10-FY07NPA150SM02-L365F08 [VINCOTECH]

High efficiency in hard switching and resonant topologies;High speed switching;Low gate charge;
10-FY07NPA150SM02-L365F08
型号: 10-FY07NPA150SM02-L365F08
厂家: VINCOTECH    VINCOTECH
描述:

High efficiency in hard switching and resonant topologies;High speed switching;Low gate charge

文件: 总29页 (文件大小:9111K)
中文:  中文翻译
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10-FY07NPA150SM02-L365F08  
datasheet  
1200 V / 150 A  
flowNPC 1  
Features  
flow 1 12 mm housing  
● NPC inverter topology  
Optimized for full rated bi-directional usage (4quadrant)  
Optimized for 1200 Vdc applications  
High-speed IGBT in all switch positions  
Integrated NTC  
Low inductive design with integrated DC capacitor  
flow 1 12mm package  
Schematic  
Target applications  
● Energy Storage Systems  
● Solar Inverters  
● UPS  
Types  
● 10-FY07NPA150SM02-L365F08  
Copyright Vincotech  
1
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Buck Switch  
VCES  
Collector-emitter voltage  
650  
83  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
450  
128  
±20  
175  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
Tjmax  
Maximum junction temperature  
°C  
Buck Diode  
VRRM  
Peak repetitive reverse voltage  
650  
86  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
300  
113  
175  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
Boost Switch  
VCES  
Collector-emitter voltage  
650  
83  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
450  
128  
±20  
175  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
Tjmax  
Maximum junction temperature  
°C  
Copyright Vincotech  
2
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Boost Diode  
VRRM  
Peak repetitive reverse voltage  
650  
86  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
300  
113  
175  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
Boost Sw. Inv. Diode  
VRRM  
Peak repetitive reverse voltage  
650  
108  
300  
149  
175  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
Capacitor (DC)  
VMAX  
Maximum DC voltage  
630  
V
Top  
Operation Temperature  
-55 ... 125  
°C  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
>12,7  
8,07  
V
tp = 1 min  
V
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 200  
Copyright Vincotech  
3
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VCE = VGE  
0,0015  
150  
25  
3,3  
4
4,7  
V
V
25  
1,7  
2,22(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
1,89  
1,94  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
80  
µA  
nA  
Ω
20  
240  
None  
8600  
150  
32  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
VCC = 520 V  
15  
150  
332  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,74  
K/W  
25  
47,6  
46,2  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
45,6  
10,6  
tr  
125  
150  
25  
12,2  
13,2  
Rgon = 2 Ω  
Rgoff = 2 Ω  
133,4  
151,8  
156,2  
7,04  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
-5/15  
350  
90  
tf  
125  
150  
25  
7,09  
ns  
7,7  
QrFWD=3,8 µC  
QrFWD=7,08 µC  
QrFWD=8,09 µC  
0,737  
1,12  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
1,21  
0,367  
0,706  
0,798  
Eoff  
125  
150  
Copyright Vincotech  
4
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Diode  
Static  
25  
1,67  
1,66  
1,66  
1,92(1)  
VF  
IR  
Forward voltage  
150  
125  
150  
V
Reverse leakage current  
Thermal  
Vr = 650 V  
25  
7,6  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,84  
K/W  
25  
110,05  
143,32  
151,37  
52,28  
84,92  
95,83  
3,8  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=7000 A/µs  
di/dt=7124 A/µs  
di/dt=6971 A/µs  
Qr  
Recovered charge  
-5/15  
350  
90  
125  
150  
25  
7,08  
μC  
8,09  
0,853  
1,61  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
1,85  
2642  
2119  
2131  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
5
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VCE = VGE  
0,0015  
150  
25  
3,3  
4
4,7  
V
V
25  
1,7  
2,22(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
1,89  
1,94  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
80  
µA  
nA  
Ω
20  
240  
None  
8600  
150  
32  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
VCC = 520 V  
15  
150  
332  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,74  
K/W  
25  
50,2  
50,6  
50  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
11,2  
13,4  
14  
tr  
125  
150  
25  
Rgon = 2 Ω  
Rgoff = 2 Ω  
114,2  
134,4  
138,6  
5,07  
7,41  
8,47  
1,1  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
