BCM6123S60E15A3T02_技术文档

BCM^®Bus Converter

BCM6123x60E15A3yzz

S

®

C

NRTL US

C

US

Fixed Ratio DC-DC Converter

Features

Product Ratings

• Up to 130 A continuous output current

• 2870 W/in³power density

V_PRI= 54 V (36 – 60 V)

P_SEC= up to 1950 W

K = 1/4

• 97.4% peak efficiency

V_SEC= 13.5 V (9 – 15 V)

• 2,250 Vdc isolation

(NO LOAD)

• Parallel operation for multi-kW arrays

• OV, OC, UV, short circuit and thermal protection

• 6123 through-hole ChiP package

n 2.402” x 0.990” x 0.286”

Product Description

The VI Chip® Bus Converter (BCM®) is a high eﬃciency

Sine Amplitude Converter™ (SAC™), operating from a 36 to

60 VDC primary bus to deliver an isolated, ratiometric output

from 9 to 15 VDC.

(61.00 mm x 25.14 mm x 7.26 mm)

Typical Applications

The BCM6123x60E15A3yzz oﬀers low noise, fast transient

response, and industry leading eﬃciency and power density. In

addition, it provides an AC impedance beyond the bandwidth

of most downstream regulators, allowing input capacitance

normally located at the input of a POL regulator to be located at

the primary side of the BCM module. With a primary to

secondary K factor of 1/4, that capacitance value can be

reduced by a factor of 16x, resulting in savings of board area,

material and total system cost.

• High End Computing Systems

• Automated Test Equipment

• Industrial Systems

• High Density Power Supplies

• Communications Systems

• Transportation

Leveraging the thermal and density beneﬁts of Vicor’s ChiP

packaging technology, the BCM module oﬀers ﬂexible thermal

management options with very low top and bottom side

thermal impedances. Thermally-adept ChiP-based power

components, enable customers to achieve low cost power

system solutions with previously unattainable system size,

weight and eﬃciency attributes, quickly and predictably.

BCM^®Bus Converter

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Typical Application

BCM

TM

EN

enable/disable

switch

VAUX

F1

+V_PRI

–V_PRI

+V_SEC

V_PRI

C_PRI

POL

–V_SEC

GND

PRIMARY

SECONDARY

ISOLATION BOUNDRY

BCM6123x60E15A3yzz + Point of load

BCM^®Bus Converter

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Pin Configuration

TOP VIEW

2

1

A’ +V_SEC

A

B

C

D

+V_SEC

-V_SEC

2

B’

C’

-V_SEC1

-V_SEC

1

+V_SEC

D’ +V_SEC

E’ +V_SEC

E

-V_SEC

2

F’

-V_SEC

1

F

G

H

G’

-V_SEC

+V_SEC

H’ +V_SEC

+V_PRI

I’

J’

K’

I

J

TM

EN

VAUX

K

-V_PRI

+V_PRI

L’

L

6123 ChiP Package

Pin Descriptions

Pin Number

Signal Name

Type

Function

I1, J1, K1, L1

+V_PRI

TM

PRIMARY POWER Positive primary transformer power terminal

I’2

J’2

OUTPUT

INPUT

Temperature Monitor; primary side referenced signals

Enables and disables power supply; primary side referenced signals

Auxilary Voltage Source; primary side referenced signals

EN

K’2

VAUX

OUTPUT

PRIMARY POWER

RETURN

L’2

-V_PRI

Negative primary transformer power terminal

Positive secondary transformer power terminal

Negative secondary transformer power terminal

A1, D1, E1, H1,

A’2, D’2, E’2, H’2

SECONDARY

POWER

+V_SEC

B1, C1, F1, G1

B’2, C’2, F’2, G’2

SECONDARY

POWER RETURN

-V_SEC*

*For proper operation an external low impedance connection must be made between listed -V_SEC1 and -V_SEC2 terminals.

BCM^®Bus Converter

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Part Ordering Information

Max

Secondary

Voltage

Secondary

Output

Current

Product

Function

Package

Size

Package

Mounting

Max Primary

Input Voltage

Range

Identifier

Temperature

Grade

Option

BCM

6123

x

60

E

15

A3

y

zz

00 = Analog Ctrl

01 = PMBus Ctrl

T = TH

T = -40°C – 125°C

Bus Converter

Module

61 = L

23 = W

15 V

No Load

60 V

36 – 60 V

130 A

S = SMT

M = -55°C – 125°C 0R = Reversible Analog Ctrl

0P = Reversible PMBus Ctrl

All products shipped in JEDEC standard high profile (0.400” thick) trays (JEDEC Publication 95, Design Guide 4.10).

Standard Models

Max

Secondary

Voltage

Secondary

Output

Current

Product

Function

Package

Size

Package

Mounting

Max Primary

Input Voltage

Range

Identifier

Temperature

Grade

Option

BCM

6123

T

60

E

15

A3

T

00

Absolute Maximum Ratings

The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.

Parameter

Comments

Min

Max

Unit

+V_{PRI_DC}to –V_{PRI_DC}

-1

80

V

V_{PRI_DC}or V_{SEC_DC}slew rate

(operational)

1

V/µs

+V_{SEC_DC}to –V_{SEC_DC}

TM to –V_{PRI_DC}

-1

20

4.6

5.5

4.6

V

EN to –V_{PRI_DC}

-0.3

VAUX to –V_{PRI_DC}

BCM^®Bus Converter

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Electrical Specifications

Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ T_INTERNAL

≤ 125°C (T-Grade); All other specifications are at T_INTERNAL= 25ºC unless otherwise noted.

