CHA7215 [UMS]
X-band High Power Amplifier; X波段高功率放大器型号: | CHA7215 |
厂家: | UNITED MONOLITHIC SEMICONDUCTORS |
描述: | X-band High Power Amplifier |
文件: | 总8页 (文件大小:198K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CHA7215
RoHS COMPLIANT
X-band High Power Amplifier
GaAs Monolithic Microwave IC
VD1
VD2
VD3
VG1R
VG2R
VG3R
Description
●
●
●
●
●
●
The CHA7215 is a monolithic three-stage
GaAs high power amplifier designed for X
band applications.
●
●
IN
OUT
The HPA provides typically 9W output power
associated to 35% power added efficiency at
4dBc and a high robustness on mismatch
load.
●
●
●
●
VD1
VD2
VG3R VD3
This device is manufactured using 0.25 µm
Power pHEMT process, including, via holes
through the substrate and air bridges.
Output Power versus Frequency @Pin=19dBm
41
40,5
40
39,5
39
Main Features
38,5
38
ꢀ 0.25 µm Power pHEMT Technology
ꢀ Frequency band: 8.5 – 11.5GHz
ꢀ Output power: 39.5dBm at saturation
ꢀ High linear gain: 28dB
ꢀ Power added efficiency: 34% @4dBc
ꢀ Quiescent bias point: Vd=8V, Id=2.3A
37,5
37
36,5
36
Temp=-40°C
Temp=+20°C
Temp=+80°C
35,5
35
ꢀ Chip size: 5 x 3.31 x 0.07mm
8
8,5
9
9,5
10
10,5
11
11,5
12
Frequency (GHz)
Main Characteristics
Vd=8V, Id (Quiescent) = 2.3A, Drain Pulse width = 25µs, Duty cycle = 10%
Symbol
Parameter
Operating temperature range
Operating frequency range
Min
-40
8.5
Typ
Max
+80
11.5
Unit
Top
°C
GHz
%
Fop
PAE_4dBc Power added efficiency @4dBc @ 20°C
34
Psat
G
Saturated output power @ 20°C
Small signal gain @ 20°C
39.5
28
dBm
dB
25
31
ESD Protections: Electrostatic discharge sensitive device. Observe handling precautions!
Ref : DSCHA72159287 - 14 Oct 09
1/8
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
Electrical Characteristics on test fixture
Tamb = 20°C, Vd=8V, Id (Quiescent) = 2.3A, Drain Pu lse width = 25µs, Duty cycle = 10%
Symbol
Fop
Parameter
Operating frequency
Min
8.5
25
Typ
Max
11.5
31
Unit
GHz
dB
G
Small signal gain
28
Small signal gain variation versus
temperature
-0.05
dB/°C
G_T
RLin
RLout
Psat
Input Return Loss
10
12
dB
dB
Output Return Loss
Saturated output power
39.5
-0.01
dBm
dB/°C
Saturated output power variation versus
temperature
Psat_T
PAE_4dBc
Power added efficiency @4dBc
Supply drain current @ 4dBc
Drain supply voltage (2)
34
3.3
8
%
A
V
A
V
Id_4dBc
4.4
Vd1, Vd2, Vd3
Id
Supply quiescent current (1)
Gate supply voltage
2.3
-2.2
Vg1, Vg2, Vg3
(1) Parameter can be adjusted by tuning of Vg.
(2) 0.5V variation on Vd leads to around 0.4dB variation of the output power (impact on
robustness see Maximum ratings)
Absolute Maximum Ratings (1)
Tamb = 20°C
Symbol
Cmp
Vd
Parameter
Compression level (2)
Values
Unit
dBc
V
6
Supply voltage with RF input power
Supply voltage without RF input power
Supply quiescent current
9
Vd
10
3
V
Id
A
Id_sat
Vg
Supply current in saturation
Supply voltage
4.8
A
-1.1
V
Tj
Maximum junction temperature
Storage temperature range
Operating temperature range
175
°C
°C
°C
Tstg
Top
(1)
-55 to +125
-40 to +80
Operation of this device above anyone of these parameters may cause
permanent damage.
