CHR2391-9900 [UMS]

12-16GHz Integrated Down Converter; 12-16GHz集成下变频器
CHR2391-9900
型号: CHR2391-9900
厂家: UNITED MONOLITHIC SEMICONDUCTORS    UNITED MONOLITHIC SEMICONDUCTORS
描述:

12-16GHz Integrated Down Converter
12-16GHz集成下变频器

文件: 总6页 (文件大小:207K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CHR2391  
RoHS COMPLIANT  
12-16GHz Integrated Down Converter  
GaAs Monolithic Microwave IC  
Description  
The CHR2391 is a multifunction chip which  
integrates a LO time two multiplier, a balanced  
cold FET mixer, and a RF LNA. It is designed for  
a wide range of applications, typically commercial  
communication systems. The backside of the  
chip is both RF and DC grounds. This helps to  
simplify the assembly process.  
The circuit is manufactured with a pHEMT  
process, 0.25µm gate length, via holes through  
the substrate and air bridges.  
It is available in chip form.  
Typical on wafer measurement:  
Conversion Gain & Image suppression  
@ IF=0.9 & 1.5GHz  
Main Features  
.
.
.
.
.
.
.
Broadband performances: 12.0-16.0GHz  
15 dB conversion gain  
2dB noise figure, for IF>0.1GHz  
10dBm LO input power  
-10dBm RF input power (1dB gain comp.)  
Low DC power consumption, 100mA@3.5V  
Chip size: 2.49 X 2.13 X 0.10mm  
22  
20  
18  
16  
14  
12  
10  
8
2 LO frequency  
6
4
2
0
-2  
-4  
-6  
-8  
-10  
-12  
-14  
-16  
10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 16.5 17.0 17.5  
RF Frequency GHz  
Main Characteristics  
Tamb. = 25°C  
Symbol  
Parameter  
Min  
12  
Typ  
Max  
16  
Unit  
GHz  
GHz  
GHz  
dB  
FRF  
FLO  
FIF  
RF frequency range  
LO frequency range  
IF frequency range  
Conversion gain  
5.25  
DC  
13  
7.25  
1.5  
Gc  
+15  
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !  
Ref. : DSCHR23911192 - 11 Jul 11  
1/6  
Specifications subject to change without notice  
United Monolithic Semiconductors S.A.S.  
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France  
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
12 -16GHz Integrated Down Converter  
CHR2391  
Electrical Characteristics for Broadband Operation  
Tamb = +25°C, Vd = 3.5V ,Idl=50mA, Idm=50mA  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
FRF  
FLO  
FIF  
RF frequency range  
12  
5.25  
DC  
16  
7.25  
1.5  
GHz  
GHz  
GHz  
dB  
LO frequency range  
IF frequency range  
Gc  
Conversion gain (1)  
Noise Figure, for IF>0.1GHz (1)  
LO Input power  
+13  
+15  
2
NF  
PLO  
2.5  
dB  
+10  
15  
+13  
dBm  
dBc  
dBm  
dBm  
Img Sup Image Suppression  
P1dB  
IP3  
Input power at 1dB gain compression  
Input IP3  
-10  
2.5  
LO VSWR Input LO VSWR (1)  
RF VSWR Input RF VSWR (1)  
2.0:1  
2.0:1  
100  
Id  
Bias current (2)  
130  
mA  
(1) On Wafer measurements  
(2) Current source biasing network is recommended.  
Optimum performances are obtained for Idm=50mA (Id consumption of the X2+buffer; vgb-0.4V)  
and Idl=50mA(Id consumption for the lna; Vga-0.4V)  
Absolute Maximum Ratings  
Tamb. = 25°C (1)  
Symbol  
Vd  
Parameter  
Maximum drain bias voltage  
Maximum drain bias current  
Values  
4.0  
Unit  
V
Id  
180  
mA  
V
Vg  
Gate bias voltage  
-2.0 to +0.4  
+5  
Vdg  
Pin  
Maximum drain to gate voltage ( Vd Vg)  
Maximum RF peak input power overdrive (2)  
Maximum channel temperature  
Operating temperature range  
Storage temperature range  
V
-5  
dBm  
°C  
°C  
°C  
Tch  
Ta  
175  
-40 to +85  
-55 to +125  
Tstg  
(1) Operation of this device above anyone of these parameters may cause permanent damage.  
(2) Duration < 1s.  
Ref. : : DSCHR23911192 - 11 Jul 11  
2/6  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
12 -16GHz Integrated Down Converter  
CHR2391  
Typical On-wafer Measurements  
Bias Conditions:  
Vdm= Vdl= 3.5 V, Idl= Idm= 50mA( Vga=vgb-0.4V), Vgm= -0.7V, Vgx= -0.6V  
Conversion gain & Image suppression with a 90° IQ combiner  
22  
IF= 0,9GHz  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
-2  
-4  
-6  
-8  
Infradyne Gain I  
Image Rejection I  
Infradyne Gain Q  
-10  
-12  
-14  
-16  
Image Rejection Q  
10,0 10,5 11,0 11,5 12,0 12,5 13,0 13,5 14,0 14,5 15,0 15,5 16,0 16,5 17,0  
RF Frequency GHz  
22  
IF= 1,5GHz  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
-2  
-4  
-6  
-8  
Infradyne Gain I  
Image Rejection Q  
Image Rejection I  
Infradyne Gain Q  
-10  
-12  
-14  
-16  
10,0 10,5 11,0 11,5 12,0 12,5 13,0 13,5 14,0 14,5 15,0 15,5 16,0 16,5 17,0 17,5  
RF Frequency GHz  
Ref. : : DSCHR23911192 - 11 Jul 11  
3/6  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
12 -16GHz Integrated Down Converter  
CHR2391  
Gain compression versus RF input power  
20  
18  
16  
14  
12  
10  
8
IF=0.9GHz  
6
Conversion Gain dB  
IF Output power dBm  
4
2
0
-20  
-18  
-16  
-14  
-12  
-10  
-8  
-6  
-4  
-2  
0
RF Input power dBm  
20  
IF=1.5GHz  
18  
16  
14  
12  
10  
8
Conversion Gain dB  
IF Output power dBm  
6
4
2
0
-20  
-18  
-16  
-14  
-12  
-10  
-8  
-6  
-4  
-2  
0
RF Input power dBm  
4/6 Specifications subject to change without notice  
Ref. : : DSCHR23911192 - 11 Jul 11  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
12 -16GHz Integrated Down Converter  
CHR2391  
Chip Assembly and Mechanical Data  
To Vg (lna) DC Gate  
To Vg (mixer) DC Gate  
To  
VdL (lna)  
+VdM  
(x +buffer)  
DC Gate supply  
To Vg (Buffer) DC Gate  
To Vg (multiplier) DC Gate  
Note: Supply feed should be capacitively bypassed. 25µm diameter gold wire is  
recommended  
Bonding pad positions  
Chip thickness: 100µm  
Unit: µm  
Tol : + / - 35µm  
Ref. : : DSCHR23911192 - 11 Jul 11  
5/6  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
12 -16GHz Integrated Down Converter  
CHR2391  
Ordering Information  
Chip form  
:
CHR2391-99F/00  
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors  
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of  
patents or other rights of third parties which may result from its use. No license is granted by implication or  
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications  
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all  
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use  
as critical components in life support devices or systems without express written approval from United  
Monolithic Semiconductors S.A.S.  
Ref. : DSCHR23911192 - 11 Jul 11  
6/6  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  

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