30-PT12NMA160SH02-M669F28Y [VINCOTECH]
Easy paralleling;High speed switching;Low switching losses;型号: | 30-PT12NMA160SH02-M669F28Y |
厂家: | VINCOTECH |
描述: | Easy paralleling;High speed switching;Low switching losses |
文件: | 总32页 (文件大小:1226K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
flow 2 MNPC
1200 V / 160 A
Features
flow 2 13mm housing
● Mixed voltage NPC topology
● Reactive power capability
● Low inductance layout
● Split output
Pressꢀfit Pin
Solder Pin
● Common collector neutral connection
Target Applications
Schematic
● Solar inverter
● UPS
● Active frontend
Types
● 30-FT12NMA160SH02-M669F28
● 30-PT12NMA160SH02-M669F28Y
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Buck Inverse Diode
Repetitive peak reverse voltage
DC forward current
V RRM
I F
1200
17
V
A
T j = T jmax
t p = 10 ms
T j = T jmax
T s = 80 °C
I FRM
Maximum repetitive forward current
14
40
A
I2tꢀvalue
I 2
t
A2s
P tot
T s = 80 °C
Power dissipation
40
W
T jmax
Maximum Junction Temperature
150
°C
Buck Switch
V CE
I C
Collectorꢀemitter breakdown voltage
1200
156
480
320
398
±20
V
A
T j = T jmax
T s = 80 °C
DC collector current
I CRM
t p limited by T jmax
Repetitive peak collector current
Turn off safe operating area
Power dissipation
A
V CEmax = 1200 V, T vj ≤ 150 °C
T j = T jmax
A
P tot
V GE
T s = 80 °C
W
V
Gateꢀemitter peak voltage
Short circuit ratings
t SC
V CC
T j ≤ 150 °C
V GE = 15 V
10
µs
V
800
T jmax
Maximum Junction Temperature
175
°C
copyright Vincotech
1
04 Jun. 2021 / Revision 6
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Maximum Ratings
T j = 25 °C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
Buck Diode
V RRM
I F
P tot
T jmax
Peak Repetitive Reverse Voltage
650
96
V
A
T j = T jmax
T j = T jmax
T s = 80 °C
T s = 80 °C
DC forward current
Power dissipation
129
175
W
°C
Maximum Junction Temperature
Boost Switch
V CE
I C
Collectorꢀemitter breakdown voltage
650
94
V
A
T j = T jmax
T s = 80 °C
DC collector current
I CRM
t p limited by T jmax
Repetitive peak collector current
Turn off safe operating area
Power dissipation
300
300
174
±20
A
V CE ≤ 600 V, T j ≤ 175 °C
T j = T jmax
A
P tot
V GE
T s = 80 °C
W
V
Gateꢀemitter peak voltage
Short circuit ratings
t SC
V CC
T j ≤ 150 °C
V GE = 15 V
6
µs
V
360
T jmax
Maximum Junction Temperature
175
°C
Boost Inverse Diode
V RRM
I F
I FRM
P tot
Peak Repetitive Reverse Voltage
650
38
V
A
T j = T jmax
T s = 80 °C
T s = 80 °C
DC forward current
t p limited by T jmax
T j = T jmax
Maximum repetitive forward current
Power dissipation
60
A
65
W
°C
T jmax
Maximum Junction Temperature
175
Boost Diode
V RRM
I F
Peak Repetitive Reverse Voltage
1200
65
V
A
T j = T jmax
T s = 80 °C
T s = 80 °C
DC forward current
I FSM
P tot
T jmax
t p = 8,3 ms Half sine wave 60 Hz
T j = T jmax
Nonrepetitive peak surge current
Power dissipation
650
128
175
A
W
°C
Maximum Junction Temperature
Thermal Properties
T stg
T op
Storage temperature
ꢀ40…+125
°C
°C
ꢀ40…+(T jmax ꢀ 25)
Operation temperature under switching condition
Isolation Properties
DC Test Voltage*
AC Voltage
t p = 2 s
4000
2500
V
V is
Isolation voltage
t p = 1 min
V
Creepage distance
Clearance
min 12,7
min 12,7
>200
mm
mm
Comparative tracking index
CTI
* 100 % Tested in production
04 Jun. 2021 / Revision 6
copyright Vincotech
2
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V] I C [A]
V CE [V] I F [A]
V DS [V] I D [A]
V GE [V]
V GS [V]
T j [°C]
Min
Max
Buck Inverse Diode
Forward voltage
25
125
25
125
25
125
1
1,97
1,65
1,33
1,01
91
3,4
V F
V to
r t
7
V
V
Threshold voltage (for power loss calc. only)
Slope resistance (for power loss calc. only)
Reverse current
7
7
mꢁ
mA
91
I r
1200
25
0,25
phaseꢀchange
material
λ = 3,4 W/mK
K/W
R th(j-s)
Thermal resistance junction to sink
1,57
Buck Switch
V GE(th)
V CEsat
I CES
I GES
R gint
t d(on)
t r
V CE = V GE
Gate emitter threshold voltage
Collectorꢀemitter saturation voltage
Collectorꢀemitter cutꢀoff current incl. Diode
Gateꢀemitter leakage current