(2)
For higher compression the level limit can be increased by decreasing the voltage
Vd using the rate 0.5 V / dBc
Ref : DSCHA72159287 - 14 Oct 09
2/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
Typical measured characteristics
Measurements on Jig:
Vd=8V, Id (Quiescent) = 2.3A, Drain Pulse width = 25µs, Duty cycle = 10%
38
36
Temp=-40°C
34
Temp=+20°C
Temp=+80°C
32
30
28
26
24
22
20
18
8
8,5
9
9,5
10
10,5
11
11,5
12
Frequency (GHz)
Linear gain versus frequency and temperature
42
40
38
36
34
32
30
28
26
24
22
20
18
16
Pout
Gain
Temp=-40°C
Temp=-40°C
Temp=+20°C
Temp=+20°C
Temp=+80°C
Temp=+80°C
0
2
4
6
8
10
12
14
16
18
20
Input Power (dBm)
Linear Gain and Output Power @Freq=10GHz
versus input power and temperature
Ref : DSCHA72159287 - 14 Oct 09
3/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
41
40,5
40
39,5
39
38,5
38
37,5
37
Temp=-40°C
Temp=+20°C
Temp=+80°C
36,5
36
35,5
35
34,5
34
8
8,5
9
9,5
10
10,5
11
11,5
12
Frequency (GHz)
Output Power @Pin=17dBm versus frequency and temperature
5
4,5
4
3,5
3
2,5
2
1,5
1
Temp=-40°C
Temp=+20°C
Temp=+80°C
0,5
0
8
8,5
9
9,5
10
10,5
11
11,5
12
Frequency (GHz)
Id @Pin=17dBm versus frequency and temperature
Ref : DSCHA72159287 - 14 Oct 09
4/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
50
45
40
35
30
25
20
15
10
5
Temp=-40°C
Temp=+20°C
Temp=+80°C
0
8
8,5
9
9,5
10
10,5
11
11,5
12
Frequency (GHz)
PAE @Pin=17dBm versus frequency and temperature
Ref : DSCHA72159287 - 14 Oct 09
5/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
Chip Mechanical Data and Pin references
3 205
3 205
2
3
4
5
6
7
8
9
10 11
12
13
14
1 855
1 655
1 855
1 655
15
1
28 27 26 25 24 23 22 21 20 19
18
17 16
105
105
000
5 000
Chip thickness = 70µm +/- 10 µm
RF pads (1, 15) = (122 x 200) µm²
DC pads (2 to 12, 14, 16, 18 to 28) = (100 x 100) µm²
DC pads (13, 17) = (186 x 100) µm²
Pin number
1, 15
3, 8, 12, 18
Pin name
IN / OUT
GiR
M
Di
Gi / GiR
Description
Input / Output RF
Gate supply voltage
Ground (Not connected)
Drain supply voltage
Not connected
4, 6, 10, 14, 16, 20, 24, 26
5, 9, 13, 17, 21, 25
2, 7, 11, 19, 22, 23, 27, 28
Ref : DSCHA72159287 - 14 Oct 09
6/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
Bonding recommendations
Port
Connection
External capacitor
Inductance (Lbonding) = 0.35nH
2 gold wires with diameter of 25 µm (600µm max)
Inductance (Lbonding) = 0.35nH
IN
OUT
2 gold wires with diameter of 25 µm (600µm max)
C1 ~ 100pF
C2 ~ 10nF
C1 ~ 100pF
Vg
Vd
Inductance ≤ 1nH
Inductance ≤ 1nH
Assembly recommendations in test fixture
Vg
Vd
Vd
Vg
C1=100pF
C2=10nF
Non capacitive pad
Recommended ESD management
Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD
sensitivity and handling recommendations for the UMS products.
Ref : DSCHA72159287 - 14 Oct 09
7/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
X-band High Power Amplifier
CHA7215
Ordering Information
Chip form
:
CHA7215-99F/00
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
Ref : DSCHA72159287 - 14 Oct 09
8/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
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