WNM2020-3/TR [VBSEMI]

N-Channel 20 V (D-S) MOSFET;
WNM2020-3/TR
型号: WNM2020-3/TR
厂家: VBsemi Electronics Co.,Ltd    VBsemi Electronics Co.,Ltd
描述:

N-Channel 20 V (D-S) MOSFET

文件: 总9页 (文件大小:1051K)
中文:  中文翻译
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WNM2020-3/TR  
www.VBsemi.tw  
N-Channel 20 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
ID (A)e  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
Definition  
TrenchFET® Power MOSFET  
100 % Rg Tested  
6a  
0.028 at VGS = 4.5 V  
0.042 at VGS = 2.5 V  
0.050 at VGS = 1.8 V  
6a  
20  
8.8 nC  
Compliant to RoHS Directive 2002/95/EC  
5.6  
APPLICATIONS  
DC/DC Converters  
Load Switch for Portable Applications  
SOT-23  
G
S
1
2
3
D
Top View  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
20  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
12  
6a  
TC = 25 °C  
T
C = 70 °C  
A = 25 °C  
5.1  
Continuous Drain Current (TJ = 150 °C)  
ID  
5b, c  
4b, c  
20  
T
A
TA = 70 °C  
Pulsed Drain Current  
IDM  
IS  
TC = 25 °C  
1.75  
1.04b, c  
Continuous Source-Drain Diode Current  
T
A = 25 °C  
TC = 25 °C  
TC = 70 °C  
2.1  
1.3  
1.25b, c  
Maximum Power Dissipation  
PD  
W
TA = 25 °C  
0.8b, c  
TA = 70 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
RthJF  
Typical  
80  
Maximum  
100  
Unit  
Maximum Junction-to-Ambientb, d  
t 5 s  
Steady State  
°C/W  
Maximum Junction-to-Foot (Drain)  
40  
60  
Notes:  
a. Package limited  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. Maximum under steady state conditions is 125 °C/W.  
e. Based on TC = 25 °C.  
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SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Static  
VDS  
ΔVDS/TJ  
ΔVGS(th)/TJ  
VGS(th)  
VGS = 0 V, ID = 250 µA  
ID = 250 µA  
Drain-Source Breakdown Voltage  
20  
V
V
DS Temperature Coefficient  
25  
mV/°C  
VGS(th) Temperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
- 2.6  
VDS = VGS , ID = 250 µA  
V
0.45  
20  
1.0  
100  
1
IGSS  
VDS = 0 V, VGS  
=
8 V  
nA  
VDS = 20 V, VGS = 0 V  
DS = 20 V, VGS = 0 V, TJ = 70 °C  
VDS 5 V, VGS = 4.5 V  
VGS = 4.5 V, ID = 5.0 A  
VGS = 2.5 V, ID = 4.7 A  
VGS = 1.8 V, ID = 4.3 A  
VDS = 10 V, ID = 5.0 A  
IDSS  
µA  
A
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
V
10  
ID(on)  
0.028  
0.042  
0.050  
24  
Drain-Source On-State Resistancea  
Forward Transconductancea  
Ω
RDS(on)  
gfs  
S
Dynamicb  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
865  
105  
55  
12  
8.8  
1.1  
0.7  
2.4  
8
V
DS = 10 V, VGS = 0 V, f = 1 MHz  
pF  
V
DS = 10 V, VGS = 5 V, ID = 5.0 A  
18  
14  
Qg  
Total Gate Charge  
nC  
Qgs  
Qgd  
Rg  
Gate-Source Charge  
VDS = 10 V, VGS = 4.5 V, ID = 5.0 A  
f = 1 MHz  
Gate-Drain Charge  
Ω
Gate Resistance  
0.5  
4.8  
16  
26  
47  
16  
10  
20  
32  
12  
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
VDD = 10 V, RL = 2.2 Ω  
Rise Time  
17  
31  
8
ID 4 A, VGEN = 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
ns  
Turn-On Delay Time  
5
VDD = 10 V, RL = 2.2 Ω  
Rise Time  
13  
21  
6
ID 4 A, VGEN = 5 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Current  
Body Diode Voltage  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
1.75  
20  
A
IS = 4 A, VGS = 0 V  
0.75  
12  
5
1.2  
20  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Qrr  
ta  
10  
IF = 4 A, dI/dt = 100 A/µs, TJ = 25 °C  
7
ns  
tb  
5
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
20  
5
4
3
2
1
0
V
= 1 0 V t h r u 3 V  
GS  
15  
10  
5
V
= 2 . 5 V  
GS  
T
= 25 °C  
C
T
= 125 °C  
C
V
= 1 V  
1.5  
GS  
T
= - 55 °C  
C
0
0.0  
0.5  
1.0  
2.0  
0.0  
0.3  
V
0.6  
0.9  
1.2  
1.5  
- Gate-to-Source Voltage (V)  
V
- Drain-to-Source Voltage (V)  
GS  
DS  
Transfer Characteristics  
Output Characteristics  
0.045  
0.040  
0.035  
0.030  
0.025  
0.020  
1200  
900  
600  
300  
0
V
GS  
= 1.8 V  
= 2.5 V  
C
iss  
V
GS  
V
= 4.5 V  
GS  
C
oss  
C
rss  
0
5
10  
15  
20  
0
5
10  
15  
20  
I
- Drain Current (A)  
V
- Drain-to-Source Voltage (V)  
DS  
D
Capacitance  
On-Resistance vs. Drain Current and Gate Voltage  
5
4
3
2
1
0
1.70  
1.45  
1.20  
0.95  
0.70  
I
= 5 A  
D
V
= 2.5 V, I = 4.7 A  
D
GS  
V
= 10 V  
DS  
V
= 5 V  
DS  
V
= 4.5 V, I = 5 A  
D
GS  
V
= 16 V  
DS  
0
2
4
6
8
10  
- 50 - 25  
0
25  
50  
75  
100 125 150  
T
- Junction Temperature (°C)  
Q
- Total Gate Charge (nC)  
J
g
On-Resistance vs. Junction Temperature  
Gate Charge  