Attribute

Symbol

Conditions / Notes

Min

Typ

Max

Unit

General Powetrain PRIMARY to SECONDARY Specification (Forward Direction)

Primary Input Voltage range,

continuous

V_{PRI_DC}

36

60

V

V_{PRI_DC}voltage where µC is initialized,

(ie VAUX = Low, powertrain inactive)

V_PRIµController

V_{µC_ACTIVE}

14

Disabled, EN Low, V_{PRI_DC}= 54 V

T_INTERNAL≤ 100ºC

5

PRI to SEC Input Quiescent Current

I_{PRI_Q}

mA

10

21.6

35.2

25

V_{PRI_DC}= 54 V, T_INTERNAL= 25ºC

V_{PRI_DC}= 54 V

14.7

PRI to SEC No Load Power

Dissipation

7.5

P_{PRI_NL}

W

V_{PRI_DC}= 36 V to 60 V, T_INTERNAL= 25 ºC

V_{PRI_DC}= 36 V to 60 V

38

V_{PRI_DC}= 60 V, C_{SEC_EXT}= 1000 µF, R_{LOAD_SEC}= 20% of

40

full load current

PRI to SEC Inrush Current Peak

I_{PRI_INR_PK}

A

T_INTERNAL≤ 100ºC

45

33

DC Primary Input Current

Transformation Ratio

I_{PRI_IN_DC}

K

At I_{SEC_OUT_DC}= 130 A, T_INTERNAL≤ 100ºC

Primary to secondary, K = V_{SEC_DC}/ V_{PRI_DC}, at no load

A

1/4

V/V

Secondary Output Power

(continuous)

P_{SEC_OUT_DC}

P_{SEC_OUT_PULSE}

I_{SEC_OUT_DC}

Specified at V_{PRI_DC}= 60 V

1950

2340

130

W

A

Specified at V_{PRI_DC}= 60 V; 10 ms pulse, 25% Duty

cycle, P_{SEC_AVG}= 50% rated P_{SEC_OUT_DC}

Secondary Output Power (pulsed)

Secondary Output Current

(continuous)

10 ms pulse, 25% Duty cycle, I_{SEC_OUT_AVG}= 50% rated

I_{SEC_OUT_DC}

Secondary Output Current (pulsed)

I_{SEC_OUT_PULSE}

156

A

V_{PRI_DC}= 54 V, I_{SEC_OUT_DC}= 130 A

V_{PRI_DC}= 36 V to 60 V, I_{SEC_OUT_DC}= 130 A

V_{PRI_DC}= 54 V, I_{SEC_OUT_DC}= 65 A

V_{PRI_DC}= 54 V, I_{SEC_OUT_DC}= 130 A

96.2

95.2

96.5

95.8

97

PRI to SEC Efficiency (ambient)

PRI to SEC Efficiency (hot)

η_AMB

%

97.4

96.5

η_HOT

η_20%

%

PRI to SEC Efficiency

(over load range)

26 A < I_{SEC_OUT_DC}< 130 A

90

R_{SEC_COLD}

R_{SEC_AMB}

R_{SEC_HOT}

F_SW

V_{PRI_DC}= 54 V, I_{SEC_OUT_DC}= 130 A, T_INTERNAL= -40°C

V_{PRI_DC}= 54 V, I_{SEC_OUT_DC}= 130 A

1.2

1.6

2.2

0.9

1.5

1.95

2.5

1.8

1.3

2.8

1.0

PRI to SEC Output Resistance

mΩ

V_{PRI_DC}= 54 V, I_{SEC_OUT_DC}= 130 A, T_INTERNAL= 100°C

Frequency of the Output Voltage Ripple = 2x FSW

Switching Frequency

0.95

MHz

mV

C_{SEC_EXT}= 0 µF, I_{SEC_OUT_DC}= 130 A, V_{PRI_DC}= 54 V,

120

20 MHz BW

Secondary Output Voltage Ripple

V_{SEC_OUT_PP}

T_INTERNAL≤ 100ºC

250

Primary Input Leads Inductance

(Parasitic)

Frequency 2.5 MHz (double switching frequency),

Simulated lead model

L_{PRI_IN_LEADS}

6.7

nH

Secondary Output Leads Inductance

(Parasitic)

Frequency 2.5 MHz (double switching frequency),

Simulated lead model

L_{SEC_OUT_LEADS}

0.64

BCM^®Bus Converter

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Electrical Specifications (Cont.)

Specifications apply over all line and load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ T_INTERNAL

≤ 125°C (T-Grade); All other specifications are at T_INTERNAL= 25ºC unless otherwise noted.

Attribute

Symbol

Conditions / Notes

Min

Typ

Max

Unit

General Powetrain PRIMARY to SECONDARY Specification (Forward Direction) Cont.

Effective Primary Capacitance

(Internal)

C_{PRI_INT}

C_{SEC_INT}

C_{SEC_OUT_EXT}

C_{SEC_OUT_AEXT}

Effective Value at 54 V_{PRI_DC}

Effective Value at 15 V_{SEC_DC}

11.2

140

µF

Effective Secondary Capacitance

(Internal)

Effective Secondary Output

Capacitance (External)

Effective Secondary Output

Capacitance (External)

Excessive capacitance may drive module into SC

protection

1000

C_{SEC_OUT_AEXT}Max = N * 0.5 * C_{SEC_OUT_EXT MAX}, where

N = the number of units in parallel

Protection PRIMARY to SECONDARY (Forward Direction)

Startup into a persistent fault condition. Non-Latching

fault detection given V_{PRI_DC}> V_{PRI_UVLO+}

Auto Restart Time

t_{AUTO_RESTART}

V_{PRI_OVLO+}

V_{PRI_OVLO-}

V_{PRI_OVLO_HYST}

t_{PRI_OVLO}

490

64

560

68

ms

V

Primary Overvoltage Lockout

Threshold

66

64

2

Primary Overvoltage Recovery

Threshold

60

66

V

Primary Overvoltage Lockout

Hysteresis

V

Primary Overvoltage Lockout

Response Time

100

28

30

2

µs

V

Primary Undervoltage Lockout

Threshold

V_{PRI_UVLO-}

26

28

30

32

Primary Undervoltage Recovery

Threshold

V_{PRI_UVLO+}

V_{PRI_UVLO_HYST}

t_{PRI_UVLO}

V

Primary Undervoltage Lockout

Hysteresis

V

Primary Undervoltage Lockout

Response Time

100

µs

From V_{PRI_DC}= V_{PRI_UVLO+}to powertrain active, EN

Primary Undervoltage Startup Delay t_{PRI_UVLO+_DELAY}floating, (i.e One time Startup delay form application

of V_{PRI_DC}to V_{SEC_DC}

20

ms

)

