10-PZ07NMA100SM-M265F58Y [VINCOTECH]
High efficiency in hard switching and resonant topologies;High speed switching;Low gate charge;型号: | 10-PZ07NMA100SM-M265F58Y |
厂家: | VINCOTECH |
描述: | High efficiency in hard switching and resonant topologies;High speed switching;Low gate charge |
文件: | 总29页 (文件大小:2211K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
flow MNPC 0
650 V / 100 A
Features
flow 0 12mm housing
● Mixed voltage NPC topology
● Reactive power capability
● Low inductance layout
● Common collector neutral connection
Pressꢀfit pins
Solder pins
Target Applications
Schematic
● Solar Inverter
● UPS
Types
● 10ꢀFZ07NMA100SMꢀM265F58
● 10ꢀPZ07NMA100SMꢀM265F58Y
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Buck Switch
V CES
I C
Collectorꢀemitter breakdown voltage
650
79
V
A
T j = T jmax
T s = 80 °C
DC collector current
I CRM
t p limited by T jmax
Repetitive peak collector current
Turn off safe operating area
Power dissipation
300
300
136
±20
175
A
T j ≤ 150 °C
V CE<=V CES
A
P tot
V GE
T j = T jmax
T s = 80 °C
W
V
Gateꢀemitter peak voltage
Maximum Junction Temperature
T jmax
°C
Buck Diode
V RRM
I FAV
Peak Repetitive Reverse Voltage
600
50
V
A
T j = T jmax
T j = T jmax
T s = 80 °C
T s = 80 °C
Mean forward current
Power dissipation
P tot
69
W
°C
T jmax
Maximum Junction Temperature
175
17 Jan. 2019 / Revision 4
copyright Vincotech
1
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Boost Switch
V CES
I C
Collectorꢀemitter breakdown voltage
600
57
V
A
T j = T jmax
T s = 80 °C
DC collector current
I CRM
t p limited by T jmax
Repetitive peak collector current
Turn off safe operating area
Power dissipation
225
225
82
A
T j ≤ 150 °C
V CE<=V CES
A
P tot
V GE
T j = T jmax
T s = 80 °C
W
V
Gateꢀemitter peak voltage
Short circuit ratings
±20
t SC
V CC
T j ≤ 150 °C
V GE = 15 V
6
µs
V
360
T jmax
Maximum Junction Temperature
175
°C
Boost Diode
V RRM
Peak Repetitive Reverse Voltage
650
V
I FAV
I FSM
I FRM
T j = T jmax
T s = 80 °C
Mean forward current
47
A
A
A
t p = 10 ms
Surge (nonꢀrepetitive) forward current
Repetitive peak forward current
100
100
t p limited by T jmax
P tot
T j = T jmax
T s = 80 °C
Power dissipation
70
W
T jmax
Maximum Junction Temperature
175
°C
Thermal Properties
T stg
T op
Storage temperature
ꢀ40…+125
°C
°C
ꢀ40…+(T jmax ꢀ 25)
Operation temperature under switching condition
Isolation Properties
Isolation voltage
t
= 2 s
DC Test Voltage*
4000
min >12,7
9 / 9,15
>200
V
Creepage distance
Clearance
mm
mm
Pressꢀfit pins / Solder pins
Pressꢀfit pins / Solder pins
Comparative Tracking Index
CTI
*100% tested in production
17 Jan. 2019 / Revision 4
copyright Vincotech
2
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V] I C [A]
V GE [V]
V CE [V] I F [A]
V GS [V]
T j [°C]
Min
Max
V DS [V] I D [A]
Buck Switch
V GE(th)
V CEsat
I CES
I GES
R gint
t d(on)
t r
V CE = V GE
Gate emitter threshold voltage
Collectorꢀemitter saturation voltage
Collectorꢀemitter cutꢀoff current incl. Diode
Gateꢀemitter leakage current
Integrated Gate resistor
Turnꢀon delay time
0,0005
100
25
3,3
1
4
4,7
2,4
V
V
25
125
1,63
1,78
15
0
650
0
25
25
0,07
400
mA
nA
ꢁ
20
none
25
125
25
125
25
125
25
125
25
125
25
70
71
18
21
78
94
13
22
0,14
0,27
0,18
0,32
Rise time
ns
t d(off)
t f
Turnꢀoff delay time
R goff = 4 ꢁ
R gon = 4 ꢁ
±15
150
50
Fall time
