BCM6123S60E10AST0R [VICOR]
Fixed Ratio DC-DC Converter;型号: | BCM6123S60E10AST0R |
厂家: | VICOR CORPORATION |
描述: | Fixed Ratio DC-DC Converter |
文件: | 总23页 (文件大小:2739K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BCM® Bus Converter
BCM6123x60E10A5yzz
S
®
C
NRTL US
C
US
Fixed Ratio DC-DC Converter
Features
Product Ratings
• Up to 150 A continuous output current
• 2208 W/in3 power density
VPRI = 54 V (36 – 60 V)
PSEC= up to 1500 W
K = 1/6
• 97.6% peak efficiency
VSEC = 9 V (6 – 10 V)
• 2,250 Vdc isolation
(NO LOAD)
• Parallel operation for multi-kW arrays
• OV, OC, UV, short circuit and thermal protection
• 6123 through-hole ChiP package
n 2.402” x 0.990” x 0.286”
Product Description
The VI Chip® Bus Converter (BCM®) is a high efficiency
Sine Amplitude Converter™ (SAC™), operating from a 36 to
60 VDC primary bus to deliver an isolated, ratiometric output
from 6 to 10 VDC.
(61.00 mm x 25.14 mm x 7.26 mm)
Typical Applications
The BCM6123x60E10A5yzz offers low noise, fast transient
response, and industry leading efficiency and power density. In
addition, it provides an AC impedance beyond the bandwidth
of most downstream regulators, allowing input capacitance
normally located at the input of a POL regulator to be located at
the primary side of the BCM module. With a primary to
secondary K factor of 1/6, that capacitance value can be
reduced by a factor of 36x, resulting in savings of board area,
material and total system cost.
• High End Computing Systems
• Automated Test Equipment
• Industrial Systems
• High Density Power Supplies
• Communications Systems
• Transportation
Leveraging the thermal and density benefits of Vicor’s ChiP
packaging technology, the BCM module offers flexible thermal
management options with very low top and bottom side
thermal impedances. Thermally-adept ChiP-based power
components, enable customers to achieve low cost power
system solutions with previously unattainable system size,
weight and efficiency attributes, quickly and predictably.
BCM® Bus Converter
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Typical Application
BCM
TM
EN
enable/disable
switch
VAUX
F1
+PRI
–PRI
+VSEC
VPRI
CPRI
POL
–VSEC
GND
PRIMARY
SECONDARY
ISOLATION BOUNDRY
BCM6123x60E10A5yzz + Point of load
BCM® Bus Converter
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Pin Configuration
TOP VIEW
2
1
A’ +VSEC
A
B
C
D
+VSEC
-VSEC
-VSEC
2
2
B’
C’
-VSEC1
-VSEC
1
+VSEC
+VSEC
D’ +VSEC
E’ +VSEC
E
-VSEC
2
2
F’
-VSEC
1
1
F
G
H
G’
-VSEC
-VSEC
+VSEC
H’ +VSEC
+VPRI
+VPRI
+VPRI
I’
J’
K’
I
J
TM
EN
VAUX
K
-VPRI
+VPRI
L’
L
6123 ChiP Package
Pin Descriptions
Pin Number
Signal Name
Type
Function
I1, J1, K1, L1
+VPRI
TM
PRIMARY POWER Positive primary transformer power terminal
I’2
J’2
OUTPUT
INPUT
Temperature Monitor; primary side referenced signals
Enables and disables power supply; primary side referenced signals
Auxilary Voltage Source; primary side referenced signals
EN
K’2
VAUX
OUTPUT
PRIMARY POWER
RETURN
L’2
-VPRI
Negative primary transformer power terminal
Positive secondary transformer power terminal
Negative secondary transformer power terminal
A1, D1, E1, H1,
A’2, D’2, E’2, H’2
SECONDARY
POWER
+VSEC
B1, C1, F1, G1
B’2, C’2, F’2, G’2
SECONDARY
POWER RETURN
-VSEC*
*For proper operation an external low impedance connection must be made between listed -VSEC1 and -VSEC2 terminals.
BCM® Bus Converter
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Part Ordering Information
Max
Secondary
Voltage
Secondary
Output
Current
Product
Function
Package
Size
Package
Mounting
Max Primary
Input Voltage
Range
Identifier
Temperature
Grade
Option
BCM
6123
x
60
E
10
A5
y
zz
00 = Analog Ctrl
01 = PMBus Ctrl
T = TH
T = -40°C – 125°C
Bus Converter
Module
61 = L
23 = W
10 V
No Load
60 V
36 – 60 V
150 A
S = SMT
M = -55°C – 125°C 0R = Reversible Analog Ctrl
0P = Reversible PMBus Ctrl
All products shipped in JEDEC standard high profile (0.400” thick) trays (JEDEC Publication 95, Design Guide 4.10).
