10-PG12NAB008ME-LC59F66T [VINCOTECH]

High Blocking Voltage with low drain source on state resistance;High speed SiC-MOSFET technology;Resistant to Latch-up;
10-PG12NAB008ME-LC59F66T
型号: 10-PG12NAB008ME-LC59F66T
厂家: VINCOTECH    VINCOTECH
描述:

High Blocking Voltage with low drain source on state resistance;High speed SiC-MOSFET technology;Resistant to Latch-up

文件: 总65页 (文件大小:10252K)
中文:  中文翻译
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10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
flowANPC 1 split  
1200 V / 8 mΩ  
Features  
● Split Advanced NPC topology  
flow 1 12 mm housing  
Ultra-high switching frequency with SiC MOSFETs  
Optimized for 1500 Vdc applications  
● Split topology for better thermal performance  
● No cross-conduction at high frequencies  
LC59F66T  
LC69F66T  
Schematic  
Target applications  
● Solar Inverters  
Types  
● 10-PG12NAB008ME-LC59F66T  
● 10-PG12NAC008ME-LC69F66T  
LC69F66T  
LC59F66T  
1
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
AC Switch  
VDSS  
Drain-source voltage  
1200  
147  
V
A
ID  
Drain current (DC current)  
Peak drain current  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IDM  
tp limited by Tjmax  
Tj = Tjmax  
480  
A
Ptot  
Total power dissipation  
274  
W
-4 / 15  
-8 / 19  
175  
VGSS  
Gate-source voltage  
V
dynamic  
Tjmax  
Maximum Junction Temperature  
°C  
AC Diode  
VRRM  
Peak repetitive reverse voltage  
1200  
74  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Surge (non-repetitive) forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
IFRM  
IFSM  
Ptot  
tp limited by Tjmax  
183  
330  
185  
175  
A
Single Half Sine Wave,  
tp = 10 ms  
A
Tj = Tjmax  
Ts = 80 °C  
W
°C  
Tjmax  
Maximum junction temperature  
Neutral Point Switch  
VCES  
Collector-emitter voltage  
1200  
150  
300  
288  
±20  
9,5  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
tSC  
Short circuit ratings  
VGE = 15 V, VCC = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
2
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
DC-Link Diode  
VRRM  
Peak repetitive reverse voltage  
1200  
86  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
200  
158  
175  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
Neutral Point Switch Prot. Diode  
VRRM  
Peak repetitive reverse voltage  
Forward current (DC current)  
Surge (non-repetitive) forward current  
Surge current capability  
1200  
21  
V
A
IF  
Tj = Tjmax  
Ts = 80 °C  
Tj = 25 °C  
Ts = 80 °C  
IFSM  
I2t  
65  
A
Single Half Sine Wave,  
tp = 10 ms  
21  
A2s  
W
°C  
Ptot  
Total power dissipation  
Tj = Tjmax  
70  
Tjmax  
Maximum junction temperature  
175  
Neutral Point Diode  
VRRM  
Peak repetitive reverse voltage  
1200  
111  
300  
183  
175  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
3
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
DC-Link Switch  
VCES  
Collector-emitter voltage  
1200  
150  
300  
288  
±20  
9,5  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
tSC  
Short circuit ratings  
VGE = 15 V, VCC = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
DC-Link Switch Prot. Diode  
VRRM  
Peak repetitive reverse voltage  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
1200  
86  
V
A
IF  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
200  
158  
175  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
Capacitor (GS)  
VMAX  
Maximum DC voltage  
25  
V
Top  
Operation Temperature  
0 ... 125  
°C  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
DC Test Voltage*  
tp = 2 s  
6000  
min. 12,7  
8,33  
V
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 600  
4
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
AC Switch  
Static  
25  
5,6  
1,8  
9
10,4(1)  
rDS(on)  
Drain-source on-state resistance  
15  
150  
125  
150  
11  
12  
mΩ  
VGS(th)  
IGSS  
IDSS  
rg  
Gate-source threshold voltage  
Gate to Source Leakage Current  
Zero Gate Voltage Drain Current  
Internal gate resistance  
0
0,046  
25  
25  
25  
2,5  
40  
3,6  
1000  
76  
V
15  
0
0
nA  
µA  
1200  
4
0,425  
472  
13428  
516  
32  
Qg  
Gate charge  
-4/15  
800  
160  
25  
25  
25  
nC  
Ciss  
Coss  
Crss  
VSD  
Short-circuit input capacitance  
Short-circuit output capacitance  
Reverse transfer capacitance  
Diode forward voltage  
f = 100 kHz  
0
0
1000  
0
pF  
V
80  
4,6  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,35  
K/W  
AC Diode  
Static  
25  
1,5  
1,8(1)  
600  
VF  
IR  
Forward voltage  
60  
125  
150  
1,86  
2,01  
V
Reverse leakage current  
Thermal  
Vr = 1200 V  
25  
105  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,51  
K/W  
5
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
AC Real Open Configuration  
Switch Dynamic  
25  
