US5507PED8 [UPI]
High Slew Rate, High Current Drive Rail to Rail Operation Amplifier;
| 型号： | US5507PED8 |
| 厂家： | 
uPI Semiconductor Corp. |
| 描述： | High Slew Rate, High Current Drive Rail to Rail Operation Amplifier |
| 文件： | 总9页 (文件大小：144K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
uS5507
High Slew Rate, High Current Drive,
and Rail to Rail Operation Amplifier
Features
General Description
The uS5507 contains two independent, high slew rate abd 4.5V to 20V Input Voltage Range
high current drive rail to rail operation amplifiers. The
uS5507 operates over a wide range of voltage 4.5V ~
1.3A Peak Output Current
20V with very low bias current.
Rail to Rail Output
uS5507 provides peak output current to 1.3A drive rail to
rail output and fast slew rate to 50V/us. Other features
include over-temperature protection, over-current
protection, and output short protection. They provide
complete protection for system application. The uS5507
is available in WDFN-8L package.
50V/uS Slew Rate
30MHz Bandwidth
3mA Quiescent Current Per Channel
Over Current Protection
Over Temperature Protection
Output Short Protection
WDFN-8L Package
Ordering Information
Order Number Package Type
uS5507PDE8 WDFN3x3-8L
Top Marking
uS5507P
RoHS Compliant and Halogen Free
Note: uPI products are compatible with the current IPC/
JEDEC J-STD-020 requirement. They are halogen-free,
RoHS compliant and 100% matte tin (Sn) plating that are
suitable for use in SnPb or Pb-free soldering processes.
Applications
TFT-LCD VCOM Buffer
TFT-LCD Gamma Buffer
Pin Configuration & Typical Application Circuit
VIN
VDD
NC
VINA-
VINA+
GND
1
2
3
4
8
7
6
5
NC
Load
VINA+
RS
VOUTA
VDD
VOUTA
NC
VINA-
GND
GND
WDFN3x3 – 8L
uS5507-DS-F0000, Dec. 2012
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uS5507
Functional Pin Description
No. Pin Name Pin Function
Not Internally Connected.
Negative Input for Amplifier-A.
Positive Input for Amplifier-A.
Ground.
1
2
3
4
5
6
7
8
NC
VINA-
VINA+
GND
NC
Not Internally Connected.
VCOM Output A.
VOUTA
VDD
NC
Positive Supply Input.
Not Internally Connected.
Ground.
Exposed Pad
Functional Block Diagram
NC
VDD
VINA-
VINA+
VOUTA
NC
GND
NC
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uS5507-DS-F0000, Dec. 2012
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uS5507
Functional Description
The uS5507 is a high performance operation amplifier. It
has fast slew rate to 50V/uS and high current drive to
600mA peak current. It can operate wide range from
4.5~20V and rail to rail output. It is suitable to use for
TFT-LCD gamma and VCOM buffer voltage.
The uS5507 features over current protection, over
temperature protection, and output short protection
function. This feature supply complete protection for the
TFT-LCDpanel application. When VIN= VDD/2, the output
current will be limited to 1.3A for m = normal operation. If
output short to GND, the over current protection machine
will keep in to regulate power dissipation to prevent power
bus being burnt out.
uS5507 has thermal protection function to prevent the
excessive power dissipation from overheating. When the
junction temperature exceeds 150°C, it will disable normal
operation to lower chip operation temperature.
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uS5507
Absolute Maximum Rating
(Note 1)
Supply Voltage, VDD to GND ------------------------------------------------------------------------------------ -0.3V to +22.5V
Input Voltage ----------------------------------------------------------------------------------------------------- VDD-0.5V to GND + 0.5V
Storage Temperature Range ----------------------------------------------------------------------------------------------- -65OC to +150OC
Junction Temperature --------------------------------------------------------------------------------------------------------------------- 150OC
Lead Temperature (Soldering, 10 sec) ------------------------------------------------------------------------------------------------ 260OC
ESD Susceptibility (Note 2)
HBM (Human Body Mode) -------------------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ---------------------------------------------------------------------------------------------------------------- 200V
Thermal Information
Package Thermal Resistance (Note 3)
WDFN3x3-8L θJA -------------------------------------------------------------------------------------------------------- 68OC/W
WDFN3x3-8L θJC ---------------------------------------------------------------------------------------------------------- 6OC/W
Power Dissipation, PD @ TA = 25°C
WDFN3x3-8L --------------------------------------------------------------------------------------------------------------------- 1.47W
Recommended Operation Conditions
(Note 4)
Operating Junction Temperature Range -------------------------------------------------------------------------- -40°C to +125°C
OperatingAmbient Temperature Range ---------------------------------------------------------------------------------- -40°C to +85°C
Note 1. Stresses listed as the above “ Absolute Maximum Ratings” may cause permanent damage to the device.
These are for stress ratings. Functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 4. The device is not guaranteed to function outside its operating conditions.