Integrated Gate resistor
Turnꢀon delay time
0,006
25
5,3
2
5,8
6,3
V
V
25
125
2,02
2,37
2,42
15
0
160
1200
0
25
25
0,02
480
mA
nA
K
20
none
25
125
25
125
25
125
25
125
25
125
25
134
132
29
Rise time
33
ns
199
247
36
54,8
1,82
3,36
3,39
5,81
t d(off)
t f
Turnꢀoff delay time
R goff = 4 ꢁ
R gon = 4 ꢁ
±15
350
150
Fall time
E on
Turnꢀon energy loss
mWs
pF
E off
C ies
C oss
C rss
Q G
Turnꢀoff energy loss
125
Input capacitance
9320
600
520
740
Output capacitance
f = 1 MHz
0
25
25
Reverse transfer capacitance
Gate charge
15
960
160
nC
phaseꢀchange
material
R th(j-s)
Thermal resistance junction to sink
0,22
K/W
λ = 3,4 W/mK
Buck Diode
25
125
25
125
25
125
25
125
25
125
25
2,28
1,67
92
133
30
V F
I RRM
Diode forward voltage
100
150
V
A
Peak reverse recovery current
Reverse recovery time
t rr
ns
115
1,65
6,41
12559
4726
0,23
1,25
Q rr
R gon = 4 ꢁ
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovered energy
±15
350
µC
( di rf/dt )max
E rec
A/µs
mWs
125
phaseꢀchange
material
λ = 3,4 W/mK
K/W
R th(j-s)
Thermal resistance junction to sink
0,73
04 Jun. 2021 / Revision 6
copyright Vincotech
3
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Characteristic Values
Conditions
Value
Typ
Parameter
Symbol
Unit
V r [V] I C [A]
V CE [V] I F [A]
V DS [V] I D [A]
V GE [V]
V GS [V]
T j [°C]
Min
Max
Boost Switch
Gate emitter threshold voltage
Collectorꢀemitter saturation voltage
Collectorꢀemitter cutꢀoff incl diode
Gateꢀemitter leakage current
Integrated Gate resistor
Turnꢀon delay time
V GE(th)
V CEsat
I CES
I GES
R gint
t d(on)
t r
V CE = V GE
0,0016
25
5,1
5,8
6,4
V
V
25
125
0,93
1,58
1,8
1,77
15
0
100
650
0
25
25
0,0056
300
mA
nA
K
20
none
25
125
25
125
25
125
25
125
25
125
25
103
103
17
Rise time
19
ns
158
179
44
t d(off)
t f
Turnꢀoff delay time
R goff = 4 ꢁ
R gon = 4 ꢁ
±15
350
100
Fall time
64
1,06
1,52
2,48
3,32
E on
Turnꢀon energy loss
Turnꢀoff energy loss
Input capacitance
µWs
pF
E off
C ies
C oss
C rss
Q G
125
6280
400
186
620
Output capacitance
f = 1 MHz
0
25
25
Reverse transfer capacitance
Gate charge
15
480
100
nC
phaseꢀchange
material
λ = 3,4 W/mK
K/W
R th(j-s)
Thermal resistance junction to sink
0,48
Boost Inverse Diode
25
125
1,23
1,64
1,55
1,87
V F
Diode forward voltage
30
V
phaseꢀchange
material
λ = 3,4 W/mK
K/W
R th(j-s)
Thermal resistance junction to sink
1,22
Boost Diode
25
150
1,50
2,47
2,11
3,30
200
V F
Diode forward voltage
60
V
ꢂA
I r
I RRM
Reverse leakage current
Peak reverse recovery current
Reverse recovery time
1200
350
25
25
150
25
150
25
150
25
150
25
150
107
142
51
69
6
A
t rr
ns
Q rr
R gon = 4 ꢁ
Reverse recovered charge
Peak rate of fall of recovery current
Reverse recovery energy
±15
100
µC
13
5985
2890
1,71
3,61
( di rf/dt )max
E rec
A/µs
mWs
phaseꢀchange
material
λ = 3,4 W/mK
K/W
R th(j-s)
Thermal resistance junction to sink
0,68
Thermistor
Rated resistance
Deviation of R 100
Power dissipation
Power dissipation constant
Bꢀvalue
R
Δ R/R
P
25
100
25
25
25
25
22000
K
%
R 100 = 1486 ꢁ
ꢀ12
+12
200
2
mW
mW/K
K
B (25/50)
Tol. ±3%
Tol. ±3%
3950
3998
B (25/100)
Bꢀvalue
K
Vincotech NTC Reference
B
04 Jun. 2021 / Revision 6
copyright Vincotech
4
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical output characteristics
Typical output characteristics
I C = f(V CE
)
I C = f(V CE)
300
300
240
180
120
60
240
180
120
60
0
0
0
0
1
2
3
4
5
1
2
3
4
5
VCE (V)
VCE (V)
At
At
t p
=
t p =
250
25
ꢂs
250
125
ꢂs
T j =
T j =
°C
°C
V GE from
V GE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
figure 3.
Typical transfer characteristics
IGBT
figure 4.
FWD
Typical FWD forward current as
a function of forward voltage
I F = f(V F)
I C = f(V GE
)
100
300
240
180
120
60
80
60
40
20
0
0
0
2
4
6
8
10
12
0
0,5
1
1,5
2
2,5
3
3,5
VGE (V)
VF (V)
At
At
25/125
250
T j =
T j =
°C
25/125
250
°C
t p
V CE
T j =
=
t p =
ꢂs
V
ꢂs
=
10
25/125
°C
04 Jun. 2021 / Revision 6
copyright Vincotech
5
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 5.
IGBT
figure 6.
