UM3015 [UNITPOWER]

P-Ch 30V Fast Switching MOSFETs; P沟道30V的快速开关MOSFET
UM3015
型号: UM3015
厂家: ShenZhen XinDeYi Electronics Co., Ltd.    ShenZhen XinDeYi Electronics Co., Ltd.
描述:

P-Ch 30V Fast Switching MOSFETs
P沟道30V的快速开关MOSFET

开关
文件: 总4页 (文件大小:484K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Unitpower  
UM3015  
P-Ch 30V Fast Switching MOSFETs  
General Description  
Product Summery  
The UM3015 is the highest performance trench  
P-ch MOSFETs with extreme high cell density ,  
which provide excellent RDSON and gate charge  
for most of the synchronous buck converter  
applications .  
BVDSS  
RDSON  
ID  
-30V  
10.5m  
-10A  
Applications  
The UM3015 meet the RoHS and Green Product  
requirement , 100% EAS guaranteed with full  
High Frequency Point-of-Load Synchronous  
Buck Converter for MB/NB/UMPC/VGA  
Networking DC-DC Power System  
Load Switch  
function reliability approved.  
Features  
SOP8 Pin Configuration  
Advanced high cell density Trench technology  
Super Low Gate Charge  
Excellent CdV/dt effect decline  
100% EAS Guaranteed  
Green Device Available  
S O-8  
1
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
-30  
Units  
V
VDS  
VGS  
Drain-Source Voltage  
Gate-Souce Voltage  
20  
-10  
V
ID@TA=25ꢁ  
ID@TA=70ꢁ  
IDM  
Continuous Drain Current, VGS @ -10V1  
Continuous Drain Current, VGS @ -10V1  
PulsedDrain Current2  
A
-8  
A
-40  
A
EAS  
Single Pulse Avalanche Energy3  
408  
mJ  
A
IAS  
Avalanche Current  
Total Power Dissipation4  
-55.4  
1.5  
PD@TA=25ꢁ  
TSTG  
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
ꢁꢂ  
ꢁꢂ  
TJ  
Thermal Data  
Symbol  
RJA  
Parameter  
Typ.  
---  
Max.  
85  
Unit  
Thermal Resistance Junction-Ambient 1  
Thermal Resistance Junction-Case1  
/Wꢀ  
/Wꢀ  
RJC  
---  
24  
Rev A.04 D072011  
1
Unitpower  
UM3015  
P-Ch 30V Fast Switching MOSFETs  
Electrical Characteristics (TJ=25ꢂꢁ, unless otherwise noted)  
Symbol  
Parameter  
Conditions  
VGS=0V , ID=-250uA  
Min.  
-30  
---  
Typ.  
---  
Max.  
---  
Unit  
V
BVDSS  
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
BVDSSꢂꢁTJ  
Reference to 25, ID=-1mA  
VGS=-10V , ID=-10A  
-0.018  
8
---  
V/ꢁ  
---  
10.5  
18.5  
-2.5  
---  
RDS(ON)  
Static Drain-Source On-Resistance2  
mꢂ  
VGS=-4.5V , ID=-8A  
---  
14  
VGS(th)  
Gate Threshold Voltage  
-1.2  
---  
-1.6  
5.04  
---  
V
VGS=VDS , ID =-250uA  
VGS(th)  
V
GS(th) Temperature Coefficient  
mV/ꢁ  
VDS=-24V , VGS=0V , TJ=25ꢁ  
VDS=-24V , VGS=0V , TJ=55ꢁ  
---  
-1  
IDSS  
Drain-Source Leakage Current  
uA  
---  
---  
-5  
V
GS20V , VDS=0V  
IGSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
---  
---  
100  
---  
nA  
S
VDS=-5V , ID=-10A  
---  
25  
Qg  
---  
30  
42  
VDS=-15V , VGS=-4.5V , ID=-10A  
nC  
Qgs  
Qgd  
Td(on)  
Tr  
---  
10  
14  
---  
10.4  
9.4  
10.2  
117  
24  
14.6  
19  
Turn-On Delay Time  
Rise Time  
---  
VDD=-15V , VGS=-10V , RG=3.3,  
---  
18  
ns  
ID=-10A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
---  
234  
48  
---  
Ciss  
Coss  
Crss  
Input Capacitance  
---  
3448  
508  
421  
4827  
711  
589  
VDS=-15V , VGS=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
---  
---  
Guaranteed Avalanche Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
EAS  
Single Pulse Avalanche Energy5  
120  
---  
---  
mJ  
VDD=-25V , L=0.1mH , IAS=-30A  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
---  
Typ.  
---  
Max.  
-10  
-40  
-1.2  
---  
Unit  
A
IS  
ISM  
VSD  
trr  
Continuous Source Current1,6  
Pulsed Source Current2,6  
Diode Forward Voltage2  
Reverse Recovery Time  
Reverse Recovery Charge  
VG=VD=0V , Force Current  
---  
---  
A
VGS=0V , IS=-1A , TJ=25ꢁ  
IF=-10A , dI/dt=100A/µs ,  
TJ=25ꢁ  
---  
---  
V
---  
19.4  
9.1  
nS  
nC  
Qrr  
---  
---  
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width 300us , duty cycle 2%  
3.The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.1mH,IAS=-55.4A  
4.The power dissipation is limited by 150junction temperature  
5.The Min. value is 100% EAS tested guarantee.  
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
2
Unitpower  
UM3015  
P-Ch 30V Fast Switching MOSFETs  
Typical Characteristics  
14  
12  
10  
8
40  
35  
ID=-10A  
30  
25  
20  
15  
10  
5
VGS=-10V  
VGS=-7V  
VGS=-5V  
VGS=-4.5V  
VGS=-3V  
0
6
0
1
2
3
4
2
4
6
8
10  
-VDS , Drain-to-Source Voltage (V)  
-VGS (V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance v.s Gate-Source  
12  
10  
8
6
T =150  
T =25  
J
J
4
2
0
0.2  
0.4  
0.6  
0.8  
1
-VSD , Source-to-Drain Voltage (V)  
Fig.4 Gate-Charge Characteristics  
Fig.3 Forward Characteristics Of Reverse  
2.0  
1.5  
1.5  
1.0  
0.5  
1
0.5  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T ,Junction Temperature (  
J
)
T , Junction Temperature ( )  
J
Fig.6 Normalized RDSON vs. TJ  
Fig.5 Normalized VGS(th) vs. TJ  
3
Unitpower  
UM3015  
P-Ch 30V Fast Switching MOSFETs  
10000  
1000  
100  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
1ms  
Coss  
Crss  
10ms  
100ms  
0.10  
DC  
TA=25oC  
Single Pulse  
0.01  
10  
0.01  
0.1  
1
10  
100  
1
1
5
9
13  
17  
21  
25  
-VDS , Drain to Source Voltage(V)  
-VDS (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
DUTY=0.5  
0.2  
0.1  
0.1  
0.01  
0.05  
0.01  
PDM  
TON  
T
D = TON/T  
SINGLE  
TJpeak = TC+PDMXRJC  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.11 Unclamped Inductive Switching Waveform  
Fig.10 Switching Time Waveform  
4

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