E on
Turnꢀon energy loss
mWs
pF
E off
C ies
C oss
C rss
Q G
Turnꢀoff energy loss
125
Input capacitance
6000
100
22
Output capacitance
f = 1 MHz
0
25
25
25
Reverse transfer capacitance
Gate charge
±15
520
100
240
nC
λ paste = 3,4 W/mK
(PSX)
R th(j-s)
Thermal resistance junction to sink
0,7
K/W
Buck Diode
25
125
1,80
1,58
3
V F
Diode forward voltage
60
V
µA
I r
I RRM
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
600
150
25
10
25
125
25
125
25
125
25
125
25
125
41
59
33
A
t rr
ns
113
1,00
3,10
4239
2404
0,084
0,306
Q rr
R gon = 4 ꢁ
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovered energy
±15
50
µC
( di rf/dt )max
E rec
A/µs
mWs
λ paste = 3,4 W/mK
(PSX)
R th(j-s)
Thermal resistance junction to sink
1,38
K/W
17 Jan. 2019 / Revision 4
copyright Vincotech
3
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V] I C [A]
V GE [V]
V CE [V] I F [A]
V GS [V]
T j [°C]
Min
Max
V DS [V] I D [A]
Boost Switch
Gate emitter threshold voltage
Collectorꢀemitter saturation voltage
Collectorꢀemitter cutꢀoff incl diode
Gateꢀemitter leakage current
Integrated Gate resistor
Turnꢀon delay time
V GE(th)
V CEsat
I CES
I GES
R gint
t d(on)
t r
V CE = V GE
0,0012
75
25
5
5,8
6,5
V
V
25
125
1,05
1,44
1,58
1,85
15
0
600
0
25
25
0,03
700
mA
nA
ꢁ
20
none
25
125
25
125
25
125
25
125
25
125
25
93
94
14
Rise time
17
ns
138
156
74
t d(off)
t f
Turnꢀoff delay time
R goff = 4 ꢁ
R gon = 4 ꢁ
±15
150
50
Fall time
97
0,13
0,25
0,70
0,95
E on
Turnꢀon energy loss
Turnꢀoff energy loss
Input capacitance
mWs
E off
C ies
C oss
C rss
Q G
125
4620
288
137
470
Output capacitance
f = 1 MHz
0
25
25
25
pF
Reverse transfer capacitance
Gate charge
15
480
75
nC
λ paste = 3,4 W/mK
(PSX)
R th(j-s)
Thermal resistance junction to sink
1,16
K/W
Boost Diode
25
125
1
1,62
1,53
2
V F
Diode forward voltage
50
60
V
ꢂA
I r
I RRM
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
650
150
25
27
25
125
25
125
25
125
25
125
25
125
37
43
144
290
1,98
4,21
2751
1443
0,24
0,52
A
t rr
ns
Q rr
R gon = 4 ꢁ
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
±15
µC
( di rf/dt )max
E rec
A/µs
mWs
λ paste = 3,4 W/mK
(PSX)
R th(j-s)
Thermal resistance junction to sink
1,36
K/W
Thermistor
Rated resistance
Deviation of R 100
Power dissipation
Power dissipation constant
Bꢀvalue
R
Δ R/R
P
25
100
25
25
25
25
22000
ꢁ
%
R 100 = 1486 ꢁ
ꢀ12
+14
200
2
mW
mW/K
K
B(25/50)
Tol. ±3%
3950
3998
Bꢀvalue
B(25/100) Tol. ±3%
K
Vincotech NTC Reference
B
17 Jan. 2019 / Revision 4
copyright Vincotech
4
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 1.
Typical output characteristics
IGBT
figure 2.
Typical output characteristics
IGBT
I C = f(V CE
)
I C = f(V CE)
300
300
250
200
150
100
50
250
200
150
100
50
0
0
0
0
1
2
3
4
5
1
2
3
4
5
V
CE (V)
VCE (V)
At
At
t p
=
t p =
250
25
ꢂs
°C
250
125
ꢂs
°C
T j =
T j =
V GE from
V GE from
5 V to 15 V in steps of 1 V
5 V to 15 V in steps of 1 V
figure 3.
Typical transfer characteristics
IGBT
figure 4.
FWD
Typical diode forward current as
a function of forward voltage
I F = f(V F)
I C = f(V GE
)
100
240
200
160
120
80
80
60
40
20
40
0
0
0
0
1
2
3
4
2
4
6
8
VGE (V)
VF (V)
At
At
T j =
T j =
25/125
250
°C
ꢂs
V
25/125
250
°C
ꢂs
t p
=
t p =
V CE
=
10
17 Jan. 2019 / Revision 4
copyright Vincotech
5
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 5.
IGBT
figure 6.
