10-F106NIA150SA-M136F [VINCOTECH]
Easy paralleling;Low turn-off losses;Low collector emitter saturation voltage;Positive temperature coefficient;Short tail current;型号: | 10-F106NIA150SA-M136F |
厂家: | VINCOTECH |
描述: | Easy paralleling;Low turn-off losses;Low collector emitter saturation voltage;Positive temperature coefficient;Short tail current |
文件: | 总27页 (文件大小:3292K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
10-F106NIA150SA-M136F
flowNPC 1
600V/150A
Features
flow1 housing
● Neutral-point-Clamped inverter
● Compact flow1 housing
● Low Inductance Layout
Target Applications
Schematic
● UPS
● Motor Drive
● Solar inverters
Types
● 10-F106NIA150SA-M136F
Maximum Ratings
Tj=25°C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Buck IGBT
VCE
IC
ICpulse
Ptot
Collector-emitter break down voltage
DC collector current
600
V
A
Th=80°C
Tc=80°C
109
144
Tj=Tjmax
tp limited by Tjmax
Tj=Tjmax
Pulsed collector current
Power dissipation per IGBT
Gate-emitter peak voltage
Short circuit ratings
450
A
Th=80°C
Tc=80°C
166
251
W
V
VGE
±20
tSC
Tj≤150°C
6
µs
V
VCC
VGE=15V
360
Tjmax
Maximum Junction Temperature
Turn off safe operating area
175
300
°C
A
Tj≤150°C
VCE<=VCES
Buck Diode
Tj=25°C
VRRM
IF
IFRM
Ptot
Peak Repetitive Reverse Voltage
DC forward current
600
V
A
Th=80°C
Tc=80°C
62
82
Tj=Tjmax
tp limited by Tjmax
Tj=Tjmax
Tc=100°C
Repetitive peak forward current
Power dissipation per Diode
Maximum Junction Temperature
450
A
Th=80°C
Tc=80°C
74
W
°C
112
Tjmax
175
Copyright by Vincotech
1
Revision: 5
10-F106NIA150SA-M136F
Maximum Ratings
Tj=25°C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Boost IGBT
VCE
IC
Collector-emitter break down voltage
DC collector current
600
V
A
Th=80°C
Tc=80°C
100
134
Tj=Tjmax
ICpuls
Ptot
VGE
tp limited by Tjmax
Tj=Tjmax
Pulsed collector current
Power dissipation per IGBT
Gate-emitter peak voltage
Short circuit ratings
450
A
Th=80°C
Tc=80°C
151
228
W
V
±20
tSC
Tj≤150°C
6
µs
V
VCC
VGE=15V
360
Tjmax
Maximum Junction Temperature
Turn off safe operating area
175
300
°C
A
Tj≤150°C
VCE<=VCES
Boost Inverse Diode
Peak Repetitive Reverse Voltage
DC forward current
VRRM
IF
IFRM
Ptot
Tc=25°C
600
V
A
Th=80°C
Tc=80°C
91
Tj=Tjmax
121
tp limited by Tjmax
Tj=Tjmax
Repetitive peak forward current
Power dissipation per Diode
Maximum Junction Temperature
300
A
Th=80°C
Tc=80°C
123
187
W
°C
Tjmax
175
Boost Diode
Tj=25°C
VRRM
IF
IFRM
Ptot
Peak Repetitive Reverse Voltage
DC forward current
600
V
A
Th=80°C
Tc=80°C
98
Tj=Tjmax
129
tp limited by Tjmax
Tj=Tjmax
Repetitive peak forward current
Power dissipation per Diode
Maximum Junction Temperature
300
A
Th=80°C
Tc=80°C
135
205
W
°C
Tjmax
175
Thermal Properties
Tstg
Top
Storage temperature
-40…+125
°C
°C
Operation temperature under switching condition
-40…+(Tjmax - 25)
Insulation Properties
Insulation voltage
Creepage distance
Clearance
Vis
t=2s
DC voltage
4000
V
min 12,7
min 12,7
mm
mm
Copyright by Vincotech
2
Revision: 5
10-F106NIA150SA-M136F
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
Vr [V] or
VGE [V] or
IC [A] or
IF [A] or
ID [A]
VCE [V] or
Tj
Min
Max
VGS [V]
VDS [V]
Buck IGBT
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
5
5,8
6,5
1,85
60
VGE(th)
VCE(sat)
ICES
IGES
Rgint
td(on)
tr
Gate emitter threshold voltage
Collector-emitter saturation voltage
Collector-emitter cut-off current incl. Diode
