US2410 [UNITPOWER]

N-Ch 20V Fast Switching MOSFETs; N-CH 20V的快速开关MOSFET
US2410
型号: US2410
厂家: ShenZhen XinDeYi Electronics Co., Ltd.    ShenZhen XinDeYi Electronics Co., Ltd.
描述:

N-Ch 20V Fast Switching MOSFETs
N-CH 20V的快速开关MOSFET

开关
文件: 总4页 (文件大小:747K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
US2410  
N-Ch 20V Fast Switching MOSFETs  
General Description  
Product Summery  
The US2410 is the highest performance trench  
N-ch MOSFETs with extreme high cell density ,  
which provide excellent RDSON and gate charge  
for most of the small power switching and load  
switch applications.  
BVDSS  
RDS(ON)  
ID  
20V  
37m  
4.2A  
Applications  
The US2410 meet the RoHS and Green Product  
requirement with full function reliability approved.  
z High Frequency Point-of-Load Synchronous  
Small power switching for MB/NB/UMPC/VGA  
z Networking DC-DC Power System  
z Load Switch  
Features  
SOT23 Pin Configuration  
z Advanced high cell density Trench technology  
z Super Low Gate Charge  
z Excellent Cdv/dt effect decline  
z Green Device Available  
Absolute Maximum Ratings  
Symbol  
VDS  
Parameter  
Rating  
20  
Units  
V
Drain-Source Voltage  
VGS  
Gate-Source Voltage  
±12  
4.2  
V
ID@TA=25℃  
ID@TA=70℃  
IDM  
Continuous Drain Current, VGS @ 4.5V1  
Continuous Drain Current, VGS @ 4.5V1  
Pulsed Drain Current2  
A
3.3  
A
17  
A
PD@TA=25℃  
TSTG  
Total Power Dissipation3  
1
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
RθJA  
Parameter  
Typ.  
---  
Max.  
125  
80  
Unit  
/W  
/W  
Thermal Resistance Junction-ambient 1  
Thermal Resistance Junction-Case1  
RθJC  
---  
1
US2410  
N-Ch 20V Fast Switching MOSFETs  
Electrical Characteristics (TJ=25 , unless otherwise noted)  
Symbol  
Parameter  
Conditions  
VGS=0V , ID=250uA  
Min.  
20  
---  
---  
---  
0.5  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
Typ.  
---  
Max.  
---  
Unit  
V
BVDSS  
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
BVDSS/△TJ  
Reference to 25, ID=1mA  
VGS=4.5V , ID=4A  
0.018  
30  
---  
V/℃  
37  
45  
1.2  
---  
RDS(ON)  
Static Drain-Source On-Resistance2  
mΩ  
VGS=2.5V , ID=3A  
36  
VGS(th)  
Gate Threshold Voltage  
0.7  
-3.1  
---  
V
VGS=VDS , ID =250uA  
VGS(th)  
V
GS(th) Temperature Coefficient  
mV/℃  
VDS=16V , VGS=0V , TJ=25℃  
VDS=16V , VGS=0V , TJ=55℃  
1
IDSS  
Drain-Source Leakage Current  
uA  
---  
5
VGS=±12V , VDS=0V  
IGSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
---  
±100  
---  
nA  
S
VDS=5V , ID=4A  
20  
Rg  
VDS=0V , VGS=0V , f=1MHz  
1.5  
8.6  
1.37  
2.3  
5.2  
34  
3
Ω
Qg  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
12.0  
1.9  
3.2  
10.4  
61  
VDS=15V , VGS=4.5V , ID=4A  
nC  
ns  
Qgs  
Qgd  
Td(on)  
Tr  
VDS=10V , VGS=4.5V , RG=3.3Ω  
ID=4A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
23  
46  
9.2  
635  
70  
18.4  
889  
98  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS=15V , VGS=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
63  
88  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
---  
Typ.  
---  
Max.  
4.2  
17  
Unit  
A
IS  
ISM  
VSD  
trr  
Continuous Source Current1,4  
Pulsed Source Current2,4  
Diode Forward Voltage2  
Reverse Recovery Time  
Reverse Recovery Charge  
VG=VD=0V , Force Current  
---  
---  
A
VGS=0V , IS=1A , TJ=25℃  
---  
---  
1.2  
---  
V
---  
7.5  
2.1  
nS  
nC  
IF=4A , dI/dt=100A/µs , TJ=25℃  
Qrr  
---  
---  
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width 300us , duty cycle 2%  
3.The power dissipation is limited by 150junction temperature  
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
2
US2410  
N-Ch 20V Fast Switching MOSFETs  
Typical Characteristics  
45  
40  
35  
30  
25  
20  
18  
ID=4A  
VGS=5V  
VGS=4.5V  
16  
14  
12  
10  
8
VGS=3V  
VGS=2.5V  
VGS=1.8V  
6
4
2
0
1
3
5
7
9
11  
0
0.5  
1
1.5  
2
VDS , Drain-to-Source Voltage (V)  
VGS (V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. Gate-Source  
6
4
2
0
T =175  
T =25  
J
J
0
0.3  
0.6  
0.9  
1.2  
VSD , Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics Of Reverse  
Fig.4 Gate-Charge Characteristics  
1.8  
1.4  
1.0  
0.6  
0.2  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T ,Junction Temperature (  
)
T , Junction Temperature (  
)
J
J
Fig.5 Normalized VGS(th) vs. TJ  
Fig.6 Normalized RDSON vs. TJ  
3
US2410  
N-Ch 20V Fast Switching MOSFETs  
1000  
100  
10  
100.00  
10.00  
1.00  
Ciss  
100us  
10ms  
Coss  
Crss  
100ms  
1s  
0.10  
DC  
T =25  
A
F=1.0MHz  
Single Pulse  
0.01  
1
4
7
10  
13  
16  
19  
22  
0.1  
1
10  
100  
VDS Drain to Source Voltage (V)  
VDS (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
0.01  
PDM  
TON  
0.001 SINGLE PULSE  
T
D = TON/T  
TJpeak = TA + PDM x RθJA  
0.0001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Gate Charge Waveform  
4

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