BC850CMTF [UTC]

NPN Epitaxial Silicon Transistor; NPN外延硅晶体管
BC850CMTF
型号: BC850CMTF
厂家: Unisonic Technologies    Unisonic Technologies
描述:

NPN Epitaxial Silicon Transistor
NPN外延硅晶体管

晶体 晶体管 开关 光电二极管
文件: 总2页 (文件大小:102K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BC846 ... BC850  
BC846 ... BC850  
Surface Mount General Purpose Si-Epi-Planar Transistors  
Si-Epi-Planar Universaltransistoren für die Oberflächenmontage  
NPN  
NPN  
Version 2006-06-02  
Power dissipation – Verlustleistung  
250 mW  
2.9±0.1  
1.1  
Plastic case  
Kunststoffgehäuse  
SOT-23  
(TO-236)  
0.4  
3
Type  
Code  
Weight approx. – Gewicht ca.  
0.01 g  
1
2
Plastic material has UL classification 94V-0  
Gehäusematerial UL94V-0 klassifiziert  
1.9  
Standard packaging taped and reeled  
Standard Lieferform gegurtet auf Rolle  
Dimensions - Maße [mm]  
1 = B 2 = E 3 = C  
Maximum ratings (TA = 25°C)  
Grenzwerte (TA = 25°C)  
BC847  
BC850  
BC848  
BC849  
BC846  
Collector-Emitter-volt. – Kollektor-Emitter-Spannung  
Collector-Base-voltage – Kollektor-Basis-Spannung  
Emitter-Base-voltage – Emitter-Basis-Spannung  
Power dissipation – Verlustleistung  
B open  
E open  
C open  
VCEO  
VCBO  
VEB0  
Ptot  
IC  
65 V  
80 V  
45 V  
50 V  
30 V  
30 V  
5 V  
6 V  
250 mW 1)  
Collector current – Kollektorstrom (dc)  
100 mA  
Peak Collector current – Kollektor-Spitzenstrom  
ICM  
200 mA  
Junction temperature – Sperrschichttemperatur  
Storage temperature – Lagerungstemperatur  
Tj  
TS  
-55...+150°C  
-55…+150°C  
Characteristics (Tj = 25°C)  
Kennwerte (Tj = 25°C)  
Min.  
Typ.  
Max.  
DC current gain – Kollektor-Basis-Stromverhältnis  
VCE = 5 V, IC = 10 µA  
Group A  
Group B  
Group C  
hFE  
hFE  
hFE  
90  
150  
270  
VCE = 5 V, IC = 2 mA  
Group A  
Group B  
Group C  
hFE  
hFE  
hFE  
110  
200  
420  
180  
290  
520  
220  
450  
800  
Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung 2)  
IC = 10 mA, IB = 0.5 mA  
IC = 100 mA, IB = 5 mA  
VCEsat  
VCEsat  
90 mV  
200 mV  
250 mV  
600 mV  
Base-Emitter saturation voltage – Basis-Sättigungsspannung 2)  
IC = 10 mA, IB = 0.5 mA  
IC = 100 mA, IB = 5 mA  
VBEsat  
VBEsat  
700 mV  
900 mV  
1
Mounted on P.C. board with 3 mm2 copper pad at each terminal  
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss  
2
Tested with pulses tp = 300 µs, duty cycle 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis 2%  
© Diotec Semiconductor AG  
http://www.diotec.com/  
1
BC846 ... BC850  
Characteristics (Tj = 25°C)  
Kennwerte (Tj = 25°C)  
Min.  
Typ.  
Max.  
Base-Emitter-voltage – Basis-Emitter-Spannung 2)  
VCE = 5 V, IC = 2 mA  
VCE = 5 V, IC = 10 mA  
VBE  
VBE  
580 mV  
660 mV  
700 mV  
720 mV  
Collector-Base cutoff current – Kollektor-Basis-Reststrom  
VCB = 30 V, (E open)  
VCE = 30 V, Tj = 125°C, (E open)  
ICB0  
ICB0  
15 nA  
5 µA  
Emitter-Base cutoff current  
VEB = 5 V, (C open)  
IEB0  
100 nA  
Gain-Bandwidth Product – Transitfrequenz  
VCE = 5 V, IC = 10 mA, f = 100 MHz  
Collector-Base Capacitance – Kollektor-Basis-Kapazität  
VCB = 10 V, IE =ie = 0, f = 1 MHz  
Emitter-Base Capacitance – Emitter-Basis-Kapazität  
VEB = 0.5 V, IC = ic = 0, f = 1 MHz  
Noise figure – Rauschzahl  
fT  
300 MHz  
3.5 pF  
9 pF  
6 pF  
CCBO  
CEB0  
VCE = 5 V, IC = 200 µA, RG = 2 k  
f = 1 kHz, Δf = 200 Hz  
BC846 ... BC848  
BC849 ... BC850  
F
F
2 dB  
1.2 dB  
10 dB  
4 dB  
Thermal resistance junction to ambient air  
Wärmewiderstand Sperrschicht – umgebende Luft  
RthA  
< 420 K/W 1)  
Recommended complementary PNP transistors  
Empfohlene komplementäre PNP-Transistoren  
BC856 ... BC859  
BC846B = 1B  
Marking of available current gain  
groups per type  
Stempelung der lieferbare Stromverstärkungs-  
gruppen pro Typ  
BC846A = 1A  
BC847A = 1E  
BC848A = 1J  
BC847B = 1F  
BC848B = 1K  
BC849B = 2B  
BC850B = 2F  
BC847C = 1G  
BC848C = 1L  
BC849C = 2C  
BC850C = 2G  
2
1
Tested with pulses tp = 300 µs, duty cycle 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis 2%  
Mounted on P.C. board with 3 mm2 copper pad at each terminal  
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss  
2
http://www.diotec.com/  
© Diotec Semiconductor AG  

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