Standard Models
Max
Secondary
Voltage
Secondary
Output
Current
Product
Function
Package
Size
Package
Mounting
Max Primary
Input Voltage
Range
Identifier
Temperature
Grade
Option
BCM
6123
T
60
E
10
A5
T
00
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
Min
Max
Unit
+VPRI_DC to –VPRI_DC
-1
80
V
VPRI_DC or VSEC_DC slew rate
(operational)
1
V/µs
+VSEC_DC to –VSEC_DC
TM to –VPRI_DC
-1
15
4.6
5.5
4.6
V
V
V
V
EN to –VPRI_DC
-0.3
VAUX to –VPRI_DC
BCM® Bus Converter
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Electrical Specifications
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
General Powetrain PRIMARY to SECONDARY Specification (Forward Direction)
Primary Input Voltage range,
continuous
VPRI_DC
36
60
V
V
VPRI_DC voltage where µC is initialized,
(ie VAUX = Low, powertrain inactive)
VPRI µController
VµC_ACTIVE
14
Disabled, EN Low, VPRI_DC = 54 V
TINTERNAL ≤ 100ºC
5
PRI to SEC Input Quiescent Current
IPRI_Q
mA
10
9
VPRI_DC = 54 V, TINTERNAL = 25ºC
VPRI_DC = 54 V
7.2
PRI to SEC No Load Power
Dissipation
5
14
12
17
PPRI_NL
W
VPRI_DC = 36 V to 60 V, TINTERNAL = 25 ºC
VPRI_DC = 36 V to 60 V
VPRI_DC = 60 V, CSEC_EXT = 4000 µF, RLOAD_SEC = 20% of
30
full load current
PRI to SEC Inrush Current Peak
IPRI_INR_PK
A
TINTERNAL ≤ 100ºC
35
DC Primary Input Current
Transformation Ratio
IPRI_IN_DC
K
At ISEC_OUT_DC = 150 A, TINTERNAL ≤ 100ºC
Primary to secondary, K = VSEC_DC / VPRI_DC, at no load
25.5
A
1/6
V/V
Secondary Output Power
(continuous)
PSEC_OUT_DC
PSEC_OUT_PULSE
ISEC_OUT_DC
Specified at VPRI_DC = 60 V
1500
1800
150
W
W
A
Specified at VPRI_DC = 60 V; 10 ms pulse, 25% Duty
cycle, PSEC_AVG = 50% rated PSEC_OUT_DC
Secondary Output Power (pulsed)
Secondary Output Current
(continuous)
10 ms pulse, 25% Duty cycle, ISEC_OUT_AVG = 50% rated
ISEC_OUT_DC
Secondary Output Current (pulsed)
ISEC_OUT_PULSE
180
A
VPRI_DC = 54 V, ISEC_OUT_DC = 150 A
VPRI_DC = 36 V to 60 V, ISEC_OUT_DC = 150 A
VPRI_DC = 54 V, ISEC_OUT_DC = 75 A
VPRI_DC = 54 V, ISEC_OUT_DC = 150 A
96.1
94.5
96.9
95.4
96.7
PRI to SEC Efficiency (ambient)
PRI to SEC Efficiency (hot)
ηAMB
%
97.6
96
ηHOT
η20%
%
%
PRI to SEC Efficiency
(over load range)
30 A < ISEC_OUT_DC < 150 A
90
RSEC_COLD
RSEC_AMB
RSEC_HOT
FSW
VPRI_DC = 54 V, ISEC_OUT_DC = 150 A, TINTERNAL = -40°C
VPRI_DC = 54 V, ISEC_OUT_DC = 150 A
0.9
1.2
1.2
1.6
2
1.5
2
PRI to SEC Output Resistance
mΩ
VPRI_DC = 54 V, ISEC_OUT_DC = 150 A, TINTERNAL = 100°C
Frequency of the Output Voltage Ripple = 2x FSW
1.6
2.2
0.95
Switching Frequency
0.85
0.90
MHz
mV
CSEC_EXT = 0 µF, ISEC_OUT_DC = 150 A, VPRI_DC = 54 V,
120
20 MHz BW
Secondary Output Voltage Ripple
VSEC_OUT_PP
TINTERNAL ≤ 100ºC
200
Primary Input Leads Inductance
(Parasitic)
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
LPRI_IN_LEADS
6.7
nH
nH
Secondary Output Leads Inductance
(Parasitic)
Frequency 2.5 MHz (double switching frequency),
Simulated lead model
LSEC_OUT_LEADS
0.64
BCM® Bus Converter
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Electrical Specifications (Cont.)
Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
General Powetrain PRIMARY to SECONDARY Specification (Forward Direction) Cont.