IGBT
Typical switching energy losses
as a function of collector current
E = f(I C)
Typical switching energy losses
as a function of gate resistor
E = f(R G)
12
10
8
12
10
8
Eon High T
Eoff High T
Eon Low
T
Eon High T
Eoff High T
6
6
Eoff Low T
Eoff Low T
4
4
Eon Low T
2
2
0
0
0
50
100
150
200
250
300
I C (A)
0
4
8
12
16
20
R G ( Ω)
With an inductive load at
With an inductive load at
T j =
T j =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
±15
V
=
I C =
K
150
A
=
4
K
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery energy loss
as a function of collector current
E rec = f(I c)
Typical reverse recovery energy loss
as a function of gate resistor
E rec = f(R G)
1,6
1,2
0,8
0,4
0
1,6
1,2
0,8
0,4
0
Erec High T
Erec High T
Erec Low T
Erec Low T
0
4
8
12
16
20
0
50
100
150
200
250
300
I C (A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j =
T j =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
V CE
V GE
=
=
=
V
±15
V
=
I C =
K
150
A
04 Jun. 2021 / Revision 6
copyright Vincotech
6
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 9.
IGBT
figure 10.
IGBT
Typical switching times as a
function of collector current
t = f(I C)
Typical switching times as a
function of gate resistor
t = f(R G)
1,00
1,00
tdoff
tdon
µ
µ
µ
µ
µ
µ
µ
µ
tdoff
tdon
0,10
0,01
0,00
0,10
0,01
0,00
tr
tf
tf
tr
0
4
8
12
16
20
0
50
100
150
200
250
300
R G ( Ω)
I C (A)
With an inductive load at
With an inductive load at
T j =
T j =
125
350
±15
4
°C
V
125
350
±15
150
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
V
=
I C =
K
A
=
4
K
figure 11.
FWD
figure 12.
Typical reverse recovery time as a
function of IGBT turn on gate resistor
FWD
Typical reverse recovery time as a
function of collector current
t rr = f(I c)
t rr = f(R gon
)
0,14
0,30
µ
µ
µ
µ
µ
µ
µ
µ
trr High T
0,12
0,10
0,08
0,06
0,04
0,02
0,00
At
0,25
0,20
0,15
0,10
0,05
0,00
trr High T
trr Low T
trr Low T
0
4
8
12
16
20
R gon ( Ω)
I C (A)
0
50
100
150
200
250
300
At
T j =
T j =
V R =
I F =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
=
V
150
A
=
V GE =
K
±15
V
04 Jun. 2021 / Revision 6
copyright Vincotech
7
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 13.
FWD
figure 14.
FWD
Typical reverse recovery charge as a
function of collector current
Q rr = f(I C)
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Q rr = f(R gon
)
10
10
µ
µ
µ µ
µ µ
µ
µ
8
6
4
2
0
8
6
4
2
0
Qrr High T
Qrr High T
Qrr Low T
Qrr Low T
0
4
8
12
16
20
R gon ( Ω)
I C (A)
300
0
50
100
150
200
250
At
At
T j =
T j =
V R =
I F =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
=
V
150
A
=
V GE =
K
±15
V
figure 15.
FWD
figure 16.
FWD
Typical reverse recovery current as a
function of collector current
I RRM = f(I C)
Typical reverse recovery current as a
function of IGBT turn on gate resistor
I RRM = f(R gon
)
200
180
150
120
90
IRRM High T
160
120
80
IRRM Low T
60
IRRM High T
40
30
IRRM Low T
0
0
0
0
50
100
150
200
250
300
I C (A)
R gon ( Ω)
4
8
12
16
20
At
At
T j =
T j =
°C
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
V R =
I F =
V
V
K
=
150
A
=
V GE =
±15
V
04 Jun. 2021 / Revision 6
copyright Vincotech
8
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 17.
FWD
figure 18.
FWD
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI 0/dt ,dI rec/dt = f(I c)
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI 0/dt ,dI rec/dt = f(R gon
)
16000
30000
dI0/dt T
µ
µ
µ
µ
dI0/dt T
µ
µ
µ
µ
dIrec/dt T
dIrec/dt T
14000
12000
10000
8000
6000
4000
2000
0
25000
20000
15000
10000
5000
0
0
50
100
150
200
250
300
0
4
8
12
16
20
R gon ( Ω)
I C (A)
At
T j =
At
T j =
V R =
I F =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
=
V
150
A
=
V GE =
K
±15
V
figure 19.
IGBT
figure 20.
FWD
IGBT transient thermal impedance
FWD transient thermal impedance
as a function of pulse width
as a function of pulse width
Z th(j-s) = f(t p)
Z th(j-s) = f(t p)
100
100
10-1
10-2
10-3
10-1
10-2
10-3
D = 0,5
0,2
D = 0,5
0,2
0,1
0,1
0,05
0,02
0,01
0,005
0,000
0,05
0,02
0,01
0,005
0,000
t p (s)
t p (s)
10-5
10-4
10-3
10-2
10-1
100
101
10-5
10-4
10-3
10-2
10-1
100
101
At
At
t p / T
t p / T
D =
D =
R th(j-s)
=
R th(j-s) =
0,22
K/W
0,73
K/W
IGBT thermal model values
FWD thermal model values
R (K/W) Tau (s)
8,1Eꢀ02 2,3E+00
5,7Eꢀ02 2,9Eꢀ01
7,2Eꢀ02 4,6Eꢀ02
2,1Eꢀ02 1,3Eꢀ02
8,0Eꢀ03 1,5Eꢀ03
R (K/W) Tau (s)
6,7Eꢀ02 4,1E+00
7,9Eꢀ02 9,3Eꢀ01
1,9Eꢀ01 1,4Eꢀ01
2,8Eꢀ01 3,5Eꢀ02
6,1Eꢀ02 6,8Eꢀ03
5,6Eꢀ02 1,2Eꢀ03
04 Jun. 2021 / Revision 6
copyright Vincotech
9
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 21.
