US112N-8 [UTC]

Silicon Controlled Rectifier, 12A I(T)RMS, 12000mA I(T), 800V V(DRM), 800V V(RRM), 1 Element, TO-220AB, TO-220, 3 PIN;
US112N-8
型号: US112N-8
厂家: Unisonic Technologies    Unisonic Technologies
描述:

Silicon Controlled Rectifier, 12A I(T)RMS, 12000mA I(T), 800V V(DRM), 800V V(RRM), 1 Element, TO-220AB, TO-220, 3 PIN

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UTC US112S/N  
SCR  
SCRs  
DESCRIPTION  
The UTC US112S/N is suitable to fit all modes of  
control found in applications such as overvoltage  
crowbar protection, motor control circuits in power  
tools and kitchen aids, in-rush current limiting circuits,  
capacitive discharge ignition, voltage regulation  
circuits...  
1
TO-220  
1: CATHODE  
SYMBOL  
2: ANODE  
RATING  
3: GATE  
ABSOLUTE MAXIMUM RATINGS  
UNIT  
V
PARAMETER  
US112S  
US112N  
Repetitive peak off-state voltages  
US112S/N-4  
VDRM  
VRRM  
400  
600  
800  
12  
US112S/N-6  
US112S/N-8  
RMS on-state current (180° conduction angle) (Tc = 105°C)  
Average on-state current (180° conduction angle) (Tc = 105°C)  
Non repetitive surge peak on-state current (Tj = 25°C)  
tp=8.3ms  
IT(RMS)  
IT(AV)  
A
A
8
ITSM  
146  
140  
98  
A
tp=10ms  
I²t Value for fusing (tp = 10 ms, Tj = 25°C)  
Critical rate of rise of on-state current  
(IG = 2 x IGT , tr 100 n s, F = 60 Hz , Tj = 125°C,)  
I²t  
A²S  
A/µs  
A
dI/dt  
50  
4
Peak gate current (tp=20µs, Tj = 125°C)  
Maximum peak reverse gate voltage  
Average gate power dissipation (Tj = 125°C)  
Storage junction temperature range  
IGM  
VRGM  
PG(AV)  
Tstg  
Tj  
5
V
1
W
°C  
°C  
-40 ~ +150  
-40 ~ +125  
Operating junction temperature range  
1
UTC UNISONIC TECHNOLOGIES CO., LTD.  
QW-R301-013,B  
UTC US112S/N  
SCR  
UTC US112S(SENSITIVE) ELECTRICAL CHARACTERISTICS  
(Tj=25unless otherwise specified)  
MAX.  
200  
0.8  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VD = 12 V, RL =140Ω  
VD = 12 V, RL=140Ω  
MIN  
UNIT  
µA  
V
Gate trigger Current  
IGT  
Gate trigger Voltage  
Gate non-trigger voltage  
VGT  
VGD  
VD = VDRM, RL = 3.3 kΩ, RGK = 1kΩ  
0.1  
8
V
Tj = 125°C  
Reverse gate voltage  
Holding Current  
VRG  
IH  
IRG = 10 µA  
V
mA  
mA  
IT = 50 mA, RGK = 1 kΩ  
5
6
Latching Current  
IL  
dV/dt  
IG = 1 mA ,RGK = 1 kΩ  
Circuit Rate Of Change Of  
VD = 67 % VDRM ,RGK = 220 Ω  
5
V/µs  
V
off-state Voltage  
Tj = 125°C  
On-state voltage  
ITM = 24A, tp = 380 µs, Tj = 25°C  
VTM  
1.6  
Tj = 125°C  
Tj = 125°C  
Vt0  
Rd  
0.85  
30  
V
Threshold Voltage  
mΩ  
Dynamic Resistance  
Off-state Leakage Current  
VDRM = VRRM, RGK = 220 Ω  
IDRM  
IRRM  
µA  
5
2
Tj = 25°C  
mA  
Tj = 125°C  
UTC US112N(STANDARD) ELECTRICAL CHARACTERISTICS  
(Tj=25unless otherwise specified)  
MAX.  
15  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VD = 12 V, RL =33Ω  
MIN  
2
UNIT  
mA  
V
Gate trigger Current  
IGT  
Gate trigger Voltage  
VGT  
1.3  
VD = 12 V, RL=33Ω  
Gate non-trigger voltage  
VD = VDRM, RL = 3.3 kΩ ,Tj = 125°C  
VGD  
0.2  
V
Holding Current  
IT = 500 mA, Gate open  
IH  
IL  
dV/dt  
30  
60  
mA  
mA  
Latching Current  
IG = 1.2 IGT  
VD = 67 % VDRM , Gate open, Tj = 125°C  
Circuit Rate Of Change Of  
200  
V/µs  
off-state Voltage  
On-state voltage  
VTM  
Vt0  
Rd  
1.6  
V
V
mΩ  
ITM = 24A, tp = 380 µs, Tj = 25°C  
Tj = 125°C  
Tj = 125°C  
0.85  
Threshold Voltage  
Dynamic Resistance  
30  
Off-state Leakage Current  
VDRM = VRRM,  
Tj = 25°C  
IDRM  
IRRM  
µA  
5
2
mA  
Tj = 125°C  
THERMAL RESISTANCES  
PARAMETER  
SYMBOL  
Rth(j-c)  
Rth(j-a)  
VALUE  
1.3  
60  
UNIT  
KW  
K/W  
Junction to case (DC)  
Junction to ambient  
2
UTC UNISONIC TECHNOLOGIES CO., LTD.  