Effective Primary Capacitance
(Internal)
CPRI_INT
CSEC_INT
CSEC_OUT_EXT
CSEC_OUT_AEXT
Effective Value at 54 VPRI_DC
Effective Value at 9 VSEC_DC
11.2
202
µF
µF
µF
Effective Secondary Capacitance
(Internal)
Effective Secondary Output
Capacitance (External)
Effective Secondary Output
Capacitance (External)
Excessive capacitance may drive module into SC
protection
4000
CSEC_OUT_AEXT Max = N * 0.5 * CSEC_OUT_EXT MAX, where
N = the number of units in parallel
Protection PRIMARY to SECONDARY (Forward Direction)
Startup into a persistent fault condition. Non-Latching
fault detection given VPRI_DC > VPRI_UVLO+
Auto Restart Time
tAUTO_RESTART
VPRI_OVLO+
VPRI_OVLO-
VPRI_OVLO_HYST
tPRI_OVLO
490
64
560
68
ms
V
Primary Overvoltage Lockout
Threshold
66
64
2
Primary Overvoltage Recovery
Threshold
60
66
V
Primary Overvoltage Lockout
Hysteresis
V
Primary Overvoltage Lockout
Response Time
100
28
30
2
µs
V
Primary Undervoltage Lockout
Threshold
VPRI_UVLO-
26
28
30
32
Primary Undervoltage Recovery
Threshold
VPRI_UVLO+
VPRI_UVLO_HYST
tPRI_UVLO
V
Primary Undervoltage Lockout
Hysteresis
V
Primary Undervoltage Lockout
Response Time
100
µs
From VPRI_DC = VPRI_UVLO+ to powertrain active, EN
Primary Undervoltage Startup Delay tPRI_UVLO+_DELAY floating, (i.e One time Startup delay form application
of VPRI_DC to VSEC_DC
20
ms
)
From powertrain active. Fast Current limit protection
disabled during Soft-Start
Primary Soft-Start Time
tPRI_SOFT-START
ISEC_OUT_OCP
tSEC_OUT_OCP
ISEC_OUT_SCP
tSEC_OUT_SCP
tOTP+
1
225
3
ms
A
Secondary Output Overcurrent Trip
Threshold
170
225
260
Secondary Output Overcurrent
Response Time Constant
Secondary Output Short Circuit
Protection Trip Threshold
Secondary Output Short Circuit
Protection Response Time
Overtemperature Shutdown
Threshold
Effective internal RC filter
ms
A
1
110
3
µs
°C
°C
°C
s
Temperature sensor located inside controller IC
125
Overtemperature Recovery
Threshold
tOTP–
105
115
-45
Undertemperature Shutdown
Threshold
Temperature sensor located inside controller IC;
Protection not available for M-Grade units.
Startup into a persistent fault condition. Non-Latching
fault detection given VPRI_DC > VPRI_UVLO+
tUTP
Undertemperature Restart Time
tUTP_RESTART
BCM® Bus Converter
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1800
1600
1400
1200
1000
800
600
400
200
0
35
45
55
65
75
85
95
105
115
125
Case Temperature (°C)
Top only at temperature
Top and leads at temperature
Leads at temperature
Top, leads and belly at temperature
Figure 1 — Specified thermal operating area
2000
1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
200
150
100
50
800
0
36
38
41
43
46
48
50
53
55
58
60
36
38
41
43
46
48
50
53
55
58
60
Input Voltage (V)
Input Voltage (V)
ISEC_OUT_DC
ISEC_OUT_PULSE
PSEC_OUT_DC
PSEC_OUT_PULSE
Figure 2 — Specified electrical operating area using rated RSEC_HOT
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80
100
Secondary Output Current (% ISEC_DC
)
Figure 3 — Specified Primary start-up into load current and external capacitance
BCM® Bus Converter
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Signal Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Temperature Monitor
• The TM pin is a standard analog I/O configured as an output from an internal µC.
• The TM pin monitors the internal temperature of the controller IC within an accuracy of 5°C.
• µC 250 kHz PWM output internally pulled high to 3.3 V.
SIGNAL TYPE
STATE
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
TYP MAX UNIT
Powertrain active to TM
time
Startup
tTM
100
µs
TM Duty Cycle
TM Current
TMPWM
ITM
18.18
68.18
4
%
mA
Recommended External filtering
TM Capacitance (External)
TM Resistance (External)
CTM_EXT
RTM_EXT
Recommended External filtering
Recommended External filtering
0.01
1
µF
DIGITAL
OUTPUT
kΩ
Regular
Specifications using recommended filter
Operation
TM Gain
ATM
10
mV / °C
V
TM Voltage Reference
VTM_AMB
1.27
RTM_EXT = 1 K Ohm, CTM_EXT = 0.01 uF, VPRI_DC
= 54 V, ISEC_DC = 150 A
28
TM Voltage Ripple
VTM_PP
mV
TINTERNAL ≤ 100ºC
40
Enable / Disable Control
• The EN pin is a standard analog I/O configured as an input to an internal µC.
• It is internally pulled high to 3.3 V.
• When held low the BCM internal bias will be disabled and the powertrain will be inactive.
• In an array of BCMs, EN pins should be interconnected to synchronize startup and permit startup into full load conditions.
SIGNAL TYPE
STATE
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
2.3
TYP MAX UNIT
EN to Powertrain active
time
VPRI_DC > VPRI_UVLO+, EN held low both
conditions satisfied for T > tPRI_UVLO+_DELAY
Startup
tEN_START
250
µs
ANALOG
INPUT
EN Voltage Threshold
EN Resistance (Internal)
EN Disable Threshold
VEN_TH
REN_INT
V
kΩ
V
Regular
Internal pull up resistor
1.5
Operation
VEN_DISABLE_TH
1
BCM® Bus Converter
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Signal Characteristics (Cont.)