40  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
38,08  
37,76  
12,48  
11,52  
11,2  
ns  
ns  
tr  
125  
150  
25  
Rgon = 2 Ω  
Rgoff = 2 Ω  
85,76  
94,08  
96,32  
39,13  
47,46  
50,62  
0,445  
0,384  
0,361  
0,878  
0,947  
0,96  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
-2/15  
600  
100  
tf  
125  
150  
25  
ns  
QrFWD=0,471 µC  
QrFWD=0,525 µC  
QrFWD=0,559 µC  
Eon  
Turn-on energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
Turn-off energy (per pulse)  
125  
150  
Diode Dynamic  
25  
65,93  
70,99  
73,39  
16,66  
16,68  
17  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
ns  
0,471  
0,525  
0,559  
0,355  
0,424  
0,451  
10019  
10682  
10883  
di/dt=10208 A/µs  
Qr  
Recovered charge  
di/dt=11198 A/µs -2/15  
di/dt=11243 A/µs  
600  
100  
125  
150  
25  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
6
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
AC Reactive Open Configuration  
Switch Dynamic  
25  
42,56  
38,4  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
38,4  
12,8  
tr  
125  
150  
25  
11,2  
10,88  
86,4  
Rgon = 2 Ω  
Rgoff = 2 Ω  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
96,64  
99,52  
30,88  
38,7  
ns  
-2/15  
600  
100  
tf  
125  
150  
25  
ns  
16,89  
0,636  
0,428  
0,404  
0,948  
1,07  
QrFWD=1,17 µC  
QrFWD=1,32 µC  
QrFWD=1,41 µC  
Eon  
Turn-on energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
Turn-off energy (per pulse)  
Diode Dynamic  
125  
150  
1,1  
25  
86,09  
90,12  
86,31  
26,49  
27,89  
29,04  
1,17  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=9714 A/µs  
Qr  
Recovered charge  
di/dt=12076 A/µs -2/15  
di/dt=12388 A/µs  
600  
100  
125  
150  
25  
1,32  
μC  
1,41  
0,658  
0,761  
0,883  
6691  
2403  
2216  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
7
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
AC Real Short Configuration  
Dynamic  
25  
40  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
38,08  
37,76  
12,16  
11,2  
ns  
ns  
tr  
125  
150  
25  
10,88  
86,4  
Rgon = 2 Ω  
Rgoff = 2 Ω  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
94,72  
97,28  
18,62  
20,72  
21,14  
0,495  
0,351  
0,29  
ns  
-2/15  
600  
100  
tf  
125  
150  
25  
ns  
QrFWD=1,25 µC  
QrFWD=1,4 µC  
QrFWD=1,54 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
0,731  
0,793  
0,805  
Eoff  
125  
150  
AC Reactive Short Configuration  
Dynamic  
25  
42,56  
38,4  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
37,76  
12,16  
10,56  
10,56  
88  
tr  
125  
150  
25  
Rgon = 2 Ω  
Rgoff = 2 Ω  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
98,88  
101,44  
21,17  
22,06  
23,75  
0,579  
0,366  
0,342  
0,783  
0,866  
0,889  
ns  
-2/15  
600  
100  
tf  
125  
150  
25  
ns  
QrFWD=1,29 µC  
QrFWD=1,39 µC  
QrFWD=1,55 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
125  
150  
8
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Neutral Point Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
10  
0,015  
150  
25  
5,4  
6
6,6  
V
V
25  
1,57  
1,8  
1,85(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
1,86  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
1200  
0
25  
25  
100  
500  
µA  
nA  
Ω
20  
3
Cies  
Coes  
Cres  
Qg  
30000  
880  
pF  
pF  
pF  
nC  
Output capacitance  
0
10  
25  
25  
Reverse transfer capacitance  
Gate charge  
320  
VCC = 600 V  
15  
150  
1000  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,33  
K/W  
Dynamic  
25  
335  
349  
td(on)  
Turn-on delay time  
125  
150  
25  
ns  
ns  
351  
38  
tr  
Rise time  
125  
150  
25  
47  
49  
Rgon = 2 Ω  
Rgoff = 2 Ω  
304  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
351  
ns  
363  
±15  
600  
100  
100,62  
139,03  
142,44  
8,92  
11,15  
11,84  
7,89  
10,42  
10,95  
tf  
125  
150  
25  
ns  
QrFWD=10,4 µC  
QrFWD=15,02 µC  
QrFWD=16,24 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
125  
150  
9
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
DC-Link Diode  
Static  
25  
1,82  
1,96  
1,96  
2,1(1)  
VF  
IR  
Forward voltage  
100  
125  
150  
V
Reverse leakage current  
Thermal  
Vr = 1200 V  
25  
40  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,6  
K/W  
25  
82,7  
86,13  
88,3  
IRRM  
Peak recovery current  
125  
150  
25  
A
309,71  
419,43  
452,63  
10,4  
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=2662 A/µs  
di/dt=2286 A/µs  
di/dt=2159 A/µs  
Qr  
Recovered charge  
±15  
600  
100  
125  
150  
25  
15,02  
16,24  
3,99  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
5,94  
mWs  
A/µs  
6,43  
506,5  
512,55  
504,33  
(dirf/dt)max  
125  
150  
10  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Neutral Point Switch Prot. Diode  
Static  
25  
2,37  