-5/15  
350  
90  
tf  
125  
150  
25  
ns  
QrFWD=3,6 µC  
QrFWD=6,94 µC  
QrFWD=7,94 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
1,77  
1,92  
0,243  
0,621  
0,719  
mWs  
mWs  
Eoff  
125  
150  
Copyright Vincotech  
6
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Diode  
Static  
25  
1,67  
1,66  
1,66  
1,92(1)  
VF  
IR  
Forward voltage  
150  
125  
150  
V
Reverse leakage current  
Thermal  
Vr = 650 V  
25  
7,6  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,84  
K/W  
25  
89,81  
116,5  
121,4  
60,9  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
97,24  
109,23  
3,6  
ns  
di/dt=5600 A/µs  
di/dt=6000 A/µs  
di/dt=5796 A/µs  
Qr  
Recovered charge  
-5/15  
350  
90  
125  
150  
25  
6,94  
μC  
7,94  
0,692  
1,33  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
1,53  
1618  
1020  
864,39  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
7
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Sw. Inv. Diode  
Static  
25  
1,18  
1,66  
1,61  
1,59  
1,82(1)  
VF  
IR  
Forward voltage  
150  
125  
150  
V
Reverse leakage current  
Vr = 650 V  
25  
1,8  
µA  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,64  
K/W  
Capacitor (DC)  
Static  
DC bias voltage =  
0 V  
C
Capacitance  
25  
25  
300  
2,5  
nF  
%
%
Tolerance  
-10  
10  
Dissipation factor  
f = 1 kHz  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
-5  
5
5
mW  
mW/K  
K
d
25  
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
Copyright Vincotech  
8
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
400  
400  
VGE  
:
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
300  
200  
100  
0
300  
200  
100  
0
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
V
CE(V)  
VCE(V)  
tp  
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 8 V to 17 V in steps of 1 V  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
150  
10  
125  
100  
75  
50  
25  
0
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
0
1
2
3
4
5
6
7
10  
10  
tp(s)  
V
GE(V)  
tp  
=
=
250  
10  
μs  
D =  
tp / T  
0,74  
25 °C  
VCE  
V
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
1,09E-01  
2,21E-01  
2,87E-01  
8,43E-02  
3,94E-02  
1,94E+00  
2,60E-01  
6,98E-02  
8,29E-03  
3,67E-04  
Copyright Vincotech  
9
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Switch Characteristics  
figure 5.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
1
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
10  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Diode Characteristics  
figure 6.  
FWD  
figure 7.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
400  
300  
200  
100  
0
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
0,843  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
6,09E-02  
1,45E-01  
3,25E-01  
2,06E-01  
8,27E-02  
2,35E-02  
4,33E+00  
8,74E-01  
1,39E-01  
4,67E-02  
9,15E-03  
1,16E-03  
Copyright Vincotech  
11  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Switch Characteristics  
figure 8.  
IGBT  
figure 9.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
400  
400  
VGE  
:
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
300  
200  
100  
0
300  
200  
100  
0
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
V
CE(V)  
VCE(V)  
tp  
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 8 V to 17 V in steps of 1 V  
figure 10.  
IGBT  
figure 11.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
150  
10  
125  
100  
75  
50  
25  
0
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
0
1
2
3
4
5
6
7
10  
10  
tp(s)  
V
GE(V)  
tp  
=
=
250  
10  
μs  
D =  
tp / T  
0,74  
25 °C  
VCE  
V
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
1,09E-01  
2,21E-01  
2,87E-01  
8,43E-02  
3,94E-02  
1,94E+00  
2,60E-01  
6,98E-02  
8,29E-03  
3,67E-04  
Copyright Vincotech  
12  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Switch Characteristics  
figure 12.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
1
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
13  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Diode Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
400  
300  
200  
100  
0
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
0,843  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
6,09E-02  
1,45E-01  
3,25E-01  
2,06E-01  
8,27E-02  
2,35E-02  
4,33E+00  
8,74E-01  
1,39E-01  
4,67E-02  
9,15E-03  
1,16E-03  
Copyright Vincotech  
14  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Sw. Inv. Diode Characteristics  
figure 15.  
