UD3010 [UNITPOWER]

N-Ch 30V Fast Switching MOSFETs; N-CH 30V的快速开关MOSFET
UD3010
型号: UD3010
厂家: ShenZhen XinDeYi Electronics Co., Ltd.    ShenZhen XinDeYi Electronics Co., Ltd.
描述:

N-Ch 30V Fast Switching MOSFETs
N-CH 30V的快速开关MOSFET

开关
文件: 总4页 (文件大小:716K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
UD3010  
N-Ch 30V Fast Switching MOSFETs  
General Description  
Product Summery  
The UD3010 is the highest performance trench  
N-ch MOSFETs with extreme high cell density ,  
which provide excellent RDSON and gate charge  
for most of the synchronous buck converter  
applications .  
RDS(ON)  
BVDSS  
ID  
30V  
45m  
15A  
Applications  
The UD3010 meet the RoHS and Green Product  
requirement with full function reliability approved.  
z High Frequency Point-of-Load Synchronous  
Buck Converter for MB/NB/UMPC/VGA  
z Networking DC-DC Power System  
z Load Switch  
Features  
TO252 Pin Configuration  
z Advanced high cell density Trench technology  
z Super Low Gate Charge  
z Excellent CdV/dt effect decline  
z 100% EAS Guaranteed  
z Green Device Available  
Absolute Maximum Ratings  
Symbol  
VDS  
Parameter  
Rating  
30  
Units  
V
Drain-Source Voltage  
VGS  
Gate-Source Voltage  
±20  
15  
V
ID@TC=25℃  
ID@TC=100℃  
ID@TA=25℃  
ID@TA=70℃  
IDM  
Continuous Drain Current, VGS @ 10V1  
Continuous Drain Current, VGS @ 10V1  
Continuous Drain Current, VGS @ 10V1  
Continuous Drain Current, VGS @ 10V1  
Pulsed Drain Current2  
A
9.5  
A
5.4  
A
4.3  
A
30  
A
PD@TC=25℃  
PD@TA=25℃  
TSTG  
Total Power Dissipation3  
Total Power Dissipation3  
15.6  
2
W
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
RθJA  
Parameter  
Typ.  
---  
Max.  
62  
Unit  
/W  
/W  
Thermal Resistance Junction-Ambient 1  
Thermal Resistance Junction-Case1  
RθJC  
---  
8
1
UD3010  
N-Ch 30V Fast Switching MOSFETs  
Electrical Characteristics (TJ=25 , unless otherwise noted)  
Symbol  
Parameter  
Conditions  
VGS=0V , ID=250uA  
Min.  
30  
---  
---  
---  
1.0  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
Typ.  
---  
Max.  
---  
Unit  
V
BVDSS  
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
BVDSS/△TJ  
Reference to 25, ID=1mA  
VGS=10V , ID=10A  
0.016  
38  
---  
V/℃  
45  
RDS(ON)  
Static Drain-Source On-Resistance2  
mΩ  
VGS=4.5V , ID=5A  
56  
70  
VGS(th)  
Gate Threshold Voltage  
1.5  
-3.04  
---  
2.5  
V
VGS=VDS , ID =250uA  
VGS(th)  
V
GS(th) Temperature Coefficient  
---  
mV/℃  
VDS=24V , VGS=0V , TJ=25℃  
VDS=24V , VGS=0V , TJ=55℃  
1
IDSS  
Drain-Source Leakage Current  
uA  
---  
5
VGS=±20V , VDS=0V  
IGSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
---  
±100  
---  
nA  
S
VDS=5V , ID=10A  
6.7  
2.3  
2.65  
1.08  
1.06  
1.0  
13.8  
7.2  
3.6  
220  
38  
Rg  
VDS=0V , VGS=0V , f=1MHz  
4.6  
Ω
Qg  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
3.71  
1.51  
1.48  
2.0  
VDS=15V , VGS=4.5V , ID=10A  
nC  
ns  
Qgs  
Qgd  
Td(on)  
Tr  
VDD=15V , VGS=10V , RG=3.3Ω  
24.8  
14.4  
7.2  
ID=10A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
Ciss  
Coss  
Crss  
Input Capacitance  
308.0  
53.2  
44.8  
VDS=15V , VGS=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
32  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
---  
Typ.  
---  
Max.  
15  
30  
1
Unit  
A
IS  
ISM  
VSD  
trr  
Continuous Source Current1,4  
Pulsed Source Current2,4  
Diode Forward Voltage2  
Reverse Recovery Time  
Reverse Recovery Charge  
VG=VD=0V , Force Current  
---  
---  
A
VGS=0V , IS=1A , TJ=25℃  
---  
---  
V
---  
4.2  
0.83  
---  
nS  
nC  
IF=10A , dI/dt=100A/µs , TJ=25℃  
Qrr  
---  
---  
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width 300us , duty cycle 2%  
3.The power dissipation is limited by 150junction temperature  
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
2
UD3010  
N-Ch 30V Fast Switching MOSFETs  
Typical Characteristics  
80.0  
70.0  
60.0  
50.0  
40.0  
ID=10A  
2
4
6
8
10  
VGS (V)  
Fig.2 On-Resistance vs. G-S Voltage  
Fig.1 Typical Output Characteristics  
10  
8
6
T =150  
T =25  
J
J
4
2
0
0
0.3  
0.6  
0.9  
1.2  
VSD , Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
1.5  
2.0  
1.5  
1.0  
0.5  
1
0.5  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T ,Junction Temperature (  
)
J
T , Junction Temperature (  
J
)
Fig.5 Normalized VGS(th) vs. TJ  
Fig.6 Normalized RDSON vs. TJ  
3
UD3010  
N-Ch 30V Fast Switching MOSFETs  
1000  
100  
10  
100.00  
10.00  
1.00  
F=1.0MHz  
10us  
100us  
Ciss  
10ms  
100ms  
DC  
Coss  
Crss  
0.10  
T =25  
C
Single Pulse  
0.01  
0.1  
1
10  
100  
1
5
9
13  
17  
21  
25  
VDS Drain to Source Voltage(V)  
VDS (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
PDM  
0.01  
SINGLE PULSE  
TON  
T
D = TON/T  
TJpeak = TC + PDM x RθJC  
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Gate Charge Waveform  
4

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