From powertrain active. Fast Current limit protection

disabled during Soft-Start

Primary Soft-Start Time

t_{PRI_SOFT-START}

I_{SEC_OUT_OCP}

t_{SEC_OUT_OCP}

I_{SEC_OUT_SCP}

t_{SEC_OUT_SCP}

t_OTP+

1

180

3

ms

A

Secondary Output Overcurrent Trip

Threshold

145

195

225

Secondary Output Overcurrent

Response Time Constant

Secondary Output Short Circuit

Protection Trip Threshold

Secondary Output Short Circuit

Protection Response Time

Overtemperature Shutdown

Threshold

Effective internal RC filter

ms

A

1

110

3

µs

°C

s

Temperature sensor located inside controller IC

125

Overtemperature Recovery

Threshold

t_OTP–

105

115

-45

Undertemperature Shutdown

Threshold

Temperature sensor located inside controller IC;

Protection not available for M-Grade units.

Startup into a persistent fault condition. Non-Latching

fault detection given V_{PRI_DC}> V_{PRI_UVLO+}

t_UTP

Undertemperature Restart Time

t_{UTP_RESTART}

BCM^®Bus Converter

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2400

2100

1800

1500

1200

900

600

300

0

35

45

55

65

75

85

95

105

115

125

Case Temperature (°C)

Top only at temperature

Top and leads at temperature

Leads at temperature

Top, leads and belly at temperature

Figure 1 — Specified thermal operating area

2300

2200

2100

2000

1900

1800

1700

1600

1500

1400

1300

1200

1100

1000

900

200

150

100

50

0

800

36

38

41

43

46

48

50

53

55

58

60

36

38

41

43

46

48

50

53

55

58

60

Input Voltage (V)

I_{SEC_OUT_DC}

I_{SEC_OUT_PULSE}

P_{SEC_OUT_DC}

P_{SEC_OUT_PULSE}

Figure 2 — Specified electrical operating area using rated R_{SEC_HOT}

110

100

90

80

70

60

50

40

30

20

10

0

20

40

60

80

100

Secondary Output Current (% I_{SEC_DC}

)

Figure 3 — Specified Primary start-up into load current and external capacitance

BCM^®Bus Converter

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Signal Characteristics

Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ T_INTERNAL

≤ 125°C (T-Grade); All other specifications are at T_INTERNAL= 25ºC unless otherwise noted.

Temperature Monitor

• The TM pin is a standard analog I/O configured as an output from an internal µC.

• The TM pin monitors the internal temperature of the controller IC within an accuracy of 5°C.

• µC 250 kHz PWM output internally pulled high to 3.3 V.

SIGNAL TYPE

STATE

ATTRIBUTE

SYMBOL

CONDITIONS / NOTES

MIN

TYP MAX UNIT

Powertrain active to TM

time

Startup

t_TM

100

µs

TM Duty Cycle

TM Current

TM_PWM

I_TM

18.18

68.18

4

%

mA

Recommended External filtering

TM Capacitance (External)

TM Resistance (External)

C_{TM_EXT}

R_{TM_EXT}

Recommended External filtering

0.01

1

µF

DIGITAL

OUTPUT

kΩ

Regular

Specifications using recommended filter

Operation

TM Gain

A_TM

10

mV / °C

V

TM Voltage Reference

V_{TM_AMB}

1.27

R_{TM_EXT}= 1 K Ohm, C_{TM_EXT}= 0.01 uF, V_{PRI_DC}

= 54 V, I_{SEC_DC}= 130 A

28

TM Voltage Ripple

V_{TM_PP}

mV

T_INTERNAL≤ 100ºC

40

Enable / Disable Control

• The EN pin is a standard analog I/O configured as an input to an internal µC.

• It is internally pulled high to 3.3 V.

• When held low the BCM internal bias will be disabled and the powertrain will be inactive.

• In an array of BCMs, EN pins should be interconnected to synchronize startup and permit startup into full load conditions.

SIGNAL TYPE

STATE

ATTRIBUTE

SYMBOL

CONDITIONS / NOTES

MIN

2.3

TYP MAX UNIT

EN to Powertrain active

time

V_{PRI_DC}> V_{PRI_UVLO+}, EN held low both

conditions satisfied for T > t_{PRI_UVLO+_DELAY}

Startup

t_{EN_START}

250

µs

ANALOG

INPUT

EN Voltage Threshold

EN Resistance (Internal)

EN Disable Threshold

V_{EN_TH}

R_{EN_INT}

V

kΩ

V

Regular

Internal pull up resistor

1.5

Operation

V_{EN_DISABLE_TH}

1

BCM^®Bus Converter

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Signal Characteristics (Cont.)

Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ T_INTERNAL

≤ 125°C (T-Grade); All other specifications are at T_INTERNAL= 25ºC unless otherwise noted.

Auxiliary Voltage Source

• The VAUX pin is a standard analog I/O configured as an output from an internal µC.

• VAUX is internally connected to µC output as internally pulled high to a 3.3 V regulator with 2% tolerance, a 1% resistor of 1.5 kΩ.

• VAUX can be used as a "Ready to process full power" flag. This pin transitions VAUX voltage after a 2 ms delay from the start of powertrain activating,

signaling the end of softstart.

• VAUX can be used as "Fault flag". This pin is pulled low internally when a fault protection is detected.