2,47  
2,71(1)  
VF  
IR  
Forward voltage  
15  
125  
150  
25  
V
2,77(1)  
60  
Reverse leakage current  
Thermal  
Vr = 1200 V  
µA  
150  
900  
1800  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
1,35  
K/W  
11  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Neutral Point Diode  
Static  
25  
1,8  
1,9  
2,1(1)  
VF  
IR  
Forward voltage  
150  
125  
150  
V
1,89  
Reverse leakage current  
Vr = 1200 V  
25  
40  
µA  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,52  
K/W  
Dynamic  
25  
116,53  
119,59  
117,81  
268,1  
406,33  
453,74  
12,79  
20,79  
22,27  
4,36  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=2578 A/µs  
di/dt=2565 A/µs  
di/dt=2545 A/µs  
Qr  
Recovered charge  
±15  
600  
100  
125  
150  
25  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
7,63  
mWs  
A/µs  
8,66  
864,58  
625,78  
631,91  
(dirf/dt)max  
125  
150  
12  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
DC-Link Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
10  
0,015  
150  
25  
5,4  
6
6,6  
V
V
25  
1,57  
1,8  
1,85(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
1,86  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
1200  
0
25  
25  
100  
500  
µA  
nA  
Ω
20  
3
Cies  
Coes  
Cres  
Qg  
30000  
880  
pF  
pF  
pF  
nC  
Output capacitance  
0
10  
25  
25  
Reverse transfer capacitance  
Gate charge  
320  
VCC = 600 V  
15  
150  
1000  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,33  
K/W  
25  
317  
335  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
350  
36  
tr  
125  
150  
25  
41  
45  
Rgon = 2 Ω  
Rgoff = 2 Ω  
306  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
351  
ns  
368  
±15  
600  
100  
96,77  
136,13  
145,76  
9,56  
13,18  
13,42  
7,12  
9,9  
tf  
125  
150  
25  
ns  
QrFWD=12,79 µC  
QrFWD=20,79 µC  
QrFWD=22,27 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
125  
150  
11,12  
13  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
DC-Link Switch Prot. Diode  
Static  
25  
1,82  
1,96  
1,96  
2,1(1)  
VF  
IR  
Forward voltage  
100  
125  
150  
V
Reverse leakage current  
Thermal  
Vr = 1200 V  
25  
40  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
0,6  
K/W  
Capacitor (GS)  
Static  
DC bias voltage =  
0 V  
C
Capacitance  
25  
10  
nF  
%
Tolerance  
-10  
10  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
-5  
5
5
mW  
mW/K  
K
d
25  
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
14  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Switch Characteristics  
figure 1.  
MOSFET  
figure 2.  
MOSFET  
Typical output characteristics  
Typical output characteristics  
ID = f(VDS  
)
ID = f(VDS)  
300  
300  
250  
200  
150  
100  
50  
VGS  
:
-4 V  
-2 V  
0 V  
250  
200  
150  
100  
50  
2 V  
4 V  
6 V  
8 V  
10 V  
12 V  
14 V  
16 V  
18 V  
20 V  
0
-50  
-100  
-150  
-200  
-250  
-300  
0
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
4,5  
DS(V)  
-10,0 -7,5  
-5,0 -2,5  
0,0  
2,5  
5,0  
7,5  
10,0 12,5  
V
VDS(V)  
tp  
=
tp  
=
250  
14  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGS  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGS from -4 V to 20 V in steps of 2 V  
figure 3.  
MOSFET  
figure 4.  
MOSFET  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
ID = f(VGS  
)
Zth(j-s) = f(tp)  
0
350  
10  
300  
250  
200  
150  
100  
50  
-1  
10  
-2  
10  
0,5  
0,2  
-3  
10  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
10  
0
2
4
6
8
10  
10  
V
GS(V)  
tp(s)  
tp  
=
=
250  
10  
μs  
V
D =  
tp / T  
0,347  
25 °C  
VDS  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
MOSFET thermal model values  
R (K/W)  
τ (s)  
4,51E-02  
5,88E-02  
1,53E-01  
5,77E-02  
3,26E-02  
3,13E+00  
4,93E-01  
6,43E-02  
9,86E-03  
1,22E-03  
15  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Switch Characteristics  
figure 5.  
MOSFET  
Safe operating area  
ID = f(VDS  
)
1000  
100  
10  
1
0,1  
0,01  
1
10  
100  
1000  
10000  
V
DS(V)  
D =  
single pulse  
Ts =  
80  
14  
°C  
V
VGS  
=
Tj =  
Tjmax  
16  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Diode Characteristics  
figure 6.  
FWD  
figure 7.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
175  
150  
125  
100  
75  
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
50  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
25  
-4  
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0
1
2
3
4
5
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
0,513  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
5,36E-02  
7,62E-02  
1,86E-01  
1,35E-01  
6,26E-02  
3,23E+00  
5,23E-01  
7,69E-02  
1,65E-02  
2,65E-03  
17  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switch Characteristics  
figure 8.  