IGBT
figure 22.
IGBT
Power dissipation as a
function of heatsink temperature
P tot = f(T s)
Collector current as a
function of heatsink temperature
I C = f(T s)
800
600
400
200
0
250
200
150
100
50
0
0
50
100
150
200
T s (
o C)
0
50
100
150
200
T s (
o C)
At
At
T j =
T j =
175
°C
175
15
°C
V
V GE
=
figure 23.
Power dissipation as a
FWD
figure 24.
Forward current as a
FWD
function of heatsink temperature
function of heatsink temperature
P tot = f(T s)
I F = f(T s)
240
210
180
150
120
90
100
80
60
40
20
0
60
30
0
0
50
100
150
200
0
50
100
150
200
T s
(
o C)
T s (
o C)
At
At
T j =
T j =
175
°C
175
°C
04 Jun. 2021 / Revision 6
copyright Vincotech
10
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 25.
IGBT
figure 26.
IGBT
Gate voltage vs Gate charge
Safe operating area as a function
of collectorꢀemitter voltage
I C = f(V CE
)
V GE = f(Q g)
17,5
15
12,5
10
103
240 V
102
100uS
960 V
101
1mS
7,5
5
10mS
100
100mS
DC
2,5
0
10-1
0
100
200
300
400
500
600
700
800
100
102
103
VCE (V)
Q g (nC)
101
At
At
D =
single pulse
I C
=
160
25
A
T s =
80
ºC
T j=
ºC
V GE
=
±15
T jmax
V
T j =
figure 27.
IGBT
figure 28.
IGBT
Short circuit withstand time as a function of
gateꢀemitter voltage
Typical short circuit collector current as a function of
gateꢀemitter voltage
t sc = f(V GE
)
I C(sc) = f(V GE)
50
1200
1000
800
600
400
200
40
30
20
10
0
0
10
12
14
16
18
20
10
12
14
16
18
VGE (V)
V GE(V)
At
At
V CE
=
600
175
V
V CE
≤
600
175
V
T j ≤
T j =
ºC
ºC
04 Jun. 2021 / Revision 6
copyright Vincotech
11
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Characteristics
figure 29.
IGBT
Reverse bias safe operating area
I C = f(V CE
)
400
I C MAX
300
200
100
0
0
200
400
600
800
1000
1200
1400
VCE (V)
At
T j =
T jmaxꢀ25
ºC
V ccminus = V ccplus
Switching mode :
3 level switching
04 Jun. 2021 / Revision 6
copyright Vincotech
12
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical output characteristics
Typical output characteristics
I C = f(V CE
)
I C = f(V CE)
300
300
250
200
150
100
50
250
200
150
100
50
0
0
0
0
1
2
3
4
5
1
2
3
4
5
VCE (V)
VCE (V)
At
At
t p
=
t p =
250
25
ꢂs
°C
250
150
ꢂs
°C
T j =
T j =
V GE from
V GE from
7 V to 17 V in steps of 1 V
7 V to 17 V in steps of 1 V
figure 3.
Typical transfer characteristics
IGBT
figure 4.
FWD
Typical FWD forward current as
a function of forward voltage
I F = f(V F)
I C = f(V GE
)
100
180
150
120
90
80
60
40
20
60
30
0
0
0
2
4
6
8
10
0
1
2
3
4
VGE (V)
VF (V)
At
At
T j =
T j =
25/150
250
°C
ꢂs
V
25/150
250
°C
t p
=
t p =
ꢂs
V CE
=
10
04 Jun. 2021 / Revision 6
copyright Vincotech
13
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 5.
IGBT
figure 6.
IGBT
Typical switching energy losses
as a function of collector current
E = f(I C)
Typical switching energy losses
as a function of gate resistor
E = f(R G)
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Eon High T
Eoff High T
Eon Low T
Eoff Low T
Eoff High T
Eoff Low T
Eon High T
Eon Low T
0
50
100
150
200
0
4
8
12
16
20
R G ( Ω)
I C (A)
With an inductive load at
With an inductive load at
T j =
T j =
25/125
350
±15
4
°C
V
25/125
350
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
±15
V
=
I C =
K
100
A
=
4
K
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery energy loss
as a function of collector current
E rec = f(I c)
Typical reverse recovery energy loss
as a function of gate resistor
E rec = f(R G)
5
4
3
2
1
0
5
4
3
2
1
0
Erec High T
Erec Low T
Erec High T
Erec Low T
0
50
100
150
200
0
4
8
12
16
20
I C (A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j =
T j =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
V CE
V GE
=
=
=
V
±15
V
=
I C =
K
100
A
04 Jun. 2021 / Revision 6
copyright Vincotech
14
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 9.
IGBT
figure 10.
IGBT
Typical switching times as a
function of collector current
t = f(I C)
Typical switching times as a
function of gate resistor
t = f(R G)
1,00
1,00
tdoff
tdon
µ
µ
µ
µ
µ
µ
µ
µ
tdoff
tdon
tf
0,10
0,01
0,00
0,10
0,01
0,00
tr
tf
tr
0
50
100
150
200
0
4
8
12
16
20
I C (A)
R G ( Ω)
With an inductive load at
With an inductive load at
T j =
T j =
125
350
±15
4
°C
V
125
350
±15
100
°C
V
V CE
=
V CE
V GE
=
V GE
R gon
R goff
=
=
V
V
=
I C =
K
A
=
4
K
figure 11.
FWD
figure 12.