IGBT
Typical switching energy losses
as a function of collector current
E = f(I C)
Typical switching energy losses
as a function of gate resistor
E = f(R G)
0,7
0,6
0,5
0,4
0,3
0,2
0,1
0
0,7
0,6
0,5
0,4
0,3
0,2
0,1
0,0
Eoff High T
Eon High T
Eon High T
Eoff Low T
Eoff Low T
Eon Low T
Eoff High T
Eon Low T
0
4
8
12
16
20
0
25
50
75
100
I C (A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j =
T j =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
±15
50
V
=
I C =
ꢁ
ꢁ
A
=
4
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery energy loss
as a function of collector current
E rec = f(I c)
Typical reverse recovery energy loss
as a function of gate resistor
E rec = f(R G)
0,4
0,3
0,2
0,1
0
0,4
0,3
0,2
0,1
Erec High T
Erec High T
Erec Low T
Erec Low T
0
0
4
8
12
16
20
0
25
50
75
100
I C (A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j =
T j =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
V CE
V GE
=
=
=
V
±15
50
V
=
I C =
ꢁ
A
17 Jan. 2019 / Revision 4
copyright Vincotech
6
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 9.
IGBT
figure 10.
IGBT
Typical switching times as a
function of collector current
t = f(I C)
Typical switching times as a
function of gate resistor
t = f(R G)
1,00
1,00
0,10
0,01
0,00
tdoff
tdoff
tdon
tr
tf
0,10
tdon
tf
0,01
tr
0,00
0
4
8
12
16
20
0
25
50
75
100
R G ( Ω)
I C (A)
With an inductive load at
With an inductive load at
T j =
T j =
125
150
±15
4
°C
V
125
150
±15
50
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
V
=
I C =
ꢁ
ꢁ
A
=
4
figure 11.
FWD
figure 12.
Typical reverse recovery time as a
function of IGBT turn on gate resistor
FWD
Typical reverse recovery time as a
function of collector current
t rr = f(I c)
t rr = f(R gon
)
0,15
0,12
0,09
0,06
0,03
0
0,15
trr High T
trr High T
0,12
0,09
0,06
0,03
trr Low T
trr Low T
0
0
4
8
12
16
20
0
25
50
75
100
I C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
=
V
50
A
=
V GE =
ꢁ
±15
V
17 Jan. 2019 / Revision 4
copyright Vincotech
7
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 13.
FWD
figure 14.
FWD
Typical reverse recovery charge as a
function of collector current
Q rr = f(I C)
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Q rr = f(R gon
)
5
4
3
2
1
0
5
Qrr High T
4
3
2
1
Qrr High T
Qrr Low T
Qrr Low T
0
0
0
25
50
75
100
4
8
12
16
20
I C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
=
V
50
A
=
V GE =
ꢁ
±15
V
figure 15.
FWD
figure 16.
FWD
Typical reverse recovery current as a
function of collector current
I RRM = f(I C)
Typical reverse recovery current as a
function of IGBT turn on gate resistor
I RRM = f(R gon
)
70
60
50
40
30
20
10
0
70
IRRM High T
60
50
40
30
20
10
IRRM Low T
IRRM High T
IRRM Low T
0
0
0
25
50
75
100
4
8
12
16
20
I
C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
=
V
50
A
=
V GE =
ꢁ
±15
V
17 Jan. 2019 / Revision 4
copyright Vincotech
8
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 17.
FWD
figure 18.
FWD
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI 0/dt ,dI rec/dt = f(I c)
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI 0/dt ,dI rec/dt = f(R gon
)
6000
6000
dIrec/dt T
dIrec/dt T
dIo/dt T
dI0/dt T
5000
5000
4000
3000
2000
1000
0
4000
3000
2000
1000
0
0
25
50
75
100
0
4
8
12
16
20
I C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
=
V
50
A
=
V GE =
ꢁ
±15
V
figure 19.
IGBT
figure 20.