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
100  
0.06  
0.05  
0.04  
0.03  
0.02  
I
= 5 A  
D
T
= 150 °C  
J
10  
T
= 125 °C  
J
T
= 25 °C  
J
1
T
= 25 °C  
J
0.1  
0.0  
0.3  
0.6  
0.9  
1.2  
0
2
4
6
8
V
- Gate-to-Source Voltage (V)  
V
- Source-to-Drain Voltage (V)  
GS  
SD  
On-Resistance vs. Gate-to-Source Voltage  
Source-Drain Diode Forward Voltage  
0.9  
0.7  
0.5  
0.3  
0.1  
32  
24  
16  
8
I
= 250 μA  
D
0
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.001  
0.01  
0.1  
1
10  
100  
Time (s)  
Single Pulse Power (Junction-to-Ambient)  
T
- Temperature (°C)  
J
Threshold Voltage  
100  
Limited by R  
*
DS(on)  
10  
100 μs  
1 ms  
1
10 ms  
T
= 25 °C  
A
100 ms  
Single Pulse  
0.1  
1 s, 10 s  
DC  
BVDSS Limited  
0.01  
0.1  
1
10  
100  
V
- Drain-to-Source Voltage (V)  
DS  
* V  
> minimum V at which R  
is specified  
GS  
GS  
DS(on)  
Safe Operating Area, Junction-to-Ambient  
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
7.5  
6.0  
Package Limited  
4.5  
3.0  
1.5  
0.0  
0
25  
50  
75  
100  
125  
150  
T
- Case Temperature (°C)  
C
Current Derating*  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.2  
0.9  
0.6  
0.3  
0.0  
0
0
25  
50  
75  
100  
125  
150  
25  
50  
75  
100  
125  
150  
T
- Case Temperature (°C)  
T
A
- Ambient Temperature (°C)  
C
Power Derating, Junction-to-Foot  
Power Derating, Junction-to-Ambient  
* The power dissipation PD is based on TJ(max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper  
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
Notes:  
P
DM  
0.05  
t
1
0.02  
t
2
t
1
1. Duty Cycle, D =  
t
2
2. Per Unit Base = R  
= 125 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM  
A
DM thJA  
Single Pulse  
0.01  
4. Surface Mounted  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
100  
10 000  
1000  
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.02  
Single Pulse  
0.05  
0.1  
10  
-4  
-3  
-2  
-1  
10  
10  
10  
1
10  
Square Wave Pulse Duration (s)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
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SOT-23 (TO-236): 3-LEAD  
b
3
E
1
E
1
2
e
S
e
1
D
0.10 mm  
0.004"  
C
C
0.25 mm  
q
A
2
A
Gauge Plane  
Seating Plane  
Seating Plane  
C
A
1
L
1
L
MILLIMETERS  
INCHES  
Dim  
Min  
0.89  
0.01  
Max  
1.12  
0.10  
Min  
0.035  
0.0004  
Max  
0.044  
0.004  
A
A1  
A2  
0.88  
0.35  
0.085  
2.80  
2.10  
1.20  
1.02  
0.50  
0.18  
3.04  
2.64  
1.40  
0.0346  
0.014  
0.003  
0.110  
0.083  
0.047  
0.040  
0.020  
0.007  
0.120  
0.104  
0.055  
b
c
D
E
E1  
e
0.95 BSC  
1.90 BSC  
0.0374 Ref  
e1  
0.0748 Ref  
L
0.40  
0.60  
8°  
0.016  
0.024  
8°  
L1  
0.64 Ref  
0.50 Ref  
0.025 Ref  
0.020 Ref  
S
q
3°  
3°  
ECN: S-03946-Rev. K, 09-Jul-01  
DWG: 5479  
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RECOMMENDED MINIMUM PADS FOR SOT-23  
0.037  
0.022  
(0.950)  
(0.559)  
0.053  
(1.341)  
0.097  
(2.459)  
Recommended Minimum Pads  
Dimensions in Inches/(mm)  
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Disclaimer  
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data are subject to change without notice.  
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representatives (collectively, the "Taiwan VBsemi"), assumes no responsibility for any errors, inaccuracies or  
incomplete data contained in the table or any other any disclosure of any information related to  
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including but not limited to special, consequential damages or incidental ; (3) any and all implied warranties,  
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Statement on certain types of applications are based on knowledge of the product is often used in a typical  
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2011/65 / EU, 2011 Nian. 6. 8 Ri Yue restrict the use of certain hazardous substances in electrical and  
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Please note that some documents may still refer to Taiwan VBsemi RoHS Directive 2002/95 / EC. We  
confirm that all products identified as consistent with the Directive 2002/95 / EC European Directive  
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halogen-free halogen-free standards required by the JEDEC JS709A. Please note that some Taiwanese  
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9

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