Gate-emitter leakage current
Integrated Gate resistor
Turn-on delay time
VCE=VGE
0,0024
150
V
V
1,05
1,57
1,73
15
0
600
0
µA
µA
Ω
1,4
20
none
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
161
162
24
Rise time
28
ns
221
249
82
114
1,01
1,75
4,10
5,92
td(off)
tf
Turn-off delay time
Rgon=4 Ω
Rgoff=4 Ω
±15
350
150
Fall time
Eon
Turn-on energy loss per pulse
Turn-off energy loss per pulse
Input capacitance
mWs
pF
Eoff
Cies
Coss
Crss
QGate
9240
576
274
940
Output capacitance
f=1MHz
0
25
Tj=25°C
Tj=25°C
Reverse transfer capacitance
Gate charge
15
480
150
nC
Thermal grease
thickness≤50um
λ = 0,81 W/mK
RthJH
Thermal resistance chip to heatsink per chip
0,574
K/W
Buck Diode
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
1,2
1,69
1,75
150
178
119
1,9
VF
IRRM
trr
Diode forward voltage
150
150
V
A
Peak reverse recovery current
Reverse recovery time
ns
148
8,6
Qrr
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovered energy
Rgoff=4 Ω
±15
350
µC
13,7
4704
3013
2,30
3,63
di(rec)max
/dt
A/µs
mWs
Erec
Thermal grease
thickness≤50um
λ = 0,81 W/mK
RthJH
Thermal resistance chip to heatsink per chip
1,288
K/W
Note: All characteristic values are related to gates of paralell IGBTs connected together
Copyright by Vincotech
3
Revision: 5
10-F106NIA150SA-M136F
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
Vr [V] or
VGE [V] or
IC [A] or
IF [A] or
ID [A]
VCE [V] or
Tj
Min
Max
VGS [V]
VDS [V]
Boost IGBT
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
5
5,8
6,5
1,85
60
VGE(th) VCE=VGE
Gate emitter threshold voltage
Collector-emitter saturation voltage
Collector-emitter cut-off incl diode
Gate-emitter leakage current
Integrated Gate resistor
Turn-on delay time
0,0024
150
V
V
1,05
1,57
1,73
VCE(sat)
ICES
IGES
Rgint
td(on)
tr
15
0
600
0
µA
µA
Ω
1,4
20
none
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
160
159
27
Rise time
30
ns
224
248
75
td(off)
tf
Turn-off delay time
Rgoff=4 Ω
Rgon=4 Ω
±15
350
150
Fall time
99
1,08
1,68
4,35
5,94
Eon
Turn-on energy loss per pulse
Turn-off energy loss per pulse
Input capacitance
mWs
pF
Eoff
Cies
Coss
Crss
QGate
9240
576
274
940
Output capacitance
f=1MHz
0
25
Tj=25°C
Tj=25°C
Reverse transfer capacitance
Gate charge
15
480
150
nC
Thermal grease
thickness≤50um
λ = 0,81 W/mK
RthJH
Thermal resistance chip to heatsink per chip
0,630
K/W
Boost Inverse Diode
Tj=25°C
Tj=125°C
1,2
1,68
1,68
1,9
VF
Diode forward voltage
150
V
Thermal grease
thickness≤50um
λ = 0,81 W/mK
RthJH
Thermal resistance chip to heatsink per chip
0,771
K/W
Boost Diode
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
Tj=25°C
Tj=150°C
1,2
1,68
1,68
1,9
60
VF
Ir
Diode forward voltage
150
150
V
µA
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
600
350
131
166
121
151
7,6
14,4
3810
1668
2,20
4,14
IRRM
trr
A
ns
Qrr
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
Rgon=4 Ω
±15
µC
di(rec)max
/dt
A/µs
mWs
Erec
Thermal grease
thickness≤50um
λ = 0,81 W/mK
RthJH
Thermal resistance chip to heatsink per chip
0,701
K/W
Thermistor
Rated resistance
Deviation of R100
Power dissipation
Power dissipation constant
B-value
R
T=25°C
T=100°C
T=25°C
T=25°C
T=25°C
T=25°C
22000
Ω
%
∆R/R R100=1486 Ω
-5
5
P
200
2
mW
mW/K
K
B(25/50) Tol. ±3%
B(25/100) Tol. ±3%
3950
3996
B-value
K
Vincotech NTC Reference
B
Copyright by Vincotech
4