FWD
IGBT transient thermal impedance
as a function of pulse width
Z th(j-s) = f(t p)
FWD transient thermal impedance
as a function of pulse width
Z th(j-s) = f(t p)
101
101
100
100
D = 0,5
0,2
D = 0,5
10-1
10-1
0,2
0,1
0,05
0,02
0,01
0,1
0,05
0,02
0,01
0,005
0,000
0,005
0,000
10-2
10-2
t p (s)
t p (s)
10-5
10-4
10-3
10-2
10-1
100
101
10-5
10-4
10-3
10-2
10-1
100
101
At
At
t p / T
t p / T
D =
D =
R th(j-s)
=
R th(j-s) =
0,70
K/W
1,38
K/W
IGBT thermal model values
FWD thermal model values
R (K/W) Tau (s)
6,67Eꢀ02 1,43E+00
1,15Eꢀ01 2,44Eꢀ01
2,87Eꢀ01 6,53Eꢀ02
1,30Eꢀ01 1,67Eꢀ02
5,73Eꢀ02 4,56Eꢀ03
R (K/W) Tau (s)
8,16Eꢀ02 3,99E+00
2,02Eꢀ01 6,32Eꢀ01
7,09Eꢀ01 1,11Eꢀ01
2,16Eꢀ01 3,68Eꢀ02
9,74Eꢀ02 5,31Eꢀ03
17 Jan. 2019 / Revision 4
copyright Vincotech
9
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 21.
IGBT
figure 22.
IGBT
Power dissipation as a
function of heatsink temperature
P tot = f(T s)
Collector current as a
function of heatsink temperature
I C = f(T s)
250
200
150
100
50
125
100
75
50
25
0
0
T s
(
o C)
T s (
o C)
0
50
100
150
200
0
50
100
150
200
At
At
T j =
T j =
175
°C
175
15
°C
V
V GE
=
figure 23.
Power dissipation as a
FWD
figure 24.
Forward current as a
FWD
function of heatsink temperature
function of heatsink temperature
P tot = f(T s)
I F = f(T s)
150
125
100
75
80
60
40
20
0
50
25
0
T s (
o C)
T s (
o C)
0
50
100
150
200
0
50
100
150
200
At
At
T j =
T j =
175
°C
175
°C
17 Jan. 2019 / Revision 4
copyright Vincotech
10
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck
Buck Switch IGBT and Buck Diode FWD
figure 25.
IGBT
figure 26.
IGBT
Gate voltage vs Gate charge
Safe operating area as a function
of collectorꢀemitter voltage
I C = f(V CE
)
V GE = f(Q g)
103
15
130 V
10uS
100uS
1mS
102
12
9
10mS
520 V
100mS
DC
101
6
100
3
10-1
0
0
40
80
120
160
200
240
Q g (nC)
100
VCE (V)
103
102
101
At
At
D =
single pulse
I C
=
100
A
T s =
80
ºC
V GE
=
±15
T jmax
V
T j =
ºC
figure 27.
Reverse bias safe operating area
IGBT
I C = f(V CE
)
250
IC MAX
200
150
100
50
0
0
100
200
300
400
500
600
700
VCE (V)
At
T j =
125 °C
R gon
R goff
=
=
4
4
ꢁ
ꢁ
17 Jan. 2019 / Revision 4
copyright Vincotech
11
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost
Boost Switch IGBT and Boost Diode FWD
figure 1.
IGBT
figure 2.
Typical output characteristics
IGBT
Typical output characteristics
I C = f(V CE
)
I C = f(V CE)
300
300
250
200
150
100
50
250
200
150
100
50
0
0
0
0
1
2
3
4
5
1
2
3
4
5
VCE (V)
VCE (V)
At
At
t p
=
t p =
250
25
ꢂs
°C
250
125
ꢂs
°C
T j =
T j =
V GE from
V GE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
figure 3.
Typical transfer characteristics
IGBT
figure 4.
FWD
Typical diode forward current as
a function of forward voltage
I F = f(V F)
I C = f(V GE
)
75
200
150
100
50
60
45
30
15
0
0
0
2
4
6
8
10
12
0
0,5
1
1,5
2
2,5
3
VGE (V)
VF (V)
At
At
T j =
T j =
25/125
250
°C
25/125
250
°C
ꢂs
t p
=
t p =
ꢂs
V
V CE
=
10
17 Jan. 2019 / Revision 4
copyright Vincotech
12
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost
Boost Switch IGBT and Boost Diode FWD
figure 5.
IGBT
figure 6.
IGBT
Typical switching energy losses
as a function of collector current
E = f(I C)
Typical switching energy losses
as a function of gate resistor
E = f(R G)
1,5
1,2
0,9
0,6
0,3
0
1,5
1,2
0,9
0,6
0,3
0
Eoff High T
Eoff Low T
Eoff High T
Eoff Low T
Eon High T
Eon Low T
Eon High T
Eon Low T
0
4
8
12
16
20
0
25
50
75
100
R G ( Ω )
I C (A)
With an inductive load at
With an inductive load at
T j =
T j =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
±15
50
V
=
I C =
ꢁ
ꢁ
A
=
4
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery energy loss
as a function of collector current
E rec = f(I c)
Typical reverse recovery energy loss
as a function of gate resistor
E rec = f(R G)
0,75
0,75
Erec High T
0,6
0,6
Erec High T
0,45
0,3
0,45
0,3
Erec Low T
Erec Low T
0,15
0,15
0
0
0
25
50
75
100
0
4
8
12
16
20
I C (A)
R G ( Ω )
With an inductive load at
With an inductive load at
T j =
T j =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
V CE
V GE
=
=
=
V
±15
50
V
=
I C =
ꢁ
A
17 Jan. 2019 / Revision 4
copyright Vincotech
13
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost
Boost Switch IGBT and Boost Diode FWD
figure 9.