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Auxiliary Voltage Source
• The VAUX pin is a standard analog I/O configured as an output from an internal µC.
• VAUX is internally connected to µC output as internally pulled high to a 3.3 V regulator with 2% tolerance, a 1% resistor of 1.5 kΩ.
• VAUX can be used as a "Ready to process full power" flag. This pin transitions VAUX voltage after a 2 ms delay from the start of powertrain activating,
signaling the end of softstart.
• VAUX can be used as "Fault flag". This pin is pulled low internally when a fault protection is detected.
SIGNAL TYPE
STATE
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
2.8
TYP MAX UNIT
Powertrain active to VAUX
time
Startup
tVAUX
Powertrain active to VAUX High
2
ms
VAUX Voltage
VVAUX
IVAUX
3.3
4
V
VAUX Available Current
mA
50
ANALOG
OUTPUT
Regular
VAUX Voltage Ripple
VVAUX_PP
mV
µF
TINTERNAL ≤ 100ºC
100
Operation
VAUX Capacitance
(External)
CVAUX_EXT
0.01
VAUX Resistance (External)
VAUX Fault Response Time
RVAUX_EXT
tVAUX_FR
VPRI_DC < VµC_ACTIVE
1.5
kΩ
Fault
From fault to VVAUX = 2.8 V, CVAUX = 0 pF
10
µs
BCM® Bus Converter
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BCM Module Timing diagram
BCM® Bus Converter
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High Level Functional State Diagram
Conditions that cause state transitions are shown along arrows. Sub-sequence activities listed inside the state bubbles.
VμC_ACTIVE < VPRI_DC < VPRI_UVLO+
STARTUP SEQUENCE
VPRI_DC > VPRI_UVLO+
STANDBY SEQUENCE
TM Low
TM Low
EN High
EN High
VAUX Low
VAUX Low
Powertrain Stopped
Powertrain Stopped
ENABLE falling edge,
or OTP detected
tPRI_UVLO+_DELAY
expired
Input OVLO or UVLO,
Output OCP,
ONE TIME DELAY
Fault
Auto-
recovery
INITIAL STARTUP
or UTP detected
ENABLE falling edge,
or OTP detected
FAULT
SEQUENCE
TM Low
SUSTAINED
OPERATION
TM PWM
Input OVLO or UVLO,
Output OCP,
EN High
EN High
or UTP detected
VAUX Low
VAUX High
Powertrain Stopped
Powertrain Active
Short Circuit detected
BCM® Bus Converter
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BCM6123x60E10A5yzz
Application Characteristics
Product is mounted and temperature controlled via top side cold plate, unless otherwise noted. All data presented in this section are collected data form
primary sourced units processing power in forward direction.See associated figures for general trend data.
15
14
13
12
11
10
9
8
7
6
5
98.0
97.5
97.0
96.5
96.0
4
3
36
39
41
44
47
49
52
55
57
60
-40
-20
0
20
40
60
80
100
Primary Input Voltage (V)
Case Temperature (ºC)
TTOP SURFACE CASE
:
- 40°C
25°C
80°C
VIN:
36 V
54 V
60 V
Figure 4 — No load power dissipation vs. VPRI_DC
Figure 5 — Full load efficiency vs. temperature; VPRI_DC
98
96
94
92
54
48
42
36
30
24
18
12
6
98
96
94
92
54
48
42
36
30
24
18
12
6
PD
PD
90
90
88
86
84
82
80
88
86
84
82
80
0
0
0
15
30
45
60
75
90 105 120 135 150
0
15
30
45
60
75
90 105 120 135 150
Secondary Output Current (A)
Load Current (A)
VIN
:
VIN :
36 V
54 V
60 V
36 V
54 V
60 V
Figure 6 — Efficiency and power dissipation at TCASE = -40°C
Figure 7 — Efficiency and power dissipation at TCASE = 25°C
3
98
96
94
92
90
88
86
84
82
80
54
48
42
36
30
24
18
12
6
2
1
0
PD
0
0
13
25
38
50
63
75
88 100 113 125
-40
-20
0
20
40
60
80
100
Secondary Output Current (A)
Case Temperature (°C)
VIN
:
36 V
54 V
60 V
IOUT
:
150 A
Figure 8 — Efficiency and power dissipation at TCASE = 80°C
Figure 9 — RSEC vs. temperature; Nominal VPRI_DC
ISEC_DC = 125 A at TCASE = 80°C
BCM® Bus Converter
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200
175
150
125
100
75
50
25
0
0
15
30
45
60
75
90 105 120 135 150
Load Current (A)
VIN:
54 V
Figure 10 — VSEC_OUT_PP vs. ISEC_DC ; No external CSEC_OUT_EXT Board
Figure 11 — Full load ripple, 2700 µF CPRI_IN_EXT; No external
.
mounted module, scope setting : 20 MHz analog BW
CSEC_OUT_EXT Board mounted module, scope setting :
.