Typical reverse recovery time as a
function of IGBT turn on gate resistor
FWD
Typical reverse recovery time as a
function of collector current
t rr = f(I c)
t rr = f(R gon
)
0,12
0,7
trr High T
µ
µ
µ
µ
trr High T
µ
µ
µ
µ
0,6
0,5
0,4
0,3
0,2
0,1
0
0,09
0,06
0,03
0,00
trr Low T
trr Low T
0
4
8
12
16
20
R gon ( Ω)
0
50
100
150
200
I C (A)
At
T j =
At
T j =
V R =
I F =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
=
V
100
A
=
V GE =
K
±15
V
04 Jun. 2021 / Revision 6
copyright Vincotech
15
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 13.
FWD
figure 14.
FWD
Typical reverse recovery charge as a
function of collector current
Q rr = f(I C)
Typical reverse recovery charge as a
function of IGBT turn on gate resistor
Q rr = f(R gon
)
18
15
Qrr High T
µ
µ
µ
µ
µ
µ
µ
µ
Qrr High T
15
12
9
12
9
Qrr Low T
6
Qrr Low T
6
3
3
0
0
0
50
100
150
200
0
4
8
12
16
20
R gon ( Ω)
I C (A)
At
At
T j =
T j =
V R =
I F =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
=
V
100
A
=
V GE =
K
±15
V
figure 15.
FWD
figure 16.
FWD
Typical reverse recovery current as a
function of collector current
I RRM = f(I C)
Typical reverse recovery current as a
function of IGBT turn on gate resistor
I RRM = f(R gon
)
180
150
120
90
200
IRRM High T
160
120
80
IRRM Low T
IRRM High T
IRRM Low T
60
40
30
0
0
0
4
8
12
16
20
0
50
100
150
200
R gon ( Ω)
I C (A)
At
At
T j =
T j =
°C
V
°C
V
25/125
350
±15
4
25/125
350
V CE
V GE
R gon
=
V R =
I F =
=
V
100
A
=
V GE =
K
±15
V
04 Jun. 2021 / Revision 6
copyright Vincotech
16
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 17.
FWD
figure 18.
FWD
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI 0/dt ,dI rec/dt = f(I c)
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI 0/dt ,dI rec/dt = f(R gon
)
10000
18000
dI0/dt T
µ
µ
µ
µ
µ
µ
µ
µ
dI0/dt T
dIrec/dt T
dIrec/dt T
15000
12000
9000
6000
3000
0
8000
6000
4000
2000
0
0
50
100
150
200
0
4
8
12
16
20
R gon ( Ω)
I C (A)
At
T j =
At
T j =
V R =
I F =
°C
V
°C
V
25/125
25/125
V CE
V GE
R gon
=
350
±15
4
350
100
±15
=
V
A
=
V GE
=
K
V
figure 19.
IGBT
figure 20.
FWD
IGBT transient thermal impedance
FWD transient thermal impedance
as a function of pulse width
as a function of pulse width
Z th(j-s) = f(t p)
Z th(j-s) = f(t p)
101
101
100
100
10-1
10-2
10-3
10-1
10-2
10-3
D = 0,5
D = 0,5
0,2
0,1
0,2
0,1
0,05
0,02
0,01
0,005
0,000
0,05
0,02
0,01
0,005
0,000
10-5
10-4
10-3
10-2
10-1
100
101 10
t p (s)
t p (s)
10-5
10-4
10-3
10-2
10-1
100
101 10
At
At
t p / T
t p / T
D =
D =
R th(j-s)
=
R th(j-s) =
0,48
K/W
0,68
K/W
IGBT thermal model values
FWD thermal model values
R (K/W) Tau (s)
R (K/W) Tau (s)
6,8Eꢀ02 3,7E+00
1,0Eꢀ01 5,4Eꢀ01
2,0Eꢀ01 9,8Eꢀ02
2,6Eꢀ01 2,8Eꢀ02
6,8Eꢀ02 4,9Eꢀ03
1,1Eꢀ01
8,8Eꢀ02
1,2Eꢀ01
1,7Eꢀ01
3,0Eꢀ02
2,9E+00
4,6Eꢀ01
9,5Eꢀ02
2,5Eꢀ02
4,4Eꢀ03
04 Jun. 2021 / Revision 6
copyright Vincotech
17
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 21.
IGBT
figure 22.
IGBT
Power dissipation as a
function of heatsink temperature
P tot = f(T s)
Collector current as a
function of heatsink temperature
I C = f(T s)
400
350
300
250
200
150
100
50
125
100
75
50
25
0
0
0
50
100
150
200
0
50
100
150
200
T s
(
o C)
T s (
o C)
At
At
T j =
T j =
175
ºC
175
15
ºC
V
V GE
=
figure 23.
Power dissipation as a
FWD
figure 24.
Forward current as a
FWD
function of heatsink temperature
function of heatsink temperature
P tot = f(T s)
I F = f(T s)
300
250
200
150
100
50
80
60
40
20
0
0
0
50
100
150
200
T s (
o C)
T s
(
o C)
0
50
100
150
200
At
T j =
At
T j =
175
ºC
175
ºC
04 Jun. 2021 / Revision 6
copyright Vincotech
18
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 25.
IGBT
Safe operating area as a function
of collectorꢀemitter voltage
I C = f(V CE
)
103
10uS
102
100uS
101
1mS
10mS
100
100mS
DC
10-1
100
102
101
103
VCE (V)
At
single pulse
D =
T s =
80
ºC
V GE
=
±15
T jmax
V
T j =
04 Jun. 2021 / Revision 6
copyright Vincotech
19
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Characteristics
figure 25.
IGBT
figure 26.