IGBT  
figure 9.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
400  
400  
VGE  
:
7 V  
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
300  
200  
100  
0
300  
200  
100  
0
0
1
2
3
4
5
0
1
2
3
4
5
V
CE(V)  
VCE(V)  
tp  
=
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 7 V to 17 V in steps of 1 V  
figure 10.  
IGBT  
figure 11.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
150  
10  
125  
100  
75  
50  
25  
0
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
10  
10  
tp(s)  
V
GE(V)  
tp  
=
250  
10  
μs  
V
D =  
tp / T  
0,33  
25 °C  
VCE  
=
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
1,65E-02  
5,74E-02  
8,95E-02  
1,41E-01  
9,15E-03  
7,29E-03  
9,29E-03  
5,52E+00  
1,28E+00  
2,47E-01  
6,93E-02  
5,43E-03  
1,62E-03  
4,10E-04  
18  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switch Characteristics  
figure 12.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
10µs  
100  
10  
100µs  
1ms  
10ms  
1
100ms  
DC  
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
19  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Diode Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
300  
250  
200  
150  
100  
50  
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
μs  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
D =  
tp / T  
0,6  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
2,99E-02  
1,04E-01  
1,63E-01  
2,56E-01  
1,66E-02  
1,33E-02  
1,69E-02  
5,52E+00  
1,28E+00  
2,47E-01  
6,93E-02  
5,43E-03  
1,62E-03  
4,10E-04  
20  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switch Prot. Diode Characteristics  
figure 15.  
FWD  
figure 16.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
40  
30  
20  
10  
0
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0
1
2
3
4
5
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,351  
25 °C  
Tj:  
125 °C  
Rth(j-s) =  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
6,74E-02  
2,35E-01  
3,66E-01  
5,77E-01  
3,75E-02  
2,98E-02  
3,80E-02  
5,52E+00  
1,28E+00  
2,47E-01  
6,93E-02  
5,43E-03  
1,62E-03  
4,10E-04  
21  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Diode Characteristics  
figure 17.  
FWD  
figure 18.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
400  
300  
200  
100  
0
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,0  
0,5  
1,0  
μs  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
D =  
tp / T  
0,52  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
2,59E-02  
9,05E-02  
1,41E-01  
2,22E-01  
1,44E-02  
1,15E-02  
1,46E-02  
5,52E+00  
1,28E+00  
2,47E-01  
6,93E-02  
5,43E-03  
1,62E-03  
4,10E-04  
22  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switch Characteristics  
figure 19.  
IGBT  
figure 20.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
400  
400  
VGE  
:
7 V  
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
300  
200  
100  
0
300  
200  
100  
0
0
1
2
3
4
5
0
1
2
3
4
5
V
CE(V)  
VCE(V)  
tp  
=
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 7 V to 17 V in steps of 1 V  
figure 21.  
IGBT  
figure 22.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
150  
10  
125  
100  
75  
50  
25  
0
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
10  
10  
tp(s)  
V
GE(V)  
tp  
=
250  
10  
μs  
V
D =  
tp / T  
0,33  
25 °C  
VCE  
=
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
1,65E-02  
5,74E-02  
8,95E-02  
1,41E-01  
9,15E-03  
7,29E-03  
9,29E-03  
5,52E+00  
1,28E+00  
2,47E-01  
6,93E-02  
5,43E-03  
1,62E-03  
4,10E-04  
23  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switch Characteristics  
figure 23.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
10µs  
100  
10  
100µs  
1ms  
10ms  
1
100ms  
DC  
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
24  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switch Prot. Diode Characteristics  
figure 24.  
FWD  
figure 25.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
0
300  
250  
200  
150  
100  
50  
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
μs  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
D =  
tp / T  
0,6  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
2,99E-02  
1,04E-01  
1,63E-01  
2,56E-01  
1,66E-02  
1,33E-02  
1,69E-02  
5,52E+00  
1,28E+00  
2,47E-01  
6,93E-02  
5,43E-03  
1,62E-03  
4,10E-04  
25  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Thermistor Characteristics  
figure 26.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
26  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Open Switching Characteristics  
figure 27.  
MOSFET  
figure 28.  
MOSFET  
Typical switching energy losses as a function of drain current  
Typical switching energy losses as a function of gate resistor  
E = f(ID)  
E = f(Rg)  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eoff  
Eoff  
Eoff  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eon  
Eon  
Eon  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
2
figure 29.  
FWD  
figure 30.  
FWD  
Typical reverse recovered energy loss as a function of drain current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(ID)  
Erec = f(Rg)  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
27  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Open Switching Characteristics  
figure 31.  
MOSFET  
figure 32.  