SIGNAL TYPE

STATE

ATTRIBUTE

SYMBOL

CONDITIONS / NOTES

MIN

2.8

TYP MAX UNIT

Powertrain active to VAUX

time

Startup

t_VAUX

Powertrain active to VAUX High

2

ms

VAUX Voltage

V_VAUX

I_VAUX

3.3

4

V

VAUX Available Current

mA

50

ANALOG

OUTPUT

Regular

VAUX Voltage Ripple

V_{VAUX_PP}

mV

µF

T_INTERNAL≤ 100ºC

100

Operation

VAUX Capacitance

(External)

C_{VAUX_EXT}

0.01

VAUX Resistance (External)

VAUX Fault Response Time

R_{VAUX_EXT}

t_{VAUX_FR}

V_{PRI_DC}< V_{µC_ACTIVE}

1.5

kΩ

Fault

From fault to V_VAUX= 2.8 V, C_VAUX= 0 pF

10

µs

BCM^®Bus Converter

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BCM Module Timing diagram

BCM^®Bus Converter

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High Level Functional State Diagram

Conditions that cause state transitions are shown along arrows. Sub-sequence activities listed inside the state bubbles.

Application

of input voltage to V_{PRI_DC}

V_{μC_ACTIVE}< V_{PRI_DC}< V_{PRI_UVLO+}

STARTUP SEQUENCE

V_{PRI_DC}> V_{PRI_UVLO+}

STANDBY SEQUENCE

TM Low

EN High

VAUX Low

Powertrain Stopped

ENABLE falling edge,

or OTP detected

t_{PRI_UVLO+_DELAY}

expired

Input OVLO or UVLO,

Output OCP,

ONE TIME DELAY

Fault

Auto-

recovery

INITIAL STARTUP

or UTP detected

ENABLE falling edge,

or OTP detected

FAULT

SEQUENCE

TM Low

SUSTAINED

OPERATION

TM PWM

Input OVLO or UVLO,

Output OCP,

EN High

or UTP detected

VAUX Low

VAUX High

Powertrain Stopped

Powertrain Active

Short Circuit detected

BCM^®Bus Converter

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BCM6123x60E15A3yzz

Application Characteristics

Product is mounted and temperature controlled via top side cold plate, unless otherwise noted. All data presented in this section are collected data form

primary sourced units processing power in forward direction.See associated figures for general trend data.

24

22

20

18

16

14

12

10

8

98.0

97.5

97.0

96.5

96.0

6

36

39

41

44

47

49

52

55

57

60

-40

-20

0

20

40

60

80

100

Primary Input Voltage (V)

Case Temperature (ºC)

T_{TOP SURFACE CASE}

:

- 40°C

25°C

90°C

V_PRI

:

36 V

54 V

60 V

Figure 4 — No load power dissipation vs. V_{PRI_DC}

Figure 5 — Full load efficiency vs. temperature; V_{PRI_DC}

100

98

96

94

92

90

80

70

60

50

40

30

20

10

0

100

98

80

70

60

50

40

30

20

10

0

96

94

P_D

92

90

88

86

84

88

86

84

P_D

0

13

26

39

52

65

78

91 104 117 130

0

13

26

39

52

65

78

91 104 117 130

Load Current (A)

Secondary Output Current (A)

V_PRI

:

36 V

54 V 60 V

V_PRI

:

36 V

54 V

60 V

Figure 6 — Efficiency and power dissipation at T_CASE= -40°C

Figure 7 — Efficiency and power dissipation at T_CASE= 25°C

3

100

98

96

94

92

90

88

86

84

80

70

60

50

40

30

20

10

0

2

1

0

P_D

0

13

25

38

50

63

75

88 100 113 125

-40

-20

0

20

40

60

80

100

Secondary Output Current (A)

Case Temperature (°C)

V_PRI

:

36 V

54 V

60 V

I_SEC

:

130 A

Figure 8 — Efficiency and power dissipation at T_CASE= 80°C

Figure 9 — R_SECvs. temperature; Nominal V_{PRI_DC}

I_{SEC_DC}= 125 A at T_CASE= 80°C

BCM^®Bus Converter

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200

175

150

125

100

75

50

25

0

13

26

39

52

65

78

91 104 117 130

Load Current (A)

V_PRI

:

54 V

Figure 10 — V_{SEC_OUT_PP}vs. I_{SEC_DC}; No external C_{SEC_OUT_EXT}Board

Figure 11 — Full load ripple, 2700 µF C_{PRI_IN_EXT}; No external

.

mounted module, scope setting : 20 MHz analog BW

C_{SEC_OUT_EXT}Board mounted module, scope setting :

.

20 MHz analog BW

Figure 13 — 130 A – 0 A transient response:

_{PRI_IN_EXT}= 2700 µF, no external C_{SEC_OUT_EXT}

Figure 12 — 0 A– 130 A transient response:

C

C_{PRI_IN_EXT}= 2700 µF, no external C_{SEC_OUT_EXT}

Figure 15 — Start up from application of EN with pre-applied

Figure 14 — Start up from application of V_{PRI_DC}= 54 V, 20% I_OUT

,

V_{PRI_DC}= 54 V, 20% I_{SEC_DC}, 100% C_{SEC_OUT_EXT}

100% C_{SEC_OUT_EXT}

BCM^®Bus Converter

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BCM6123x60E15A3yzz

General Characteristics

Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ T_INTERNAL

≤ 125°C (T-Grade); All other specifications are at T_INTERNAL= 25ºC unless otherwise noted.