QW-R301-013,B  
UTC US112S/N  
SCR  
Figure.2:Average and D.C. on-state current  
Figure.1:Maximum average power  
dissipation vs average on-state current.  
vs case temperature  
P(W)  
12  
IT(av)(A)  
14  
11 α=180°  
DC  
12  
10  
10  
9
8
α=180°  
7
6
5
8
6
4
2
4
360°  
3
2
α
1
IT(av)(A)  
Tcase()  
0
0
12  
5
25  
50  
0
75  
100  
0
2
3
4
5
6
7
8
9
1
Fig.3-2:Relative variation of thermal impedance  
junction to ambient vs pulseduration (recommended  
pad layout,FR4 PC board)  
Fig.3-1:Relative variation of thermal impedance  
junction to case vs pulse duration.  
K=<Zth(j-a)/Rth(j-a)>  
1.00  
K=<Zth(j-c)/Rth(j-c)>  
1.0  
0.5  
0.10  
0.01  
0.2  
0.1  
tp(s)  
1E+0  
tp(s)  
1E+0  
1E-3  
1E-2  
1E-1  
5E+2  
1E-2  
1E-1  
1E+1  
1E+2  
Figure.4-1:Relative variation of gate trigger  
current,holding current and latching vs  
junction temperature (US112S)  
Figure.4-2: Relative variation of gate trigger  
current,holding current and latching current vs  
junction temperature (US112N).  
IGT,IH,IL(TJ)/IGT,IH,IL (TJ=25℃)  
2.0  
IGT,IH,IL(TJ)/IGT,IH,IL (TJ=25℃)  
2.4  
1.8  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.6  
1.4  
IGT  
IGT  
1.2  
1.0  
0.8  
IH&IL  
Rgk=1kΩ  
IH&IL  
0.6  
0.4  
0.2  
0.0  
Tj()  
Tj()  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
140  
3
UTC UNISONIC TECHNOLOGIES CO., LTD.  
QW-R301-013,B  
UTC US112S/N  
SCR  
Figure.5:Relative variation of holding current vs  
Fig.6: Relative variation of dV/dt immunity vs gate-  
cathode resistance(typical values) (US112S)  
gate-cathode resistance(typical values)  
(US112S)  
IH(Rgk)/IH(Rgk=1kΩ)  
dV/dt(Rgk)/dV/dt(Rgk=220Ω)  
5.0  
4.5  
10.0  
1.0  
Ta=25℃  
Tj=125℃  
VD=0.67* VDRM  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
Rgk(kΩ)  
Rgk(Ω)  
0.4  
0.1  
01.0E-2  
1E-1  
1E+0  
0.0  
1.2  
0.2  
0.6  
0.8  
1.0  
1E+1  
Fig.8: Surge peak on-state current vs number of cycles  
dV/dt(Rgk)/dV/dt(Rgk=220Ω)  
Fig.7: Relative variation of dV/dt immunity vs gate-  
cathode capacitance(typical values) (US112S)  
dV/dt(Cgk)/dV/dt(Rgk=220Ω)  
10.0  
4.0  
3.5  
Tj=125℃  
VD=0.67* VDRM  
VD=0.67* VDRM  
Tj=125℃  
Rgk=220Ω  
3.0  
2.5  
2.0  
1.0  
1.5  
1.0  
0.5  
0.0  
Rgk(Ω)  
Cgk(nF)  
0.1  
0.0  
1.2  
0.2  
0.4  
0.6  
0.8  
1.0  
0
150  
25  
50  
75  
100  
125  
Fig.9:Non-repetitive surge peak on-state current for a  
sinusoidal pulse with width tp<10ms, and corresponding  
values of I2t.  
Fig.10: On-state characteristics(maximum values).  
2
ITSM(A),I t(A2s)  
ITSM  
2000  
1000  
200  
100  
Tjinitial=25℃  
ITSM  
Tj=max:  
Vto=0.85V  
Rd=30mΩ  
US112N  
US112S  
I2t  
dI/dt  
limitation  
Tj=Tjmax.  
US112N  
US112S  
10  
1
100  
10  
Tj=25℃  
VTM(V)  
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
tp(ms)  
0.0  
0.5  
0.01  
0.10  
1.00  
10.00  
4
UTC UNISONIC TECHNOLOGIES CO., LTD.  
QW-R301-013,B  
UTC US112S/N  
SCR  
UTC assumes no responsibility for equipment failures that result from using products at values that  
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or  
other parameters) listed in products specifications of any and all UTC products described or contained  
herein. UTC products are not designed for use in life support appliances, devices or systems where  
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in  
whole or in part is prohibited without the prior written consent of the copyright owner. The information  
presented in this document does not form part of any quotation or contract, is believed to be accurate  
and reliable and may be changed without notice.  
5
UTC UNISONIC TECHNOLOGIES CO., LTD.  
QW-R301-013,B  

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