MOSFET  
Typical switching times as a function of drain current  
Typical switching times as a function of gate resistor  
t = f(ID)  
t = f(Rg)  
0
10  
0
10  
td(off)  
-1  
10  
-1  
10  
td(off)  
td(on)  
td(on)  
tf  
tr  
tf  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
-2/15  
2
°C  
V
150  
600  
°C  
V
VDS  
=
=
=
=
VDS  
=
=
=
VGS  
Rgon  
Rgoff  
VGS  
ID  
V
-2/15  
100  
V
Ω
Ω
A
2
figure 33.  
FWD  
figure 34.  
FWD  
Typical reverse recovery time as a function of drain current  
Typical reverse recovery time as a function of turn on gate resistor  
trr = f(ID)  
trr = f(Rgon)  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
=
=
=
VDS  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
-2/15  
100  
V
25 °C  
25 °C  
VGS  
VGS  
ID  
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
28  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Open Switching Characteristics  
figure 35.  
FWD  
figure 36.  
FWD  
Typical recovered charge as a function of drain current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(ID)  
Qr = f(Rgon)  
0,9  
0,8  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
0,8  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
-2/15  
2
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 37.  
FWD  
figure 38.  
FWD  
Typical peak reverse recovery current as a function of drain current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(ID)  
IRM = f(Rgon)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
150  
125  
100  
75  
IRM  
IRM  
IRM  
50  
IRM  
IRM  
IRM  
25  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
-2/15  
2
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
29  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Open Switching Characteristics  
figure 39.  
FWD  
figure 40.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of drain current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(ID)  
diF/dt, dirr/dt = f(Rgon)  
17500  
25000  
20000  
15000  
10000  
5000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
15000  
12500  
10000  
7500  
5000  
2500  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
At  
600  
-2/15  
100  
V
25 °C  
25 °C  
V
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
figure 41.  
MOSFET  
Reverse bias safe operating area  
ID = f(VDS  
)
350  
ID MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
DS(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
2
2
Ω
30  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Open Measurement Circuit  
31  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Open Switching Characteristics  
figure 27.  
MOSFET  
figure 28.  
MOSFET  
Typical switching energy losses as a function of drain current  
Typical switching energy losses as a function of gate resistor  
E = f(ID)  
E = f(Rg)  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eoff  
Eon  
Eoff  
Eoff  
Eon  
Eon  
Eon  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
2
figure 29.  
FWD  
figure 30.  
FWD  
Typical reverse recovered energy loss as a function of drain current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(ID)  
Erec = f(Rg)  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
32  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Open Switching Characteristics  
figure 31.  
MOSFET  
figure 32.  
MOSFET  
Typical switching times as a function of drain current  
Typical switching times as a function of gate resistor  
t = f(ID)  
t = f(Rg)  
0
10  
0
10  
td(off)  
-1  
10  
-1  
10  
td(off)  
td(on)  
td(on)  
tr  
tf  
tf  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
-2/15  
2
°C  
V
150  
600  
°C  
V
VDS  
=
=
=
=
VDS  
=
=
=
VGS  
Rgon  
Rgoff  
VGS  
ID  
V
-2/15  
100  
V
Ω
Ω
A
2
figure 33.  
FWD  
figure 34.  
FWD  
Typical reverse recovery time as a function of drain current  
Typical reverse recovery time as a function of turn on gate resistor  
trr = f(ID)  
trr = f(Rgon)  
0,040  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
VGS  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
33  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Open Switching Characteristics  
figure 35.  
FWD  
figure 36.  
FWD  
Typical recovered charge as a function of drain current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(ID)  
Qr = f(Rgon)  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 37.  
FWD  
figure 38.  
FWD  
Typical peak reverse recovery current as a function of drain current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(ID)  
IRM = f(Rgon)  
125  
100  
75  
50  
25  
0
150  
125  
100  
75  
IRM  
IRM  
IRM  
50  
IRM  
IRM  
IRM  
25  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
34  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Open Switching Characteristics  
figure 39.  
FWD  
figure 40.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of drain current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(ID)  
diF/dt, dirr/dt = f(Rgon)  
20000  
30000  
25000  
20000  
15000  
10000  
5000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
17500  
15000  
12500  
10000  
7500  
5000  
2500  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
At  
600  
-2/15  
100  
V
25 °C  
25 °C  
V
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
figure 41.  
MOSFET  
Reverse bias safe operating area  
ID = f(VDS  
)
350  
ID MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
DS(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
2
2
Ω
35  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Open Measurement Circuit  
36  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Short Switching Characteristics  
figure 27.  
MOSFET  
figure 28.  
MOSFET  
Typical switching energy losses as a function of drain current  
Typical switching energy losses as a function of gate resistor  
E = f(ID)  
E = f(Rg)  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eon  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
2
figure 29.  
FWD  
figure 30.  
FWD  
Typical reverse recovered energy loss as a function of drain current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(ID)  
Erec = f(Rg)  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
37  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Short Switching Characteristics  
figure 31.  
MOSFET  
figure 32.  