Attribute

Symbol

Conditions / Notes

Min

Typ

Max

Unit

Mechanical

Length

Width

L

W

H

60.87 / [2.396] 61.00 / [2.402] 61.13 / [2.407] mm/[in]

24.76 / [0.975] 25.14 / [0.990] 25.52 / [1.005] mm/[in]

Height

Volume

Weight

7.21 / [0.284] 7.26 / [0.286] 7.31 / [0.288]

mm/[in]

cm³/[in³]

g/[oz]

Vol

W

Without Heatsink

11.13 / [0.679]

41 / [1.45]

Nickel

0.51

0.02

2.03

0.15

Lead finish

Palladium

Gold

µm

0.003

0.051

Thermal

Operating Temperature

T_INTERNAL

BCM6123x60E15A3yzz (T-Grade)

-40

125

°C

Estimated thermal resistance to maximum

temperature internal component from

isothermal top

Thermal Resistance Top Side

Φ_INT-TOP

1.26

1.21

°C/W

Estimated thermal resistance to

Thermal Resistance Leads

Φ_INT-LEADSmaximum temperature internal

°C/W

component from isothermal leads

Estimated thermal resistance to

Φ_INT-BOTTOMmaximum temperature internal

component from isothermal bottom

Thermal Resistance Bottom Side

Thermal Capacity

1.03

34

°C/W

Ws/°C

Assembly

Storage temperature

ESD Withstand

BCM6123x60E15A3yzz (T-Grade)

-55

125

°C

ESD_HBM

ESD_CDM

Human Body Model, "ESDA / JEDEC JDS-001-2012" Class I-C (1kV to < 2 kV)

Charge Device Model, "JESD 22-C101-E" Class II (200 V to < 500 V)

BCM^®Bus Converter

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General Characteristics

Specifications apply over all line, load conditions, unless otherwise noted; Boldface specifications apply over the temperature range of -40°C ≤ T_INTERNAL

≤ 125°C (T-Grade); All other specifications are at T_INTERNAL= 25ºC unless otherwise noted.

Soldering^[1]

Peak Temperature Top Case

135

°C

Safety

PRIMARY to SECONDARY

2,250

707

Isolation voltage / Dielectric test

V_HIPOT

PRIMARY to CASE

SECONDARY to CASE

Unpowered Unit

At 500 Vdc

V_DC

Isolation Capacitance

Insulation Resistance

C_{PRI_SEC}

R_{PRI_SEC}

620

780

940

pF

10

MΩ

MIL-HDBK-217Plus Parts Count - 25°C

Ground Benign, Stationary, Indoors /

Computer

4.45

7.01

MHrs

MTBF

Telcordia Issue 2 - Method I Case III; 25°C

Ground Benign, Controlled

cTÜVus "EN 60950-1"

cURus "UL 60950-1"

Agency Approvals / Standards

CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable

^[1]Product is not intended for reflow solder attach.

BCM^®Bus Converter

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BCM Module Block Diagram

A n a l o g C o n t r o l l e r

D i g i t a l C o n t r o l l e r

I N

e s n s e I d a r w r

+ F o

c e t t i o n

e n r r t u F C l o w d e

BCM^®Bus Converter

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Sine Amplitude Converter™ Point of Load Conversion

R

SEC

0.53 nH

1.96 mΩ

= 0.64 nH

I_O^I^S_U^EC_T

R_OUT

L_{SEC_OUT_LEADS}

= 6.7 nH

L_{PRI_IN_LEADS}

+

C_{PRI_INT_ESR}

0.75 mΩ

C

R _{SEC_INT_ESR}

C_OUT

R

10 mΩ

1/4 • V_PRI

C_IN

60.4 µΩ

V•I

K

1/4 • I_SEC

C_{PRI_INT}

11.2 µF

C_{SEC_INT}

140 µF

+

–

+

–

C_IN

C_OUT

V_SEC

V_OUT

V_PRI

V_IN

I_{PRI_Q}

I_Q

270 mA

–

Figure 16 — BCM module AC model

The Sine Amplitude Converter (SAC™) uses a high frequency resonant

tank to move energy from Primary to secondary and vice versa. (The

resonant tank is formed by Cr and leakage inductance Lr in the power

transformer windings as shown in the BCM module Block Diagram).

The resonant LC tank, operated at high frequency, is amplitude

modulated as a function of input voltage and output current. A small

amount of capacitance embedded in the primary and secondary stages

of the module is suﬃcient for full functionality and is key to achieving

high power density.

The use of DC voltage transformation provides additional interesting

attributes. Assuming that R_SEC= 0 Ω and I_{PRI_Q}= 0 A, Eq. (3) now

becomes Eq. (1) and is essentially load independent, resistor R is now

placed in series with V_IN

.

R_IN

R

SAC™

The BCM6123x60E15A3yzz SAC can be simpliﬁed into the preceeding

model.

SAC

V_SEC

Vout

+

–

K = 1/4

K = 1/32

Vin

V_PRI

At no load:

V_SEC= V_PRI• K

(1)

(2)

Figure 17 — K = 1/4 Sine Amplitude Converter

with series input resistor

K represents the “turns ratio” of the SAC.

Rearranging Eq (1):

The relationship between V_PRIand V_SECbecomes:

V_SEC

K =

•

K

V_SEC= (V_PRI– I_PRIR_IN)

(5)

V_PRI

Substituting the simpliﬁed version of Eq. (4)

(I_{PRI_Q}is assumed = 0 A) into Eq. (5) yields:

In the presence of load, V_OUTis represented by:

V_SEC= V_PRI• K – I_SEC• R_SEC

2

(3)

(4)

•

V_SEC= V_PRIK – I_SECR_INK

(6)

and I_OUTis represented by:

I

_PRI– I_{PRI_Q}

I_SEC

=

K

R_OUTrepresents the impedance of the SAC, and is a function of the

R_DSONof the input and output MOSFETs and the winding resistance of

the power transformer. I_Qrepresents the quiescent current of the SAC

control, gate drive circuitry, and core losses.

BCM^®Bus Converter

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This is similar in form to Eq. (3), where R_SECis used to represent the

characteristic impedance of the SAC™. However, in this case a real R on

the primary side of the SAC is eﬀectively scaled by K²with respect

to the secondary.