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 1
IGBT
Figure 2
Typical output characteristics
IGBT
Typical output characteristics
IC = f(VCE
)
IC = f(VCE)
400
400
300
200
100
300
200
100
0
0
0
0
1
2
3
4
5
1
2
3
4
5
VCE (V)
VCE (V)
At
At
tp =
tp =
250
25
µs
250
150
µs
Tj =
Tj =
°C
°C
VGE from
VGE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
Figure 3
IGBT
Figure 4
FRED
Typical transfer characteristics
Typical diode forward current as
a function of forward voltage
IF = f(VF)
IC = f(VGE
)
125
400,00
300,00
200,00
100,00
100
75
50
25
Tj = 25°C
Tj = Tjmax-25°C
Tj = Tjmax-25°C
Tj = 25°C
0
0,00
0,00
2,00
4,00
6,00
8,00
10,00
12,00
0,00
0,50
1,00
1,50
2,00
2,50
3,00
VF (V)
VGE (V)
At
At
tp =
tp =
250
10
µs
250
µs
VCE
=
V
Copyright by Vincotech
5
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 5
IGBT
Figure 6
IGBT
Typical switching energy losses
as a function of collector current
E = f(IC)
Typical switching energy losses
as a function of gate resistor
E = f(RG)
10
10
Eoff High T
Eon High T
8
8
Eoff Low T
Eon Low T
Eoff High T
6
6
Eoff Low T
4
4
Eon High T
2
2
Eon Low T
0
0
I C (A)
R G ( Ω)
0
4
8
12
16
20
0
50
100
150
200
250
300
With an inductive load at
With an inductive load at
Tj =
Tj =
°C
V
°C
V
25/150
25/150
VCE
VGE
=
=
VCE
VGE
IC =
=
=
175
±15
4
175
±15
150
V
V
Rgon
Rgoff
=
=
Ω
Ω
A
4
Figure 7
FRED
Figure 8
FRED
Typical reverse recovery energy loss
as a function of collector current
Erec = f(Ic)
Typical reverse recovery energy loss
as a function of gate resistor
Erec = f(RG)
5
4
3
2
1
0
5
4
3
2
1
0
Erec High T
Erec High T
Erec Low T
Erec Low T
0
50
100
150
200
250
300
0
4
8
12
16
20
I C (A)
R G ( Ω)
With an inductive load at
With an inductive load at
Tj =
VCE
VGE
Tj =
VCE
VGE
IC =
25/150
175
±15
4
°C
V
25/150
175
°C
V
=
=
=
=
V
±15
V
Rgon
=
Ω
150
A
Copyright by Vincotech
6
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 9
IGBT
Figure 10
IGBT
Typical switching times as a
function of collector current
t = f(IC)
Typical switching times as a
function of gate resistor
t = f(RG)
1,00
0,10
0,01
0,00
1,00
0,10
0,01
0,00
tf
tdon
tdoff
tdon
tdoff
tr
tf
tr
I C (A)
R G ( Ω)
0
50
100
150
200
250
300
0
4
8
12
16
20
With an inductive load at
With an inductive load at
Tj =
VCE
VGE
Tj =
VCE
VGE
IC =
150
175
±15
4
°C
150
175
±15
150
°C
V
=
=
=
=
V
V
Ω
Ω
V
Rgon
Rgoff
=
=
A
4
Figure 11
FRED
Figure 12
FRED
Typical reverse recovery time as a
function of collector current
trr = f(Ic)
Typical reverse recovery time as a
function of IGBT turn on gate resistor
trr = f(Rgon
)
0,20
0,15
0,10
0,05
0,00
0,4
trr High T
trr High T
0,3
0,2
0,1
trr Low T
trr Low T
0,0
0
4
8
12
16
20
I C (A)
R gon ( Ω)
0
50
100
150
200
250
300
At
At
Tj =
VCE
VGE
Tj =
25/150
175
±15
4
°C
V
25/150
°C
V
=
=
VR =
175
150
±15
IF =
V
A
Rgon
=
VGE =
Ω
V
Copyright by Vincotech
7
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 13
FRED
Figure 14
FRED
Typical reverse recovery charge as a
function of collector current
Qrr = f(IC)
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Qrr = f(Rgon
)
20
15
10
5
20
Qrr High T
Qrr High T
15
10
5
Qrr Low T
Qrr Low T
0
0
0
0
50
100
150
200
250
300
4
8
12
16
20
I
C (A)
R
gon ( Ω)
At
At
Tj =
VCE
VGE
Tj =
25/150
175
±15
4
°C
25/150
175
°C
V
=
VR =
V
V
Ω
=
IF =
150
A
Rgon
=
VGE =
±15
V
Figure 15
FRED
Figure 16
FRED
Typical reverse recovery current as a
function of collector current