IGBT
Reverse bias safe operating area
Gate voltage vs Gate charge
I C = f(V CE
)
V GE = f(Q g)
250
16
14
12
I C MAX
200
150
100
50
480 V
120 V
10
8
6
4
2
0
0
0
100
200
300
400
500
600
VCE (V)
700
0
50
100
150
200
250
Q g (nC)
At
At
T j =
T jmaxꢀ25
ºC
3 level switching
I C
=
100
25
A
V ccminus = V ccplus
T j=
ºC
Switching mode :
figure 27.
IGBT
figure 28.
IGBT
Short circuit withstand time as a function of
gateꢀemitter voltage
Typical short circuit collector current as a function of
gateꢀemitter voltage
t sc = f(V GE
)
I C(sc) = f(V GE)
14
1600
1400
1200
1000
800
12
10
8
6
600
4
400
2
200
0
0
10
11
12
13
14
15
12
14
16
18
20
VGE (V)
V GE(V)
At
At
V CE
=
600
150
V
V CE
≤
400
125
V
T j ≤
T j =
ºC
ºC
04 Jun. 2021 / Revision 6
copyright Vincotech
20
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Inverse Diode
figure 25.
FWD
figure 26.
FWD
Typical FWD forward current as
a function of forward voltage
I F = f(V F)
FWD transient thermal impedance
as a function of pulse width
Z th(j-s) = f(t p)
90
75
60
45
30
15
0
101
100
10-1
10-2
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0,000
t p (s)
0,0
0,5
1,0
1,5
2,0
2,5
3,0
10-5
10-4
10-3
10-2
10-1
100
10110
VF (V)
At
At
t p / T
T j =
°C
ꢂs
D =
R th(j-s) =
25/150
250
t p
=
1,22
K/W
figure 27.
Power dissipation as a
FWD
figure 28.
Forward current as a
FWD
function of heatsink temperature
function of heatsink temperature
P tot = f(T s)
I F = f(T s)
150
125
100
75
50
40
30
20
10
0
50
25
0
T s (
o C)
T s (
o C)
0
50
100
150
200
0
50
100
150
200
At
At
T j =
T j =
175
ºC
175
ºC
04 Jun. 2021 / Revision 6
copyright Vincotech
21
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Inverse Diode
figure 1.
FWD
figure 2.
FWD
Typical FWD forward current as
a function of forward voltage
I F= f(V F)
FWD transient thermal impedance
as a function of pulse width
Z th(j-s) = f(t p)
21
18
15
12
9
101
100
10-1
10-2
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0,000
6
3
0
0
1
2
3
4
VF (V)
t p (s)
10-5
10-4
10-3
10-2
10-1
100
10110
At
At
t p / T
T j =
°C
D =
R th(j-s) =
25/125
250
t p
=
ꢂs
1,57
K/W
figure 3.
Power dissipation as a
FWD
figure 4.
Forward current as a
FWD
function of heatsink temperature
function of heatsink temperature
P tot = f(T s)
I F = f(T s)
120
100
80
60
40
20
0
30
25
20
15
10
5
0
0
50
100
150
200
T s (
o C)
T s (
o C)
0
25
50
75
100
125
150
At
At
T j =
T j =
150
ºC
150
ºC
04 Jun. 2021 / Revision 6
copyright Vincotech
22
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Thermistor
figure 1.
Thermistor
Typical NTC characteristic
as a function of temperature
R = f(T )
NTC-typical temperature characteristic
24000
20000
16000
12000
8000
4000
0
25
50
75
100
T (°C)
125
04 Jun. 2021 / Revision 6
copyright Vincotech
23
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Switching Characteristics
General conditions
T j
=
=
=
125 °C
4 ꢁ
4 ꢁ
R gon
R goff
figure 1.
IGBT
figure 2.
IGBT
Turnꢀoff Switching Waveforms & definition of t doff, t Eoff
Turnꢀon Switching Waveforms & definition of t don, t Eon
(t E off = integrating time for E off
)
(t E on = integrating time for E on)
150
%
250
%
tdoff
200
VCE
IC
100
VGE 90%
VGE
VCE 90%
IC
150
VCE
100
50
0
VGE
tdon
tEoff
50
IC 1%
VCE5%
VGE10%
IC10%
0
tEon
-50
-50
2,95
3,05
3,15
3,25
3,35
3,45
time(µs)
-0,2
0
0,2
0,4
0,6
0,8
time (µs)
V GE (0%) =
ꢀ15
V
V GE (0%) =
ꢀ15
15
V
V GE (100%) =
V C (100%) =
I C (100%) =
15
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
V
A
350
149
0,25
0,62
V
350
149
0,13
0,37
A
t doff
=
=
ꢂs
ꢂs
t don
=
=
ꢂs
ꢂs
t E off
t E on
figure 3.
IGBT
figure 4.
IGBT
Turnꢀoff Switching Waveforms & definition of t f
Turnꢀon Switching Waveforms & definition of t r
150
%
250
%
125
200
fitted
VCE
IC
Ic
100
75
50
25
0
150
IC 90%
VCE
IC 60%
100
IC90%
tr
IC 40%
50
IC10%
IC10%
0
tf
-25
-50
0,15
0,2
0,25
0,3
0,35
0,4
3,05
3,1
3,15
3,2
3,25
3,3
time (µs)
time(µs)
V C (100%) =
I C (100%) =
t f =
350
149
0,06
V
V C (100%) =
I C (100%) =
t r =
350
149
0,03
V
A
A
ꢂs
ꢂs
04 Jun. 2021 / Revision 6
copyright Vincotech
24
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Turnꢀoff Switching Waveforms & definition of t Eoff
Turnꢀon Switching Waveforms & definition of t Eon
125
%
125
%
Eon
IC
1%
Eoff
100
100
75
75
50
50
Pon
Poff
25
25
VCE
3%
VGE 90%
VGE
10%
0
0
tEon
tEoff
-25
-25
2,9
3
3,1
3,2
3,3
3,4
-0,2
0
0,2
0,4
0,6
0,8
time (µs)
time(µs)
P off (100%) =
E off (100%) =
52,08
kW
mJ
ꢂs
P on (100%) =
E on (100%) =
52,08
kW
mJ
ꢂs
5,81
0,62
3,36
0,37
t E off
=
t E on =
figure 7.
