CHA7115-99F [UMS]

X-band High Power Amplifier; X波段高功率放大器
CHA7115-99F
型号: CHA7115-99F
厂家: UNITED MONOLITHIC SEMICONDUCTORS    UNITED MONOLITHIC SEMICONDUCTORS
描述:

X-band High Power Amplifier
X波段高功率放大器

放大器 功率放大器
文件: 总6页 (文件大小:141K)
中文:  中文翻译
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CHA7115-99F  
RoHS COMPLIANT  
X-band High Power Amplifier  
GaAs Monolithic Microwave IC  
Description  
Vg3  
Vd3  
The CHA7115 is a monolithic three-stage  
GaAs high power amplifier designed for  
X-band applications.  
The HPA provides typically 8W output power  
associated to 36% power added efficiency at  
Vg2 Vd2  
Vg1  
Vd1  
IN  
OUT  
4dBcomp and  
mismatch load.  
a
high robustness on  
Vd2  
This device is manufactured using 0.25µm  
Power pHEMT process, including, via holes  
through the substrate and air bridges.  
It is available in chip form.  
Vg3 Vd3  
44  
Main Features  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
22  
Pout @ 4dBc  
0.25µm Power pHEMT Technology  
Frequency band: 8.5 11.5GHz  
Output power : 39dBm @ 4dBcomp  
High linear gain: > 27dB  
High PAE : 37% @ 4dBcomp  
Quiescent bias point: Vd=8V, Id=2.2A  
Chip size: 4.59 x 3.31 x 0.07mm  
PAE @ 4dBc  
Linear Gain  
Pulse : 25µs 10%  
8
8.5  
9
9.5  
10  
10.5  
11  
11.5  
12  
Frequency (GHz)  
Main Characteristics  
Vd = 8V, Id (Quiescent) = 2.2A, Drain Pulse width = 25µs, Duty cycle = 10%  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
Fop  
Operating frequency range  
8.5  
11.5  
GHz  
%
PAE_4dB Power added efficiency @4dBcomp @ 20°C  
37  
39  
P_4dB  
G
Output power @ 4dBcomp @ 20°C  
Small signal gain @ 20°C  
dBm  
dB  
27.5  
ESD Protections: Electrostatic discharge sensitive device. Observe handling precautions!  
Ref : DSCHA71151069 - 10 Mar 11  
1/6  
Specifications subject to change without notice  
United Monolithic Semiconductors S.A.S.  
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France  
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7115-99F  
Electrical Characteristics on wafer  
Tamb = 20°C, Vd = 8V, Id (Quiescent) = 2.2A, Drain Pulse width = 25µs, Duty cycle = 10%  
Symbol  
Parameter  
Operating frequency  
Min  
Typ  
Max  
Unit  
GHz  
dB  
dB  
dB  
dBm  
%
Fop  
8.5  
11.5  
G
Small signal gain  
27.5  
10  
RLin  
Input Return Loss  
RLout  
P_4dBc  
PAE_4dB  
Id_4dB  
Vd1, Vd2, Vd3  
Id  
Output Return Loss  
12  
Output power @ 4dBcomp (2)  
Power Added Efficiency @ 4dBcomp  
Supply drain current @ 4dBcomp  
Drain supply voltage (2)  
Supply quiescent current (1)  
Gate supply voltage  
39  
37  
2.6  
8
A
V
2.2  
-1.4  
A
Vg  
V
(1) Parameter can be adjusted by tuning of Vg.  
(2) 0.5V variation on Vd leads to around 0.4dB variation of the output power (impact on  
robustness see Maximum ratings).  
Absolute Maximum Ratings (1)  
Tamb = 20°C  
Symbol  
Cmp  
Vd  
Parameter  
Compression level (2)  
Values  
Unit  
dB  
V
6
Supply voltage (3)  
10  
2.8  
Id  
Supply quiescent current  
Supply current in saturation  
Supply voltage  
A
Id_sat  
Vg  
4
A
-0.8  
V
Tj  
Maximum junction temperature  
Storage temperature range  
Operating temperature range  
175  
°C  
°C  
°C  
Tstg  
Top  
-55 to +150  
-40 to +80  
(1)  
(2)  
(3)  
Operation of this device above anyone of these parameters may cause permanent  