IRRM = f(IC)
Typical reverse recovery current as a
function of IGBT turn on gate resistor
IRRM = f(Rgon
)
250,00
200,00
150,00
100,00
50,00
200,00
IRRM High T
150,00
100,00
50,00
IRRM High T
IRRM Low T
IRRM Low T
0,00
0,00
0
0
50
100
150
200
250
300
4
8
12
16
20
I C (A)
R gon ( Ω)
At
At
Tj =
VCE
VGE
Tj =
25/150
175
±15
4
°C
V
25/150
°C
V
=
=
VR =
175
150
±15
IF =
V
A
Rgon
=
VGE =
Ω
V
Copyright by Vincotech
8
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 17
FRED
Figure 18
FRED
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI0/dt,dIrec/dt = f(Ic)
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI0/dt,dIrec/dt = f(Rgon
)
9000,00
7500,00
6000,00
4500,00
3000,00
1500,00
0,00
12000,00
dI0/dt T
dIo/dt T
dIrec/dt T
dIrec/dt T
10000,00
8000,00
6000,00
4000,00
2000,00
0,00
0
4
8
12
16
20
0
50
100
150
200
250
300
I C (A)
R gon ( Ω)
At
At
Tj =
VCE
VGE
Tj =
25/150
°C
V
25/150
175
°C
V
=
=
VR =
175
±15
4
IF =
VGE
V
150
A
Rgon
=
=
Ω
±15
V
Figure 19
IGBT
Figure 20
FRED
IGBT transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
FRED transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
100
10-1
D = 0,5
0,2
D = 0,5
0,2
0,1
0,1
0,05
0,02
0,01
0,005
0.000
0,05
0,02
0,01
0,005
0.000
10-2
t p (s)
t p (s)
10-5
10-4
10-3
10-2
10-1
100
1012
-435012
1100
At
D =
At
tp / T
tp / T
D =
R
thJH
=
RthJH =
0,574
K/W
1,288
K/W
IGBT thermal model values
FRED thermal model values
R (C/W)
0,05
Tau (s)
R (C/W)
0,07
Tau (s)
4,5E+00
1,0E+00
2,0E-01
6,1E-02
1,3E-02
1,8E-03
4,9E+00
1,0E+00
2,3E-01
8,0E-02
1,6E-02
1,8E-03
0,10
0,20
0,26
0,60
0,10
0,28
0,05
0,12
0,01
0,03
Copyright by Vincotech
9
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 21
IGBT
Figure 22
Collector current as a
IGBT
Power dissipation as a
function of heatsink temperature
Ptot = f(Th)
function of heatsink temperature
IC = f(Th)
175
150
125
100
75
350
300
250
200
150
100
50
50
25
0
0
T h (
o C)
T h
(
o C)
0,00
50,00
100,00
150,00
200,00
0,00
50,00
100,00
150,00
200,00
At
At
Tj =
Tj =
VGE
175
°C
175
15
°C
V
=
Figure 23
Power dissipation as a
FRED
Figure 24
Forward current as a
FRED
function of heatsink temperature
function of heatsink temperature
Ptot = f(Th)
IF = f(Th)
160
120
80
100
80
60
40
20
0
40
0
T h
(
o C)
T h (
o C)
200,00
0,00
50,00
100,00
150,00
200,00
0,00
50,00
100,00
150,00
At
At
Tj =
Tj =
175
°C
175
°C
Copyright by Vincotech
10
Revision: 5
10-F106NIA150SA-M136F
Buck
Figure 25
IGBT
Figure 26
IGBT
Gate voltage vs Gate charge
Safe operating area as a function
of collector-emitter voltage
IC = f(VCE
)
VGE = f(Qg)
16
103
14
12
10
8
100uS
1mS
102
100mS
120V
10mS
101
480V
DC
100
6
4
10-1
2
0
0
200
400
600
800
1000
100
VCE (V)
103
Q g (nC)
102
101
At
At
IC
=
D =
Th =
150
A
single pulse
80
ºC
V
VGE
Tj =
=
±15
Tjmax
ºC
Copyright by Vincotech
11
Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 1
IGBT
Figure 2
Typical output characteristics
IGBT
Typical output characteristics
IC = f(VCE
)
IC = f(VCE)
400
400
300
200
100
300
200
100
0
0
0
0
1
2
3
4
5
1
2
3
4
5
V
CE (V)
VCE (V)
At
At
tp =
tp =
250
25
µs
°C
250
150
µs
°C
Tj =
Tj =
VGE from
VGE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
Figure 3
IGBT
Figure 4
FRED
Typical transfer characteristics
Typical diode forward current as
a function of forward voltage
IF = f(VF)
IC = f(VGE
)
125,00
400
300
200
100,00
75,00