20 MHz analog BW
Figure 13 — 150 A – 0 A transient response:
PRI_IN_EXT = 2700 µF, no external CSEC_OUT_EXT
Figure 12 — 0 A– 150 A transient response:
C
CPRI_IN_EXT = 2700 µF, no external CSEC_OUT_EXT
Figure 15 — Start up from application of EN with pre-applied
Figure 14 — Start up from application of VPRI_DC= 54 V, 20% IOUT
,
VPRI_DC = 54 V, 20% ISEC_DC, 100% CSEC_OUT_EXT
100% CSEC_OUT_EXT
BCM® Bus Converter
Rev 1.1
09/2015
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800 927.9474
Page 13 of 23
BCM6123x60E10A5yzz
General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
Width
L
W
H
60.87 / [2.396] 61.00 / [2.402] 61.13 / [2.407] mm/[in]
24.76 / [0.975] 25.14 / [0.990] 25.52 / [1.005] mm/[in]
Height
Volume
Weight
7.21 / [0.284] 7.26 / [0.286] 7.31 / [0.288]
mm/[in]
cm3/[in3]
g/[oz]
Vol
W
Without Heatsink
11.13 / [0.679]
41 / [1.45]
Nickel
0.51
0.02
2.03
0.15
Lead finish
Palladium
Gold
µm
0.003
0.051
Thermal
Operating Temperature
TINTERNAL
BCM6123x60E10A5yzz (T-Grade)
-40
125
°C
Estimated thermal resistance to maximum
temperature internal component from
isothermal top
Thermal Resistance Top Side
ΦINT-TOP
1.39
1.27
°C/W
Estimated thermal resistance to
Thermal Resistance Leads
ΦINT-LEADS maximum temperature internal
°C/W
component from isothermal leads
Estimated thermal resistance to
ΦINT-BOTTOM maximum temperature internal
component from isothermal bottom
Thermal Resistance Bottom Side
Thermal Capacity
1.40
34
°C/W
Ws/°C
Assembly
Storage temperature
ESD Withstand
BCM6123x60E10A5yzz (T-Grade)
-55
125
°C
ESDHBM
ESDCDM
Human Body Model, "ESDA / JEDEC JDS-001-2012" Class I-C (1kV to < 2 kV)
Charge Device Model, "JESD 22-C101-E" Class II (200V to < 500V)
BCM® Bus Converter
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General Characteristics
Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ TINTERNAL
≤ 125°C (T-Grade); All other specifications are at TINTERNAL = 25ºC unless otherwise noted.
Soldering[1]
Peak Temperature Top Case
135
°C
Safety
PRIMARY to SECONDARY
2,250
2,250
707
Isolation voltage / Dielectric test
VHIPOT
PRIMARY to CASE
SECONDARY to CASE
Unpowered Unit
At 500 Vdc
VDC
Isolation Capacitance
Insulation Resistance
CPRI_SEC
RPRI_SEC
620
780
940
pF
10
MΩ
MIL-HDBK-217Plus Parts Count - 25°C
Ground Benign, Stationary, Indoors /
Computer
4.45
7.01
MHrs
MHrs
MTBF
Telcordia Issue 2 - Method I Case III; 25°C
Ground Benign, Controlled
cTÜVus "EN 60950-1"
cURus "UL 60950-1"
Agency Approvals / Standards
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable
[1] Product is not intended for reflow solder attach.
BCM® Bus Converter
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BCM Module Block Diagram
A n a l o g C o n t r o l l e r
D i g i t a l C o n t r o l l e r
I N
e s n s e I d a r w r
+ F o
c e t t i o n
e n r r t u F C l o w d e
BCM® Bus Converter
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Sine Amplitude Converter™ Point of Load Conversion
R
SEC
0.24 nH
1.62 mΩ
= 0.64 nH
ISEC
LSEC_OUT_LEADS
= 6.7 nH
LPRI_IN_LEADS
+
+
CPRI_INT_ESR
0.75 mΩ
C
SEC_INT_ESR
5 mΩ
1/6 • VPRI
81 µΩ
V•I
K
1/6 • ISEC
CPRI_INT
11.2 µF
CSEC_INT
202 µF
+
–
+
–
VSEC
VPRI
IPRI_Q
140 mA
–
–
Figure 16 — BCM module AC model
The Sine Amplitude Converter (SAC™) uses a high frequency resonant
tank to move energy from Primary to secondary and vice versa. (The
resonant tank is formed by Cr and leakage inductance Lr in the power
transformer windings as shown in the BCM module Block Diagram).
The resonant LC tank, operated at high frequency, is amplitude
modulated as a function of input voltage and output current. A small
amount of capacitance embedded in the primary and secondary stages
of the module is sufficient for full functionality and is key to achieving
high power density.
The use of DC voltage transformation provides additional interesting
attributes. Assuming that RSEC = 0 Ω and IPRI_Q = 0 A, Eq. (3) now
becomes Eq. (1) and is essentially load independent, resistor R is now
placed in series with VIN
.
RIN
SAC™
The BCM6123x60E10A5yzz SAC can be simplified into the preceeding
model.
VSEC
+
–
K = 1/6
VPRI
At no load:
VSEC = VPRI • K
(1)
(2)
Figure 17 — K = 1/6 Sine Amplitude Converter
with series input resistor
K represents the “turns ratio” of the SAC.