MOSFET  
Typical switching times as a function of drain current  
Typical switching times as a function of gate resistor  
t = f(ID)  
t = f(Rg)  
0
10  
0
10  
td(off)  
-1  
10  
-1  
10  
td(off)  
td(on)  
td(on)  
tr  
tf  
tf  
tr  
-2  
-2  
10  
10  
-3  
10  
-3  
10  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
-2/15  
2
°C  
V
150  
600  
°C  
V
VDS  
=
=
=
=
VDS  
=
=
=
VGS  
Rgon  
Rgoff  
VGS  
ID  
V
-2/15  
100  
V
Ω
Ω
A
2
figure 33.  
FWD  
figure 34.  
FWD  
Typical reverse recovery time as a function of drain current  
Typical reverse recovery time as a function of turn on gate resistor  
trr = f(ID)  
trr = f(Rgon)  
0,040  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
VGS  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
38  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Short Switching Characteristics  
figure 35.  
FWD  
figure 36.  
FWD  
Typical recovered charge as a function of drain current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(ID)  
Qr = f(Rgon)  
2,25  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 37.  
FWD  
figure 38.  
FWD  
Typical peak reverse recovery current as a function of drain current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(ID)  
IRM = f(Rgon)  
150  
125  
100  
75  
175  
150  
125  
100  
75  
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
50  
25  
25  
0
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
39  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Short Switching Characteristics  
figure 39.  
FWD  
figure 40.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of drain current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(ID)  
diF/dt, dirr/dt = f(Rgon)  
20000  
30000  
25000  
20000  
15000  
10000  
5000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
17500  
15000  
12500  
10000  
7500  
5000  
2500  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
At  
600  
-2/15  
100  
V
25 °C  
25 °C  
V
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
figure 41.  
MOSFET  
Reverse bias safe operating area  
ID = f(VDS  
)
350  
ID MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
DS(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
2
2
Ω
40  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Real Short Measurement Circuit  
41  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Short Switching Characteristics  
figure 27.  
MOSFET  
figure 28.  
MOSFET  
Typical switching energy losses as a function of drain current  
Typical switching energy losses as a function of gate resistor  
E = f(ID)  
E = f(Rg)  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eon  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
2
figure 29.  
FWD  
figure 30.  
FWD  
Typical reverse recovered energy loss as a function of drain current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(ID)  
Erec = f(Rg)  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
600  
-2/15  
2
V
V
Ω
125 °C  
150 °C  
600  
-2/15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
42  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Short Switching Characteristics  
figure 31.  
MOSFET  
figure 32.  
MOSFET  
Typical switching times as a function of drain current  
Typical switching times as a function of gate resistor  
t = f(ID)  
t = f(Rg)  
0
10  
0
10  
td(off)  
-1  
10  
-1  
10  
td(off)  
td(on)  
td(on)  
tf  
tr  
tf  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
25  
50  
75  
100  
125  
150  
175  
200  
ID(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
-2/15  
2
°C  
V
150  
600  
°C  
V
VDS  
=
=
=
=
VDS  
=
=
=
VGS  
Rgon  
Rgoff  
VGS  
ID  
V
-2/15  
100  
V
Ω
Ω
A
2
figure 33.  
FWD  
figure 34.  
FWD  
Typical reverse recovery time as a function of drain current  
Typical reverse recovery time as a function of turn on gate resistor  
trr = f(ID)  
trr = f(Rgon)  
0,040  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
0,045  
0,040  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
=
=
=
VDS  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
-2/15  
100  
V
25 °C  
25 °C  
VGS  
VGS  
ID  
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
43  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Short Switching Characteristics  
figure 35.  
FWD  
figure 36.  
FWD  
Typical recovered charge as a function of drain current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(ID)  
Qr = f(Rgon)  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
-2/15  
2
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
figure 37.  
FWD  
figure 38.  
FWD  
Typical peak reverse recovery current as a function of drain current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(ID)  
IRM = f(Rgon)  
175  
150  
125  
100  
75  
125  
100  
75  
50  
25  
0
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
25  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
V
Ω
At  
600  
V
V
A
25 °C  
25 °C  
125 °C  
150 °C  
-2/15  
100  
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
44  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Short Switching Characteristics  
figure 39.  
FWD  
figure 40.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of drain current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(ID)  
diF/dt, dirr/dt = f(Rgon)  
22500  
40000  
35000  
30000  
25000  
20000  
15000  
10000  
5000  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
20000  
17500  
15000  
12500  
10000  
7500  
5000  
2500  
0
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
ID(A)  
Rgon(Ω)  
VDS  
VGS  
=
=
=
VDS  
VGS  
ID  
=
=
=
At  
600  
-2/15  
2
V
At  
600  
-2/15  
100  
V
25 °C  
25 °C  
V
125 °C  
150 °C  
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Ω
figure 41.  
MOSFET  
Reverse bias safe operating area  
ID = f(VDS  
)
350  
ID MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
DS(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
2
2
Ω
45  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Reactive Short Measurement Circuit  
46  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Switching Definitions  
47  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
AC Switching Definitions  
48  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switching Characteristics  
figure 42.  
IGBT  
figure 43.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
25  
20  
15  
10  
5
17,5  
15,0  
12,5  
10,0  
7,5  
Eon  
Eon  
Eon  
Eon  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
5,0  
2,5  
0
0,0  
0
25  
50  
75  
100  
125  
150  
175  
200  
IC(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
2
figure 44.  