IGBT
figure 10.
IGBT
Typical switching times as a
function of collector current
t = f(I C)
Typical switching times as a
function of gate resistor
t = f(R G)
1
1
tdoff
tdon
tf
tdoff
tdon
tf
tr
0,1
0,1
tr
0,01
0,01
0,001
0,001
0
25
50
75
100
0
4
8
12
16
20
I C (A)
R G ( Ω )
With an inductive load at
With an inductive load at
T j =
T j =
125
150
±15
4
°C
V
125
150
±15
50
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
V
=
I C =
ꢁ
ꢁ
A
=
4
figure 11.
FWD
figure 12.
Typical reverse recovery time as a
function of IGBT turn on gate resistor
FWD
Typical reverse recovery time as a
function of collector current
t rr = f(I c)
t rr = f(R gon
)
0,4
0,3
0,2
0,1
0,0
0,4
trr High T
trr High T
0,3
0,2
0,1
trr Low T
trr Low T
0,0
0
4
8
12
16
20
0
25
50
75
100
I C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
=
V
50
A
=
V GE =
ꢁ
±15
V
17 Jan. 2019 / Revision 4
copyright Vincotech
14
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost
Boost Switch IGBT and Boost Diode FWD
figure 13.
FWD
figure 14.
FWD
Typical reverse recovery charge as a
function of collector current
Q rr = f(I C)
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Q rr = f(R gon
)
6
5
4
3
2
1
0
6
Qrr High T
5
4
3
2
1
Qrr High T
Qrr Low T
Qrr Low T
0
0
4
8
12
16
20
0
25
50
75
100
I
C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
=
=
V
50
A
R gon
=
V GE =
ꢁ
±15
V
figure 15.
FWD
figure 16.
FWD
Typical reverse recovery current as a
function of collector current
I RRM = f(I C)
Typical reverse recovery current as a
function of IGBT turn on gate resistor
I RRM = f(R gon
)
60
50
40
30
20
10
0
60
IRRM High T
50
40
30
20
10
IRRM Low T
IRRM High T
IRRM Low T
0
0
4
8
12
16
20
0
25
50
75
100
I C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
150
°C
V
V CE
V GE
R gon
=
=
V
50
A
=
V GE =
ꢁ
±15
V
17 Jan. 2019 / Revision 4
copyright Vincotech
15
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost
Boost Switch IGBT and Boost Diode FWD
figure 17.
FWD
figure 18.
FWD
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI 0/dt ,dI rec/dt = f(I c)
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI 0/dt ,dI rec/dt = f(R gon
)
7500
7500
dIrec/dt T
dIrec/dt T
di0/dt T
dI0/dt T
6000
6000
4500
3000
1500
0
4500
3000
1500
0
0
25
50
75
100
0
4
8
12
16
20
I C (A)
R gon ( Ω)
At
At
T j =
T j =
V R =
I F =
25/125
150
±15
4
°C
V
25/125
°C
V
V CE
V GE
R gon
=
150
50
=
V
A
=
V GE
=
ꢁ
±15
V
figure 19.
IGBT
figure 20.
FWD
IGBT transient thermal impedance
FWD transient thermal impedance
as a function of pulse width
as a function of pulse width
Z th(j-s) = f(t p)
Z th(j-s) = f(t p)
101
101
100
100
D = 0,5
D = 0,5
0,2
10-1
10-1
0,2
0,1
0,1
0,05
0,02
0,01
0,005
0,000
0,05
0,02
0,01
0,005
0,000
10-2
10-2
t p (s)
t p (s)
10-5
10-4
10-3
10-2
10-1
100
101
10
10-5
10-4
10-3
10-2
10-1
100
101
102
At
At
t p / T
t p / T
D =
D =
R th(j-s)
=
R th(j-s) =
1,16
K/W
1,36
K/W
IGBT thermal model values
FWD thermal model values
R (K/W) Tau (s)
R (K/W) Tau (s)
5,64Eꢀ02 4,97E+00
1,45Eꢀ01 9,35Eꢀ01
4,55Eꢀ01 1,51Eꢀ01
3,75Eꢀ01 4,97Eꢀ02
7,15Eꢀ02 5,37Eꢀ03
5,72Eꢀ02 3,97Eꢀ04
6,09Eꢀ02 2,36E+00
1,41Eꢀ01 3,82Eꢀ01
6,52Eꢀ01 6,81Eꢀ02
2,75Eꢀ01 2,04Eꢀ02
1,29Eꢀ01 4,50Eꢀ03
1,02Eꢀ01 6,56Eꢀ04
17 Jan. 2019 / Revision 4
copyright Vincotech
16
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost
Boost Switch IGBT and Boost Diode FWD
figure 21.