Rearranging Eq (1):
The relationship between VPRI and VSEC becomes:
VSEC
K =
•
•
K
VSEC = (VPRI – IPRI RIN)
(5)
VPRI
Substituting the simplified version of Eq. (4)
(IPRI_Q is assumed = 0 A) into Eq. (5) yields:
In the presence of load, VOUT is represented by:
VSEC = VPRI • K – ISEC • RSEC
2
(3)
(4)
•
•
•
VSEC = VPRI K – ISEC RIN K
(6)
and IOUT is represented by:
I
PRI – IPRI_Q
ISEC
=
K
ROUT represents the impedance of the SAC, and is a function of the
RDSON of the input and output MOSFETs and the winding resistance of
the power transformer. IQ represents the quiescent current of the SAC
control, gate drive circuitry, and core losses.
BCM® Bus Converter
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This is similar in form to Eq. (3), where RSEC is used to represent the
characteristic impedance of the SAC™. However, in this case a real R on
the primary side of the SAC is effectively scaled by K2 with respect
to the secondary.
Low impedance is a key requirement for powering a high-current, low-
voltage load efficiently. A switching regulation stage should have
minimal impedance while simultaneously providing appropriate
filtering for any switched current. The use of a SAC between the
regulation stage and the point of load provides a dual benefit of scaling
down series impedance leading back to the source and scaling up shunt
capacitance or energy storage as a function of its K factor squared.
However, the benefits are not useful if the series impedance of the SAC
is too high. The impedance of the SAC must be low, i.e. well beyond the
crossover frequency of the system.
Assuming that R = 1 Ω, the effective R as seen from the secondary side is 28
mΩ, with K = 1/6 .
A similar exercise should be performed with the additon of a capacitor
or shunt impedance at the primary input to the SAC. A switch in series
with VPRI is added to the circuit. This is depicted in Figure 18.
A solution for keeping the impedance of the SAC low involves
switching at a high frequency. This enables small magnetic components
because magnetizing currents remain low. Small magnetics mean small
path lengths for turns. Use of low loss core material at high frequencies
also reduces core losses.
S
SAC™
The two main terms of power loss in the BCM module are:
V
K = 1/6
SEC
+
–
C
V
PRI
n
No load power dissipation (PPRI_NL): defined as the power
used to power up the module with an enabled powertrain
at no load.
n
Resistive loss (RSEC): refers to the power loss across
the BCM® module modeled as pure resistive impedance.
Figure 18 — Sine Amplitude Converter with input capacitor
PDISSIPATED= PPRI_NL + PRSEC
(10)
A change in VPRI with the switch closed would result in a change in
capacitor current according to the following equation:
Therefore,
PSEC_OUT = PPRI_IN – PDISSIPATED = PRI_IN – PPRI_NL – PRSEC (11)
dVPRI
dt
(7)
IC(t) = C
The above relations can be combined to calculate the overall module
efficiency:
Assume that with the capacitor charged to VPRI, the switch is opened
and the capacitor is discharged through the idealized SAC. In this case,
PSEC_OUT
P
PRI_IN – PPRI_NL – PRSEC
=
(12)
h =
•
PIN
PIN
IC= ISEC
K
(8)
substituting Eq. (1) and (8) into Eq. (7) reveals:
2
VPRI
I
PRI – PPRI_NL – (ISEC
)
R
•
SEC
•
•
=
C
K2
dISEC
dt
(9)
ISEC
=
VIN
I
IN
•
The equation in terms of the output has yielded a K2 scaling factor for
C, specified in the denominator of the equation.
2
PPRI_NL + (ISEC
)
R
•
SEC
= 1 –
(
)
VPRI IPRI
•
A K factor less than unity results in an effectively larger capacitance on
the secondary output when expressed in terms of the input. With a
K= 1/6 as shown in Figure 18, C=1 μF would appear as C=36 μF when
viewed from the secondary.
BCM® Bus Converter
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Input and Output Filter Design
Thermal Considerations
A major advantage of SAC™ systems versus conventional PWM
converters is that the transformer based SAC does not require external
filtering to function properly. The resonant LC tank, operated at
extreme high frequency, is amplitude modulated as a function of input
voltage and output current and efficiently transfers charge through the
isolation transformer. A small amount of capacitance embedded in the
primary and secondary stages of the module is sufficient for full
functionality and is key to achieving power density.
The ChiP package provides a high degree of flexibility in that it presents
three pathways to remove heat from internal power dissipating
components. Heat may be removed from the top surface, the bottom
surface and the leads. The extent to which these three surfaces are
cooled is a key component for determining the maximum power that is
available from a ChiP, as can be seen from Figure 1.
Since the ChiP has a maximum internal temperature rating, it is
necessary to estimate this internal temperature based on a real thermal
solution. Given that there are three pathways to remove heat from the
ChiP, it is helpful to simplify the thermal solution into a roughly
equivalent circuit where power dissipation is modeled as a current
source, isothermal surface temperatures are represented as voltage
sources and the thermal resistances are represented as resistors. Figure
19 shows the “thermal circuit” for a VI Chip® BCM module 6123 in an
application where the top, bottom, and leads are cooled. In this case,
the BCM power dissipation is PDTOTAL and the three surface
temperatures are represented as TCASE_TOP, TCASE_BOTTOM, and TLEADS. This
thermal system can now be very easily analyzed using a SPICE
simulator with simple resistors, voltage sources, and a current source.