IGBT  
figure 45.  
IGBT  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
9
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
49  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switching Characteristics  
figure 46.  
IGBT  
figure 47.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(on)  
td(off)  
td(on)  
td(off)  
tf  
tf  
-1  
10  
-1  
10  
tr  
tr  
-2  
10  
-2  
10  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
±15  
2
°C  
V
150  
600  
±15  
100  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
V
Ω
Ω
A
2
figure 48.  
IGBT  
figure 49.  
IGBT  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
50  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switching Characteristics  
figure 50.  
IGBT  
figure 51.  
IGBT  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
22,5  
20,0  
17,5  
15,0  
12,5  
10,0  
7,5  
20,0  
17,5  
15,0  
12,5  
10,0  
7,5  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
5,0  
5,0  
2,5  
2,5  
0,0  
0,0  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 52.  
IGBT  
figure 53.  
IGBT  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
100  
80  
60  
40  
20  
0
125  
100  
75  
50  
25  
0
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
51  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Switching Characteristics  
figure 54.  
IGBT  
figure 55.  
IGBT  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
3500  
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
dirr/dt ──────  
3000  
2500  
2000  
1500  
1000  
500  
0
0
0
25  
50  
75  
100  
125  
150  
175  
200  
IC(A)  
0
1
2
3
4
5
6
7
8
9
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 56.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
350  
IC MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
CE(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
2
2
Ω
52  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Neutral Point Measurement Circuit  
53  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switching Characteristics  
figure 57.  
IGBT  
figure 58.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
30  
25  
20  
15  
10  
5
20,0  
17,5  
15,0  
12,5  
10,0  
7,5  
Eon  
Eon  
Eon  
Eon  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
Eoff  
5,0  
2,5  
0
0,0  
0
25  
50  
75  
100  
125  
150  
175  
200  
IC(A)  
0
1
2
3
4
5
6
7
8
9
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
2
figure 59.  
IGBT  
figure 60.  
IGBT  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
12,5  
10,0  
7,5  
10  
Erec  
Erec  
8
Erec  
Erec  
6
Erec  
5,0  
4
Erec  
2,5  
2
0,0  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
54  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switching Characteristics  
figure 61.  
IGBT  
figure 62.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(on)  
td(off)  
td(on)  
td(off)  
tf  
tf  
-1  
10  
-1  
10  
tr  
tr  
-2  
10  
-2  
10  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
600  
±15  
2
°C  
V
150  
600  
±15  
100  
°C  
V
VCE  
=
=
=
=
VCE  
=
=
=
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
V
Ω
Ω
A
2
figure 63.  
IGBT  
figure 64.  
IGBT  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
55  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switching Characteristics  
figure 65.  
IGBT  
figure 66.  
IGBT  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
35  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 67.  
IGBT  
figure 68.  
IGBT  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
150  
125  
100  
75  
175  
150  
125  
100  
75  
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
50  
25  
25  
0
0
0
25  
50  
75  
100  
125  
150  
175  
200  
0
1
2
3
4
5
6
7
8
9
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
56  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Switching Characteristics  
figure 69.  
IGBT  
figure 70.  
IGBT  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
4500  
6000  
5000  
4000  
3000  
2000  
1000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
4000  
dirr/dt ──────  
3500  
3000  
2500  
2000  
1500  
1000  
500  
0
0
25  
50  
75  
100  
125  
150  
175  
200  
IC(A)  
0
1
2
3
4
5
6
7
8
9
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
600  
±15  
2
V
V
Ω
125 °C  
150 °C  
600  
±15  
100  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 71.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
350  
IC MAX  
300  
250  
200  
150  
100  
50  
0
0
250  
500  
750  
1000  
1250  
1500  
V
CE(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
2
2
Ω
57  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
DC-Link Measurement Circuit  
58  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Switching Definitions  
figure 72.  
IGBT  
figure 73.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (ttEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 74.  
IGBT  
figure 75.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
59  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Switching Definitions  
figure 76.  