damage.  
For higher compression the level limit can be increased by decreasing the voltage  
Vd using the rate 0.5V/dBc.  
Without RF input power.  
Ref DSCHA71151069 - 10 Mar 11  
2/6  
Specifications subject to change without notice  
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7115-99F  
Typical measured characteristics  
Measurements on Wafer:  
Vd = 8V, Id (Quiescent) = 2.2A, Drain Pulse width = 25µs, Duty cycle = 10%  
Linear gain versus frequency  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
8
8.5  
9
9.5  
10  
10.5  
11  
11.5  
12  
Frequency (GHz)  
Output Power @ 4dBcomp versus frequency  
42.0  
41.5  
41.0  
40.5  
40.0  
39.5  
39.0  
38.5  
38.0  
37.5  
37.0  
36.5  
36.0  
35.5  
35.0  
8
8.5  
9
9.5  
10  
10.5  
11  
11.5  
12  
Frequency (GHz)  
Ref : DSCHA71151069 - 10 Mar 11  
3/6  
Specifications subject to change without notice  
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7115-99F  
Power added efficiency @ 4dBcomp versus frequency  
46  
44  
42  
40  
38  
36  
34  
32  
30  
28  
26  
24  
8
8.5  
9
9.5  
10  
10.5  
11  
11.5  
12  
Frequency (GHz)  
Drain Current @ 4dBcomp versus frequency  
4
3.5  
3
2.5  
2
1.5  
1
0.5  
0
8
8.5  
9
9.5  
10  
10.5  
11  
11.5  
12  
Frequency (GHz)  
Ref DSCHA71151069 - 10 Mar 11  
4/6  
Specifications subject to change without notice  
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7115-99F  
Chip Mechanical Data and Pin references  
2
3
4
5
6
7
8
9 10 11 12  
13  
14  
15  
1
16  
27 26 25 24  
23 22 21 20  
19  
18  
17  
Chip width and length are given with a tolerance of +/- 35µm  
Chip thickness  
RF pads (1, 16)  
DC pads wide (14, 18)  
= 70µm +/- 10µm  
= 118 x 196µm²  
= 186 x 100µm²  
DC pads (others, 2 to 27) = 100 x 100µm²  
Pin number  
Pin name  
Description  
Input RF  
1
2, 5, 6, 7, 8, 11, 12, 20, 24, 25  
3, 21  
4, 9, 13, 15, 17, 19, 23, 27  
10, 14, 18, 22,26  
16  
IN  
G
GR  
GND  
VD  
NC  
Gate supply voltage  
Ground (NC)  
Drain supply voltage  
Output RF  
OUT  
Ref : DSCHA71151069 - 10 Mar 11  
5/6  
Specifications subject to change without notice  
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7115-99F  
Bonding recommendations  
Port  
IN  
Connection  
Inductance (Lbonding) = 0.3nH  
2 gold wires with diameter of 25µm (550µm max)  
External capacitor  
Inductance (Lbonding) = 0.3nH  
2 gold wires with diameter of 25µm (550µm max)  
OUT  
C1 ~ 100pF, C2 ~ 10nF  
C1 ~ 100pF  
Vg  
Vd  
Inductance 1nH  
Inductance 1nH  
Assembly recommendations in test fixture  
Vg  
Vd  
Vg  
Vd  
C1=100pF  
C2=10nF  
Non capacitive pad  
Ordering Information  
Chip form  
:
CHA7115-99F/00  
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors  
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of  
patents or other rights of third parties which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all  
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorized for use  
as critical components in life support devices or systems without express written approval from United  
Monolithic Semiconductors S.A.S.  
Ref DSCHA71151069 - 10 Mar 11  
6/6  
Specifications subject to change without notice  
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  

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