IGBT
figure 22.
IGBT
Power dissipation as a
function of heatsink temperature
P tot = f(T s)
Collector current as a
function of heatsink temperature
I C = f(T s)
175
150
125
100
75
100
80
60
40
20
0
50
25
0
o C)
T s (
o C)
0
50
100
150
200
0
50
100
150
200
T s
(
At
At
T j =
T j =
175
ºC
175
15
ºC
V
V GE
=
figure 23.
Power dissipation as a
FWD
figure 24.
Forward current as a
FWD
function of heatsink temperature
function of heatsink temperature
P tot = f(T s)
I F = f(T s)
150
125
100
75
80
60
40
20
0
50
25
0
o C)
T s (
o C)
0
50
100
150
200
0
50
100
150
200
T s
(
At
At
T j =
T j =
175
ºC
175
ºC
17 Jan. 2019 / Revision 4
copyright Vincotech
17
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Thermistor
figure 1.
Thermistor
Typical NTC characteristic
as a function of temperature
RT = f(T)
NTC-typical temperature characteristic
24000
20000
16000
12000
8000
4000
0
25
50
75
100
125
T (°C)
17 Jan. 2019 / Revision 4
copyright Vincotech
18
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck Switching Definitions
General conditions
T j
=
=
=
125 °C
4 ꢁ
4 ꢁ
R gon
R goff
figure 1.
IGBT
figure 2.
IGBT
Turnꢀoff Switching Waveforms & definition of t doff, t Eoff
Turnꢀon Switching Waveforms & definition of t don, t Eon
(t E off = integrating time for E off
)
(t E on = integrating time for E on)
250
%
125
%
tdoff
IC
200
150
100
100
IC
VGE 90%
75
50
25
0
VCE
VGE
VGE
tEoff
VCE 90%
tdon
VCE
50
IC 1%
VCE 3%
IC 10%
VGE 10%
tEon
0
-25
-50
-0,05
0
0,05
0,1
0,15
0,2
2,95
3
3,05
3,1
3,15
3,2
3,25
time (us)
time(us)
V GE (0%) =
ꢀ15
15
V
V GE (0%) =
ꢀ15
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
V GE (100%) =
V C (100%) =
I C (100%) =
15
V
150
50
V
150
50
V
A
A
t doff
=
=
0,094
0,171
ꢂs
ꢂs
t don
=
=
0,071
0,151
ꢂs
ꢂs
t E off
t E on
figure 3.
IGBT
figure 4.
IGBT
Turnꢀoff Switching Waveforms & definition of t f
Turnꢀon Switching Waveforms & definition of t r
125
250
fitted
%
%
IC
IC
100
200
150
IC 90%
VCE
75
50
25
0
IC 60%
100
IC 90%
tr
IC 40%
VCE
50
IC10%
IC 10%
0
tf
-25
-50
0
0,03
0,06
0,09
0,12
0,15
3,05
3,08
3,11
3,14
3,17
time (us)
time(us)
V C (100%) =
I C (100%) =
t f =
150
50
V
V C (100%) =
I C (100%) =
t r =
150
50
V
A
A
0,022
ꢂs
0,021
ꢂs
17 Jan. 2019 / Revision 4
copyright Vincotech
19
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck Switching Definitions
figure 5.
IGBT
figure 6.
IGBT
Turnꢀoff Switching Waveforms & definition of t Eoff
Turnꢀon Switching Waveforms & definition of t Eon
125
%
125
%
Eon
Eoff
100
75
50
25
0
100
75
Poff
50
Pon
IC 1%
25
VGE 90%
VCE 3%
VGE 10%
0
tEoff
tEon
-25
-25
2,95
3
3,05
3,1
3,15
3,2
-0,1
-0,05
0
0,05
0,1
0,15
0,2
time (us)
time(us)
P off (100%) =
E off (100%) =
7,49
0,32
0,171
kW
mJ
ꢂs
P on (100%) =
E on (100%) =
7,49
0,27
0,151
kW
mJ
ꢂs
t E off
=
t E on =
figure 7.