50,00
25,00
100
Tj = Tjmax-25°C
Tj = Tjmax-25°C
Tj = 25°C
Tj = 25°C
0
0,00
0,00
0,0
0,5
1,0
1,5
2,0
2,5
3,0
2,00
4,00
6,00
8,00
10,00
12,00
VGE (V)
VF (V)
At
At
tp =
tp =
250
10
µs
250
µs
VCE
=
V
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 5
IGBT
Figure 6
IGBT
Typical switching energy losses
as a function of collector current
E = f(IC)
Typical switching energy losses
as a function of gate resistor
E = f(RG)
10,00
8,00
6,00
4,00
2,00
0,00
10,00
8,00
6,00
4,00
2,00
0,00
Eon High T
Eoff High T
Eon Low T
Eoff High T
Eoff Low T
Eoff Low T
Eon High T
Eon Low T
0
50
100
150
200
250
300
0
4
8
12
16
20
R G ( Ω )
I C (A)
With an inductive load at
With an inductive load at
Tj =
VCE
VGE
Tj =
VCE
VGE
25/150
350
±15
4
°C
V
25/150
350
°C
V
=
=
=
=
V
±15
V
Rgon
Rgoff
=
=
IC =
Ω
Ω
149
A
4
Figure 7
IGBT
Figure 8
IGBT
Typical reverse recovery energy loss
as a function of collector current
Erec = f(Ic)
Typical reverse recovery energy loss
as a function of gate resistor
Erec = f(RG)
5,00
4,00
3,00
2,00
1,00
0,00
5,00
4,00
3,00
2,00
1,00
0,00
Erec High T
Erec Low T
Erec High T
Erec Low T
0
50
100
150
200
250
300
R G ( Ω )
I C (A)
0
4
8
12
16
20
With an inductive load at
With an inductive load at
Tj =
VCE
VGE
Tj =
VCE
VGE
25/150
350
±15
4
°C
V
25/150
350
°C
V
=
=
=
=
V
±15
V
Rgon
=
IC =
Ω
149
A
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 9
IGBT
Figure 10
IGBT
Typical switching times as a
function of collector current
t = f(IC)
Typical switching times as a
function of gate resistor
t = f(RG)
1,00
0,10
0,01
0,00
1,00
0,10
0,01
0,00
tdoff
tdon
tdoff
tdon
tf
tr
tr
tf
0
50
100
150
200
250
300
0
4
8
12
16
20
I C (A)
R G ( Ω )
With an inductive load at
With an inductive load at
Tj =
VCE
VGE
Tj =
VCE
VGE
150
350
±15
4
°C
150
350
±15
149
°C
V
=
=
=
=
V
V
Ω
Ω
V
Rgon
Rgoff
=
=
IC =
A
4
Figure 11
FRED
Figure 12
FRED
Typical reverse recovery time as a
function of collector current
trr = f(Ic)
Typical reverse recovery time as a
function of IGBT turn on gate resistor
trr = f(Rgon
)
0,20
0,15
0,10
0,05
0,00
0,4
trr High T
trr High T
0,3
0,2
0,1
trr Low T
trr Low T
0,0
0
4
8
12
16
20
I C (A)
R gon ( Ω)
0
50
100
150
200
250
300
At
At
Tj =
VCE
VGE
Tj =
25/150
350
±15
4
°C
25/150
°C
V
=
=
VR =
V
V
Ω
350
149
±15
IF =
A
Rgon
=
VGE =
V
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 13
FRED
Figure 14
FRED
Typical reverse recovery charge as a
function of collector current
Qrr = f(IC)
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Qrr = f(Rgon
)
20
16
12
8
20,00
Qrr High T
16,00
12,00
8,00
Qrr High T
Qrr Low T
Qrr Low T
4
4,00
0
0,00
0
0
50
100
150
200
250
300
4
8
12
16
20
I C (A)
R gon ( Ω)
At
At
Tj =
VCE
VGE
Tj =
25/150
350
±15
4
°C
25/150
350
°C
V
=
=
VR =
V
V
Ω
IF =
149
A
Rgon
=
VGE =
±15
V
Figure 15
FRED
Figure 16
FRED
Typical reverse recovery current as a
function of collector current
IRRM = f(IC)
Typical reverse recovery current as a
function of IGBT turn on gate resistor
IRRM = f(Rgon
)
200,00
150,00
100,00
50,00
0,00
200,00
IRRM High T
150,00
100,00
50,00
IRRM Low T
IRRM High T
IRRM Low T
0,00
0
0
50
100
150
200
250
300
4
8
12
16
20
I C (A)
R gon ( Ω)
At
At
Tj =
VCE
VGE
Tj =
25/150
350
±15
4
°C
V
25/150
°C
V
=
=
VR =
350
149
±15
IF =
V
A
Rgon
=
VGE =
Ω
V
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 17
FRED
Figure 18
FRED