The results of the simulation would provide an estimate of heat flow
through the various pathways as well as internal temperature.
This paradigm shiꢀ requires system design to carefully evaluate
external filters in order to:
n Guarantee low source impedance:
To take full advantage of the BCM module’s dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5 MHz. The
connection of the bus converter module to its power
source should be implemented with minimal distribution
inductance. If the interconnect inductance exceeds
100 nH, the input should be bypassed with a RC damper
to retain low source impedance and stable operation. With
an interconnect inductance of 200 nH, the RC damper
may be as high as 1 μF in series with 0.3 Ω. A single
electrolytic or equivalent low-Q capacitor may be used in
place of the series RC bypass.
Thermal Resistance Top
MAX INTERNAL TEMP
1.39°C / W
n Further reduce input and/or output voltage ripple without
Thermal Resistance Bottom
Thermal Resistance Leads
1.40°C / W
1.27°C / W
sacrificing dynamic response:
+
–
+
–
+
–
Given the wide bandwidth of the module, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor.
TCASE_BOTTOM(°C)
TLEADS(°C)
TCASE_TOP(°C)
Power Dissipation (W)
Figure 19 — Top case, Bottom case and leads thermal model
n Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
induce stresses:
Alternatively, equations can be written around this circuit and
analyzed algebraically:
The module primary/secondary voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even when disabled, the powertrain is exposed
to the applied voltage and power MOSFETs must
withstand it.
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD2 • 1.24 = TCASE_BOTTOM
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1+ PD2+ PD3
Where TINT represents the internal temperature and PD1, PD2, and PD3
represent the heat flow through the top side, bottom side, and leads
respectively.
Total load capacitance at the output of the BCM module shall not
exceed the specified maximum. Owing to the wide bandwidth and low
output impedance of the module, low-frequency bypass capacitance
and significant energy storage may be more densely and efficiently
provided by adding capacitance at the input of the module. At
frequencies <500 kHz the module appears as an impedance of RSEC
between the source and load.
Thermal Resistance Top
MAX INTERNAL TEMP
1.39°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
Within this frequency range, capacitance at the input appears as
effective capacitance on the output per the relationship
defined in Eq. (13).
1.40°C / W
1.27°C / W
+
–
+
–
TCASE_BOTTOM(°C)
TLEADS(°C)
TCASE_TOP(°C)
Power Dissipation (W)
CPRI_EXT
(13)
CSEC_EXT
=
K2
Figure 20 — Top case and leads thermal model
This enables a reduction in the size and number of capacitors used in a
typical system.
BCM® Bus Converter
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Figure 20 shows a scenario where there is no bottom side cooling. In
this case, the heat flow path to the bottom is leꢀ open and the
equations now simplify to:
ZIN_EQ1
ZOUT_EQ1
BCM®1
R0_1
Vout
Vin
TINT – PD1 • 1.24 = TCASE_TOP
TINT – PD3 • 7 = TLEADS
PDTOTAL = PD1 + PD3
ZOUT_EQ2
ZIN_EQ2
BCM®2
R0_2
+
Load
DC
Thermal Resistance Top
MAX INTERNAL TEMP
1.39°C / W
Thermal Resistance Bottom
Thermal Resistance Leads
1.40°C / W
1.27°C / W
+
–
TCASE_BOTTOM(°C)
TLEADS(°C)
TCASE_TOP(°C)
Power Dissipation (W)
ZOUT_EQn
BCM®n
R0_n
ZIN_EQn
Figure 21 — Top case thermal model
Figure 22 — BCM module array
Figure 21 shows a scenario where there is no bottom side and leads
cooling. In this case, the heat flow path to the bottom is leꢀ open and
the equations now simplify to:
Fuse Selection
In order to provide flexibility in configuring power systems
VI Chip® modules are not internally fused. Input line fusing
of VI Chip products is recommended at system level to provide thermal
protection in case of catastrophic failure.
TINT – PD1 • 1.24 = TCASE_TOP
PDTOTAL = PD1
Please note that Vicor has a suite of online tools, including a simulator
and thermal estimator which greatly simplify the task of determining
whether or not a BCM thermal configuration is valid for a given
condition. These tools can be found at:
The fuse shall be selected by closely matching system
requirements with the following characteristics:
n Current rating
http://www.vicorpower.com/powerbench.
(usually greater than maximum current of BCM module)
n Maximum voltage rating
Current Sharing
(usually greater than the maximum possible input voltage)
n Ambient temperature
n Nominal melting I2t
The performance of the SAC™ topology is based on efficient transfer of
energy through a transformer without the need of closed loop control.
For this reason, the transfer characteristic can be approximated by an
ideal transformer with a positive temperature coefficient series
resistance.
n Recommend fuse: ≤ 40 A Littelfuse 456 Series
Reverse Operation
This type of characteristic is close to the impedance characteristic of a
DC power distribution system both in dynamic (AC) behavior and for
steady state (DC) operation.