IGBT
Turnꢀoff Switching Waveforms & definition of t rr
150
%
Id
100
trr
50
Vd
fitted
0
IRRM 10%
-50
-100
IRRM 90%
IRRM 100%
-150
3,05
3,1
3,15
3,2
3,25
3,3
time(us)
V d (100%) =
I d (100%) =
I RRM (100%) =
150
50
V
A
ꢀ59
A
t rr
=
0,113
ꢂs
17 Jan. 2019 / Revision 4
copyright Vincotech
20
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Buck Switching Definitions
figure 8.
FWD
figure 9.
FWD
Turnꢀon Switching Waveforms & definition of t Qrr
(t Q rr = integrating time for Q rr)
Turnꢀon Switching Waveforms & definition of t Erec
(t Erec= integrating time for E rec
)
150
125
%
%
Erec
Qrr
Id
100
100
75
tQrr
tErec
50
0
-50
50
Prec
25
-100
-150
0
-25
3
3,1
3,2
3,3
3,4
3
3,1
3,2
3,3
3,4
time(us)
time(us)
I d (100%) =
Q rr (100%) =
50
A
P rec (100%) =
E rec (100%) =
7,49
0,31
0,227
kW
mJ
ꢂs
3,10
0,227
ꢂC
ꢂs
t Q rr
=
t E rec =
17 Jan. 2019 / Revision 4
copyright Vincotech
21
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Measurement circuits
figure 10.
Buck stage switching measurement circuit
17 Jan. 2019 / Revision 4
copyright Vincotech
22
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost Switching Definitions
General conditions
T j
=
=
=
125 °C
4 ꢁ
4 ꢁ
R gon
R goff
figure 1.
IGBT
figure 2.
IGBT
Turnꢀoff Switching Waveforms & definition of t doff, t Eoff
Turnꢀon Switching Waveforms & definition of t don, t Eon
(t E off = integrating time for E off
)
(t E on = integrating time for E on)
200
125
%
tdoff
%
IC
VCE
100
150
VCE 90%
VGE 90%
75
50
25
0
VCE
IC
100
VGE
tdon
tEoff
50
VCE 3%
VGE 10%
IC 1%
IC 10%
tEon
VGE
0
-25
-50
-0,2
0
0,2
0,4
0,6
0,8
2,9
3
3,1
3,2
3,3
time (us)
time(us)
V GE (0%) =
ꢀ15
15
V
V GE (0%) =
ꢀ15
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
V GE (100%) =
V C (100%) =
I C (100%) =
15
V
150
50
V
150
50
V
A
A
t doff
=
=
0,156
0,676
ꢂs
ꢂs
t don
=
=
0,094
0,217
ꢂs
ꢂs
t E off
t E on
figure 3.
IGBT
figure 4.
IGBT
Turnꢀoff Switching Waveforms & definition of t f
Turnꢀon Switching Waveforms & definition of t r
125
200
IC
fitted
%
%
VCE
IC
100
150
IC 90%
75
50
25
0
VCE
100
IC 60%
IC 90%
tr
IC 40%
50
IC 10%
IC10%
0
tf
-25
-50
0,05
0,1
0,15
0,2
0,25
0,3
3,05
3,1
3,15
3,2
3,25
3,3
time (us)
time(us)
V C (100%) =
I C (100%) =
t f =
150
50
V
V C (100%) =
I C (100%) =
t r =
150
50
V
A
A
0,097
ꢂs
0,017
ꢂs
17 Jan. 2019 / Revision 4
copyright Vincotech
23
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost Switching Definitions
figure 5.
IGBT
figure 6.
IGBT
Turnꢀoff Switching Waveforms & definition of t Eoff
Turnꢀon Switching Waveforms & definition of t Eon
125
125
%
%
Eon
Eoff
100
100
Poff
75
75
50
50
Pon
IC 1%
25
25
0
VGE 90%
VGE 10%
VCE 3%
0
tEon
tEoff
-25
-25
2,9
3
3,1
3,2
3,3
-0,2
0
0,2
0,4
0,6
0,8
time (us)
time(us)
P off (100%) =
E off (100%) =
7,56
0,95
kW
mJ
ꢂs
P on (100%) =
E on (100%) =
7,56
kW
mJ
ꢂs
0,25
t E off
=
0,676
t E on
=
0,217
figure 7.