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI0/dt,dIrec/dt = f(Ic)
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI0/dt,dIrec/dt = f(Rgon
)
10000,00
10000,00
dI0/dt T
dI0/dt T
dIrec/dt T
dIrec/dt T
8000,00
6000,00
4000,00
2000,00
8000,00
6000,00
4000,00
2000,00
0,00
0,00
0
4
8
12
16
20
0
50
100
150
200
250
300
C (A)
I
R gon ( Ω)
At
At
Tj =
VCE
VGE
Tj =
25/150
350
±15
4
°C
V
25/150
350
°C
V
=
=
VR =
IF =
VGE
V
149
A
Rgon
=
=
Ω
±15
V
Figure 19
IGBT
Figure 20
FRED
IGBT transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
FRED transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
100
10-1
D = 0,5
D = 0,5
0,2
0,2
0,1
0,1
0,05
0,02
0,01
0,005
0.000
0,05
0,02
0,01
10-2
10-5
10-4
10-3
10-2
10-1
1012
0,005
0.000
t p (s)
t p (s)
100-12 10-5
10-4
10-3
10-2
10-1
100 1012
At
At
D =
RthJH
tp / T
0,630
D =
RthJH
tp / T
=
=
K/W
0,701
K/W
IGBT thermal model values
FRED thermal model values
R (C/W)
0,06
Tau (s)
R (C/W)
0,07
Tau (s)
3,3E+00
4,3E-01
9,8E-02
1,4E-02
1,2E-03
4,3E+00
1,1E+00
2,2E-01
6,2E-02
1,2E-02
1,3E-03
0,10
0,17
0,31
0,34
0,10
0,10
0,05
0,03
0,02
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 21
IGBT
Figure 22
Collector current as a
IGBT
Power dissipation as a
function of heatsink temperature
Ptot = f(Th)
function of heatsink temperature
IC = f(Th)
300
250
200
150
100
50
175
150
125
100
75
50
25
0
0
T h
(
o C)
T h (
o C)
200,00
0,00
50,00
100,00
150,00
200,00
0,00
50,00
100,00
150,00
At
At
Tj =
Tj =
VGE
175
ºC
175
15
ºC
V
=
Figure 23
Power dissipation as a
FRED
Figure 24
Forward current as a
FRED
function of heatsink temperature
function of heatsink temperature
Ptot = f(Th)
IF = f(Th)
280
240
200
160
120
80
150
125
100
75
50
25
40
0
0
Th
(
o C)
Th (
o C)
0,00
50,00
100,00
150,00
200,00
0,00
50,00
100,00
150,00
200,00
At
At
Tj =
Tj =
175
ºC
175
ºC
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Boost
Figure 25
Boost Inverse Diode
Figure 26
Boost Inverse Diode
Typical diode forward current as
a function of forward voltage
IF = f(VF)
Diode transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
100
400,00
300,00
200,00
100,00
10-1
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
Tj = Tjmax-25°C
Tj = 25°C
0,00
10-2
10-5
0,00
0,50
1,00
1,50
2,00
2,50
3,00
VF (V)
t p (s)
10-4
10-3
10-2
10-1
100
1012
At
At
tp =
250
µs
D =
tp / T
RthJH
=
0,771
K/W
Figure 27
Power dissipation as a
Boost Inverse Diode
Figure 28
Forward current as a
Boost Inverse Diode
function of heatsink temperature
function of heatsink temperature
Ptot = f(Th)
IF = f(Th)
250
200
150
100
50
150
125
100
75
50
25
0
0
o C)
Th (
o C)
0,00
50,00
100,00
150,00
200,00
0,00
50,00
100,00
150,00
200,00
Th
(
At
At
Tj =
Tj =
175
ºC
175
ºC
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Thermistor
Figure 1
Thermistor
Figure 2
Typical NTC resistance values
Thermistor
Typical NTC characteristic
as a function of temperature
RT = f(T)
1
1
B
−
25/100
R(T) = R25 e
[Ω
]
T
T25
NTC-typical temperature characteristic
25000
20000
15000
10000
5000
0
25
50
75
100
125
T (°C)
Copyright by Vincotech
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Revision: 5
10-F106NIA150SA-M136F
Switching Definitions BUCK IGBT
General conditions
Tj
=
=
=
150 °C
4 Ω
Rgon
Rgoff
4 Ω
Figure 1
10-F106NIA150SA-M136F Output inverter IGBT
Figure 2
Output inverter IGBT
Turn-off Switching Waveforms & definition of tdoff, tEoff