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uS5507-DS-F0000, Dec. 2012
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uS5507
Electrical Characteristics
(VS+ = 20V,VS- = 0V, VL = 10kΩ, CL = 10pFΩ, TA = 25OC, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max Units
Supply Input
Input Offset Voltage
VOS
VCM = 10V
--
--
+/-2
5
15
--
mV
Averaged Temperature
Coefficient of Input Offset Voltage
TCVOS
uV/OC
Input Bias Current
I
VCM = 10V
--
--
2
1
50
--
nA
GΩ
pF
V
IB
Input Impedance
RIN
CIN
Input Capacitance
--
1.5
--
--
Common Mode Input Range
Common Mode Rejection Ratio
Open Loop Gain
CMIR
-0.5
50
50
--
+20.5
--
CMRR +0.5V < VOUT < +19.5V(No Load)
70
70
100
dB
dB
mV
V
AVOL
VOL
+0.5V < VOUT < +19.5V(No Load)
IL = -5mA
--
Output Swing Low
150
--
Output Swing High
VOH
IL = +5mA
19.85 19.9
average current of peak source & sink
current
Peak Output Current
IOUT
--
+/-1.3
--
A
Power Supply Rejection Ratio
Supply Current(Per Channel)
PSRR +6V < VDD < +20V
60
--
80
3
--
--
dB
IS
No Load
mA
+0 .5 V < V O U T < +1 9 .5 V, 2 0 % to
80%(average of rising and falling edge
slew rate)
Slew Rate
SR
--
50
--
V/uS
Setting to +/-0.1%(AV = +1)
-3dB Bandwidth
ts
VO = 2.0V step @ CL = 0pF
No Load
--
--
--
--
--
--
--
200
30
--
--
--
--
--
--
--
nS
MHz
MHz
deg
dB
BW
Gain Bandwidth Product
Phase Margin
GBWP No Load
PM No Load
24
50
Channel Separation
CHS f = 5MHz
TOTP
90
Over-Temperature Threshold
Over-Temperature Hysteresis
150
20
OC
TOTP_HYS
OC
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uS5507
Typical Operation Characteristics
Slew Rate (Rising)
Slew Rate (Falling)
VINA+ 2V/Div
VOUTA 2V/Div
VINA+ 2V/Div
VOUTA 2V/Div
Time (20ns/Div)
Time (40ns/Div)
VS+ = 20V, VINA+ = 10V, No Load
VS+ = 20V, VINA+ = 10V, No Load
Small Signal Transient Response
Large Signal Transient Response
VINA+ 100mV/Div
VINA+ 5V/Div
VOUTA 5V/Div
VOUTA 100mV/Div
Time (2ms/Div)
Time (2ms/Div)
VS+ = 20V, VINA+ = 200mV, No Load
VS+ = 20V, VINA+ = 10V, No Load
Voltage Follower Pulse Response
Voltage Follwer Pulse Response
VINA+ 5V/Div
VOUTA 100mV/Div
IOUT 200mA/Div
VOUTA 5V/Div
Time (10us/Div)
Time (40s/Div)
VS+ = 10V, VINA+ = 10V, No Load
VS+ = 20V, VINA+ = 10V, Load = 500mA
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uS5507-DS-F0000, Dec. 2012
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uS5507
Typical Operation Characteristics
Output Peak Current
Output Continue Current
VOUTA 5V/Div
VOUTA 5V/Div
IOUT 500mA/Div
IOUT 50mA/Div
Time (1us/Div)
Time (1us/Div)
VS+ = 20V, VINA+ = 10V, VOUTA short to GND
VS+ = 20V, VINA+ = 10V, VOUTA short to GND
Supply Current vs. Temperature
Input Offset Voltage vs. Supply Voltage
5
4
3
2
1
0
0
TA = +25OC
-5
-10
-15
-20
TA = -40OC
TA = +125OC
-50
-25
0
25
50
75
100
125
6
8
10
12
14
16
18
20
Temperature (OC)
Supply Voltage (V)
uS5507-DS-F0000, Dec. 2012
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uS5507
Package Information
WDFN3x3-8L
2.90 - 3.10
1.90 - 2.40
0.20 - 0.45
5
8
4
1
0.65 BSC
0.18 - 0.40
1.90 - 2.40
0.203 REF
0.00 - 0.05
0.18 - 0.40
0.65 BSC
Recommended Solder Pitch and Dimensions
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.
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uS5507
Important Notice
uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products
and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete.
uPI products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment. However, no responsibility is
assumed by uPI or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of uPI or its subsidiaries.
COPYRIGHT (C) 2010, UPI SEMICONDUCTOR CORP.
uPI Semiconductor Corp.
Sales Branch Office
uPI Semiconductor Corp.
Headquarter
12F-5, No. 408, Ruiguang Rd. Neihu District,
Taipei Taiwan, R.O.C.
TEL : 886.2.8751.2062 FAX : 886.2.8751.5064
9F.,No.5, Taiyuan 1st St. Zhubei City,
Hsinchu Taiwan, R.O.C.
TEL : 886.3.560.1666 FAX : 886.3.560.1888
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