IGBT
Turnꢀoff Switching Waveforms & definition of t rr
150
%
Id
100
trr
50
Vd
fitted
IRRM 10%
0
-50
IRRM 90%
IRRM 100%
-100
-150
3
3,1
3,2
3,3
3,4
3,5
time(us)
V d (100%) =
I d (100%) =
I RRM (100%) =
150
50
V
A
ꢀ43
A
t rr
=
0,290
ꢂs
17 Jan. 2019 / Revision 4
copyright Vincotech
24
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Boost Switching Definitions
figure 8.
FWD
figure 9.
FWD
Turnꢀon Switching Waveforms & definition of t Qrr
(t Q rr = integrating time for Q rr)
Turnꢀon Switching Waveforms & definition of t Erec
(t Erec= integrating time for E rec
)
150
125
%
%
Id
Erec
Qrr
100
100
tErec
75
tQrr
50
50
0
-50
25
Prec
0
-100
-25
3
3,2
3,4
3,6
3,8
4
4,2
3
3,2
3,4
3,6
3,8
4
4,2
time(us)
time(us)
I d (100%) =
Q rr (100%) =
50
A
P rec (100%) =
E rec (100%) =
7,56
0,52
1,00
kW
mJ
ꢂs
4,21
1,00
ꢂC
ꢂs
t Q rr
=
t E rec =
17 Jan. 2019 / Revision 4
copyright Vincotech
25
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Measurement circuits
figure 10.
Boost stage switching measurement circuit
17 Jan. 2019 / Revision 4
copyright Vincotech
26
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Ordering Code & Marking
Version
Ordering Code
without thermal paste 12 mm housing with solder pins
with thermal paste 12 mm housing with solder pins
without thermal paste 12 mm housing with pressꢀfit pins
with thermal paste 12 mm housing with pressꢀfit pins
10ꢀFZ07NMA100SMꢀM265F58
10ꢀFZ07NMA100SMꢀM265F58ꢀ/3/
10ꢀPZ07NMA100SMꢀM265F58Y
10ꢀPZ07NMA100SMꢀM265F58Yꢀ/3/
Name
Text
Date code
UL & VIN
Lot
Serial
NN-NNNNNNNNNNNNNN
TTTTTTVV WWYY UL
VIN LLLLL SSSS
NNꢀNNNNNNNNNNNNNNꢀTTTTTTVV
WWYY
UL VIN
LLLLL
SSSS
Type&Ver
Lot number
Serial
Date code
Datamatrix
TTTTTTTVV
LLLLL
SSSS
WWYY
Outline
Pin table [mm]
Solder pins
Pin
1
X
33,6
30,8
22
Y
Function
S2
0
2
0
G2
3
0
ꢀDC
ꢀDC
GND
S4
4
19,2
10,1
2,8
0
0
5
0
6
0
7
0
G4
8
0
7,1
9,9
12,7
15,5
22,6
22,6
22,6
22,6
22,6
22,6
22,6
14,8
8,2
Line
Line
Line
Line
G3
9
0
Pressꢀfit pins
10
11
12
13
14
15
16
17
18
19
20
21
22
0
0
0
2,8
10,1
19,2
22
S3
GND
+DC
+DC
G1
30,8
33,6
33,6
33,6
S1
NTC1
NTC2
Not assembled
17 Jan. 2019 / Revision 4
copyright Vincotech
27
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Pinout
T1
T2
Identification
Current
ID
Component
Voltage
Function
Comment
T1, T2
D4, D3
T4, T3
D1, D2
NTC
IGBT
FWD
IGBT
FWD
NTC
650 V
600 V
600 V
650 V
100 A
60 A
75 A
50 A
Buck Switch
Buck Diode
Boost Switch
Boost Diode
Thermistor
17 Jan. 2019 / Revision 4
copyright Vincotech
28
10ꢀFZ07NMA100SMꢀM265F58
10ꢀPZ07NMA100SMꢀM265F58Y
Datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ)
>SPQ
Standard
<SPQ
Sample
135
Handling instructions for flow 0 packages see vincotech.com website.
Package data
Package data for flow 0 packages see vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
27
Correct NTC coordinates
10ꢀxZ07NMA100SMꢀM265F58xꢀD4ꢀ14
17 Jan. 2019
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to reader in
good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations that may exist or
occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability, function or design. No
representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said information or that the application or use
of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons or property or that the same will not infringe third
parties rights or give desired results. It is reader’s sole responsibility to test and determine the suitability of the information and the product for reader’s
intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of
Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c)
whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in
significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of
the life support device or system, or to affect its safety or effectiveness.
copyright Vincotech
29
17 Jan. 2019 / Revision 4
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