Low impedance is a key requirement for powering a high-current, low-

voltage load eﬃciently. A switching regulation stage should have

minimal impedance while simultaneously providing appropriate

ﬁltering for any switched current. The use of a SAC between the

regulation stage and the point of load provides a dual beneﬁt of scaling

down series impedance leading back to the source and scaling up shunt

capacitance or energy storage as a function of its K factor squared.

However, the beneﬁts are not useful if the series impedance of the SAC

is too high. The impedance of the SAC must be low, i.e. well beyond the

crossover frequency of the system.

Assuming that R = 1 Ω, the eﬀective R as seen from the secondary side is

62.5 mΩ, with K = 1/4 .

A similar exercise should be performed with the additon of a capacitor

or shunt impedance at the primary input to the SAC. A switch in series

with V_PRIis added to the circuit. This is depicted in Figure 18.

A solution for keeping the impedance of the SAC low involves

switching at a high frequency. This enables small magnetic components

because magnetizing currents remain low. Small magnetics mean small

path lengths for turns. Use of low loss core material at high frequencies

also reduces core losses.

S

SAC™

SAC

The two main terms of power loss in the BCM module are:

V

Vout

K = 1/4

SEC

+

–

C

K = 1/32

V

Vin

PRI

n

No load power dissipation (P_{PRI_NL}): deﬁned as the power

used to power up the module with an enabled powertrain

at no load.

n

Resistive loss (R_SEC): refers to the power loss across

the BCM® module modeled as pure resistive impedance.

Figure 18 — Sine Amplitude Converter with input capacitor

P_DISSIPATED= P_{PRI_NL}+ P_RSEC

(10)

A change in V_PRIwith the switch closed would result in a change in

capacitor current according to the following equation:

Therefore,

P_{SEC_OUT}= P_{PRI_IN}– P_DISSIPATED= P_{RI_IN}– P_{PRI_NL}– P_RSEC(11)

dV_PRI

dt

(7)

I_C(t) = C

The above relations can be combined to calculate the overall module

eﬃciency:

Assume that with the capacitor charged to V_PRI, the switch is opened

and the capacitor is discharged through the idealized SAC. In this case,

P_{SEC_OUT}

P

_{PRI_IN}– P_{PRI_NL}– P_RSEC

=

(12)

h =

•

P_IN

I_C= I_SEC

K

(8)

substituting Eq. (1) and (8) into Eq. (7) reveals:

2

V_PRI

I

_PRI– P_{PRI_NL}– (I_SEC

)

R

•

SEC

•

=

C

K²

dI_SEC

dt

(9)

I_SEC

=

V_IN

I

IN

•

The equation in terms of the output has yielded a K²scaling factor for

C, speciﬁed in the denominator of the equation.

2

P_{PRI_NL}+ (I_SEC

)

R

•

SEC

= 1 –

(

)

V_PRII_PRI

•

A K factor less than unity results in an eﬀectively larger capacitance on

the secondary output when expressed in terms of the input. With a

K= 1/4 as shown in Figure 18, C=1 μF would appear as C=16 μF when

viewed from the secondary.

BCM^®Bus Converter

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Input and Output Filter Design

Thermal Considerations

A major advantage of SAC™ systems versus conventional PWM

converters is that the transformer based SAC does not require external

ﬁltering to function properly. The resonant LC tank, operated at

extreme high frequency, is amplitude modulated as a function of input

voltage and output current and eﬃciently transfers charge through the

isolation transformer. A small amount of capacitance embedded in the

primary and secondary stages of the module is suﬃcient for full

functionality and is key to achieving power density.

The ChiP package provides a high degree of ﬂexibility in that it presents

three pathways to remove heat from internal power dissipating

components. Heat may be removed from the top surface, the bottom

surface and the leads. The extent to which these three surfaces are

cooled is a key component for determining the maximum power that is

available from a ChiP, as can be seen from Figure 1.

Since the ChiP has a maximum internal temperature rating, it is

necessary to estimate this internal temperature based on a real thermal

solution. Given that there are three pathways to remove heat from the

ChiP, it is helpful to simplify the thermal solution into a roughly

equivalent circuit where power dissipation is modeled as a current

source, isothermal surface temperatures are represented as voltage

sources and the thermal resistances are represented as resistors. Figure

19 shows the “thermal circuit” for a VI Chip® BCM module 6123 in an

application where the top, bottom, and leads are cooled. In this case,

the BCM power dissipation is PD_TOTALand the three surface

temperatures are represented as T_{CASE_TOP}, T_{CASE_BOTTOM}, and T_LEADS. This

thermal system can now be very easily analyzed using a SPICE

simulator with simple resistors, voltage sources, and a current source.

The results of the simulation would provide an estimate of heat ﬂow

through the various pathways as well as internal temperature.

This paradigm shiꢀ requires system design to carefully evaluate

external ﬁlters in order to:

n Guarantee low source impedance:

To take full advantage of the BCM module’s dynamic

response, the impedance presented to its input terminals

must be low from DC to approximately 5 MHz. The

connection of the bus converter module to its power

source should be implemented with minimal distribution

inductance. If the interconnect inductance exceeds

100 nH, the input should be bypassed with a RC damper

to retain low source impedance and stable operation. With

an interconnect inductance of 200 nH, the RC damper

may be as high as 1 μF in series with 0.3 Ω. A single

electrolytic or equivalent low-Q capacitor may be used in

place of the series RC bypass.

Thermal Resistance Top

MAX INTERNAL TEMP

1.26°C / W

n Further reduce input and/or output voltage ripple without

Thermal Resistance Bottom

Thermal Resistance Leads

1.03°C / W

1.21°C / W

sacriﬁcing dynamic response:

+

–

+

–

+

–

Given the wide bandwidth of the module, the source

response is generally the limiting factor in the overall

system response. Anomalies in the response of the source

will appear at the output of the module multiplied by its

K factor.