FWD
Turnꢀoff Switching Waveforms & definition of t rr
150
%
Id
100
trr
50
Vd
0
IRRM 10%
-50
fitted
IRRM 90%
IRRM 100%
-100
3,1
3,15
3,2
3,25
3,3
3,35
time(µs)
3,4
V d (100%) =
I d (100%) =
350
V
149
A
I RRM (100%) =
t rr
ꢀ133
0,11
A
=
ꢂs
04 Jun. 2021 / Revision 6
copyright Vincotech
25
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Buck Switching Characteristics
figure 8.
FWD
figure 9.
FWD
Turnꢀon Switching Waveforms & definition of t Qrr
(t Q rr = integrating time for Q rr)
Turnꢀon Switching Waveforms & definition of t Erec
(t Erec= integrating time for E rec
)
150
%
125
%
Erec
Id
Qrr
100
100
tErec
75
tQrr
50
50
0
-50
25
Prec
0
-25
-100
3,1
3,15
3,2
3,25
3,3
3,35
3,4
3,45
3,5
3,1
3,15
3,2
3,25
3,3
3,35
3,4
3,45
3,5
time(µs)
time(µs)
I d (100%) =
Q rr (100%) =
149
A
P rec (100%) =
E rec (100%) =
52,08
kW
mJ
ꢂs
6,41
0,23
ꢂC
ꢂs
1,25
0,23
t Q rr
=
t E rec =
Buck switching measurement circuit
figure 10.
IGBT
Vcc
V
D2
15V
Q1
DQ1
DQ3
D3
OUT1
Q3
3*470uF
3*470uF
47kohm
47kohm
5nH
5nH
200uH
Vdc
700
15V
15V
Vce
V
Q4
D4
OUT2
D1
Vge
V
Q2
DQ4
DQ2
1mH
L6
Ic
A
0.00001
Q
0.000003
Q
Rgon
+15V
Q
Q
Rgoff
-15V
Q
Q
04 Jun. 2021 / Revision 6
copyright Vincotech
26
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Switching Characteristics
General conditions
T j
=
=
=
125 °C
4 ꢁ
4 ꢁ
R gon
R goff
figure 1.
IGBT
figure 2.
IGBT
Turnꢀoff Switching Waveforms & definition of t doff, t Eoff
Turnꢀon Switching Waveforms & definition of t don, t Eon
(t E off = integrating time for E off
)
(t E on = integrating time for E on)
125
250
tdoff
%
%
IC
VCE
100
200
VCE 90%
VGE 90%
75
50
25
0
150
VGE
IC
VCE
100
VGE
tEoff
tdon
50
VCE 3%
IC 1%
VGE 10%
IC 10%
0
tEon
-25
-50
-0,1
0
0,1
0,2
0,3
0,4
time (µs)
0,5
2,95
3
3,05
3,1
3,15
3,2
3,25
time(µs)
V GE (0%) =
ꢀ15
15
V
V GE (0%) =
ꢀ15
V
V GE (100%) =
V C (100%) =
I C (100%) =
V
V GE (100%) =
V C (100%) =
I C (100%) =
15
V
350
100
0,18
0,44
V
350
100
0,10
0,15
V
A
A
t doff
=
=
ꢂs
ꢂs
t don
=
=
ꢂs
ꢂs
t E off
t E on
figure 3.
IGBT
figure 4.
IGBT
Turnꢀoff Switching Waveforms & definition of t f
Turnꢀon Switching Waveforms & definition of t r
125
250
fitted
Ic
%
%
IC
100
200
Ic
90%
75
150
100
50
Ic
60%
VCE
50
IC 90%
Ic
40%
tr
25
Ic 10%
VCE
IC 10%
0
0
tf
-25
-50
0,00
0,05
0,10
0,15
0,20
0,25
0,30
3,05
3,1
3,15
3,2
time (µs)
time(µs)
V C (100%) =
I C (100%) =
t f =
350
V
V C (100%) =
I C (100%) =
t r =
350
100
V
100
A
A
0,064
ꢂs
0,019
ꢂs
04 Jun. 2021 / Revision 6
copyright Vincotech
27
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Turnꢀoff Switching Waveforms & definition of t Eoff
Turnꢀon Switching Waveforms & definition of t Eon
125
200
%
%
Ic 1%
Eoff
Pon
100
75
50
25
0
150
100
50
Poff
Eon
Uge 10%
Uge 90%
Uce 3%
0
tEoff
tEon
-50
-25
2,95
3
3,05
3,1
3,15
3,2
3,25
-0,1
0
0,1
0,2
0,3
0,4
time (µs)
0,5
time(µs)
P off (100%) =
E off (100%) =
34,96
3,32
0,44
kW
mJ
ꢂs
P on (100%) =
E on (100%) =
34,964
1,52
kW
mJ
ꢂs
t E off
=
t E on
=
0,15
figure 7.
