
or to discuss your specific requirements, please contact our Applications
Team using the contact details below.
MIL-STD-202
Method 108
125°C, 1000 hours
Life at Elevated
Temperature
© IRC Advanced Film Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
WBC Series Issue January 2009 Sheet 4 of 4
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