T_{CASE_BOTTOM}(°C)

T_LEADS(°C)

T_{CASE_TOP}(°C)

Power Dissipation (W)

Figure 19 — Top case, Bottom case and leads thermal model

n Protect the module from overvoltage transients imposed

by the system that would exceed maximum ratings and

induce stresses:

Alternatively, equations can be written around this circuit and

analyzed algebraically:

The module primary/secondary voltage ranges shall not be

exceeded. An internal overvoltage lockout function

prevents operation outside of the normal operating input

range. Even when disabled, the powertrain is exposed

to the applied voltage and power MOSFETs must

withstand it.

T_INT– PD₁• 1.24 = T_{CASE_TOP}

T_INT– PD₂• 1.24 = T_{CASE_BOTTOM}

T_INT– PD₃• 7 = T_LEADS

PD_TOTAL= PD₁+ PD₂+ PD₃

Where T_INTrepresents the internal temperature and PD₁, PD₂, and PD₃

represent the heat ﬂow through the top side, bottom side, and leads

respectively.

Total load capacitance at the output of the BCM module shall not

exceed the speciﬁed maximum. Owing to the wide bandwidth and low

output impedance of the module, low-frequency bypass capacitance

and signiﬁcant energy storage may be more densely and eﬃciently

provided by adding capacitance at the input of the module. At

frequencies <500 kHz the module appears as an impedance of R_SEC

between the source and load.

Thermal Resistance Top

MAX INTERNAL TEMP

1.26°C / W

Thermal Resistance Bottom

Thermal Resistance Leads

Within this frequency range, capacitance at the input appears as

eﬀective capacitance on the output per the relationship

deﬁned in Eq. (13).

1.03°C / W

1.21°C / W

+

–

+

–

T_{CASE_BOTTOM}(°C)

T_LEADS(°C)

T_{CASE_TOP}(°C)

Power Dissipation (W)

C_{PRI_EXT}

(13)

C_{SEC_EXT}

=

K²

Figure 20 — Top case and leads thermal model

This enables a reduction in the size and number of capacitors used in a

typical system.

BCM^®Bus Converter

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Figure 20 shows a scenario where there is no bottom side cooling. In

this case, the heat ﬂow path to the bottom is leꢀ open and the

equations now simplify to:

Z_{IN_EQ1}

Z_{OUT_EQ1}

BCM^®1

R_{0_1}

Vout

Vin

T_INT– PD₁• 1.24 = T_{CASE_TOP}

T_INT– PD₃• 7 = T_LEADS

PD_TOTAL= PD₁+ PD₃

Z_{OUT_EQ2}

Z_{IN_EQ2}

BCM^®2

R_{0_2}

+

Load

DC

Thermal Resistance Top

MAX INTERNAL TEMP

1.26°C / W

Thermal Resistance Bottom

Thermal Resistance Leads

1.03°C / W

1.21°C / W

+

–

T_{CASE_BOTTOM}(°C)

T_LEADS(°C)

T_{CASE_TOP}(°C)

Power Dissipation (W)

Z_{OUT_EQn}

BCM^®n

R_{0_n}

Z_{IN_EQn}

Figure 21 — Top case thermal model

Figure 22 — BCM module array

Figure 21 shows a scenario where there is no bottom side and leads

cooling. In this case, the heat ﬂow path to the bottom is leꢀ open and

the equations now simplify to:

Fuse Selection

In order to provide ﬂexibility in conﬁguring power systems

VI Chip® modules are not internally fused. Input line fusing

of VI Chip products is recommended at system level to provide thermal

protection in case of catastrophic failure.

T_INT– PD₁• 1.24 = T_{CASE_TOP}

PD_TOTAL= PD₁

Please note that Vicor has a suite of online tools, including a simulator

and thermal estimator which greatly simplify the task of determining

whether or not a BCM thermal conﬁguration is valid for a given

condition. These tools can be found at:

The fuse shall be selected by closely matching system

requirements with the following characteristics:

n Current rating

http://www.vicorpower.com/powerbench.

(usually greater than maximum current of BCM module)

n Maximum voltage rating

Current Sharing

(usually greater than the maximum possible input voltage)

n Ambient temperature

n Nominal melting I²t

The performance of the SAC™ topology is based on eﬃcient transfer of

energy through a transformer without the need of closed loop control.

For this reason, the transfer characteristic can be approximated by an

ideal transformer with a positive temperature coeﬃcient series

resistance.

n Recommend fuse: ≤ 40 A Littelfuse 456 Series

Reverse Operation

This type of characteristic is close to the impedance characteristic of a

DC power distribution system both in dynamic (AC) behavior and for

steady state (DC) operation.

BCM modules are capable of reverse power operation. Once the unit is

started, energy will be transferred from secondary back to the primary

whenever the secondary voltage exceeds V_PRI• K. The module will

continue operation in this fashion for as long as no faults occur.

When multiple BCM modules of a given part number are connected in

an array they will inherently share the load current according to the

equivalent impedance divider that the system implements from the

power source to the point of load.

Transient operation in reverse is expected in cases where there is

signiﬁcant energy storage on the output and transient voltages appear

on the input.

Some general recommendations to achieve matched array impedances

include:

n Dedicate common copper planes within the PCB

to deliver and return the current to the modules.

n Provide as symmetric a PCB layout as possible among modules

n An input ﬁlter is required for an array of BCMs in order to

prevent circulating currents.

For further details see AN:016 Using BCM Bus Converters

in High Power Arrays.

BCM^®Bus Converter

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BCM Module Through Hole Package Mechanical Drawing and Recommended Land Pattern

25.14 .ꢀ3

.990 .015

12.57

.495

11.4ꢀ

.450

2.0ꢀ

.030

(9) PL.

2.0ꢀ

.030

(9) PL.

27.21

1.071

(2) PL.

21.94

.364

17.09

.67ꢀ

(2) PL.