BCM modules are capable of reverse power operation. Once the unit is
started, energy will be transferred from secondary back to the primary
whenever the secondary voltage exceeds VPRI • K. The module will
continue operation in this fashion for as long as no faults occur.
When multiple BCM modules of a given part number are connected in
an array they will inherently share the load current according to the
equivalent impedance divider that the system implements from the
power source to the point of load.
Transient operation in reverse is expected in cases where there is
significant energy storage on the output and transient voltages appear
on the input.
Some general recommendations to achieve matched array impedances
include:
n Dedicate common copper planes within the PCB
to deliver and return the current to the modules.
n Provide as symmetric a PCB layout as possible among modules
n An input filter is required for an array of BCMs in order to
prevent circulating currents.
For further details see AN:016 Using BCM Bus Converters
in High Power Arrays.
BCM® Bus Converter
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BCM Module Through Hole Package Mechanical Drawing and Recommended Land Pattern
25.14 .ꢀ3
.990 .015
12.57
.495
11.4ꢀ
.450
2.0ꢀ
.030
(9) PL.
2.0ꢀ
.030
(9) PL.
27.21
1.071
(2) PL.
21.94
.364
17.09
.67ꢀ
(2) PL.
(2) PL.
ꢀ0.50
1.201
12.52
.49ꢀ
7.94
.ꢀ12
(2) PL.
(2) PL.
ꢀ.ꢀ7
.1ꢀ2
1.49
.053
(2) PL.
0
0
0
0
(2) PL.
6.76
.266
61.00 .1ꢀ
2.402 .005
(2) PL.
1.02
.040
1.02
.040
(ꢀ) PL.
(ꢀ) PL.
13.05
.710
20.34
.320
(2) PL.
(2) PL.
2ꢀ.64
.9ꢀ1
(2) PL.
27.55
1.035
(2) PL.
TOP VIEW (COMPONENT SIDE)
BOTTOM VIEW
.05 [.002]
7.26 .05
.236 .002
NOTES:
1- RoHS COMPLIANT PER CST-0001 LATEST REVISION.
SEATING
PLANE
2- UNLESS SPECIFIED OTHERWISE, DIMENSIONS ARE MM / [INCH], TOLERANCE 0.127 / [0.005]
4.17
.164
.41
.016
(24) PL.
(24) PL.
27.21 .03
1.071 .00ꢀ
(2) PL.
+VSEC
-VSEC
+VSEC
21.94 .03
.364 .00ꢀ
(2) PL.
-VSEC
17.09 .03
.67ꢀ .00ꢀ
(2) PL.
-VSEC
+VSEC
+VSEC
-VSEC
-VSEC
+VSEC
+VSEC
-VSEC
12.52 .03
.49ꢀ .00ꢀ
(2) PL.
7.94 .03
.ꢀ12 .00ꢀ
(2) PL.
ꢀ.ꢀ7 .03
.1ꢀ2 .00ꢀ
(2) PL.
1.49 .03
.053 .00ꢀ
0
0
-VSEC
-VSEC
(2) PL.
6.76 .03
.266 .00ꢀ
(2) PL.
+VSEC
+VSEC
1.52 .03
.060 .00ꢀ
PLATED THRU
.25 [.010]
ANNULAR RING
2.54 .03
.100 .00ꢀ
PLATED THRU
.ꢀ3 [.015]
ANNULAR RING
+VPRI
+VPRI
+VPRI
TM
(6) PL.
EN
VAUX
(13) PL.
13.05 .03
.710 .00ꢀ
(2) PL.
+VPRI
-VPRI
20.34 .03
.320 .00ꢀ
(2) PL.
2ꢀ.64 .03
.9ꢀ1 .00ꢀ
(2) PL.
27.55 .03
1.035 .00ꢀ
(2) PL.
RECOMMENDED HOLE PATTERN
(COMPONENT SIDE)
BCM® Bus Converter
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Revision History
Revision
Date
Description
Page Number(s)
1.0
08/26/15
Initial Release
n/a
Changed PRI to SEC Input Quiescent Current
Added certifications
5
1.1
09/28/15
1 & 15
BCM® Bus Converter
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Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and
accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom
power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no
representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make
changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and
is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are
used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
Specifications are subject to change without notice.
Vicor’s Standard Terms and Conditions
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.
Product Warranty
In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the
“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment
and is not transferable.
UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMS
ALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW) WITH
RESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY, FITNESS FOR
PARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER MATTER.
This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liable
for collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumes
no liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products and
components. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and
operating safeguards.
Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact
Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be
returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the
product was defective within the terms of this warranty.
Life Support Policy
VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS
PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support
devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform
when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the
user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products
and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and pending patent applications) relating to the products described in this
data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is granted by this document.
Interested parties should contact Vicor's Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
6,911,848; 6,930,893; 6,934,166; 7,145,786; 7,782,639; 8,427,269 and for use under 6,975,098 and 6,984,965.
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: custserv@vicorpower.com
Technical Support: apps@vicorpower.com
BCM® Bus Converter
Page 23 of 23
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SI9122E
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