Turn-on Switching Waveforms & definition of tdon, tEon
(tEoff = integrating time for Eoff
)
(tEon = integrating time for Eon)
125
250
%
tdoff
%
VCE
IC
100
200
VGE 90%
VCE 90%
75
50
25
0
150
IC
VCE
100
VGE
tEoff
tdon
50
VGE
VCE
3%
VGE 10%
IC10%
tEon
0
IC 1%
-50
-25
2,8
3
3,2
3,4
3,6
-0,2
0
0,2
0,4
0,6
time(us)
time (us)
VGE (0%) =
VGE (0%) =
-15
15
V
-15
V
VGE (100%) =
VC (100%) =
IC (100%) =
VGE (100%) =
VC (100%) =
IC (100%) =
V
15
V
350
150
V
350
150
0,16
0,36
V
A
A
tdoff
tEoff
=
=
tdon
tEon
=
=
0,25
0,63
µs
µs
µs
µs
Figure 3
Output inverter IGBT
Figure 4
Output inverter IGBT
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
125
250
fitted
%
%
VCE
IC
IC
100
200
IC 90%
75
150
IC 60%
VCE
50
100
IC
90%
IC 40%
tr
25
50
IC10%
IC10%
0
0
tf
-25
-50
0,1
0,15
0,2
0,25
0,3
0,35
0,4
3
3,1
3,2
3,3
3,4
time (us)
time(us)
VC (100%) =
IC (100%) =
tf =
VC (100%) =
IC (100%) =
tr =
350
150
0,11
V
350
150
0,03
V
A
A
µs
µs
Copyright by Vincotech
20
Revision: 5
10-F106NIA150SA-M136F
Switching Definitions BUCK IGBT
Figure 5
Output inverter IGBT
Figure 6
Output inverter IGBT
Turn-off Switching Waveforms & definition of tEoff
Turn-on Switching Waveforms & definition of tEon
125
%
125
%
IC
1%
Eoff
100
100
Eon
Poff
75
75
50
25
50
Pon
25
VGE
VGE 10%
90%
VCE
3%
0
0
tEon
tEoff
-25
-25
2,9
3
3,1
3,2
3,3
3,4
-0,2
0
0,2
0,4
0,6
time (us)
time(us)
Poff (100%) =
Eoff (100%) =
Pon (100%) =
Eon (100%) =
52,44
5,92
0,63
kW
mJ
µs
52,44
1,75
0,36
kW
mJ
µs
tEoff
=
tEon =
Figure 7
Output inverter FRED
Figure 8
Output inverter IGBT
Gate voltage vs Gate charge (measured)
Turn-off Switching Waveforms & definition of trr
20
150
%
15
10
5
Id
100
trr
50
Vd
fitted
IRRM 10%
0
0
-50
-5
-10
-15
-20
-100
-150
IRRM 90%
IRRM 100%
3,1
3,2
3,3
3,4
3,5
-200
0
200
400
600
800
1000 1200 1400 1600 1800
Qg (nC)
time(us)
VGEoff
VGEon
=
=
Vd (100%) =
Id (100%) =
-15
15
V
350
150
-178
0,15
V
V
A
VC (100%) =
IC (100%) =
Qg =
IRRM (100%) =
350
150
V
A
trr
=
A
µs
1585,43
nC
Copyright by Vincotech
21
Revision: 5
10-F106NIA150SA-M136F
Switching Definitions BUCK IGBT
Figure 9
Output inverter FRED
Figure 10
Output inverter FRED
Turn-on Switching Waveforms & definition of tQrr
(tQrr = integrating time for Qrr)
Turn-on Switching Waveforms & definition of tErec
(tErec= integrating time for Erec
)
150
125
%
%
Id
Erec
Qrr
100
75
50
25
0
100
Prec
tQrr
50
tErec
0
-50
-100
-150
-25
3
3,1
3,2
3,3
3,4
3,5
3,6
3,1
3,2
3,3
3,4
3,5
3,6
time(us)
time(us)
Id (100%) =
Prec (100%) =
Erec (100%) =
150
A
52,44
3,63
0,30
kW
mJ
µs
Qrr (100%) =
13,73
0,30
µC
µs
tQrr
=
tErec =
Measurement circuit
Figure 11
BUCK stage switching measurement circuit
Copyright by Vincotech
22
Revision: 5
10-F106NIA150SA-M136F
Switching Definitions BOOST IGBT
General conditions
Tj
=
=
=
150 °C
4 Ω
Rgon
Rgoff
4 Ω
Figure 1
10-F106NIA150SA-M136F Output inverter IGBT
Figure 2
Output inverter IGBT
Turn-off Switching Waveforms & definition of tdoff, tEoff
Turn-on Switching Waveforms & definition of tdon, tEon
(tEoff = integrating time for Eoff
)
(tEon = integrating time for Eon)
250
140
IC
120
100
80
tdoff
200
150
VCE
VGE 90%
VCE 90%
%
VCE
%
IC
60
100
tdon
tEoff
VGE
40
20
0
50
0
IC 1%
VGE10%
VCE3%
IC10%
VGE
tEon
-20
-50
-0,2
-0,1
0
0,1
0,2
0,3
0,4
0,5
0,6
0,7
2,8
2,9
3
3,1
3,2
3,3
3,4
3,5
3,6
time(us)
time (us)
VGE (0%) =
VGE (0%) =
-15
V
-15
V
VGE (100%) =
