NDS351AN [TYSEMI]

SUPERSOT-3;
NDS351AN
型号: NDS351AN
厂家: TY Semiconductor Co., Ltd    TY Semiconductor Co., Ltd
描述:

SUPERSOT-3

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Product specification  
NDS351AN  
General Description  
Features  
1.2A, 30 V. RDS(ON) = 0.25 W @ VGS = 4.5 V  
These N-Channel logic level enhancement mode power field  
effect transistors are produced using Fairchild's proprietary,  
high cell density, DMOS technology. This very high density  
process is especially tailored to minimize on-state resistance.  
These devices are particularly suited for low voltage  
applications in notebook computers, portable phones, PCMCIA  
RDS(ON) = 0.16 W @ VGS = 10 V.  
Industry standard outline SOT-23 surface mount package  
using proprietary SuperSOTTM-3 design for superior  
thermal and electrical capabilities.  
cards, and  
other battery powered circuits where fast  
High density cell design for extremely low RDS(ON)  
.
switching, and low in-line power loss are needed in a very small  
outline surface mount package.  
Exceptional on-resistance and maximum DC current  
capability.  
Compact industry standard SOT-23 surface mount  
_________________________________________________________________________________  
D
S
G
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDSS  
VGSS  
ID  
Parameter  
NDS351AN  
Units  
Drain-Source Voltage  
30  
V
V
A
Gate-Source Voltage - Continuous  
Maximum Drain Current - Continuous  
- Pulsed  
20  
± 1.2  
(Note 1a)  
± 10  
Maximum Power Dissipation  
(Note 1a)  
(Note 1b)  
0.5  
W
PD  
0.46  
Operating and Storage Temperature Range  
-55 to 150  
°C  
TJ,TSTG  
THERMAL CHARACTERISTICS  
Rq  
Rq  
Thermal Resistance, Junction-to-Ambient (Note 1a)  
250  
75  
°C/W  
°C/W  
JA  
JC  
Thermal Resistance, Junction-to-Case  
(Note 1)  
1 of 3  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  
Product specification  
NDS351AN  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
BVDSS  
IDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 µA  
VDS = 24 V, VGS = 0 V  
30  
V
Zero Gate Voltage Drain Current  
1
µA  
µA  
nA  
nA  
10  
TJ =125°C  
IGSSF  
IGSSR  
Gate - Body Leakage, Forward  
Gate - Body Leakage, Reverse  
VGS = 20 VDS = 0 V  
100  
-100  
VGS = -20 V, VDS = 0 V  
ON CHARACTERISTICS (Note 2)  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS, ID = 250 µA  
VGS = 4.5 V, ID = 1.2 A  
0.8  
0.5  
1.7  
1.3  
2
V
1.5  
TJ =125°C  
TJ =125°C  
Static Drain-Source On-Resistance  
0.19  
0.28  
0.125  
0.25  
0.37  
0.16  
RDS(ON)  
W
VGS = 10 V, ID = 1.4 A  
VGS = 4.5 V, VDS = 5 V  
VDS = 5 V, ID= 1.2 A,  
On-State Drain Current  
3.5  
A
S
ID(ON)  
gFS  
Forward Transconductance  
1.8  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
125  
100  
90  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
VDS = 10 V, VGS = 0 V,  
f = 1.0 MHz  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS (Note 2)  
td(on)  
tr  
td(off)  
tf  
Turn - On Delay Time  
Turn - On Rise Time  
Turn - Off Delay Time  
Turn - Off Fall Time  
Total Gate Charge  
VDD = 10 V, ID = 1 A,  
6
15  
30  
30  
40  
2.7  
ns  
ns  
VGS = 10 V, RGEN = 50 W  
15  
14  
18  
1.9  
0.5  
0.9  
ns  
ns  
Qg  
Qgs  
Qgd  
VDS = 10 V, ID = 1.2 A,  
VGS = 4.5 V  
nC  
nC  
nC  
Gate-Source Charge  
Gate-Drain Charge  
2 of 3  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  
Product specification  
NDS351AN  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
0.42  
5
A
A
V
ISM  
VSD  
Drain-Source Diode Forward Voltage  
VGS = 0 V, IS = 1.2 A (Note 2)  
0.8  
1.2  
Notes:  
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
guaranteed by design while RqCA is determined by the user's board design.  
the drain pins. RqJC is  
T
J
- T  
A
-
T
T
A
J
PD  
=
=
= I2D (t) ´ RDS(ON )  
J
qJC+RqCA(t)  
( )  
t
T
R
qJA(t)  
R
Typical RqJA using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:  
a. 250oC/W when mounted on a 0.02 in2 pad of 2oz copper.  
b. 270oC/W when mounted on a 0.001 in2 pad of 2oz copper.  
1a  
1b  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.  
3 of 3  
http://www.twtysemi.com  
sales@twtysemi.com  
4008-318-123  

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