FWD  
figure 16.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
400  
300  
200  
100  
0
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
0,638  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
6,14E-02  
1,03E-01  
2,81E-01  
1,21E-01  
4,83E-02  
2,26E-02  
3,48E+00  
5,85E-01  
9,46E-02  
2,14E-02  
5,07E-03  
5,92E-04  
Copyright Vincotech  
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17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Thermistor Characteristics  
figure 17.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
Copyright Vincotech  
16  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Switching Characteristics  
figure 18.  
IGBT  
figure 19.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eon  
Eon  
Eon  
Eon  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
Ω
Ω
2
figure 20.  
FWD  
figure 21.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
V
Ω
Copyright Vincotech  
17  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Switching Characteristics  
figure 22.  
IGBT  
figure 23.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(off)  
td(off)  
-1  
10  
-1  
10  
td(on)  
td(on)  
tr  
tf  
tr  
tf  
-2  
-2  
10  
10  
10  
10  
-3  
-3  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
-5/15  
2
°C  
150  
350  
-5/15  
90  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
V
V
Ω
Ω
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
A
2
figure 24.  
FWD  
figure 25.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
Ω
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
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17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Switching Characteristics  
figure 26.  
FWD  
figure 27.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
15,0  
12,5  
10,0  
7,5  
12  
10  
8
Qr  
Qr  
Qr  
Qr  
6
Qr  
5,0  
4
Qr  
2,5  
2
0,0  
0
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Ω
figure 28.  
FWD  
figure 29.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
200  
175  
150  
125  
100  
75  
175  
150  
125  
100  
75  
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
50  
25  
25  
0
0
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Ω
Copyright Vincotech  
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17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Buck Switching Characteristics  
figure 30.  
FWD  
figure 31.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
9000  
12500  
10000  
7500  
5000  
2500  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
8000  
dirr/dt ──────  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
0
25  
50  
75  
100  
125  
150  
175  
IC(A)  
0
1
2
3
4
5
6
7
8
9
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
Ω
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 32.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
350  
IC MAX  
300  
250  
200  
150  
100  
50  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
V
CE(V)  
Tj =  
At  
150  
2
°C  
Ω
Rgon  
Rgoff  
=
=
2
Ω
Copyright Vincotech  
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17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Switching Characteristics  
figure 33.  
IGBT  
figure 34.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eon  
Eon  
Eon  
Eon  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
V
Rgon  
Rgoff  
Ω
Ω
2
figure 35.  
FWD  
figure 36.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
V
Ω
Copyright Vincotech  
21  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Switching Characteristics  
figure 37.  
IGBT  
figure 38.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(off)  
td(off)  
td(on)  
-1  
10  
-1  
10  
td(on)  
tr  
tf  
tr  
tf  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
-5/15  
2
°C  
150  
350  
-5/15  
90  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
V
V
Ω
Ω
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
A
2
figure 39.  
FWD  
figure 40.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
Ω
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
22  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Switching Characteristics  
figure 41.  
FWD  
figure 42.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
15,0  
12,5  
10,0  
7,5  
9
8
7
6
5
4
3
2
1
0
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
5,0  
2,5  
0,0  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Ω
figure 43.  
FWD  
figure 44.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
150  
125  
100  
75  
150  
125  
100  
75  
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
50  
25  
25  
0
0
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Ω
Copyright Vincotech  
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17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Boost Switching Characteristics  
figure 45.  
FWD  
figure 46.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
8000  
8000  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
dirr/dt ──────  
0
25  
50  
75  
100  
125  
150  
175  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
-5/15  
2
V
V
Ω
125 °C  
150 °C  
350  
-5/15  
90  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 47.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
350  
IC MAX  
300  
250  
200  
150  
100  
50  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
V
CE(V)  
Tj =  
At  
150  
2
°C  
Ω
Rgon  
Rgoff  
=
=
2
Ω
Copyright Vincotech  
24  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Switching Definitions  
figure 48.  