VC (100%) =
IC (100%) =
VGE (100%) =
VC (100%) =
IC (100%) =
15
V
15
V
350
150
0,25
0,49
V
350
150
0,16
0,34
V
A
A
tdoff
tEoff
=
=
tdon
tEon
=
=
µs
µs
µs
µs
Figure 3
Output inverter IGBT
Figure 4
Output inverter IGBT
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
125
250
IC
Ic
100
VCE
200
IC 90%
75
150
IC 60%
%
50
%
100
IC90%
IC 40%
tr
25
0
50
0
IC10%
VCE
IC10%
fitted
tf
-25
-50
0,1
0,15
0,2
0,25
0,3
0,35
0,4
3,05
3,1
3,15
3,2
3,25
time(us)
3,3
3,35
3,4
time (us)
VC (100%) =
IC (100%) =
tf =
VC (100%) =
IC (100%) =
tr =
350
150
0,10
V
350
V
A
150
A
µs
0,03
µs
Copyright by Vincotech
23
Revision: 5
10-F106NIA150SA-M136F
Switching Definitions BOOST IGBT
Figure 5
Output inverter IGBT
Figure 6
Output inverter IGBT
Turn-off Switching Waveforms & definition of tEoff
Turn-on Switching Waveforms & definition of tEon
120
120
%
Eon
Eoff
%
Poff
100
80
60
40
20
0
100
80
60
Pon
40
20
VGE10%
VCE3%
0
tEoff
VGE90%
IC 1%
tEon
-20
-20
-0,2
2,9
3
3,1
3,2
3,3
3,4
3,5
-0,1
0
0,1
0,2
0,3
0,4
0,5
0,6
time (us)
time(us)
Poff (100%) =
Eoff (100%) =
Pon (100%) =
Eon (100%) =
52,38
kW
mJ
µs
52,38
1,68
0,34
kW
mJ
µs
5,94
0,49
tEoff
=
tEon =
Figure 7
Output inverter FRED
Figure 8
Output inverter IGBT
Gate voltage vs Gate charge (measured)
Turn-off Switching Waveforms & definition of trr
20
150
Id
15
10
5
100
trr
fitted
50
Vd
%
0
0
IRRM10%
-5
-50
-100
-150
-10
-15
-20
IRRM90%
IRRM100%
-200
0
200
400
600
1200 1400 1600 1800
3,1
3,15
3,2
3,35
3,4
3,45
Qg (nC)1000
800
time(us3),3
3,25
VGEoff
VGEon
=
=
Vd (100%) =
Id (100%) =
-15
V
350
V
15
V
150
A
VC (100%) =
IC (100%) =
Qg =
IRRM (100%) =
350
150
V
-166
0,15
A
trr
=
A
µs
1583,47
nC
Copyright by Vincotech
24
Revision: 5
10-F106NIA150SA-M136F
Switching Definitions BOOST IGBT
Figure 9
Output inverter FRED
Figure 10
Output inverter FRED
Turn-on Switching Waveforms & definition of tQrr
(tQrr = integrating time for Qrr)
Turn-on Switching Waveforms & definition of tErec
(tErec= integrating time for Erec
)
150
120
Erec
Id
Qrr
100
80
100
tQrr
50
tEre
60
%
%
40
20
0
-50
-100
-150
Prec
-20
3
3,1
3,2
3,3
3,4
3,5
3,6
3,7
3,05
3,15
3,25
3,35
3,45
3,55
3,65
time(us)
time(us)
Id (100%) =
Prec (100%) =
Erec (100%) =
150
A
52,38
4,14
0,31
kW
mJ
µs
Qrr (100%) =
14,35
0,31
µC
µs
tQrr
=
tErec =
Measurement circuit
Figure 11
BOOST stage switching measurement circuit
Copyright by Vincotech
25
Revision: 5
10-F106NIA150SA-M136F
Ordering Code and Marking - Outline - Pinout
Ordering Code & Marking
Version
Ordering Code
in DataMatrix as
M136F
in packaging barcode as
without thermal paste 12mm housing
10-F106NIA150SA-M136F
M136F
Outline
Pinout
Copyright by Vincotech
26
Revision: 5
10-F106NIA150SA-M136F
DISCLAIMER
The information given in this datasheet describes the type of component and does not represent assured characteristics. For tested
values please contact Vincotech.Vincotech reserves the right to make changes without further notice to any products herein to improve
reliability, function or design. Vincotech does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights, nor the rights of others.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written
approval of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright by Vincotech
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Revision: 5
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