FWD  
figure 77.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
60  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Ordering Code  
Marking  
Version  
Ordering Code  
Without thermal paste  
With thermal paste  
10-PG12NAB008ME-LC59F66T  
10-PG12NAB008ME-LC59F66T-/3/  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
High Side Module 10-PG12NAB008ME-LC59F66T  
Outline  
Pin table [mm]  
Function 25  
Pin  
1
X
Y
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
28,9  
not assembled  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
2
52,9  
49,9  
52,9  
49,9  
3
3
0
0
DC-1  
3
DC-1  
DC-1  
DC-1  
4
5
6
not assembled  
7
40  
37  
0
0
GND1  
GND1  
40,9  
43,9  
46,9  
49,9  
52,9  
44,3  
41,2  
38,2  
37,95  
Ph1  
Ph1  
Ph1  
Ph1  
Ph1  
N1  
8
28,9  
9
not assembled  
not assembled  
28,9  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
28,9  
21,8  
18,9  
0
0
GND1  
GND1  
28,9  
17,9  
not assembled  
14,7  
S15  
G15  
N1  
9
0
0
DC+1  
14,7  
6
DC+1  
DC+1  
DC+1  
G11  
17,9  
3
0
not assembled  
not assembled  
18,5  
0
0
0
0
9,5  
12,5  
17,45  
18,45  
28,9  
28,9  
29,35  
26,9  
P1  
P1  
S11  
15,6  
12,45  
15,45  
0
G13  
not assembled  
not assembled  
not assembled  
not assembled  
S13  
Therm11  
Therm12  
3
not assembled  
61  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
High Side Module 10-PG12NAB008ME-LC59F66T  
Pinout  
DC+1  
14,15,16,17  
T11  
D11-a  
G11  
18  
S11  
19  
P1  
43,44  
T13  
D16-b  
G13  
20  
C13  
S13  
21  
GND1  
Ph1  
7,8,11,12  
32,33,34,35,36  
T15  
D15-a  
D13  
G15  
39  
S15  
38  
N1  
37,40  
D12-b  
Rt1  
2,3,4,5  
DC-1  
Therm11  
22  
Therm12  
23  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T13  
D13  
D16-b  
T15  
D12-b  
D15-a  
T11  
MOSFET  
FWD  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
25 V  
8 mΩ  
60 A  
AC Switch  
AC Diode  
Neutral Point Diode  
Neutral Point Switch  
DC-Link Diode  
FWD  
150 A  
150 A  
100 A  
15 A  
IGBT  
FWD  
FWD  
Neutral Point Switch Prot. Diode  
DC-Link Switch  
IGBT  
150 A  
100 A  
D11-a  
C13  
FWD  
DC-Link Switch Prot. Diode  
Capacitor  
Thermistor  
Capacitor (GS)  
Thermistor  
Rt1  
62  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Ordering Code  
Marking  
Version  
Ordering Code  
Without thermal paste  
With thermal paste  
10-PG12NAC008ME-LC69F66T  
10-PG12NAC008ME-LC69F66T-/3/  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Low Side Module 10-PG12NAC008ME-LC69F66T  
Outline  
Pin table [mm]  
Function 25  
Ph2 26  
Pin  
1
X
Y
9
28,9  
DC+2  
GND2  
52,9  
52,9  
49,9  
52,9  
49,9  
6
not assembled  
2
3
Ph2  
Ph2  
Ph2  
Ph2  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
18,9  
21,8  
31  
28,9  
28,9  
28,9  
28,9  
3
3
GND2  
GND2  
GND2  
4
0
5
0
34  
6
not assembled  
not assembled  
not assembled  
0
not assembled  
not assembled  
7
8
43,9  
46,9  
49,9  
52,9  
28,9  
28,9  
28,9  
28,9  
DC-2  
9
31,5  
28,5  
S14  
G14  
DC-2  
DC-2  
DC-2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
1
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
not assembled  
14,9  
3
0
0
0
0
0
Therm21  
Therm22  
S16  
35,9  
G12  
S12  
35,35  
17,9  
9,5  
12,5  
not assembled  
15,6  
G16  
26,9  
26,9  
N2  
N2  
not assembled  
not assembled  
13  
not assembled  
12,3  
0
3
6
28,9  
28,9  
28,9  
DC+2  
17,8  
15,2  
P2  
P2  
DC+2  
DC+2  
12,3  
63  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Low Side Module 10-PG12NAC008ME-LC69F66T  
Pinout  
DC+2  
22,23,24,25  
D11-b  
P2  
47,48  
T16  
D16-a  
D14  
G16  
19  
S16  
18  
Ph2  
GND2  
1,2,3,4,5  
27,28,29,30  
T14  
D15-b  
G14  
10  
C14  
S14  
9
N2  
44,45  
T12  
D12-a  
G12  
41  
S12  
42  
Rt2  
33,34,35,36  
DC-2  
Therm21  
16  
Therm22  
17  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T14  
D14  
MOSFET  
FWD  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
1200 V  
25 V  
8 mΩ  
60 A  
AC Switch  
AC Diode  
Neutral Point Switch  
T16  
IGBT  
150 A  
100 A  
15 A  
D11-b  
D16-a  
T12  
FWD  
DC-Link Diode  
FWD  
Neutral Point Switch Prot. Diode  
DC-Link Switch  
IGBT  
150 A  
150 A  
100 A  
D15-b  
D12-a  
C14  
FWD  
Neutral Point Diode  
DC-Link Switch Prot. Diode  
Capacitor (GS)  
FWD  
Capacitor  
Thermistor  
Rt2  
Thermistor  
64  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  
10-PG12NAB008ME-LC59F66T  
10-PG12NAC008ME-LC69F66T  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 100  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 1 packages see vincotech.com website.  
Package data  
Package data for flow 1 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-PG12NAx008ME-LCx9F66T-D1-14  
29 Sep. 2020  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
65  
Copyright Vincotech  
29 Sep. 2020 / Revision 1  

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