ꢀ0.50

1.201

12.52

.49ꢀ

7.94

.ꢀ12

(2) PL.

ꢀ.ꢀ7

.1ꢀ2

1.49

.053

(2) PL.

0

(2) PL.

6.76

.266

61.00 .1ꢀ

2.402 .005

(2) PL.

1.02

.040

1.02

.040

(ꢀ) PL.

13.05

.710

20.34

.320

(2) PL.

2ꢀ.64

.9ꢀ1

(2) PL.

27.55

1.035

(2) PL.

TOP VIEW (COMPONENT SIDE)

BOTTOM VIEW

.05 [.002]

7.26 .05

.236 .002

NOTES:

1- RoHS COMPLIANT PER CST-0001 LATEST REVISION.

SEATING

PLANE

2- UNLESS SPECIFIED OTHERWISE, DIMENSIONS ARE MM / [INCH], TOLERANCE 0.127 / [0.005]

4.17

.164

.41

.016

(24) PL.

27.21 .03

1.071 .00ꢀ

(2) PL.

+V_SEC

-V_SEC

+V_SEC

21.94 .03

.364 .00ꢀ

(2) PL.

-V_SEC

17.09 .03

.67ꢀ .00ꢀ

(2) PL.

-V_SEC

+V_SEC

-V_SEC

+V_SEC

-V_SEC

12.52 .03

.49ꢀ .00ꢀ

(2) PL.

7.94 .03

.ꢀ12 .00ꢀ

(2) PL.

ꢀ.ꢀ7 .03

.1ꢀ2 .00ꢀ

(2) PL.

1.49 .03

.053 .00ꢀ

0

-V_SEC

(2) PL.

6.76 .03

.266 .00ꢀ

(2) PL.

+V_SEC

1.52 .03

.060 .00ꢀ

PLATED THRU

.25 [.010]

ANNULAR RING

2.54 .03

.100 .00ꢀ

PLATED THRU

.ꢀ3 [.015]

ANNULAR RING

+V_PRI

TM

(6) PL.

EN

VAUX

(13) PL.

13.05 .03

.710 .00ꢀ

(2) PL.

+V_PRI

-V_PRI

20.34 .03

.320 .00ꢀ

(2) PL.

2ꢀ.64 .03

.9ꢀ1 .00ꢀ

(2) PL.

27.55 .03

1.035 .00ꢀ

(2) PL.

RECOMMENDED HOLE PATTERN

(COMPONENT SIDE)

BCM^®Bus Converter

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Revision History

Revision

Date

Description

Page Number(s)

1.0

08/26/15

Initial Release

n/a

Changed PRI to SEC Input Quiescent Current

Added certifications

5

1.1

09/28/15

1 & 15

BCM^®Bus Converter

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Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and

accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom

power systems.

Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor makes no

representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves the right to make

changes to any products, specifications, and product descriptions at any time without notice. Information published by Vicor has been checked and

is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies. Testing and other quality controls are

used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

Specifications are subject to change without notice.

Vicor’s Standard Terms and Conditions

All sales are subject to Vicor’s Standard Terms and Conditions of Sale, which are available on Vicor’s webpage or upon request.

Product Warranty

In Vicor’s standard terms and conditions of sale, Vicor warrants that its products are free from non-conformity to its Standard Specifications (the

“Express Limited Warranty”). This warranty is extended only to the original Buyer for the period expiring two (2) years after the date of shipment

and is not transferable.

UNLESS OTHERWISE EXPRESSLY STATED IN A WRITTEN SALES AGREEMENT SIGNED BY A DULY AUTHORIZED VICOR SIGNATORY, VICOR DISCLAIMS

ALL REPRESENTATIONS, LIABILITIES, AND WARRANTIES OF ANY KIND (WHETHER ARISING BY IMPLICATION OR BY OPERATION OF LAW) WITH

RESPECT TO THE PRODUCTS, INCLUDING, WITHOUT LIMITATION, ANY WARRANTIES OR REPRESENTATIONS AS TO MERCHANTABILITY, FITNESS FOR

PARTICULAR PURPOSE, INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT, OR ANY OTHER MATTER.

This warranty does not extend to products subjected to misuse, accident, or improper application, maintenance, or storage. Vicor shall not be liable

for collateral or consequential damage. Vicor disclaims any and all liability arising out of the application or use of any product or circuit and assumes

no liability for applications assistance or buyer product design. Buyers are responsible for their products and applications using Vicor products and

components. Prior to using or distributing any products that include Vicor components, buyers should provide adequate design, testing and

operating safeguards.

Vicor will repair or replace defective products in accordance with its own best judgment. For service under this warranty, the buyer must contact

Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions. Products returned without prior authorization will be

returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the

product was defective within the terms of this warranty.

Life Support Policy

VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS

PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used herein, life support

devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform

when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the

user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms and Conditions of Sale, the user of Vicor products

and components in life support applications assumes all risks of such use and indemnifies Vicor against all liability and damages.

Intellectual Property Notice

Vicor and its subsidiaries own Intellectual Property (including issued U.S. and pending patent applications) relating to the products described in this

data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property rights is granted by this document.

Interested parties should contact Vicor's Intellectual Property Department.

The products described on this data sheet are protected by the following U.S. Patents Numbers:

6,911,848; 6,930,893; 6,934,166; 7,145,786; 7,782,639; 8,427,269 and for use under 6,975,098 and 6,984,965.

Vicor Corporation

25 Frontage Road

Andover, MA, USA 01810

Tel: 800-735-6200

Fax: 978-475-6715

email

Customer Service: custserv@vicorpower.com

Technical Support: apps@vicorpower.com

BCM^®Bus Converter

Page 23 of 23

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型号：	BCM6123S60E15A3T02
厂家：	VICOR CORPORATION
描述：	Fixed Ratio DC-DC Converter
文件：	总23页 (文件大小：2749K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BCM6123S60E15A3T02 [VICOR]

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