FWD
Turnꢀoff Switching Waveforms & definition of t rr
150
%
Id
100
trr
50
Ud
fitted
0
-50
IRRM 10%
-100
-150
IRRM 90%
IRRM 100%
3,05
3,1
3,15
3,2
3,25
3,3
time(µs)
V d (100%) =
I d (100%) =
I RRM (100%) =
350
V
100
A
ꢀ142
0,07
A
t rr
=
ꢂs
04 Jun. 2021 / Revision 6
copyright Vincotech
28
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Boost Switching Characteristics
figure 8.
FWD
figure 9.
FWD
Turnꢀon Switching Waveforms & definition of t Qrr
(t Qrr= integrating time for Q rr)
Turnꢀon Switching Waveforms & definition of t Erec
(t Erec= integrating time for E rec
)
150
125
%
%
Qrr
Id
Erec
100
100
75
50
25
0
tQint
50
tErec
0
-50
Prec
-100
-150
-25
3
3,25
3,5
3,75
4
4,25
3
3,2
3,4
3,6
3,8
4
4,2
time(µs)
time(µs)
I d (100%) =
Q rr (100%) =
100
A
P rec (100%) =
E rec (100%) =
34,96
3,61
1,00
kW
mJ
ꢂs
12,71
1,00
ꢂC
ꢂs
t Qint
=
t E rec =
Boost switching measurement circuit
figure 10.
IGBT
V
Vcc
D2
Q1
15V
DQ1
Vce
V
DQ3
D3
15V
OUT1
3*470uF
3*470uF
Q3
47kohm
47kohm
5nH
200uH
VDC
700
5nH
Q4
D4
OUT2
D1
15V
DQ4
Q2
DQ2
1mH
L6
I2
A
+15V
Rgon
0.00001
Q
0.000003
Q
Vge
Q
Q
V
Rgoff
-15V
Q
Q
04 Jun. 2021 / Revision 6
copyright Vincotech
29
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Ordering Code & Marking
Version
without thermal paste 13 mm housing with solder pins
with thermal paste 13 mm housing with solder pins
without thermal paste 13 mm housing with press-fit pins
with thermal paste 13 mm housing with press-fit pins
Ordering Code
30-FT12NMA160SH02-M669F28
30-FT12NMA160SH02-M669F28-/3/
30-PT12NMA160SH02-M669F28Y
30-PT12NMA160SH02-M669F28Y-/3/
Name
Date code
WWYY
Serial
UL & VIN
UL VIN
Lot
Serial
NN-NNNNNNNNNNNNNN
TTTTTTVV WWYY UL
VIN LLLLL SSSS
Text
NN-NNNNNNNNNNNNNN-TTTTTTVV
LLLLL
SSSS
Type&Ver
Lot number
Date code
WWYY
Datamatrix
TTTTTTTVV
LLLLL
SSSS
Outline
Pin table
Pin table
Y
Pin
X
Y
3
0
0
0
0
0
3
0
3
0
Pin
X
Function
C1
Function
K1
70
1
2
52
53
54
55
56
52
18,1
70
C1
C1
C1
C1
C1
N1
N1
N1
N1
64,2
70,6
70
36,6
36,55
18,9
NTC1
NTC2
S1
3
4
67,5
65
5
62,5
60
68,55
15,9
G1
6
7
52,75
52,75
50,25
50,25
8
9
10
11
12
13
43
43
40,5
3
0
3
E1
E1
E1
14
15
16
17
18
19
20
21
22
40,5
38
0
3
0
3
0
3
0
3
0
E1
E1
E1
E2
E2
E2
E2
E2
E2
38
32
32
29,5
29,5
27
27
23
24
25
26
27
28
29
30
31
32
33
34
35
19,75
17,25
14,75
12,25
5
0
N2
N2
N2
N2
C2
C2
C2
C2
C2
C2
G4
S4
K2
0
0
0
3
5
0
3
2,5
2,5
0
0
3
0
0
5,75
5,75
12,1
19,45
22,45
22,7
04 Jun. 2021 / Revision 6
Copyright Vincotech
30
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Pinout
Identification
ID
Component
Voltage
Current
Function
Comment
Q1, Q2
DQ1, DQ2
D3, D4
Q3, Q4
DQ3, DQ4
D1, D2
R1
IGBT
FWD
FWD
IGBT
FWD
FWD
NTC
1200 V
1200 V
650 V
160 A
7 A
Buck Switch
Buck Sw. Protection Diode
Buck Diode
100 A
100 A
60 A
60 A
650 V
Boost Switch
650 V
Boost Sw. Protection Diode
Boost Diode
1200 V
Thermistor
04 Jun. 2021 / Revision 6
copyright Vincotech
31
30ꢀFT12NMA160SH02ꢀM669F28
30ꢀPT12NMA160SH02ꢀM669F28Y
datasheet
Packaging instruction
Standard packaging quantity (SPQ)
>SPQ
Standard
<SPQ
Sample
36
Handling instruction
Handling instructions for flow 2 packages see vincotech.com website.
Package data
Package data for flow 2 packages see vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
30
30ꢀxT12NMA160SH02ꢀM669F28xꢀD6ꢀ14
04 Jun. 2021
Ordering Code and Marking corrected
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to reader in
good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations that may exist or
occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability, function or design. No
representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said information or that the application or use
of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons or property or that the same will not infringe third
parties rights or give desired results. It is reader’s sole responsibility to test and determine the suitability of the information and the product for reader’s
intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of
Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c)
whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in
significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of
the life support device or system, or to affect its safety or effectiveness.
04 Jun. 2021 / Revision 6
copyright Vincotech
32
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