IGBT  
figure 49.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (ttEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 50.  
IGBT  
figure 51.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
Copyright Vincotech  
25  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Switching Definitions  
figure 52.  
FWD  
figure 53.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
Copyright Vincotech  
26  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Ordering Code  
Marking  
Version  
Ordering Code  
Without thermal paste  
With thermal paste  
10-FY07NPA150SM02-L365F08  
10-FY07NPA150SM02-L365F08-/3/  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
Function  
Therm1  
Therm2  
S4  
52,2  
52,2  
36,2  
33,2  
33,2  
9,2  
6,2  
6,2  
2,7  
0
6,9  
0
2
3
6,75  
7,9  
4
G14  
G18  
S2  
5
4,9  
6
5,75  
6,9  
7
G12  
G16  
DC-  
DC-  
DC-  
DC-  
DC-  
DC-  
GND  
GND  
GND  
GND  
DC+  
DC+  
DC+  
DC+  
DC+  
DC+  
S1  
8
3,9  
9
0
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
0
2,7  
0
2,7  
2,7  
2,7  
0
5,4  
5,4  
2,7  
0
12,75  
12,75  
15,45  
15,45  
22,8  
22,8  
25,5  
25,5  
28,2  
28,2  
22,45  
21,3  
24,3  
22,15  
21  
2,7  
0
2,7  
0
2,7  
0
2,7  
0
18,3  
21,3  
21,3  
43  
G15  
G11  
S3  
46  
G17  
G13  
Ph  
46  
24  
52,2  
49,5  
52,2  
49,5  
52,2  
49,5  
52,2  
20,1  
22,8  
22,8  
25,5  
25,5  
28,2  
28,2  
Ph  
Ph  
Ph  
Ph  
Ph  
Ph  
Copyright Vincotech  
27  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Pinout  
DC+  
19,20,21,22,23,24  
T11  
27  
T15  
D14  
D18  
26  
C1  
G11  
S1  
G15  
25  
T13  
T17  
D43  
D47  
D11  
30  
29  
G13  
S3  
G17  
28  
GND  
Ph  
15,16,17,18  
31,32,33,34,35,36,37  
T18  
T14  
D44  
D48  
D12  
4
5
G14  
S4  
G18  
3
C2  
Rt  
T12  
T16  
D13  
D17  
7
8
G12  
S2  
G16  
Therm1  
1
Therm2  
2
DC-  
6
9,10,11,12,13,14  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
Parallel devices with separate control. Values apply  
T11, T15, T12, T16  
D11, D12  
IGBT  
FWD  
IGBT  
650 V  
650 V  
650 V  
150 A  
150 A  
150 A  
Buck Switch  
Buck Diode  
Boost Switch  
to complete device (T11||T15, T12||T16).  
Parallel devices with separate control. Values apply  
to complete device (T13||T17, T14||T18).  
Parallel devices. Values apply  
T13, T17, T14, T18  
D13, D17, D14, D18  
D44, D48, D43, D47  
FWD  
FWD  
650 V  
150 A  
150 A  
Boost Diode  
to complete device (D13||D17, D14||D18).  
Parallel devices. Values apply  
to complete device (D44||D48, D43||D47).  
650 V  
Boost Sw. Inv. Diode  
C1, C2  
Rt  
Capacitor  
630 V  
Capacitor (DC)  
Thermistor  
Thermistor  
Copyright Vincotech  
28  
17 Mar. 2021 / Revision 8  
10-FY07NPA150SM02-L365F08  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 100  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 1 packages see vincotech.com website.  
Package data  
Package data for flow 1 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
Correct Vce conditions from 700V to 350V for Buck & Boost  
Switches and Diodes in all dynamic & switching characteristics  
4-7, 17-24  
10-FY07NPA150SM02-L365F08-D8-14  
17 Mar. 2021  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
29  
17 Mar. 2021 / Revision 8  

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